CN201749877U

CN201749877U - Packaging cover board with organic lighting element

Info

Publication number: CN201749877U
Application number: CN2010202412874U
Authority: CN
Inventors: 张斌
Original assignee: Irico Group Corp
Current assignee: Irico Group Corp; Irico Group Electronics Co Ltd
Priority date: 2010-06-29
Filing date: 2010-06-29
Publication date: 2011-02-16
Anticipated expiration: 2020-06-29

Abstract

The utility model relates to a packaging cover board with an organic lighting element, which comprises a glass substrate, wherein the glass substrate is provided with a first groove and a second groove, and the second groove is arranged at the periphery of the first groove. In the utility model, the first groove filled with drying agent is externally provided with the second groove, the head and the end of the second groove are communicated, and the second groove is used for containing sealing agent, so the contact area of the sealing agent and the air can be reduced after the packaging cover board is fit with the glass front cover containing OLED, the moisture can be free from penetrating into the elements, finally the service life of the elements can be improved and the elements are lighter and thinner.

Description

A kind of organic light-emitting device encapsulation cover plate

Technical field

The utility model relates to the organic luminescent device field, particularly a kind of organic light-emitting device encapsulation cover plate.

Background technology

Organic Light Emitting Diode (OLED) is present emerging a kind of flat panel display, because of it has active illuminating, the contrast height, ultra-thinization, plurality of advantages such as quick response, be acknowledged as the main force of flat-panel monitor of future generation, its principle of luminosity is the extremely thin organic material of deposition between two electrodes, passes to direct current and makes it luminous.The life-span of OLED device is depended on selected organic material on the one hand, also depends on the method for packing of device on the other hand.Want strict stopping to enter organic substance and the electrode that device inside touches sensitivity from the oxygen and the moisture of surrounding environment.Because in organic light emitting apparatus inside, the existence of moisture or oxygen causes the degeneration or the inefficacy of its characteristic easily, though the moisture of trace also can the organifying compound layer and electrode layer peel off, cause producing blackspot.For degeneration and the inefficacy of OLED in the long-term work process is inhibited, steady operation reaches enough life-spans, to the very high requirement of barrier proposition of encapsulating material.

Mainly be to adopt metal cover board, glass cover-plate or film to encapsulate at present, wherein, metal cover board makes the device distortion easily because of different with the coefficient of expansion of glass, and the die cost height of making, and metal cover board is just eliminated gradually; And thin-film package does not also reach the level of practicability; The still glass cover-plate of using at most at present.To the requirement of this glass cover-plate be will be on flat glass the smooth groove in etching bottom so that load drier in groove, the high-precision register guide of etching simultaneously is so that fit with the flat glass protecgulum contraposition of display.Shortcoming when glass cover-plate commonly used encapsulates is that the width of sealant is wayward after the pressing; The relative area that sealant is exposed in the atmosphere is bigger, makes moisture penetrate device and the possibility that weathers increases; The device integral thickness is thicker.

The utility model content

The purpose of this utility model provides a kind of organic light-emitting device encapsulation cover plate, this encapsulation cover plate can reduce the area that sealant contacts with atmosphere, reduce the possibility that device inside is etched, the coating zone of while energy fixing seal agent, make the width unanimity of sealing coating zone, reduce the device integral thickness.

To achieve these goals, the utility model adopts following technical scheme: a kind of organic light-emitting device encapsulation cover plate, comprise glass substrate, and glass substrate is provided with the groove and second groove, and described second groove is arranged in the groove periphery.

Described second groove is a groove that head and the tail communicate.

The degree of depth of depth ratio second groove of described groove is dark.

Compared with prior art, a kind of organic light-emitting device encapsulation cover plate of the utility model is by being provided with second groove that head and the tail communicate outside the groove of loading drier, this second groove is used to accommodate sealant, after making that encapsulation cover plate and the glass protecgulum that comprises OLED are fitted, reduce the contact area of sealant and air, make moisture penetrate the device possibility and reduce greatly, finally reach raising device lifetime and the device effect of slimming more.

