CN108417598A - The preparation method of OLED display panel, packaging method and organic film - Google Patents
The preparation method of OLED display panel, packaging method and organic film Download PDFInfo
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- CN108417598A CN108417598A CN201810097751.8A CN201810097751A CN108417598A CN 108417598 A CN108417598 A CN 108417598A CN 201810097751 A CN201810097751 A CN 201810097751A CN 108417598 A CN108417598 A CN 108417598A
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- array substrate
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- protrusion
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a kind of OLED display panels, the preparation method of packaging method and organic film, the encapsulation cover plate being oppositely arranged including array substrate and with array substrate, array substrate is equipped with pixel confining layer, it is limited by pixel confining layer in array substrate and forms multiple pixel regions, it is separated from each other by pixel confining layer between adjacent pixel region, organic film is being arranged towards the side of array substrate in encapsulation cover plate, organic film is equipped with the first protrusion in the array substrate protrusion that is positioned against of respective pixel confining layers, first protrusion with pixel confining layer against and be used to support encapsulation cover plate.The present invention replaces original interval pillar with organic film, solves the problems, such as that original interval pillar is easily fallen off and position offset, improves the impact resistance of OLED display panel.
Description
Technical field
The present invention relates to the technical fields of OLED display panel, more particularly to a kind of OLED display panel, packaging method
And the preparation method of organic film.
Background technology
As the display device of a new generation, OLED (Organic Light-Emitting Diode Display) device is
The advantage that organic light emitting display has traditional monitor incomparable, such as self-luminous do not need backlight, ultra-thin display can be achieved
Show that, power saving low with Flexible Displays, driving voltage, reaction speed are fast etc..But OLED device is very sensitive to oxygen and moisture,
It is invaded by oxygen and moisture, performance can be made to deteriorate ultimate failure.Therefore influence of the packaging technology to the OLED device service life is very big.
It is widely used at present using frit packaging method seal protection OLED device.
Existing frit packaging method as shown in Figure 1, usually first manufacture array substrate 10 and encapsulation cover plate 20, so respectively
Glass powder 30 is set between array substrate 10 and encapsulation cover plate 20 afterwards and two pieces of substrates are bonded using Frit encapsulation technologies, namely
At box.In order to make encapsulation cover plate 20 that there is certain anti-pressure ability, prevent from having an impact display effect during package sealing with laser
The Newton's ring of fruit, the prior art will usually make multiple interval pillars 4 (photo spacer), septal branch in array substrate 10
Column 4 also plays the effect of support screen body and keeping box thickness simultaneously, and current each interval pillar 4 is to be produced on pixel confining layer
On 1, then negative electrode layer 2 and PDL layers 3 are made above the pillar 4 of interval again.Since these interval pillars 4 are mutual indepedent
, interval pillar 4 after by external impacts, the interval pillar 4 in the area that is hit, which is easy to happen, to fall off and position offset, after position offset
Interval pillar 4 can pixel region 11 (open region) is caused to block, lead to the problem of falling sphere blackspot.
Invention content
In order to overcome shortcoming and defect existing in the prior art, the purpose of the present invention is to provide a kind of OLED display surfaces
The preparation method of plate, packaging method and organic film solves the problems, such as that pillar is easy to fall off causes blackspot at interval.
The purpose of the invention is achieved by the following technical solution：
The present invention provides a kind of OLED display panel, including array substrate and the cap that is oppositely arranged with array substrate
Plate, array substrate is equipped with pixel confining layer, is limited by pixel confining layer in array substrate and form multiple pixel regions, adjacent
It being separated from each other by pixel confining layer between pixel region, organic film is being arranged towards the side of array substrate in encapsulation cover plate,
Organic film is equipped with the first protrusion, the first protrusion and pixel confining layer in the array substrate protrusion that is positioned against of respective pixel confining layers
Against and support encapsulation cover plate.
Further, the first protrusion is hemisphere shape or the truncated cone or cylinder, and the top of the first protrusion is towards array substrate
And with pixel confining layer against.
Further, also there is the light of corresponding each pixel region setting to take out region, light takes out region tool on organic film
There is the second hemispherical protrusion.
Further, the height of the second protrusion is less than the height of the first protrusion.
Further, the first protrusion is circumferentially positioned at the surrounding of each pixel region, is correspondingly arranged with each pixel region
The second protrusion be multiple and mutually close arrangement.
Further, also whole face covering is provided with CPL layer in pixel region and pixel confining layer, first it is raised directly with
CPL layers of abutting contact.
The present invention also provides a kind of packaging method of OLED display panel, the method includes：
Encapsulation cover plate and array substrate are provided, being attached towards the side of array substrate in encapsulation cover plate has the first protrusion
Organic film, make first protrusion with array substrate on pixel confining layer against and support encapsulation cover plate；
Encapsulation cover plate and array substrate are packaged together using Frit materials.
