CN110634403A - Display panel and manufacturing method thereof - Google Patents
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- CN110634403A CN110634403A CN201910809865.5A CN201910809865A CN110634403A CN 110634403 A CN110634403 A CN 110634403A CN 201910809865 A CN201910809865 A CN 201910809865A CN 110634403 A CN110634403 A CN 110634403A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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Abstract
The embodiment of the invention relates to a display panel and a manufacturing method thereof, wherein the display panel comprises: a stress coordination layer and a flexible substrate on the stress coordination layer; the protective layer is positioned on the flexible substrate, and the flexible substrate is positioned between the protective layer and the stress coordination layer. The invention is beneficial to avoiding the problem of separation of the flexible substrate and the protective layer in the manufacturing process, thereby improving the yield of the display panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a manufacturing method thereof.
Background
In recent years, various new display technologies are developed, including 2D display technologies such as Organic Light-emitting diode (OLED) and electronic Ink (E Ink), and 3D display technologies such as Laser display (Laser display) and Light field display (Light field display).
At present, with the popularization of electronic devices and the demand of the public, flexible display panels are the key point of research of various enterprises. Flexible display panels have various advantages over conventional rigid substrate display panels, including rollability, thinness, durability, good luminance, etc.
The quality of the flexible display panel manufactured by the prior art needs to be improved.
Disclosure of Invention
The embodiment of the invention provides a display panel and a manufacturing method thereof, which can improve the yield of the display panel.
To solve the above technical problem, an embodiment of the present invention provides a display panel, including: a stress coordination layer and a flexible substrate on the stress coordination layer; the protective layer is positioned on the flexible substrate, and the flexible substrate is positioned between the protective layer and the stress coordination layer.
In addition, the protective layer comprises a first protective layer and a second protective layer, the first protective layer is positioned on the flexible substrate, the second protective layer is positioned on the first protective layer, and the hardness of the first protective layer is smaller than that of the second protective layer.
In addition, the material of the protective layer comprises one or more of silicon oxide, silicon nitride, silicon oxycarbide, silicon oxynitride or silicon oxycarbonitride; the material of the stress coordination layer comprises at least one of the material of the first protective layer or the material of the second protective layer.
Additionally, the stress coordination layer includes: a first stress coordination layer located on the substrate; and the second stress coordination layer is positioned on the first stress coordination layer, and the hardness of the second stress coordination layer is less than that of the first stress coordination layer.
In addition, the material of the first protective layer is the same as that of the second stress coordination layer, and the thickness of the first protective layer is the same as that of the second stress coordination layer; the material of the second protective layer is the same as that of the first stress coordination layer, and the thickness of the second protective layer is the same as that of the first stress coordination layer.
Correspondingly, an embodiment of the present invention further provides a method for manufacturing a display panel, including: providing a substrate; forming a stress coordination layer on the substrate; forming a flexible substrate on the stress coordination layer; forming a protective layer on the flexible substrate; after the protective layer is formed, the substrate is separated from the flexible base.
In addition, the separating the substrate from the flexible substrate specifically includes: separating the substrate from the stress coordination layer, or separating the stress coordination layer from the flexible substrate.
In addition, before the step of "forming a flexible substrate on the stress coordination layer", further comprising: forming a sacrificial layer on the stress coordination layer, the flexible substrate being formed on the sacrificial layer; the separating the substrate from the flexible base includes: and laser processing the sacrificial layer to separate the sacrificial layer from the flexible substrate.
In addition, the material of the sacrificial layer is amorphous silicon.
In addition, the thickness of the sacrificial layer is in the range of
Compared with the prior art, the technical scheme provided by the embodiment of the invention has the following advantages:
in the technical scheme, the stress coordination layer is arranged between the base plate and the flexible substrate, the protective layer and the stress coordination layer are respectively arranged on two opposite surfaces of the flexible substrate, and the stress coordination layer is used for reducing or offsetting the stress borne by the flexible substrate. Specifically, the stress applied by the protective layer to the flexible substrate and the stress applied by the stress coordination layer to the flexible substrate are mutually offset, so that the problem of deformation of the flexible substrate caused by the stress from the protective layer on the flexible substrate is avoided, the flexible substrate is prevented from being separated from the protective layer, good interface performance between the flexible substrate and the protective layer is ensured, the flexible substrate is prevented from being deformed, and the performance of the display panel can be improved.
