CN106449711A - Flexible AMOLED display device preparation method - Google Patents
Flexible AMOLED display device preparation method Download PDFInfo
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- CN106449711A CN106449711A CN201610947753.2A CN201610947753A CN106449711A CN 106449711 A CN106449711 A CN 106449711A CN 201610947753 A CN201610947753 A CN 201610947753A CN 106449711 A CN106449711 A CN 106449711A
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- displayer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention provides a flexible AMOLED display device preparation method, before preparing a flexible substrate on a rigid substrate, firstly forming an inorganic substance film layer with flat surface, then coating a polymer material on the inorganic substance film layer, and forming the flexible substrate, the method not only can avoid the issue of bad pits and bulges on the flexible substrate caused by residual impurities from poor rinsing of the rigid substrate surface, but also can make the flexible substrate and the rigid substrate to easily be separated in the peeling process of the flexible substrate and the rigid substrate, protects the flexible substrate from being damaged, thereby enabling the prepared flexible substrate of the flexible AMOLED display device to have relatively high degree of evenness, the method increases the water resistance and oxygen resistance performance of the flexible substrate, and guarantees the optical performance of the flexible AMOLED display device.
Description
Technical field
The present invention relates to display technology field, more particularly, to a kind of manufacture method of flexibility displayer.
Background technology
Organic Light Emitting Diode（Organic Light-Emitting Diode, OLED）Display, also referred to as Organic Electricity
Electroluminescent display, is a kind of emerging panel display apparatus, due to its have preparation process is simple, low cost, low in energy consumption, send out
Brightness height, operating temperature wide accommodation, volume are frivolous, fast response time, and are easily achieved colored display and giant-screen
Show, be easily achieved the advantages of match, be easily achieved Flexible Displays with driver ic, thus there is wide application
Prospect.
OLED can be divided into passive matrix OLED according to type of drive（Passive Matrix OLED, PMOLED）With
Active array type OLED（Active Matrix OLED, AMOLED）Two big class, i.e. direct addressin and thin film transistor (TFT)（TFT,
Thin Film Transistor）Matrix addressing two class.Wherein, AMOLED has the pixel of the arrangement in array, belongs to actively
Display type, luminous efficacy is high, is typically used as the large scale display device of fine definition.
OLED generally includes：Substrate, located at the anode on substrate, the hole injection layer on anode（Hole Inject
Layer, HIL）, the hole transmission layer on hole injection layer（Hole Transport Layer, HTL）, located at hole pass
Luminescent layer on defeated layer, the electron transfer layer on luminescent layer（Electron Transport Layer, ETL）, located at electricity
Electron injecting layer in sub- transport layer（Electron Inject Layer, EIL）, and the negative electrode on electron injecting layer.
The principle of luminosity of OLED display device be semi-conducting material and luminous organic material under electric field driven, by carrier injection and
Composite guide photoluminescence.Specifically, OLED display device generally adopts ITO pixel electrode and metal electrode respectively as the sun of device
Pole and negative electrode, under certain voltage drives, electronics and hole are injected into electron transfer layer and hole biography from negative electrode and anode respectively
Defeated layer, electronics and hole move to luminescent layer respectively through electron transfer layer and hole transmission layer, and meet in luminescent layer, shape
Become exciton and so that light emitting molecule is excited, the latter sends visible ray through radiative relaxation.
OLED and display panels（TFT-LCD）Compare, maximum advantage is exactly to prepare large scale, ultra-thin flexibility
Device, a kind of existing manufacture method of flexibility displayer, comprise the steps：
Step 1 ' as shown in figure 1, providing a glass substrate 100, described glass substrate 100 is carried out（initial
Clean）；
Step 2 ' as shown in Fig. 2 on described glass substrate 100 coating polyimide（Polyimide, PI）, be dried with
Solidification（Curing）Afterwards, form a flexible substrate 200；
Step 3 ' as shown in figure 3, thin film transistor (TFT) array is made on described flexible substrate 200（TFT Array）Layer
300, described thin film transistor array layer 300 makes OLED 400, and adopts thin film encapsulation technology（TFE）To described
OLED 400 is packaged with thin film transistor array layer 300, is formed in described flexible substrate 200 with OLED 400
Coat the encapsulating structure layer 500 of described OLED 400 and thin film transistor array layer 300 outer surface；
Step 4 ' as shown in figure 4, adopting laser lift-off technique（LLO）Technology is by described flexible substrate 200 from described glass
Peel off on substrate 100, a flexible displayer 600 is obtained.
