CN108365128A - Prepare the method and flexible display device of flexible display device - Google Patents
Prepare the method and flexible display device of flexible display device Download PDFInfo
- Publication number
- CN108365128A CN108365128A CN201810055242.9A CN201810055242A CN108365128A CN 108365128 A CN108365128 A CN 108365128A CN 201810055242 A CN201810055242 A CN 201810055242A CN 108365128 A CN108365128 A CN 108365128A
- Authority
- CN
- China
- Prior art keywords
- flexible substrate
- sacrificial layer
- laser
- inorganic sacrificial
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
This application discloses a kind of method and flexible display device preparing flexible display device, the method includes：It is sequentially prepared inorganic sacrificial layer, flexible substrate and display screen body on the rigid substrate, the binding force between the flexible substrate and the inorganic sacrificial layer is less than the binding force between the inorganic sacrificial layer and the rigid substrates；Flexible substrate is cut using laser, makes ablation contraction and inorganic sacrificial layer separation of the edge of the flexible substrate after cutting because of laser, the cutting position of laser is between the edge and the edge of the flexible substrate of the display screen body；Using mechanical external force along the contraction place at flexible substrate edge, flexible substrate and the rigid substrates are removed.This method will not make influencing for the high temperature that entire flexible substrate generated by laser, therefore will not be damaged to display screen body, not interfere with the service life of flexible display device.
Description
Technical field
The invention relates to flexible display device manufacturing technology field more particularly to a kind of preparing flexible display device
Method and flexible display device.
Background technology
Flexible display device, because volume is light and handy, can be bent, foldable, easy to carry, application is more and more extensive.It is existing
Flexible display device manufacturing process substantially：First on the rigid substrate, then on flexible substrates flexible substrate is fixed
Fixation and the techniques such as encapsulation of display screen body are carried out, and after packaging is accomplished, then under flexible substrate is removed from rigid substrates
Come, obtains flexible display device.
Currently, in the manufacturing process of flexible display device, flexible substrate is stripped down from rigid substrates common
Mode is：Laser lift-off.As shown in Figure 1, laser lift-off typically refers to scan the bottom of rigid substrates 11 using laser 14, make soft
Property substrate 12 technology peeled away with rigid substrates 11 due to ablation is shunk occurs because absorbing the heat that laser 14 generates, but at this
It, can be to flexible substrate since entire flexible substrate 12 can all absorb the high temperature that the irradiation of laser 14 generates in kind stripping mode
Display screen body 13 on 12 damages, and influences the service life of flexible display device.
Invention content
The embodiment of the present application provides a kind of method and flexible display device preparing flexible display device, existing to solve
The technical issues of technology that flexible substrate is removed from rigid substrates can damage display screen body.
In a first aspect, the embodiment of the present application provides a kind of method preparing flexible display device, the method includes：
Inorganic sacrificial layer is prepared on the rigid substrate；
Flexible substrate, the combination between the flexible substrate and the inorganic sacrificial layer are prepared on the inorganic sacrificial layer
Power is less than the binding force between the inorganic sacrificial layer and the rigid substrates；
Display screen body is prepared in the flexible substrate；
The flexible substrate is cut using laser, makes the edge of the flexible substrate after cutting because of the laser
Ablation shrink with the inorganic sacrificial layer separation；Wherein, the cutting position of the laser the edge of the display screen body with
Between the edge of the flexible substrate；
Using mechanical external force along the contraction place at the flexible substrate edge, the flexible substrate and the rigid substrates are shelled
From.
Optionally, described to prepare inorganic sacrificial layer on the rigid substrate, including：Organic polymer is prepared on the rigid substrate
Layer, prepares inorganic sacrificial layer, the combination between the flexible substrate and the inorganic sacrificial layer in the organic polymer layers
Power is less than the binding force between the organic polymer layers and the rigid substrates；Then,
It is described that the flexible substrate is cut using laser, make the edge of the flexible substrate after cutting because described in
The ablation of laser is shunk and the inorganic sacrificial layer separation, including：
The flexible substrate is cut using laser, makes the edge of the flexible substrate after cutting and described organic
The edge of polymeric layer shrinks because of the ablation of the laser and is detached with the inorganic sacrificial layer.