In addition, the hardness of the second coordination layer is smaller than that of the first coordination layer, so that the stress from the stress coordination layer on the flexible substrate can be relieved, the damage probability of the flexible substrate is reduced, and the yield of the flexible substrate is improved.
In addition, the first protective layer and the second stress coordination layer are made of the same material and have the same thickness, and the second protective layer and the first stress coordination layer are made of the same material and have the same thickness, so that the stress applied to the flexible substrate by the protective layer and the stress coordination layer is the same in magnitude and opposite in direction, the total stress applied to the flexible substrate is further reduced, even the total stress applied to the flexible substrate is zero, and the performance of the display panel is further improved.
In addition, a sacrificial layer is arranged between the flexible substrate and the stress coordination layer, the sacrificial layer can absorb laser energy for stripping the substrate, and the self property of the sacrificial layer changes after the laser energy is absorbed, so that the substrate is stripped, the flexible substrate is prevented from being damaged by the laser energy, and the performance of the display panel is further improved.
Drawings
One or more embodiments are illustrated by corresponding figures in the drawings, which are not to be construed as limiting the embodiments, unless expressly stated otherwise, and the drawings are not to scale.
Fig. 1 is a schematic cross-sectional view illustrating a display panel according to an embodiment of the invention;
fig. 2 is a schematic cross-sectional view illustrating a display panel according to another embodiment of the present invention;
fig. 3 to 6 are schematic cross-sectional structure diagrams corresponding to steps of a method for manufacturing a display panel according to another embodiment of the invention;
fig. 7 to 8 are schematic cross-sectional structures corresponding to steps of a method for manufacturing a display panel according to another embodiment of the invention.
Detailed Description
The display panel includes a flexible substrate and a protection layer on the flexible substrate, wherein the flexible substrate has a larger Coefficient of Thermal Expansion (CTE) than that of the protection layer. In the existing substrate peeling method mainly adopted, a Laser Lift-off (LLO) technology is adopted to scan the display panel, part of energy output by Laser is accumulated at an interface between the flexible substrate and the substrate, and the accumulated high energy can damage the interface contact between the flexible substrate and the substrate, so that the peeling of the flexible substrate is realized. Currently, excimer lasers are often used for separation of flexible substrates.
In the above scheme, because the flexible substrate has a larger thermal expansion coefficient than the protective layer, the stress applied to the flexible substrate by the protective layer and the substrate is easily mismatched during the array high-temperature process, and the protective layer is peeled off. To this end, an embodiment of the present invention provides a display panel, in which a stress coordination layer is disposed between a substrate and a flexible substrate, and the stress coordination layer and a protection layer are respectively disposed on opposite surfaces of the flexible substrate. The invention is beneficial to avoiding the problem of separation of the flexible substrate and the protective layer, thereby improving the yield of the display panel.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention.
Referring to fig. 1, the display panel in the present embodiment includes: a stress coordination layer 12 and a flexible substrate 14 on the stress coordination layer 12; a protective layer 15, the protective layer 15 being located on the flexible substrate 14, the flexible substrate 14 being located between the protective layer 15 and the stress coordination layer 12.
Hereinafter, a display panel provided by an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
The array high temperature process includes Baking (Baking) the substrate, Curing (Curing) the encapsulation colloid, laser stripping the substrate, and subsequent Thermal Cycle (Thermal Cycle) operation. The present embodiment takes laser lift-off of a substrate as an exemplary process.
In this embodiment, the material of the stress tuning layer 12 comprises one or more of silicon oxide, silicon nitride, silicon oxycarbide, silicon oxynitride, or silicon oxycarbonitride.
In the present embodiment, the stress coordination layer 12 is a laminated structure comprising a first stress coordination layer 121 and a second stress coordination layer 122 on the first stress coordination layer 121, wherein the first stress coordination layer 121 and the second stress coordination layer 122 are made of different materials.
