CN107359267B - A kind of AMOLED waterproof encapsulation structure - Google Patents
A kind of AMOLED waterproof encapsulation structure Download PDFInfo
- Publication number
- CN107359267B CN107359267B CN201710409969.8A CN201710409969A CN107359267B CN 107359267 B CN107359267 B CN 107359267B CN 201710409969 A CN201710409969 A CN 201710409969A CN 107359267 B CN107359267 B CN 107359267B
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- ltps
- layer
- oled
- insulating layer
- back plane
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a kind of AMOLED waterproof encapsulation structures, including LTPS backboard, LTPS back plane circuitry layer, OLED luminous anode material layer, encapsulation cover plate, the first insulating layer and second insulating layer are respectively equipped between LTPS backboard and LTPS back plane circuitry layer, between the luminous anode material layer of LTPS back plane circuitry layer and OLED, packaged glass glue-line is equipped between LTPS backboard and encapsulation cover plate, it punches to form spaced groove at the edge of second insulating layer, the section indention at second insulating layer edge, the groove is for injecting reinforcement glue.The section at second insulating layer edge is set as zigzag, it plays a supporting role between encapsulation cover plate and LTPS backboard, by alternately injecting reinforcement glue and silica gel into each groove, reinforcement glue is improving the bond strength between encapsulation cover plate and LTPS backboard, obstruct the infiltration path of water and oxygen, and silica gel also can effectively adsorb LTPS back plane circuitry layer and the luminous anode material layer of OLED, to effectively stop the infiltration of water and oxygen, reduce its injury caused by OLED device.
Description
Technical field
The present invention relates to technical field of display panel, and in particular to a kind of AMOLED waterproof encapsulation structure.
Background technique
AMOLED, that is, active matrix organic light-emitting diode (Active-matrix organic light emitting
Diode) due to having luminous, ultra-thin active, no angle limit, rollable, high image quality, all solid state, low energy consumption and operating temperature
The innate advantages such as range is wide, therefore widely paid close attention to, and the display mode as a new generation, it is expected to become after traditional liquid
Next-generation flat panel display after crystalline substance display (LCD), is widely used in mobile phone screen, video screen, computer monitor
Equal fields.
AMOLED is to deposit OLED pixel or be integrated on tft array, and wherein OLED pixel, which has, is sequentially formed in base
LTPS back plane circuitry structure, anode, organic luminous layer and cathode on plate.However the service life of organic light emitting diode OLED short is
The main bottleneck of AMOLED industry development is restricted, and constitutes the electrode of OLED device and the organic material of luminescent layer in atmosphere
Pollutant, steam and oxygen are all very sensitive, electrochemical corrosion are easy to happen in the environment containing water, oxygen, to OLED
It is the main reason for causing the OLED service life short that device, which damages,.Therefore it needs effectively to encapsulate OLED device, to
It prevents water, oxygen from entering inside OLED, extends the service life of OLED.
Currently, there are mainly three types of AMOLED packaging methods: glass-encapsulated technology, Metal Packaging technology and thin film encapsulation technology
(TFE), wherein it is especially the most extensive with glass-encapsulated technical application, due to being inorganic encapsulated medium, so it blocks water and oxygen
It is very capable, it is particularly suitable for the OLED technology to water and oxygen sensitive, but is easy to appear gas when laser realizes frit packaging
The problems such as bubble and cracking, and frit is more fragile, can be easily separated.So AMOLED product works as base in current production process
After plate is bonded with cover-plate glass, a procedure is also added: reinforcement glue has been injected in substrate and cover-plate glass gap, further to add
Strong package strength.Usually plus reinforcement glue is to be added in the crack of base plate glass and cover-plate glass by mode for dispensing glue, is used
Routine techniques keeps dispensing and infiltration glue relatively difficult due to the gap very little between two glass.And this packaged type is once have
Oxygen and water are into then OLED service life and performance will substantially reduce.