The present invention also provides a kind of preparation method of organic film, the preparation method includes：
Photoresist is coated in substrate；
Photoresist is exposed using gray level mask plate, is developed, photoresist patterned is made, forms recess in photoresist
The first different pit of depth and second dimple；
The organic material of liquid is injected in the first pit and second dimple of photoresist；
Organic material heat hardening is formed into organic film, organic film forms the first protrusion in the position of corresponding first pit,
Organic film forms the second protrusion in the position of corresponding second dimple.
Advantageous effect of the present invention is：Replace original interval pillar being arranged in pixel confining layer using organic film, uses
Organic film is projected through in all the first of support encapsulation cover plate to be linked together, and is not susceptible to fall off, is improved OLED display panel
Impact resistance, and then reduce blocked caused by open region due to original interval pillar is easily fallen off with position offset
Blackspot.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of existing OLED display panel.
Fig. 2 is the structural schematic diagram of OLED display panel in first embodiment of the invention.
Fig. 3 is the vertical view of array substrate in first embodiment of the invention.
Fig. 4 is the structural schematic diagram of organic film in first embodiment of the invention.
Fig. 5 is the structural schematic diagram of OLED display panel in second embodiment of the invention.
Fig. 6 a are the packaging method schematic diagrames of OLED display panel in third embodiment of the invention.
Fig. 6 b are the making step schematic diagrames of organic film in third embodiment of the invention.
Fig. 7 a to Fig. 7 d are the manufacturing process schematic diagrames of organic film in third embodiment of the invention.
Specific implementation mode
The present invention is described in further detail in the following with reference to the drawings and specific embodiments, but is not the present invention's
Practical range is confined to this.
[first embodiment]
As shown in Fig. 2, first embodiment of the invention provides a kind of OLED display panel, including array substrate 10 and with battle array
The encapsulation cover plate 20 that row substrate 10 is oppositely arranged, array substrate 10 are equipped with pixel confining layer 1, and pixel confining layer 1 can be by gathering
Acid imide material is made up of photoetching or printing.It is limited by pixel confining layer 1 in array substrate 10 and forms multiple pixel regions 11,
Each pixel region 11 is surrounded by pixel confining layer 1, between adjacent pixel region 11 to each other by pixel confining layer 1
It separates, pixel confining layer 1 is for being isolated adjacent pixel region 11.
Organic film 5 is being arranged towards the side of array substrate 10 in encapsulation cover plate 20, and specifically, organic film 5 is to be attached to envelope
On the inner surface of capping plate 20.Organic film 5 is equipped with first in the protrusion of array substrate 10 that is positioned against of respective pixel confining layers 1
Protrusion 51, first protrusion 51 with pixel confining layer 1 against and support encapsulation cover plate 20.Organic film 5 further includes matrix 50, organic film
The first protrusion 51 on 5 is linked together by matrix 50.
In the present embodiment, each first protrusion 51 of support encapsulation cover plate 20 is arranged on organic film 5, rather than directly makes
Make on encapsulation cover plate 20, there is following reason：Since encapsulation cover plate 20 is relatively thin, it is not easy to perform etching it, when to encapsulation cover plate
20 etchings are easy to influence the intensity of encapsulation cover plate 20 when deeper；In order to be conducive to etch, the thickness of encapsulation cover plate 20 can be increased
Add, but the light extraction efficiency of OLED display panel can be influenced in this way.
Pixel region 11 is provided with anode electrode layer (not shown), organic luminous layer (not shown) and negative electrode layer 2.Have
Machine luminescent layer is for example including hole injection layer (HIL), hole transmission layer (HTL), electron transfer layer (ETL) and electron injecting layer
(EIL) the organic functions film layer such as.Pixel circuit layer (not shown) is also formed in array substrate 10, pixel circuit layer mainly wraps
Include thin film transistor (TFT) (TFT), the circuit (scan line, data line etc.) that is connected with TFT and storage, this is this field skill
Known to art personnel, this will not be repeated here.The principle of luminosity of OLED device is that semi-conducting material and luminous organic material drive in electric field
Under dynamic, pass through carrier injection and composite guide photoluminescence.Specifically, OLED device generally use ITO and metal are respectively as device
The anode and cathode of part, certain voltage driving under, electrons and holes respectively from cathode and anode be injected into electron transfer layer and
Hole transmission layer, electrons and holes pass through electron transfer layer respectively and hole transmission layer moves to luminescent layer, and in luminescent layer
It meets, form exciton and light emitting molecule is made to excite, the latter sends out visible light by radiative relaxation.
Further, also whole face covering is provided with CPL layers 3 in pixel region 11 and pixel confining layer 1.CPL(capping
Layer) i.e. light extraction material, this Refractive Index of Material is higher, and absorptivity is small, and the light to improve OLED display panel takes out effect
Rate.In the present embodiment, the first protrusion 51 directly with 3 abutting contact of CPL layers in pixel confining layer 1.