In this embodiment, the hardness of the second stress coordination layer 122 is less than the hardness of the first stress coordination layer 121. Thus, the flexible substrate 14 directly contacts the second stress coordination layer 122 with relatively low hardness, so that the stress from the stress coordination layer 12 on the flexible substrate 14 on the second stress coordination layer 122 can be reduced, the damage probability of the flexible substrate 14 is reduced, and the yield of the flexible substrate 14 is further improved.
Specifically, in one embodiment, the material of the second stress coordination layer 122 is silicon oxide, and the material of the first stress coordination layer 121 is silicon nitride.
It should be noted that in other embodiments, the stress coordination layer may be a single layer structure.
The flexible substrate 14 is located on the surface of the second stress coordination layer 122. The material of the flexible substrate 14 may be transparent polyimide (CPI), yellow polyimide, polyethylene terephthalate (PET), or polyethylene naphthalate (PEN). In this embodiment, the flexible substrate 14 is a transparent polyimide.
In this embodiment, the flexible substrate 14 has a protective layer 15 thereon. The material of the protective layer 15 includes one or more of silicon oxide, silicon nitride, silicon oxycarbide, silicon oxynitride, or silicon oxycarbonitride.
In the present embodiment, the protection layer 15 functions as an isolation protection and a package to prevent the flexible substrate 14 from physical damage or air corrosion in the subsequent process. It should be noted that in other embodiments, the protective layer also functions as a driver and a display.
In this embodiment, the protection layer 15 is a laminated structure, and includes a first protection layer 151 on the flexible substrate 14 and a second protection layer 152 on the first protection layer 151, where the hardness of the first protection layer 151 is less than that of the second protection layer 152. Thus, the flexible substrate 14 directly contacts the first protection layer 151 with relatively low hardness, so that the stress from the protection layer 15 on the flexible substrate 14 can be reduced, the damage probability of the flexible substrate 14 is reduced, and the yield of the flexible substrate 14 is improved.
In this embodiment, the first passivation layer 151 is made of silicon dioxide, and the second passivation layer 152 is made of silicon nitride. Wherein the thickness range of the first protection layer 151 is
For example, is
The thickness of the second passivation layer 152 is in the range of
For example, is
In this embodiment, the thickness of the first passivation layer 151 is
Thickness of the second protective layer 152Degree of
It should be noted that in other embodiments, the protective layer may have a single-layer structure.
In this embodiment, the first protection layer 151 is made of silicon dioxide, and the silicon dioxide has a thermal insulation function while playing a role in isolation protection, so that the laser energy received by the flexible substrate 14 is dissipated less, and the action time of the laser energy is prolonged. By extending the duration of the application of the laser energy while accumulating energy to peel off the flexible substrate 14, the energy density of the laser energy can be reduced appropriately, thereby reducing the ashing of the flexible substrate 14.
In this embodiment, the passivation layer 15 is a laminated structure, and the material of the stress coordination layer 12 includes at least one of the material of the first passivation layer 151 or the material of the second passivation layer 152. In other embodiments, the protective layer is a single layer structure, and the stress-tuning layer and the protective layer may comprise at least one of the same material.
In this embodiment, the material of the first protection layer 151 is the same as the material of the second stress coordination layer 122, and the thickness of the first protection layer 151 is the same as the thickness of the second stress coordination layer 122; the material of the second protection layer 152 is the same as the material of the first stress coordination layer 121, and the thickness of the second protection layer 152 is the same as the thickness of the first stress coordination layer 121. In this way, the protective layer 15 and the stress coordination layer 12 apply the same amount of stress to the flexible substrate 14 in opposite directions, thereby reducing or even counteracting the stress applied to the flexible substrate 14.
It should be noted that in other embodiments, the material of the first passivation layer may be the same as the material of the first stress coordination layer, the thickness of the first passivation layer may be the same as the thickness of the first stress coordination layer, the material of the second passivation layer may be the same as the material of the second stress coordination layer, and the thickness of the second passivation layer may be the same as the thickness of the second stress coordination layer.