Optionally, the flexible substrate and/or the organic polymer layers are made of one or more in llowing group of materials：It is poly-
Polyimide PI, polyethylene, polycarbonate, poly-naphthalene dicarboxylic acid glycol ester and polyethylene terephthalate.
Optionally, the thickness of the organic polymer layers is less than the thickness of the flexible substrate.
Optionally, the thickness of the organic polymer layers is between 2 μm -10 μm.
Optionally, the thickness of the flexible substrate is between 6 μm -30 μm.
Optionally, the laser is green laser.
Optionally, the inorganic sacrificial layer is made of one or more in llowing group of materials：Silica, silicon nitride and oxidation
Aluminium.
Optionally, flexible substrate is prepared on the inorganic sacrificial layer, including：
At a temperature of 80-300 DEG C, flexible substrate is prepared on the inorganic sacrificial layer.
Second aspect, the embodiment of the present application provide a kind of flexible display device, and the flexible display device is to use first
What the method described in aspect was prepared.
At least one technical solution provided by the embodiments of the present application, before preparing flexible substrate, first on the rigid substrate
It is prepared for inorganic sacrificial layer, since the binding force between the flexible substrate and the inorganic sacrificial layer is less than the inorganic sacrificial
Binding force between layer and the rigid substrates, and since inorganic sacrificial layer with the material property of flexible substrate differs larger,
This makes adhesive force between flexible substrate and inorganic sacrificial layer itself also smaller, thus, it is only required to use laser to flexible liner
Bottom is cut, and the edge of the flexible substrate after cutting is made to be shunk under the action of the high temperature that laser generates and inorganic sacrificial
Layer separation, finally by smaller mechanical external force along the contraction place at flexible substrate edge, so that it may with by flexible substrate from rigid base
It is stripped down on plate.Without the height for as laser lift-off in the prior art, entire flexible substrate being made to be generated by laser
The influence of temperature, therefore display screen body will not be damaged, do not interfere with the service life of flexible display device.
In addition, a kind of method preparing flexible display device provided by the embodiments of the present application, need not be special, it is expensive
Laser lift-off equipment, it is only necessary to common, relatively inexpensive laser cutting device, therefore can also reduce and prepare flexible display device
Cost.
Description of the drawings
Attached drawing described herein is used for providing further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please do not constitute the improper restriction to the application for explaining the application.In the accompanying drawings：
Fig. 1 is the principle schematic for the stripping flexible display device that the prior art provides；
Fig. 2A is a kind of a kind of specific implementation mode for the method preparing flexible display device provided by the embodiments of the present application
Flow diagram；
Fig. 2 B to Fig. 2 D are a kind of method preparing flexible display device that embodiment provides shown in the application Fig. 2A
Principle schematic；
Fig. 3 is a kind of laser cutting position signal of method preparing flexible display device provided by the embodiments of the present application
Figure；
Fig. 4 A are a kind of another specific embodiment party for the method preparing flexible display device provided by the embodiments of the present application
The flow diagram of formula；
Fig. 4 B to Fig. 4 D are a kind of method preparing flexible display device that embodiment provides shown in the application Fig. 4 A
Principle schematic.
Specific implementation mode
To keep the purpose, technical scheme and advantage of the application clearer, below in conjunction with the application specific embodiment and
Technical scheme is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the application one
Section Example, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
Go out the every other embodiment obtained under the premise of creative work, shall fall in the protection scope of this application.
It can be hurtful to display screen body in order to solve the existing technology for removing flexible substrate from rigid substrates
Technical problem, the embodiment of the present application provide a kind of method and flexible display device preparing flexible display device, with reference to
Each technical solution that each embodiment of the application provides is described in detail in attached drawing.