Above-mentioned flexibility displayer manufacture method in, due to described step 1 ' in initial Clean can not
By the impurity particle on described glass substrate 100（Particle）Wash completely, lead to described glass substrate 100 surface thick
Rough, thus the flexible substrate 200 being formed on such glass substrate 100 easily produces raised and is recessed bad；And, institute
In the case of stating glass substrate 100 rough surface, described flexible substrate 200 is easily tightly combined with described glass substrate 100, leads
Cause described step 4 ' in laser lift-off processing procedure described flexible substrate 200 can not be completely exfoliated from described glass substrate 100, make
The polyimide film becoming trickle remains on described glass substrate 100, so that described flexible substrate 200 sustains damage；With
Upper two kinds of factors all can cause the degree of planarization of described flexible substrate 200 to decline, and reduces blocking water of described flexible substrate 200
Oxygen performance is so that the steam in the external world and oxygen are easily accessible in described flexibility displayer 600 to described flexible substrate 200
The thin film transistor array layer 300 of top is corroded, and the degree of planarization decline of described flexible substrate 200 also can be to soft simultaneously
The optical property of property displayer 600 impacts.
Content of the invention
It is an object of the invention to provide a kind of manufacture method of flexibility displayer, prepared flexibility can be made
The flexible substrate of displayer has higher degree of planarization, the oxygen resistance that blocks water of lifting flexible substrate, and guarantees
The optical property of flexible displayer.
For achieving the above object, the present invention provides a kind of manufacture method of flexibility displayer, comprises the steps：
Described rigid substrates are carried out by step 1, offer one rigid substrates；
Step 2, the flat inorganic matters film layer in a surface is formed on described rigid substrates；
Step 3, in described inorganic matters film layer coated polymer material, be dried with solidification after, formed a flexible substrate；
Step 4, in described flexible substrate make thin film transistor array layer, in described thin film transistor array layer make
Make OLED, and described OLED and thin film transistor array layer are packaged, in described flexible substrate and OLED device
The encapsulating structure layer coating described OLED and thin film transistor array layer outer surface is formed on part；
Step 5, described flexible substrate is peeled off from described inorganic matters film layer, a flexible displayer is obtained.
Described flexibility displayer includes flexible substrate, the thin film transistor (TFT) array in described flexible substrate
Layer, located at the OLED in described thin film transistor array layer and in described flexible substrate and OLED and cladding
Described OLED and the encapsulating structure layer of thin film transistor array layer outer surface.
In described step 1, described rigid substrates are glass substrate；In described step 2, using plasma strengthens chemical gas
Phase sedimentation forms described inorganic matters film layer.
The material of described inorganic matters film layer includes at least one in silicon nitride and silicon oxide.
Described inorganic matters film layer includes from top to bottom the first silicon nitride layer of lamination setting, silicon oxide layer and second successively
Silicon nitride layer.
The thickness of described inorganic matters film layer is 1 μm～10 μm.
Preferably, the thickness of described inorganic matters film layer is 2 μm.
In described step 3, described polymeric material is polyimides.
In described step 4, using thin film encapsulation technology, described OLED and thin film transistor array layer are packaged.
In described step 5, using laser lift-off technique, described flexible substrate is peeled off from described inorganic matters film layer.
Beneficial effects of the present invention：A kind of manufacture method of flexibility displayer that the present invention provides, by firm
Property substrate on make flexible substrate before, form the flat inorganic matters film layer in a surface first on the rigid substrate, afterwards in institute
State coated polymer material in inorganic matters film layer, form flexible substrate, rigid substrates surface can not only be avoided bad because cleaning
The impurity particle of remaining causes flexible substrate depression and raised bad problem, and can be in flexible substrate and rigid substrates
Peeling off in processing procedure makes described flexible substrate and rigid substrates can be easily separated, and protects flexible substrate from damage, so that prepared
The flexible substrate of flexible displayer has higher degree of planarization, lifts the oxygen resistance that blocks water of flexible substrate, and
Guarantee the optical property of flexible displayer.
In order to be able to be further understood that feature and the technology contents of the present invention, refer to detailed below in connection with the present invention
Illustrate and accompanying drawing, but accompanying drawing only provides and uses with reference to explanation, is not used for the present invention is any limitation as.
Brief description
Below in conjunction with the accompanying drawings, by the specific embodiment detailed description to the present invention, technical scheme will be made
And other beneficial effects are apparent.
In accompanying drawing,
Fig. 1-4 is the schematic diagram of the manufacture method of existing flexibility displayer；
Fig. 5 is the flow chart of the manufacture method of flexible displayer of the present invention；
Fig. 6 is the schematic diagram of the step 1 of manufacture method of flexible displayer of the present invention；
Fig. 7 is the schematic diagram of the step 2 of manufacture method of flexible displayer of the present invention；
Fig. 8 is the schematic diagram of the step 3 of manufacture method of flexible displayer of the present invention；
Fig. 9 is the schematic diagram of the step 4 of manufacture method of flexible displayer of the present invention；
Figure 10 is the schematic diagram of the step 5 of manufacture method of flexible displayer of the present invention.