Summary of the invention
The present invention is intended to provide a kind of AMOLED waterproof encapsulation structure, solve be conducive to encapsulation the injection of reinforcement glue,
Improve that bond strength between encapsulation cover plate and LTPS backboard, packaging effect is good, greatly reduces by the absorption property of silica gel
Effective waterproof action is played in the infiltration of water and oxygen, helps to improve the performance of OLED device, and extend OLED device uses the longevity
The technical issues of life.
The invention provides the following technical scheme:
A kind of AMOLED waterproof encapsulation structure, including the luminous anode material of LTPS backboard, LTPS back plane circuitry layer, OLED
Layer, encapsulation cover plate, between LTPS backboard and LTPS back plane circuitry layer, LTPS back plane circuitry layer and OLED shine anode material layer it
Between be respectively equipped with the first insulating layer and second insulating layer, between LTPS backboard and encapsulation cover plate be equipped with packaged glass glue-line,
The edge of the second insulating layer punches to form spaced groove, the section indention at the second insulating layer edge,
The groove is for alternately injecting reinforcement glue and silica gel.
Further, the LTPS back plane circuitry layer is OLED light emission drive circuit structure sheaf.
Further, the LTPS backboard and encapsulation cover plate are glass substrate.
Further, the spaced groove is zigzag, and for alternately injecting reinforcement glue and silica gel.
Compared with prior art, the beneficial effects of the present invention are: the present invention passes through cutting the second insulating layer edge
Face is set as zigzag, plays a supporting role between encapsulation cover plate and LTPS backboard, by alternately injecting into each groove
Reinforcement glue and silica gel, reinforcement glue obstruct water and oxygen while improving the bond strength between encapsulation cover plate and LTPS backboard
Infiltration path, and silica gel also can effectively adsorb LTPS back plane circuitry layer and OLED and shine and may seep between anode material layer
The water and oxygen entered reduces its injury caused by OLED device to effectively stop the infiltration of water and oxygen.This encapsulation side
The packaging effect of formula is good, helps to improve the performance of OLED device, extends the service life of OLED device.
Detailed description of the invention
Fig. 1 is the main view of AMOLED encapsulating structure of the present invention；
Fig. 2 is the first diagrammatic cross-section of AMOLED encapsulating structure of the present invention；
Fig. 3 is the second diagrammatic cross-section of AMOLED encapsulating structure of the present invention.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the scope of protection of the invention.
A kind of AMOLED waterproof encapsulation structure of embodiment, including LTPS backboard 1, LTPS back plane circuitry layer 2, OLED shine
Anode material layer 3, encapsulation cover plate 4, between LTPS backboard 1 and LTPS back plane circuitry layer 2, LTPS back plane circuitry layer 2 and OLED hair
The first insulating layer 12 and second insulating layer 23 are respectively equipped between optical anode material layer 3, LTPS backboard 1 and encapsulation cover plate 4 it
Between be equipped with packaged glass glue-line 14, punch to form spaced groove 13 at the edge of the second insulating layer 23, described the
The section indention at two insulating layers, 23 edge, the groove 13 is for alternately injecting reinforcement glue and silica gel.
Fig. 2,3 respectively illustrate cross-sectional view in Fig. 1 at the first hatching L1 and the second hatching L2, pass through comparison diagram 2
The second insulating layer 23 is set with Fig. 3 spaced groove that can be specifically used for replacing injection reinforcement glue gold and silica gel
Edge.
The LTPS back plane circuitry layer 2 is OLED light emission drive circuit structure sheaf.The LTPS backboard 1 and encapsulation cover plate 4
It is glass substrate.The packaged glass glue-line 14 is Frit glass glue-line, and the Frit glass glue-line shines positive around OLED
One collar region of periphery of pole material layer 3.
Knot of the film layer structure between the effective Mask of LTPS backboard process between the LTPS backboard 1 and encapsulation cover plate 4
Structure, when doing LTPS back plane circuitry, the insulating layer of isolating metal layer and metal layer or effective interlayer, including 12 He of the first insulating layer
Second insulating layer 23.