A to Fig. 2 D is please referred to Fig.2, it is as shown in Figure 2 A, provided by the embodiments of the present application in one embodiment of the application
A method of flexible display device is prepared, may include steps of：
Step 201 prepares inorganic sacrificial layer 22 on rigid substrates 21.
Rigid substrates 21 can be the rigid substrates of routine, such as nonbreakable glass.
Inorganic sacrificial layer 22 can specifically be made of one or more in llowing group of materials：Silica, silicon nitride and oxidation
The inorganic material such as aluminium and inorganic spin-coating glass (spin on glass, SOG) are made.It is appreciated that working as inorganic sacrificial layer 22
When being made of a variety of inorganic material, inorganic sacrificial layer 22 can be specifically the lamination layer structure that each inorganic material is constituted.
In actual fabrication process, may be used the techniques such as deposition, vapor deposition, spin coating prepared on rigid substrates 21 it is inorganic sacrificial
Domestic animal layer 22.
Specifically, plasma enhanced chemical vapor deposition method (Plasma Enhanced Chemical may be used
Vapor Deposition, PECVD) inorganic sacrificial layer 22 is prepared on rigid substrates 21, preparation temperature may be provided at 80-300
℃。
Step 202 prepares flexible substrate 23 on the inorganic sacrificial layer 22.
Also, the binding force between the flexible substrate 23 and the inorganic sacrificial layer 22 is less than the inorganic sacrificial layer 22
With the binding force between the rigid substrates 21.
The flexible substrate for the flexible display device that flexible substrate 23 is as finally gone for, the purpose of the embodiment of the present application
Exactly realize the stripping of flexible substrate 23 and rigid substrates 21.The unstripped flexible display device being prepared is specifically as follows
First flexible display device 1 shown in Fig. 2 B.
Specifically, flexible substrate 23 can be made of one or more in llowing group of materials：Polyimides
(Polyimide, PI), polyethylene, makrolon (Polycarbonate, PC), poly-naphthalene dicarboxylic acid glycol ester and poly- to benzene two
The resin materials such as formic acid ethylene glycol fat.Under normal conditions, since polyimides not only has good mechanical performance but also is easy to
It prepares, it is therefore advantageous to, the material for preparing of flexible substrate 23 is specifically as follows polyimides.
In actual fabrication process, coating may be used or the techniques such as stick prepares flexible substrate on inorganic sacrificial layer 22
23。
Step 203 prepares display screen body 24 in the flexible substrate 23.
The process that display screen body 24 is prepared in flexible substrate 23 is similar with existing preparation method, and details are not described herein again.
Wherein, display screen body 24 can be specifically OLED display screen body.
Step 204 cuts the flexible substrate 23 using laser 26, makes the flexible substrate 23 after cutting
Edge is shunk because of the ablation of the laser 26 to be detached with the inorganic sacrificial layer 22.
Wherein, as shown in Figure 2 B, edge of the cutting position of laser 26 at the edge of display screen body 24 and flexible substrate 23
Between, so as to only be cut to flexible substrate 23, inorganic sacrificial layer 22 and rigid substrates 21, without to display screen body 24
It damages, shown in the dotted line in specific cutting position such as Fig. 2 B.
In practical cutting process, the incident direction of laser 26 can be vertical with the surface of flexible substrate 23, also may be used certainly
With out of plumb, but display screen body 24 cannot be damaged.
In cutting, the part edge of flexible substrate 23 both can be only cut, can also will be surround in flexible substrate 23
Whole edges in heart district domain are cut, specific to be cut one week along dashed rectangle as shown in figure 3, laser 26 may be used.It can be with
Understand, when being cut whole edges of flexible substrate 23, is more advantageous to and shells flexible substrate 23 from rigid substrates 21
From getting off.