Specific embodiment
For further illustrating the technological means and its effect that the present invention taken, being preferable to carry out below in conjunction with the present invention
Example and its accompanying drawing are described in detail.
Refer to Fig. 5, the present invention provides a kind of manufacture method of flexibility displayer, comprises the steps：
Step 1, as shown in fig. 6, providing rigid substrates 10, is carried out to described rigid substrates 10（initial
Clean）.
Specifically, in described step 1, described rigid substrates 10 are glass substrate.
Step 2 is as shown in fig. 7, form the flat inorganic matters film layer 20 in a surface on described rigid substrates 10.
Specifically, in described step 2, using plasma strengthens chemical vapour deposition technique（PECVD, Plasma
Enhanced Chemical Vapor Deposition）Form described inorganic matters film layer 20.
Described inorganic matters film layer 20 can improve the degree of planarization on described rigid substrates 10 surface, makes subsequently described firm
Property substrate 10 on the degree of planarization of flexible substrate 30 that formed improve, and be conducive to follow-up flexible substrate 30 and described rigid base
The separation of plate 10, protects described flexible substrate 30 injury-free in separation process, is further ensured that described flexible substrate 30
Degree of planarization.
Specifically, the material of described inorganic matters film layer 20 includes silicon nitride（SiNx）With silicon oxide（SiOx）In at least one
Kind.
Preferably, as shown in fig. 7, described inorganic matters film layer 20 includes from top to bottom the first silicon nitride of lamination setting successively
Layer 21, silicon oxide layer 23 and the second silicon nitride layer 22.
Specifically, the thickness of described inorganic matters film layer 20 is 1 μm～10 μm, preferably 2 μm.
Step 3 as shown in figure 8, in described inorganic matters film layer 20 coated polymer material, be dried with solidification（Curing）
Afterwards, form a flexible substrate 30.
Specifically, as the substrate of flexible displayer, described flexible substrate 30 needs to have good optical
Can, chemical-resistance and the oxygen resistance that blocks water, with ensure flexible displayer have preferable display quality with longer
Service life.
In described step 3, because flexible substrate 30 is formed in the flat inorganic matters film layer 20 in surface, be therefore obtained is soft
Property substrate 30 degree of planarization high, it is to avoid flexible substrate is caused because of the impurity particle that cleans bad remaining in rigid substrates 10 surface
30 depressions and raised bad problem, the oxygen resistance that blocks water of lifting flexible substrate 30, and guarantee the flexibility being subsequently obtained
The optical property of displayer 70.
Preferably, in described step 3, described polymeric material is polyimides（Polyimide, PI）.
Step 4 is as shown in figure 9, making thin film transistor array layer 40 in described flexible substrate 30, brilliant in described thin film
Make OLED 50 on body pipe array layer 40, and described OLED 50 and thin film transistor array layer 40 be packaged,
The described OLED of cladding 50 and thin film transistor array layer 40 appearance are formed on described flexible substrate 30 with OLED 50
The encapsulating structure layer 60 in face.
Preferably, in described step 4, described OLED 50 is formed using vapour deposition method.
Preferably, in described step 4, using thin film encapsulation technology（TFE）To described OLED 50 and thin film transistor (TFT)
Array layer 40 is packaged.
Step 5, as shown in Figure 10, described flexible substrate 30 is peeled off from described inorganic matters film layer 20, a flexibility is obtained
Displayer 70.
Specifically, described flexibility displayer 70 includes flexible substrate 30, thin in described flexible substrate 30
Film transistor array layer 40, the OLED 50 in described thin film transistor array layer 40 and located at described flexible substrate
30 with OLED 50 on and coat the encapsulating structure layer 60 of described OLED 50 and thin film transistor array layer 40 outer surface.
In described step 5, because the surface that described flexible substrate 30 is contacted with each other with described inorganic matters film layer 20 is respectively provided with
Higher degree of planarization, therefore, described in stripping process, flexible substrate 30 is easier to separate with inorganic matters film layer 20, energy
Enough avoid flexible substrate 30 to sustain damage in stripping process, so that the degree of planarization of described flexible substrate 30 is guaranteed, from
And lift the oxygen resistance that blocks water of flexible substrate 30, and guarantee the optical property of flexible displayer 70.
Specifically, in described step 5, using laser lift-off technique（LLO）By described flexible substrate 30 from described inorganic matters
Peel off in film layer 20.