The metal layer and to have active layer be the All Layers to form LTPS back plane circuitry, and the luminous sun of OLED is provided
Pole film layer is in the present embodiment LTPS back plane circuitry layer 2 and the luminous anode material layer 3 of OLED.
The present invention can make the infiltration of glue faster more equal by the way that some incised grooves are arranged on the substrate at dispensing
It is even, and the roughness of contact surface is increased, so that the contact area of LTPS backboard 1 and 4 liang of glass substrates of encapsulation cover plate increases, mend
Potent fruit enhancing.And by the way of alternately injecting reinforcement glue and silica gel into each groove, in enhancing reinforcement packaging effect
While, because the stronger absorption property of silica gel can effectively play the effect of waterproof.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the exemplary embodiment, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit require rather than it is described illustrate to limit, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.In addition, it should be understood that although this specification is described in terms of embodiments, but it is not each
Embodiment only contains an independent technical solution, and this description of the specification is merely for the sake of clarity, this field
Technical staff should consider the specification as a whole, and the technical solutions in the various embodiments may also be suitably combined, form this
The other embodiments that field technical staff is understood that.
Claims (4)
1. a kind of AMOLED waterproof encapsulation structure, including the luminous anode material layer of LTPS backboard, LTPS back plane circuitry layer, OLED,
Encapsulation cover plate, between LTPS backboard and LTPS back plane circuitry layer, between the luminous anode material layer of LTPS back plane circuitry layer and OLED
It is respectively equipped with the first insulating layer and second insulating layer, packaged glass glue-line is equipped between LTPS backboard and encapsulation cover plate, it is special
Sign is: punching to form spaced groove at the edge of the second insulating layer, the section at the second insulating layer edge
Indention, the groove is for alternately injecting reinforcement glue and silica gel.
2. a kind of AMOLED waterproof encapsulation structure according to claim 1, it is characterised in that: the LTPS back plane circuitry layer
For OLED light emission drive circuit structure sheaf.
3. a kind of AMOLED waterproof encapsulation structure according to claim 1, it is characterised in that: the LTPS backboard and encapsulation
Cover board is glass substrate.
4. a kind of AMOLED waterproof encapsulation structure according to claim 1, it is characterised in that: the spaced groove
For zigzag, and for alternately injecting reinforcement glue and silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710409969.8A CN107359267B (en) | 2017-06-02 | 2017-06-02 | A kind of AMOLED waterproof encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710409969.8A CN107359267B (en) | 2017-06-02 | 2017-06-02 | A kind of AMOLED waterproof encapsulation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107359267A CN107359267A (en) | 2017-11-17 |
| CN107359267B true CN107359267B (en) | 2019-03-08 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109935615B (en) | 2017-12-15 | 2021-02-26 | 京东方科技集团股份有限公司 | Substrate, preparation method thereof and display panel |
| CN111176490A (en) * | 2020-02-18 | 2020-05-19 | 恩利克（浙江）智能装备有限公司 | Structure and manufacturing method of foldable AMOLED display screen |
| CN113219737B (en) * | 2021-04-20 | 2022-06-07 | 绵阳惠科光电科技有限公司 | Display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101833182B (en) * | 2010-04-13 | 2011-07-27 | 友达光电股份有限公司 | Panel display module with reinforced structure and manufacturing method thereof |
| CN205141030U (en) * | 2015-10-22 | 2016-04-06 | 信利（惠州）智能显示有限公司 | AMOLED packaging structure |
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Effective date of registration: 20201228 Address after: 230000 northeast corner of the intersection of Jiudingshan road and Kuihe Road, Xinzhan District, Hefei City, Anhui Province Patentee after: HEFEI HUIKE JINYANG TECHNOLOGY Co.,Ltd. Address before: 230000 Hefei Huike Jinyang Technology Co., Ltd., east of Jiudingshan road and north of Kuihe Road, Xinzhan District, Hefei City, Anhui Province Patentee before: HEFEI HUIKE PRECISION DIE Co.,Ltd. |