Further, the first protrusion 51 is hemisphere shape, the top of the first protrusion 51 towards array substrate 10, difference by
Contact area in the case of power between the first 51 and CPL of protrusion layers 3 is different, can improve the shock resistance energy of OLED display panel
Power.
Further, organic film 5 is equipped with light in the position of each pixel region of correspondence 11 and takes out region 55, and light takes out region
55 have the second protrusion 52, and in the present embodiment, the second protrusion 52 is hemisphere shape, and the size of the second protrusion 52 is less than the first protrusion
51 so that the height of the second protrusion 52 is less than the height of the first protrusion 51.The first protrusion 51 on organic film 5 and the second protrusion 52
It is linked together by matrix 50.
Please refer to Fig.3 and Fig. 4, Fig. 3 be pixel confining layer 1 planar structure schematic diagram, Fig. 4 be organic film 5 planar junction
Structure schematic diagram.From figure 3, it can be seen that limiting the multiple pixel regions 11, Fig. 3 for foring and being arranged in array by pixel confining layer 1
Each of rectangular white space i.e. represent a pixel region 11.From fig. 4, it can be seen that the first protrusion on organic film 5
51 are arranged in position corresponding with pixel confining layer 1, and the first protrusion 51 is circumferentially positioned at the surrounding of each pixel region 11, and
52 setting of the second protrusion on organic film 5 is corresponding with each pixel region 11 to set in position corresponding with each pixel region 11
The second protrusion 52 set is multiple and mutually close arrangement.Since the second protrusion 52 faces organic hair in each pixel region 11
The light direction of photosphere, the second hemispherical protrusion 52 can be such that light converges, and reduce light in OLED display panel
Total reflection, and then improve the light extraction efficiency of display panel.
In the present embodiment, it is, for example, dimethyl silicone polymer that making, which forms the organic material of organic film 5,
(polydimethylsiloxane, PDMS) has the characteristics that at low cost, optical clear, inertia, nontoxic and nonflammable.
As shown in Fig. 2, array substrate 10 is bonded into box by glass powder 30 with encapsulation cover plate 20 using Frit encapsulation technologies,
Frit encapsulation technologies are that glass powder is made into the solution of certain viscosity, be coated in packaged glass on, heating removal solvent, then with
Glass gluing to be packaged is burnt Frit glass powder moments to thawing using laser, to which two panels plate glass to be bonded together.
In the OLED display panel of the present embodiment, organic film 5 is arranged on encapsulation cover plate 20, and organic film 5 is towards array base
The protrusion of plate 10 is equipped with the first protrusion 51 for being used to support encapsulation cover plate 20, and the first protrusion 51 is with pixel confining layer 1 against by organic
The 51 original interval pillar 4 being arranged in pixel confining layer 1 of substitution of the first protrusion of film 5, each the of support encapsulation cover plate 20
One protrusion 51 is linked together by matrix 50, is not susceptible to fall off or position offset, and then is reduced because of original interval pillar 4 easily
It falls off and blocks blackspot caused by pixel region 11 (open region) with position offset.
[second embodiment]
As shown in figure 5, the OLED in OLED display panel and first embodiment (Fig. 2) that second embodiment of the invention provides
Display panel is essentially identical, the difference is that, in the present embodiment, the first protrusion 51 of organic film 5 is the truncated cone, the structure
Making is more simple, and similarly, technical staff can set the first protrusion 51 to its arbitrary for meeting actual demand as needed
Its shape, such as cylinder.
Remaining structure and operation principle of the present embodiment are identical with the first embodiment, and which is not described herein again.
[3rd embodiment]
As shown in figures 6 a and 6b, third embodiment of the invention provides a kind of packaging method of OLED display panel, including：
Encapsulation cover plate 20 and array substrate 10 are provided, being attached towards the side of array substrate 10 in encapsulation cover plate 20 has the
The organic film 5 of one protrusion 51, make first protrusion 51 with array substrate 10 on pixel confining layer 1 against and support encapsulation cover plate
20；
Encapsulation cover plate 20 and array substrate 10 are packaged together.
Specifically, it is made in array substrate 10 and is formed with pixel confining layer 1, anode electrode layer, organic luminous layer and cathode
Electrode layer 2 forms multiple pixel regions 11 wherein being limited by pixel confining layer 1, anode electrode layer, organic luminous layer and cathode electricity
Pole layer 2 is arranged in pixel region 11.
Specifically, when encapsulation cover plate 20 and array substrate 10 to be packaged, glass can be coated on encapsulation cover plate 20
Glass powder 30 realizes the encapsulation of array substrate 10 and encapsulation cover plate 20 by glass powder 30 using Frit encapsulation technologies.