In this embodiment, the stress coordination layer 12 is disposed on the side of the flexible substrate 14 opposite to the protection layer 15, so that the protection layer 15 and the stress coordination layer 12 are respectively disposed on the opposite surfaces of the flexible substrate 14; in the array high temperature process, the stress coordination layer 12 can provide a stress opposite to the stress applied to the flexible substrate 14 by the protection layer 15 for the flexible substrate 14, so as to reduce the total stress applied to the flexible substrate 14, thereby being beneficial to avoiding the problem of mismatching of the stresses from two opposite sides of the flexible substrate 14, further avoiding the protection layer 15 from being peeled off from the flexible substrate 14, and improving the yield of the display panel.
A further embodiment of the present invention further provides a display panel, which is different from the previous embodiment in that in this embodiment, the display panel further includes a sacrificial layer, and the sacrificial layer is located between the flexible substrate and the stress coordination layer. The following detailed description is made with reference to the accompanying drawings, and it should be noted that the same or corresponding features as those of the foregoing embodiments can be referred to the corresponding description of the foregoing embodiments, and will not be described below in detail.
Fig. 2 is a schematic cross-sectional view of a display panel according to another embodiment of the invention.
Referring to fig. 2, the display panel provided in the present embodiment includes: a stress coordination layer 22 and a sacrificial layer 23 on the stress coordination layer 22; a flexible substrate 24 on the sacrificial layer 23; and a protective layer 25. The sacrificial layer 23 needs to have a high absorption rate for laser light of a set wavelength to prevent the laser light from penetrating the sacrificial layer 23 to damage the flexible substrate 23. The laser may be emitted by an excimer laser; meanwhile, after the display panel is scanned by the laser with a certain intensity for a certain number of times, the adhesion strength between the sacrificial layer 23 and the flexible substrate 24 may be significantly reduced, so that the flexible substrate 24 may be peeled off from the sacrificial layer 23.
The interface adhesion strength between the sacrificial layer 23 and the flexible substrate 24 should have controllable properties, and the interface adhesion strength is controlled by changing laser scanning parameters. For example, sacrificial layer 23 may separate from flexible substrate 24 after multiple scans of a high energy density laser, while at lower energies, fewer scans, the interface adhesion strength may only decrease but still maintain some interface adhesion.
The material of the sacrificial layer 23 is amorphous silicon (a-Si). When the crystal grain of the sacrificial layer 23 is repeatedly scanned by high-energy laser for multiple times, the sacrificial layer 23 can undergo multiple recrystallization processes, and the crystalline interface can reduce Gibbs free energy increased by the action of high-energy excimer laser by forming silicon nano particles (SiNPs). The formation of the nano particles can reduce the contact area between interfaces so as to realize interface stripping, and the morphology of the silicon nano particles can be regulated and controlled by the energy and the scanning times of the excimer laser.
The thickness of the sacrificial layer 23 ranges from
For example, is
Within this thickness range, the interface contact area between the sacrificial layer 23 and the flexible substrate 24 can be changed by laser scanning, thereby achieving interface peeling; in addition, the sacrificial layer 23 is set within the thickness range, which is beneficial to reduce the influence of the sacrificial layer 23 on the stress matching of the flexible substrate 24.
It should be noted that after the sacrificial layer 23 is added, the peeling mode of the flexible substrate 24 is changed from the interface contact of the interface between the flexible substrate 24 and the stress coordination layer 22 damaged by high energy to the high energy laser, so that the particle morphology of the surface of the sacrificial layer 23 facing the flexible substrate 24 is changed, and the contact area between the interfaces is reduced by changing the particle morphology of the surface, thereby realizing the peeling. The minimum energy of the laser scan after the addition of the sacrificial layer 23 is determined by the laser energy required for the surface grain topography of the sacrificial layer 23 to change.
The laser energy required to change the surface grain topography of the sacrificial layer 23 is less than the laser energy required to break the interfacial contact between the stress coordination layer 22 and the flexible substrate 24. In the present embodiment, the laser energy for peeling the flexible substrate 24 can be reduced by 50mJ/cm after adding the sacrificial layer 232And because the peeling principle of the flexible substrate 24 is changed, the interface contact of the flexible substrate 24 is not damaged by high energy, thereby avoiding ashing of the flexible substrate 24 caused by accumulated high energy and ensuring the optical transmission performance of the flexible substrate 24.