The structure of the first after cutting, unstripped flexible display device is as shown in Figure 2 C, as can be seen that cutting from Fig. 2 C
The edge of flexible substrate 23 after cutting makes the edge of flexible substrate 23 because of the effect generation ablation contraction for the high temperature that laser generates
It is detached with inorganic sacrificial layer 22 and generates gap.
Step 205, using mechanical external force along the contraction place at 23 edge of the flexible substrate, by the flexible substrate 23 and institute
State the stripping of rigid substrates 21.
It is specific as shown in Figure 2 D, since the binding force between flexible substrate 23 and inorganic sacrificial layer 22 is less than inorganic sacrificial layer
Binding force between 22 and rigid substrates 21, and since inorganic sacrificial layer 22 with the material property of flexible substrate 23 differs larger,
This makes adhesive force between flexible substrate 23 and inorganic sacrificial layer 22 itself also smaller, therefore, in use laser to flexible liner
The edge at bottom 23 carry out cutting generate gap after, by smaller mechanical external force along 23 edge of flexible substrate contraction place to away from
Flexible substrate 23 is pullled in the direction (can be specifically the direction opposite with the incident direction of laser 26) of inorganic sacrificial layer 22, just
Flexible substrate 23 can be stripped down from rigid substrates 21, realizes the stripping of flexible substrate 23 and rigid substrates 21, finally
The second flexible display device 2 after being removed.
A kind of method preparing flexible display device provided by the embodiments of the present application, before preparing flexible substrate 23, first
Inorganic sacrificial layer 22 is prepared on rigid substrates 21, due to the binding force between flexible substrate 23 and the inorganic sacrificial layer 22
Less than the binding force between the inorganic sacrificial layer 22 and the rigid substrates 21, and due to inorganic sacrificial layer 22 and flexible liner
The material property difference at bottom 23 is larger, this makes adhesive force between flexible substrate 23 and inorganic sacrificial layer 22 itself also smaller,
Thus, it is only required to be cut to flexible substrate 23 using laser, the edge of the flexible substrate after cutting 23 is made to be generated in laser
High temperature under the action of shrink and detached with inorganic sacrificial layer 22, finally by smaller mechanical external force along 23 side of flexible substrate
The contraction place of edge, so that it may to strip down flexible substrate 23 from rigid substrates 21.Without as laser in the prior art
Influencing for the high temperature for making entire flexible substrate be generated by laser like that is removed, therefore display screen body will not be damaged, no
It can influence the service life of flexible display device.
In addition, a kind of method preparing flexible display device provided by the embodiments of the present application, need not be special, it is expensive
Laser lift-off equipment, it is only necessary to common, relatively inexpensive laser cutting device, therefore can also reduce and prepare flexible display device
Cost.
A to Fig. 4 D is please referred to Fig.4, in another embodiment of the application, as shown in Figure 4 A, the embodiment of the present application provides
A kind of method preparing flexible display device, with embodiment shown in Fig. 2A the difference is that：
Above-mentioned steps 201 can specifically include following steps：
Step 2011 prepares organic polymer layers 27 on rigid substrates 21.
Step 2012 prepares inorganic sacrificial layer 22 in the organic polymer layers 27.
Wherein, the binding force between flexible substrate 23 and inorganic sacrificial layer 22 is less than organic polymer layers 27 and rigid substrates
Binding force between 21.
It is specific as shown in Figure 4 B, organic polymer layers 27 are prepared on rigid substrates 21, and in the organic polymer layers
After preparing inorganic sacrificial layer 22 on 27, the first unstripped flexible display device 1 is obtained.
Similar with flexible substrate 23, organic polymer layers 27 can be made of one or more in llowing group of materials：Polyamides
Imines (Polyimide, PI), polyethylene, makrolon (Polycarbonate, PC), poly-naphthalene dicarboxylic acid glycol ester and poly- pair
The resin materials such as phthalic acid ethylene glycol fat.Under normal conditions, due to polyimides not only have good mechanical performance but also
It is easily prepared, it is therefore advantageous to, the material for preparing of organic polymer layers 27 is specifically as follows polyimides.