Description of drawings

Fig. 1 is the structural representation of encapsulation cover plate in the prior art; Fig. 2 is the cutaway view of encapsulation cover plate shown in Figure 1 along the A-A line; Fig. 3 is the schematic diagram after encapsulation cover plate is fitted with the glass protecgulum that comprises OLED in the prior art; Fig. 4 is the schematic diagram of a kind of organic light-emitting device encapsulation cover plate of the utility model; Fig. 5 is the cutaway view of encapsulation cover plate shown in Figure 4 along the B-B line; Fig. 6 is the schematic diagram after the utility model encapsulation cover plate and the glass protecgulum that comprises OLED are fitted; Wherein: 1 is glass substrate; 2 is second groove; 3 is groove; 4 is sealant; 5 for comprising the glass protecgulum of OLED.

Embodiment

Below in conjunction with accompanying drawing the utility model is done and to be described in further detail.

See also Fig. 1 to shown in Figure 3, etch groove 3 on the glass substrate 1 of encapsulation cover plate in the prior art, be used for loading drier in the groove 3; The glass cover-plate of populated drier is coated sealant 4 around glass substrate 1, fit in then on the glass protecgulum 5 that comprises OLED, the width of sealant 4 is wayward after the pressing, and the relative area that sealant 4 is exposed in the atmosphere is bigger, makes moisture penetrate device and the possibility that weathers increases.

See also Fig. 4 to shown in Figure 6, increase by second groove 2 that applies sealant 4 around the groove 3 of the glass substrate 1 of a kind of organic light-emitting device encapsulation cover plate of the utility model, second groove 2 is accommodated sealant 4, after making that glass substrate 1 and glass protecgulum 5 are fitted, because the restriction of second groove 2, and very little sealant overflows width, after the encapsulation pressing is solidified, can reach the sealant thickness of minimum ingress of air, and the sealant of stable and consistent encapsulation track and shape, and don't influence the required sealant adhesive strength of device, finally reach raising device lifetime and the device effect of slimming more.

The depth dimensions of second groove 02 that sealant 4 applies is to determine according to the difference design that allows the minimum spacing size between the sealant optimal design thickness that uses non-modified model glass cover-plate device and non-modified model glass cover-plate and luminescent device panel; The width dimensions of second groove 2 is according to using non-modified model glass cover-plate device sealing agent optimal design width design to determine, after this size should be considered to encapsulate pressing, and the width dimensions that sealant overflows in the linear groove.

The manufacture method of the utility model encapsulation cover plate comprises the steps: 1, at first selects the plate glass of suitable size specification to clean up; 2, at the positive sticking anti-etching adhesive tape of one deck single face that attaches of the plate glass that cleans up; 3, at this above above-mentioned anti-etching adhesive tape, with laser cutting go out second groove 2 that sealant applies, groove 3 that drier attaches pattern and with the pattern of luminescent panel register guide; 4, because depth ratio second groove 2 of groove 3 is dark, so remove the anti-etching diaphragm above groove 3 zones earlier, behind certain density HF, HNO3, HCL mixed aqueous solution etching certain hour A, take out, peel off the anti-etching diaphragm above second groove, 2 zones then, continue etching with above-mentioned etching solution again, finally form the groove 3 and second groove 2; The definite of time A decides according to the etch rate of etching solution; Etched mode can be that the immersion etching also can be the spray etching; 5, remove the anti-etching diaphragm of surface of plate glass, and cut the described organic light-emitting device encapsulation cover plate of formation by the design size of display.

Claims

1. an organic light-emitting device encapsulation cover plate is characterized in that, comprises glass substrate (1), and glass substrate (1) is provided with groove (3) and second groove (2), and described second groove (2) is arranged in groove (3) periphery.

2. organic light-emitting device encapsulation cover plate according to claim 1 is characterized in that described second groove (2) is a groove that head and the tail communicate.

3. organic light-emitting device encapsulation cover plate as claimed in claim 1 or 2 is characterized in that the degree of depth of depth ratio second groove (2) of described groove (3) is dark.