In this embodiment, the stress coordination layer 22 is disposed on the side of the flexible substrate 24 opposite to the protection layer 25, so that the protection layer 25 and the stress coordination layer 22 are respectively disposed on the opposite surfaces of the flexible substrate 24; the stress coordination layer 22 can provide a stress opposite to the stress applied to the flexible substrate 24 by the protection layer 25 for the flexible substrate 24, so that the total stress borne by the flexible substrate 24 is reduced, the problem of stress mismatch from two opposite sides borne by the flexible substrate 24 is avoided, the protection layer 25 is prevented from being peeled off from the flexible substrate 24, and the yield of the display panel is improved.
Meanwhile, the sacrificial layer 23 is arranged between the flexible substrate 24 and the stress coordination layer 22, and the laser energy required by the change of the particle morphology on the surface of the sacrificial layer 23 is less than the laser energy required by the damage of the interface contact between the stress coordination layer 22 and the flexible substrate 24, so that the laser energy density for stripping can be properly reduced, and the influence of high-energy laser on the performance of the flexible substrate 24 is avoided; meanwhile, the addition of the sacrificial layer 23 changes the original stripping mode that interface contact is damaged by high laser energy, which is beneficial to avoiding ashing of the flexible substrate 24 due to high laser energy, and further ensures the optical transmission performance of the flexible substrate 24.
Correspondingly, an embodiment of the present invention further provides a manufacturing method for manufacturing the display panel, including: providing a substrate; forming a stress coordination layer on the substrate; forming a flexible substrate on the stress coordination layer; forming a protective layer on the flexible substrate; after the protective layer is formed, the substrate is separated from the flexible base.
A method for manufacturing a display panel according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
Fig. 3 to fig. 6 are schematic cross-sectional structures corresponding to steps of a manufacturing method of a display panel according to another embodiment of the invention.
Referring to fig. 3, a substrate 31 is provided, and a stress coordination layer 32 is formed on the substrate 31.
The substrate 31 serves as a carrier. The substrate 31 needs to have a transmittance for a predetermined wavelength, for example, quartz glass or sapphire glass can be selected for 308nm excimer laser, which has a high transmittance for 308nm ultraviolet laser.
The material of the stress coordination layer 32 comprises one or more of silicon oxide, silicon nitride, silicon oxycarbide, silicon oxynitride, or silicon oxycarbonitride.
Before forming the stress coordination layer 32 on the substrate 31, the structure, material and thickness of the protective layer to be formed later need to be determined. The stress coordination layer 32 cooperates with the subsequently formed protective layer to reduce or counteract the stress experienced by the subsequently formed flexible substrate.
In the present embodiment, the protective layer is predetermined as a laminated structure including a first protective layer on a flexible substrate to be formed later and a second protective layer on the first protective layer; the first protective layer is made of silicon dioxide, and the second protective layer is made of silicon nitride; further, the first protective layer has a thickness in the range of
For example, is
The thickness range of the second protective layer is
For example, is
In this embodiment, the thickness of the first passivation layer is
The thickness of the second protective layer is
Accordingly, the stress coordination layer 32 is formed according to a predetermined protective layer structure, material, and thickness. In the present embodiment, the stress coordination layers 32 are stacked, and the stress coordination layers 32 include a first stress coordination layer 321 on the substrate 31 and a second stress coordination layer 322 on the first stress coordination layer 321.
Wherein the material of the first stress coordination layer 321 is silicon nitride, i.e. the first stress coordination layerThe material of the stress-tuning layer 321 is the same as the material of the second passivation layer, and the thickness of the first stress-tuning layer 321 is
I.e., the first stress coordination layer 321 and the second protection layer have the same thickness; the second stress coordination layer 322 is made of silicon dioxide, i.e., the second stress coordination layer 322 is made of the same material as the first protective layer, and the thickness of the second stress coordination layer 322 is set as
I.e. the thickness of the second stress coordination layer 322 is the same as the thickness of the first protection layer.