In actual fabrication process, coating may be used or the techniques such as stick prepares organic polymer on rigid substrates 21
Layer 27.
It, can at low temperature, using techniques such as deposition, vapor deposition, spin coatings in organic polymer layers in actual fabrication process
Inorganic sacrificial layer 22 is prepared on 27.Prepare inorganic sacrificial layer 22 at low temperature, on the one hand, can make inorganic sacrificial layer 22 with it is organic
The adhesive force of polymeric layer 27 is small as far as possible, and then flexible substrate 23 is made to be easier to strip down from rigid substrates 21；Separately
On the one hand, it does not influence to prepare the follow-up preparation process such as display screen body 24.
Since the decomposition temperature of polyimides is about 500 DEG C, when organic polymer layers 27 are made of polyimides
When, above-mentioned low temperature is specifically as follows the temperature less than 500 DEG C.
More specifically, plasma enhanced chemical vapor deposition method (Plasma Enhanced may be used
Chemical Vapor Deposition, PECVD) inorganic sacrificial layer 22, preparation temperature tool are prepared in organic polymer layers 27
Body can be arranged at 80-300 DEG C.
Correspondingly, in the present embodiment, above-mentioned steps 204 can specifically include：Using laser 26 to the flexible substrate
23 are cut, and the edge at the edge and the organic polymer layers 27 of the flexible substrate 23 after cutting is made, because described in
The ablation contraction of laser 26 is detached with the inorganic sacrificial layer 22.
In cutting, the part edge of flexible substrate 23 can be both cut, can also will surround the center of flexible substrate 23
Cut at whole edges in region, it will be understood that when whole edges of flexible substrate 23 are cut, be more advantageous to by
Flexible substrate 23 is stripped down from rigid substrates 21.
The structure of the first after cutting, unstripped flexible display device is as shown in Figure 4 C, from Fig. 4 C as can be seen that soft
Property substrate 23 and organic polymer layers 27 edge occur under the action of the high temperature that laser generates ablation contraction, and with it is inorganic
Sacrificial layer 22 detaches.
Further, it is not difficult to find out from Fig. 4 C, if before preparing inorganic sacrificial layer 22 on rigid substrates 21, first prepares
It, can be to flexible substrate 23,22 and of inorganic sacrificial layer when using flexible substrate 23 is cut by laser after one layer of organic polymer layers 27
Organic polymer layers 27 are cut, this can make the flexible substrate 23 and organic polymer that are attached to 22 both sides of inorganic sacrificial layer
The edge of layer 27 can be shunk in ablation under the action of the high temperature that laser generates, in flexible substrate 23 and organic polymer layers
The Separation become apparent is formed between 27, is more conducive to flexible substrate 23 and organic polymer in this way by mechanical external force
Layer 27 is peeled away, the final stripping for realizing flexible substrate 23 and rigid substrates 21, specific as shown in Figure 4 D, after finally obtaining stripping
The second flexible display device 2.
A kind of method preparing flexible display device provided by the embodiments of the present application, before preparing flexible substrate 23, first
Organic polymer layers 27 and inorganic sacrificial layer 22 are prepared on rigid substrates 21 successively, due to the flexible substrate 23 with it is described
Binding force between inorganic sacrificial layer 22 is less than the binding force between the organic polymer layers 27 and the rigid substrates 21, and
And since inorganic sacrificial layer 22 with the material property of flexible substrate 23 differs larger, this makes flexible substrate 23 and inorganic sacrificial layer
Adhesive force between 22 itself is also smaller, thus, it is only required to be cut to flexible substrate 23 using laser, makes soft after cutting
Property substrate 23 and organic polymer layers 27 edge laser generate high temperature under the action of shrink and inorganic sacrificial layer
22 separation, and apparent Separation is formed, finally by smaller mechanical external force along the contraction place at 23 edge of flexible substrate, just
Flexible substrate 23 can be stripped down from rigid substrates 21.Without as laser lift-off in the prior art, making whole
A flexible substrate is influenced by the high temperature that laser generates, therefore will not be damaged to display screen body, is not interfered with flexible aobvious
Show the service life of equipment.