In sum, the manufacture method of the flexible displayer of the present invention, by making flexibility on the rigid substrate
Before substrate, form the flat inorganic matters film layer in a surface first on the rigid substrate, apply in described inorganic matters film layer afterwards
Cover polymeric material, form flexible substrate, rigid substrates surface can not only be avoided to make because of the impurity particle cleaning bad remaining
Become flexible substrate depression and raised bad problem, and can make described in the stripping processing procedure with rigid substrates for the flexible substrate
Flexible substrate be can be easily separated with rigid substrates, protects flexible substrate from damage, so that the flexible displayer being obtained
Flexible substrate there is higher degree of planarization, the oxygen resistance that blocks water of lifting flexible substrate, and guarantee that flexible AMOLED shows
Show the optical property of device.
The above, for the person of ordinary skill of the art, can be with technology according to the present invention scheme and technology
Design is made other various corresponding changes and is deformed, and all these change and deformation all should belong to the claims in the present invention
Protection domain.
Claims (10)
1. a kind of manufacture method of flexibility displayer is it is characterised in that comprise the steps：
Described rigid substrates (10) are carried out by step 1, offer one rigid substrates (10)；
Step 2, form the flat inorganic matters film layer (20) in a surface described rigid substrates (10) are upper；
Step 3, in the upper coated polymer material of described inorganic matters film layer (20), be dried with solidification after, form a flexible substrate
(30)；
Step 4, making thin film transistor array layer (40) in described flexible substrate (30), in described thin film transistor array layer
(40) upper making OLED (50), and described OLED (50) is packaged with thin film transistor array layer (40),
Formed upper with OLED (50) of described flexible substrate (30) coats described OLED (50) and thin film transistor array layer
(40) the encapsulating structure layer (60) of outer surface；
Step 5, described flexible substrate (30) is peeled off from described inorganic matters film layer (20), a flexible displayer is obtained
(70).
2. the manufacture method of flexibility displayer as claimed in claim 1 is it is characterised in that described flexibility AMOLED shows
Show device (70) include flexible substrate (30), the thin film transistor array layer (40) in described flexible substrate (30), located at institute
State OLED (50) in thin film transistor array layer (40) and in described flexible substrate (30) with OLED (50)
And coat the encapsulating structure layer (60) of described OLED (50) and thin film transistor array layer (40) outer surface.
3. the manufacture method of flexibility displayer as claimed in claim 1 is it is characterised in that in described step 1, described
Rigid substrates (10) are glass substrate；In described step 2, using plasma enhancing chemical vapour deposition technique forms described inorganic
Thing film layer (20).
4. the manufacture method of flexibility displayer as claimed in claim 1 is it is characterised in that described inorganic matters film layer
(20) material includes at least one in silicon nitride and silicon oxide.
5. the manufacture method of flexibility displayer as claimed in claim 4 is it is characterised in that described inorganic matters film layer
(20) first silicon nitride layer (21) of lamination setting, silicon oxide layer (23) and the second silicon nitride layer successively are included from top to bottom
(22).
6. the manufacture method of flexibility displayer as claimed in claim 1 is it is characterised in that described inorganic matters film layer
(20) thickness is 1 μm～10 μm.
7. the manufacture method of flexibility displayer as claimed in claim 6 is it is characterised in that described inorganic matters film layer
(20) thickness is 2 μm.
8. the manufacture method of flexibility displayer as claimed in claim 1 is it is characterised in that in described step 3, described
Polymeric material is polyimides.
9. the manufacture method of flexibility displayer as claimed in claim 1 is it is characterised in that in described step 4, adopt
Thin film encapsulation technology is packaged with thin film transistor array layer (40) to described OLED (50).
10. the manufacture method of flexibility displayer as claimed in claim 1 is it is characterised in that in described step 5, adopt
With laser lift-off technique, described flexible substrate (30) is peeled off from described inorganic matters film layer (20).
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| CN107415333A (en) * | 2017-07-17 | 2017-12-01 | 武汉华星光电半导体显示技术有限公司 | Cured film and preparation method thereof, flexible AMOLED display device |
| CN107742628A (en) * | 2017-09-12 | 2018-02-27 | 奕瑞影像科技（太仓）有限公司 | Flexible scintillation screen, radiation image sensor and preparation method thereof |
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| WO2019051959A1 (en) * | 2017-09-18 | 2019-03-21 | 武汉华星光电半导体显示技术有限公司 | Method for manufacturing oled device, and corresponding oled device |
| WO2019109456A1 (en) * | 2017-12-05 | 2019-06-13 | 武汉华星光电半导体显示技术有限公司 | Method for fabricating flexible oled display panel |
| CN109961692A (en) * | 2017-12-26 | 2019-07-02 | 昆山维信诺科技有限公司 | Flexible display device and preparation method thereof |
| CN110056786A (en) * | 2018-01-18 | 2019-07-26 | 展晶科技(深圳)有限公司 | Bendable ultra-thin light-emitting body structure and preparation method thereof |
| US10497899B2 (en) | 2017-07-17 | 2019-12-03 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Hardening film and method of manufacturing the same, flexible AMOLED display device |
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