It should be noted that in other embodiments, the stress tuning layer is a single layer structure. In addition, the thickness of the stress coordination layer and the thickness of the protective layer may be the same or different depending on the actual situation.
Referring to FIG. 4, a flexible substrate 34 is formed over the stress coordination layer 32.
In this embodiment, the flexible substrate 34 is a transparent polyimide. It is noted that in other embodiments, the flexible substrate is yellow polyimide.
Referring to fig. 5, a protective layer 35 is formed on the flexible substrate 34.
Specifically, the protective layer 35 is formed according to a predetermined structure, material, and thickness, and the protective layer 35 includes a first protective layer 351 and a second protective layer 352.
In other embodiments, the protective layer has a single-layer structure. The material of the protective layer comprises one or more of silicon oxide, silicon nitride, silicon oxycarbide, silicon oxynitride or silicon oxycarbonitride.
Referring to fig. 6, after the protective layer 35 is formed, the substrate 31 is separated from the flexible base 34.
In this embodiment, the stress coordination layer 32 is separated from the flexible base 34, and the substrate 31 is separated as the stress coordination layer 32 is separated. It should be noted that in other embodiments, the substrate 31 is separated from the stress coordination layer 32, and the stress coordination layer 32 remains on the lower surface of the flexible substrate 34.
In this embodiment, when the display panel is scanned by excimer laser along the direction from the substrate 31 to the flexible substrate 34, part of the laser energy will be accumulated at the interface between the flexible substrate 34 and the stress coordination layer 32, and the accumulated high energy will break the interface contact between the flexible substrate 34 and the stress coordination layer 32, so as to peel off the flexible substrate 34.
In this embodiment, the substrate 31 is separated from the stress coordination layer 32 by mechanical separation or the like.
Fig. 7 to 8 are schematic cross-sectional structures corresponding to steps of a method for manufacturing a display panel according to another embodiment of the invention.
It should be noted that, the same or corresponding manufacturing steps as those in the previous method embodiment may refer to corresponding descriptions in the previous method embodiment, and are not described in detail below. The method embodiment of the invention is different from the previous method embodiment in that: prior to forming the flexible substrate 44, further comprising: a sacrificial layer 43 is formed on the stress coordination layer 42 and a flexible substrate 44 is formed on the sacrificial layer 43.
Referring to FIG. 7, in this embodiment, a sacrificial layer 43 is formed on the stress coordination layer 42, the flexible substrate 44 is formed on the sacrificial layer 43, and a protective layer 45 is formed on the flexible substrate 44 prior to forming the flexible substrate 44.
The material of the sacrificial layer 43 is amorphous silicon (a-Si). When the crystal grain of the sacrificial layer 23 is repeatedly scanned by high-energy laser for many times, the amorphous silicon layer undergoes many recrystallization processes, and the crystalline interface reduces the gibbs free energy of the crystalline interface, which is increased by the action of the high-energy excimer laser, by forming silicon nano particles (SiNPs). The formation of the nano particles can reduce the contact area between interfaces so as to realize interface stripping, and the morphology of the silicon nano particles can be regulated and controlled by the energy and the scanning times of the excimer laser.
In this embodiment, the thickness of the sacrificial layer 43 is in the range of
For example, is
Referring to fig. 8, in the present embodiment, the manner of separating the substrate 41 from the flexible base 44 is: the sacrifice layer 43 is subjected to laser processing so that the sacrifice layer 43 is separated from the flexible substrate 44.
The sacrificial layer 43 undergoes multiple recrystallization processes under multiple scanning of excimer laser, and the crystal interface reduces gibbs free energy increased by the action of the sacrificial layer 43 and the excimer laser by forming silicon nanoparticles (SiNPs). The formation of silicon nanoparticles changes the surface particle morphology of the sacrificial layer 43 and simultaneously reduces the contact area of the interface between the sacrificial layer 43 and the flexible substrate 44, thereby achieving interface peeling.