Likewise, a kind of method preparing flexible display device provided by the embodiments of the present application, need not be special, it is expensive
Laser lift-off equipment, it is only necessary to common, relatively inexpensive laser cutting device, therefore can also reduce and prepare flexible display device
Cost.
In addition, in the embodiment of the present application, the thickness of organic polymer layers 27 can be less than the thickness of flexible substrate 23, with
Save the raw material for preparing organic polymer layers 27.
Specifically, the thickness of organic polymer layers 27 can be between 2 μm -10 μm.Correspondingly, the thickness of flexible substrate 23
It can be between 6 μm -30 μm.
Further more, in any embodiment of the application, the wavelength of laser 26 can be in 308-556nm.Further, due to
Flexible substrate 23 or organic polymer layers 27 have better absorptivity to green laser of the wavelength between 532-556nm, therefore,
Preferably, laser 26 is green laser.
In the another embodiment of the application, optionally, after above-mentioned steps 203, before above-mentioned steps 204, this
Applying for a kind of method preparing flexible display device that embodiment provides can also include：To the encapsulation of display screen body 24 routinely
Technique is packaged to form encapsulated layer 25, the first flexible display device 1 after being encapsulated.It is after encapsulation, not from rigid substrates
The first flexible display device 1 stripped down on 21 specifically can be as shown in Fig. 2 B and Fig. 4 B.
In addition, the embodiment of the present application also provides a kind of flexible display device, which is specifically using this
What a kind of method preparing flexible display device that application embodiment provides was prepared.
It is appreciated that since the flexible display device is specifically that a kind of flexibility for preparing provided by the embodiments of the present application is used to show
Show what the method for equipment was prepared, therefore display screen body therein is not by the broken of the high temperature of existing laser lift-off generation
It is bad so that the product yield of the flexible display device is high, display life is long.
It should be noted that the terms "include", "comprise" or its any other variant are intended to the packet of nonexcludability
Contain, so that process, method, commodity or equipment including a series of elements include not only those elements, but also includes
Other elements that are not explicitly listed, or further include for this process, method, commodity or the intrinsic element of equipment.
In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including the element
Process, method, there is also other identical elements in commodity or equipment.
Above is only an example of the present application, it is not intended to limit this application.For those skilled in the art
For, the application can have various modifications and variations.It is all within spirit herein and principle made by any modification, equivalent
Replace, improve etc., it should be included within the scope of claims hereof.
Claims (10)
1. a kind of method preparing flexible display device, which is characterized in that the method includes：
Inorganic sacrificial layer is prepared on the rigid substrate；
Flexible substrate is prepared on the inorganic sacrificial layer, the binding force between the flexible substrate and the inorganic sacrificial layer is small
Binding force between the inorganic sacrificial layer and the rigid substrates；
Display screen body is prepared in the flexible substrate；
The flexible substrate is cut using laser, makes the edge of the flexible substrate after cutting because of the burning of the laser
Erosion is shunk and the inorganic sacrificial layer separation；Wherein, the cutting position of the laser the edge of the display screen body with it is described
Between the edge of flexible substrate；
Using mechanical external force along the contraction place at the flexible substrate edge, the flexible substrate and the rigid substrates are removed.
2. according to the method described in claim 1, it is characterized in that,
It is described to prepare inorganic sacrificial layer on the rigid substrate, including：Organic polymer layers are prepared on the rigid substrate, are had described
Inorganic sacrificial layer is prepared on machine polymeric layer, the binding force between the flexible substrate and the inorganic sacrificial layer has less than described
Binding force between machine polymeric layer and the rigid substrates；
Then,
It is described that the flexible substrate is cut using laser, make the edge of the flexible substrate after cutting because of the laser
Ablation shrink with the inorganic sacrificial layer separation, including：
The flexible substrate is cut using laser, makes the edge of the flexible substrate after cutting and the organic polymer
The edge of nitride layer shrinks because of the ablation of the laser and is detached with the inorganic sacrificial layer.