As shown in Figure 7 a to 7 d, third embodiment of the invention also provides a kind of preparation method of organic film 5, the preparation
Method includes：
As shown in Figure 7a, photoresist 60 is coated in substrate 70；
As shown in figs. 7 a and 7b, photoresist 60 is exposed using gray level mask plate 80, developed, make 60 figure of photoresist
Case forms cup depth different the first pit 61 and second dimple 62 in photoresist 60；
As shown in Figure 7 c, the organic material of liquid is injected in the first pit 61 and second dimple 62 of photoresist 60；
As shown in figure 7d, organic material heat hardening is formed into organic film 5, wherein organic film 5 is in corresponding first pit 61
Position form the first protrusion 51, the second protrusion 52 is formed in the position of corresponding second dimple 62, in corresponding first pit, 61 He
Position other than second dimple 62 forms matrix 50, and the matrix 50 with encapsulation cover plate 20 for connecting.
The present embodiment can make the organic film 5 of different hardness by the heating different degrees of to organic material progress, with
Adapt to different OLED display panels.
Organic film 5 is arranged on encapsulation cover plate 20 packaging method of OLED display panel provided in this embodiment, organic
Film 5 is equipped with the first protrusion 51 for being used to support encapsulation cover plate 20 towards the protrusion of array substrate 10, and the first protrusion 51 is limited with pixel
CPL layers 3 on layer 1 are against by the 51 original interval pillar being arranged in pixel confining layer 1 of substitution of the first protrusion of organic film 5
4, all first protrusions 51 are all linked together by matrix 50, are solved original interval pillar 4 and are easily fallen off and position offset
Problem improves the impact resistance of OLED display panel.
The above embodiment is the embodiment of the present invention, is not intended to limit implementation and the interest field of the present invention, all
The equivalence changes and modification that the content described in the apllied protection domain of patent is made according to the present invention, should all be included in this hair
In bright scope of patent protection.
Claims (8)
1. a kind of OLED display panel, including array substrate (10) and the encapsulation cover plate that is oppositely arranged with the array substrate (10)
(20), the array substrate (10) is equipped with pixel confining layer (1), by the pixel confining layer on the array substrate (10)
(1) it limits and forms multiple pixel regions (11), between adjacent pixel region (11) to each other by the pixel confining layer (1)
It separates, which is characterized in that organic film (5), institute is being arranged towards the side of the array substrate (10) in the encapsulation cover plate (20)
The array substrate (10) protrusion that is positioned against that organic film (5) is stated in the correspondence pixel confining layer (1) is equipped with the first protrusion
(51), described first raised (51) and the pixel confining layer (1) against and support the encapsulation cover plate (20).
2. OLED display panel according to claim 1, which is characterized in that described first raised (51) be hemisphere shape or
The truncated cone or cylinder, the tops of first raised (51) towards the array substrate (10) and with the pixel confining layer (1)
Against.
3. OLED display panel according to claim 1, which is characterized in that also have on the organic film (5) corresponding every
The light of a pixel region (11) setting takes out region (55), and the light, which takes out region (55), has the second hemispherical protrusion
(52)。
4. OLED display panel according to claim 3, which is characterized in that the height of described second raised (52) is less than institute
State the height of first raised (51).
5. OLED display panel according to claim 3 or 4, which is characterized in that described first raised (51) are around setting
Surrounding in each pixel region (11), second raised (52) being correspondingly arranged with each pixel region (11) are multiple and mutual
Close arrangement.
6. OLED display panel according to claim 1, which is characterized in that the pixel region (11) and pixel limit
In given layer (1) also whole face covering be provided with CPL layer (3), it is described first protrusion (51) directly with CPL layers described (3) abutting contact.
7. a kind of packaging method of OLED display panel, which is characterized in that the method includes：
Encapsulation cover plate (20) and array substrate (10) is provided, in the encapsulation cover plate (20) towards the one of the array substrate (10)
Side attaches the organic film (5) with first raised (51), makes described first raised (51) and the picture in the array substrate (10)
Plain confining layers (1) against and support the encapsulation cover plate (20)；
The encapsulation cover plate (20) and the array substrate (10) are packaged together using Frit materials.
8. a kind of preparation method of organic film (5), which is characterized in that the preparation method includes：
Photoresist (60) is coated in substrate (70)；
The photoresist (60) is exposed using gray level mask plate (80), is developed, the photoresist (60) is made to pattern,
Cup depth different the first pit (61) and second dimple (62) are formed in the photoresist (60)；
The organic material of liquid is injected in first pit (61) and the second dimple (62) of the photoresist (60)；
The organic material heat hardening is formed into organic film (5), the organic film (5) is in correspondence first pit (61)
Position forms first raised (51), and the organic film (5) forms the second protrusion in the position of the correspondence second dimple (62)
(52)。
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