In this embodiment, the contact area of the interface between the sacrificial layer 43 and the flexible substrate 44 is reduced by multiple laser scans, and when the contact area of the interface between the sacrificial layer 43 and the flexible substrate 44 is smaller than a preset threshold, the sacrificial layer 43 is peeled off from the flexible substrate 44 by mechanical separation or the like. The preset threshold is determined by the current process and the performance parameters of the flexible substrate 44, and it is ensured that the performance parameters of the flexible substrate 44 are not affected when the sacrificial layer 43 is stripped by adopting a mechanical separation method and the like.
By stripping the sacrificial layer 43 in the above manner, the time consumed by the process can be shortened and the manufacturing efficiency of the display panel can be improved without affecting the performance of the flexible substrate 44.
It should be noted that in other embodiments, the contact area of the interface between the sacrificial layer and the flexible substrate is continuously reduced by multiple laser scans until the sacrificial layer and the flexible substrate are naturally separated.
Because the laser energy required for the surface particle morphology change of the sacrificial layer 43 is less than the laser energy required for breaking the interface contact between the stress coordination layer 42 and the flexible substrate 44, after the sacrificial layer 43 is formed, the excimer laser energy density for stripping the sacrificial layer 43 can be correspondingly reduced, so that the influence of the laser energy on the performance of the flexible substrate 44 can be reduced; in addition, after the sacrificial layer 43 is formed, the principle of laser lift-off of the substrate 41 is that high laser energy breaks the contact between the stress coordination layer 42 and the flexible substrate 44, and the high laser energy is converted into the condition that the sacrificial layer 43 absorbs the laser energy, so that the contact area between the flexible substrate 44 and the interface is reduced, and because the sacrificial layer 43 absorbs the laser energy, the laser energy received by the flexible substrate 44 is weakened, thereby avoiding the flexible substrate 44 from being ashed due to the high laser energy, and ensuring the optical permeability of the flexible substrate.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A display panel, comprising:
a stress coordination layer and a flexible substrate on the stress coordination layer;
the protective layer is positioned on the flexible substrate, and the flexible substrate is positioned between the protective layer and the stress coordination layer.
2. The display panel according to claim 1, wherein the protective layer comprises a first protective layer and a second protective layer, the first protective layer is disposed on the flexible substrate, the second protective layer is disposed on the first protective layer, and a hardness of the first protective layer is less than a hardness of the second protective layer.
3. The display panel according to claim 2, wherein the material of the protective layer comprises one or more of silicon oxide, silicon nitride, silicon oxycarbide, silicon oxynitride, or silicon oxycarbonitride; the material of the stress coordination layer comprises at least one of the material of the first protective layer or the material of the second protective layer.
4. The display panel of claim 3, wherein the stress coordination layer comprises: the stress coordination layer is positioned on the first stress coordination layer, and the hardness of the second stress coordination layer is smaller than that of the first stress coordination layer.
5. The display panel of claim 4 wherein the material of the first protective layer is the same as the material of the second stress coordination layer and the thickness of the first protective layer is the same as the thickness of the second stress coordination layer; the material of the second protective layer is the same as that of the first stress coordination layer, and the thickness of the second protective layer is the same as that of the first stress coordination layer.
6. A method for manufacturing a display panel is characterized by comprising the following steps:
providing a substrate;
forming a stress coordination layer on the substrate;
forming a flexible substrate on the stress coordination layer;
forming a protective layer on the flexible substrate;
after the protective layer is formed, the substrate is separated from the flexible base.
7. The method for manufacturing a display panel according to claim 6, wherein the separating the substrate from the flexible substrate specifically includes: separating the substrate from the stress coordination layer, or separating the stress coordination layer from the flexible substrate.
8. The method of claim 6, further comprising, before the step of forming a flexible substrate over the stress coordination layer: forming a sacrificial layer on the stress coordination layer, the flexible substrate being formed on the sacrificial layer; the separating the substrate from the flexible base includes: laser processing the sacrificial layer so that the sacrificial layer is separated from the flexible substrate.
9. The method of claim 8, wherein the sacrificial layer is made of amorphous silicon.
10. The method of claim 9, wherein the sacrificial layer has a thickness in a range of
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