3. according to the method described in claim 2, it is characterized in that,
The flexible substrate and/or the organic polymer layers are made of one or more in llowing group of materials：Polyimides PI, gather
Carbonic ester PC, polyethylene, poly-naphthalene dicarboxylic acid glycol ester and polyethylene terephthalate.
4. according to the method described in claim 2, it is characterized in that, the thickness of the organic polymer layers is less than the flexible liner
The thickness at bottom.
5. according to the method described in claim 2, it is characterized in that, the thickness of the organic polymer layers 2 μm -10 μm it
Between.
6. according to the method described in claim 2, it is characterized in that, the thickness of the flexible substrate is between 6 μm -30 μm.
7. according to the method described in claim 1, it is characterized in that,
The laser is green laser.
8. according to the method described in claim 1, it is characterized in that, the inorganic sacrificial layer is by one kind in llowing group of materials or more
Kind is made：Silica, silicon nitride and aluminium oxide.
9. according to the method described in claim 1, it is characterized in that, prepare flexible substrate on the inorganic sacrificial layer, including：
At a temperature of 80-300 DEG C, flexible substrate is prepared on the inorganic sacrificial layer.
10. a kind of flexible display device, which is characterized in that the flexible display device is using any one of claim 1-9 institute
What the method stated was prepared.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810055242.9A CN108365128B (en) | 2018-01-19 | 2018-01-19 | Prepare the method and flexible display device of flexible display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810055242.9A CN108365128B (en) | 2018-01-19 | 2018-01-19 | Prepare the method and flexible display device of flexible display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108365128A true CN108365128A (en) | 2018-08-03 |
| CN108365128B CN108365128B (en) | 2019-12-03 |
Family
ID=63006402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810055242.9A Active CN108365128B (en) | 2018-01-19 | 2018-01-19 | Prepare the method and flexible display device of flexible display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108365128B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110634403A (en) * | 2019-08-29 | 2019-12-31 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and manufacturing method thereof |
| WO2020132804A1 (en) * | 2018-12-24 | 2020-07-02 | 深圳市柔宇科技有限公司 | Electronic device and manufacturing method therefor |
| CN111627325A (en) * | 2019-02-27 | 2020-09-04 | 昆山工研院新型平板显示技术中心有限公司 | Display panel mother board, display panel and preparation method of display panel |
| CN112662259A (en) * | 2020-12-02 | 2021-04-16 | 深圳市华星光电半导体显示技术有限公司 | Water-soluble material, preparation method of flexible layer and application of flexible layer |
| WO2021082473A1 (en) * | 2019-10-31 | 2021-05-06 | 云谷（固安）科技有限公司 | Flexible display screen manufacturing method and flexible display screen on temporary substrate to be peeled |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104425320A (en) * | 2013-08-30 | 2015-03-18 | 株式会社半导体能源研究所 | Device for forming separation starting point, method for forming separation starting point, and stack manufacturing apparatus |
| CN105789440A (en) * | 2014-12-23 | 2016-07-20 | 深圳Tcl工业研究院有限公司 | Composite substrate for fabricating flexible display, fabrication method of composite substrate and fabrication method of active matrix/organic light emitting diode (AMOLED) |
| WO2017014136A1 (en) * | 2015-07-21 | 2017-01-26 | シャープ株式会社 | Device substrate, liquid crystal display device, and method for manufacturing device substrate |
| CN106449711A (en) * | 2016-10-24 | 2017-02-22 | 武汉华星光电技术有限公司 | Flexible AMOLED display device preparation method |
-
2018
- 2018-01-19 CN CN201810055242.9A patent/CN108365128B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104425320A (en) * | 2013-08-30 | 2015-03-18 | 株式会社半导体能源研究所 | Device for forming separation starting point, method for forming separation starting point, and stack manufacturing apparatus |
| CN105789440A (en) * | 2014-12-23 | 2016-07-20 | 深圳Tcl工业研究院有限公司 | Composite substrate for fabricating flexible display, fabrication method of composite substrate and fabrication method of active matrix/organic light emitting diode (AMOLED) |
| WO2017014136A1 (en) * | 2015-07-21 | 2017-01-26 | シャープ株式会社 | Device substrate, liquid crystal display device, and method for manufacturing device substrate |
| CN106449711A (en) * | 2016-10-24 | 2017-02-22 | 武汉华星光电技术有限公司 | Flexible AMOLED display device preparation method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020132804A1 (en) * | 2018-12-24 | 2020-07-02 | 深圳市柔宇科技有限公司 | Electronic device and manufacturing method therefor |
| CN111627325A (en) * | 2019-02-27 | 2020-09-04 | 昆山工研院新型平板显示技术中心有限公司 | Display panel mother board, display panel and preparation method of display panel |
| CN110634403A (en) * | 2019-08-29 | 2019-12-31 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and manufacturing method thereof |
| CN110634403B (en) * | 2019-08-29 | 2022-03-08 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and manufacturing method thereof |
| WO2021082473A1 (en) * | 2019-10-31 | 2021-05-06 | 云谷（固安）科技有限公司 | Flexible display screen manufacturing method and flexible display screen on temporary substrate to be peeled |
| CN112662259A (en) * | 2020-12-02 | 2021-04-16 | 深圳市华星光电半导体显示技术有限公司 | Water-soluble material, preparation method of flexible layer and application of flexible layer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108365128B (en) | 2019-12-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108365128B (en) | Prepare the method and flexible display device of flexible display device | |
| TWI449007B (en) | Manufacturing method for felxible display apparatus | |
| US8520180B2 (en) | Display device having transparent layer partially covered with sealant and method for fabricating same | |
| US8864540B2 (en) | Fabricating method of gas barrier substrate, organic electro-luminescent device and packaging method thereof | |
| US9096044B2 (en) | Flexible display panel and method of fabricating the same | |
| US8969128B2 (en) | Method of fabricating thin film transistor substrate and organic light emitting display device using the same | |
| TWI610433B (en) | Flat panel display, flexible substrate of the flat panel display and manufacturing method thereof | |
| CN106773206B (en) | The manufacturing method of display panel | |
| US11296285B2 (en) | Flexible substrate and method for manufacturing same, and flexible display substrate and method for manufacturing same | |
| EP3246962B1 (en) | Oled encapsulating methods and encapsulating apparatus thereof | |
| US11094894B2 (en) | Method for manufacturing a display motherboard | |
| KR20140000249A (en) | Stacked body and method for detaching stacked body | |
| KR20140095824A (en) | Methods for processing substrates | |
| JP2010188411A (en) | Resin film medium and method of manufacturing the same | |
| CN105118844A (en) | Manufacturing method for flexible display panel and flexible display panel | |
| CN106711348A (en) | Organic light-emitting display panel, preparation method thereof and display device | |
| CN111430301B (en) | Manufacturing method of flexible display panel | |
| JP2013157228A (en) | Organic el device, and manufacturing method therefor | |
| CN103107137A (en) | Manufacturing method of chip | |
| EP2116895A3 (en) | Laminated structure and image display device | |
| CN107634031B (en) | Manufacturing method of display panel | |
| CN109961692A (en) | Flexible display device and preparation method thereof | |
| CN108336245B (en) | Flexible electronic device and manufacturing method thereof | |
| KR20160066363A (en) | Organic light emitting display device and method of manufacturing the same | |
| KR102031987B1 (en) | Manufacturing method of transparent acoustic speaker using femtosecond laser treatment process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |