CN108054297A - The production method of flexible display panels - Google Patents
The production method of flexible display panels Download PDFInfo
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- CN108054297A CN108054297A CN201711322932.8A CN201711322932A CN108054297A CN 108054297 A CN108054297 A CN 108054297A CN 201711322932 A CN201711322932 A CN 201711322932A CN 108054297 A CN108054297 A CN 108054297A
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- sacrificial layer
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- display panels
- bearing plate
- flexible display
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 28
- 230000005540 biological transmission Effects 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 37
- 239000004642 Polyimide Substances 0.000 claims description 33
- 229920001721 polyimide Polymers 0.000 claims description 33
- 239000011521 glass Substances 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 5
- 230000000704 physical effect Effects 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 239000011133 lead Substances 0.000 claims description 4
- 229920002480 polybenzimidazole Polymers 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 238000009832 plasma treatment Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000005439 thermosphere Substances 0.000 claims 1
- 238000002604 ultrasonography Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention provides a kind of production method of flexible display panels, by setting sacrificial layer between rigid bearing plate and the flexible base board of flexible display panels, the sacrificial layer includes the first sacrificial layer and positioned at first sacrificial layer periphery and second sacrificial layer closely coupled with it, contacting directly for laser and flexible base board can be reduced or avoided in the setting of the sacrificial layer in laser lift-off processing procedure, reduce the possibility that flexible base board is damaged；In addition, by setting the second sacrificial layer in the first sacrificial layer periphery, the lateral transport of heat is can speed up, reduces the longitudinal direction transmission of heat, so as to which the heat generated in laser lift-off processing procedure be avoided to cause to damage to TFT layer and OLED luminescent layers, the production yield of flexible display panels is promoted.
Description
Technical field
The present invention relates to display technology field more particularly to a kind of production methods of flexible display panels.
Background technology
Organic electroluminescent (Organic Light Emitting Display, OLED) display panel is due to having flexibility
The advantages such as bent, high contrast and reaction time are short progressively substitute liquid crystal display panel (LCD), become and possess leather
The next-generation of life property shows product, and still, OLED display panel is due to its price is high and the service life is relatively short etc., limitation
Its development popularization, the yield relatively low problem in OLED display panel production process becomes always limits the important of its prices
Factor.
Flexible OLED display panel is an important branch of OLED display panel, needs first to use glass in process of production
Glass substrate forms flexibility PI (polyimides) substrates and display device layer, afterwards to it on the glass substrate as supporting substrate
Carry out laser lift-off (LLO) so that glass substrate and the separation of PI substrates.The combination of PI substrates and glass substrate and the side of separation at present
There are mainly two types of formulas：The first is：Solid PI substrates pass through releasing layer (De-bonding layer, DBL) and glass substrate
It is combined, carries out LLO afterwards, when carrying out LLO, laser spot is located at DBL so that its bonding force declines, and causes PI substrates
It is separated with glass substrate；It is for second：As shown in Figure 1, by PI liquid 310 coated on glass substrate 200, through being formed by curing with
The PI substrates 300 that glass substrate 200 is combined carry out LLO afterwards, and when carrying out LLO, the focus of laser is located at glass substrate 200
With the interface of PI substrates 300 so that the intermolecular force between the two weakens, and the two is caused to separate.
In the combination and separate mode of both the above PI substrates and glass substrate, the second way using commonplace, on
It states in the second way, is formed since PI substrates 300 are coated by PI liquid, PI substrates 300 and glass substrate 300 are closely tied
It closes, the focus of laser may reach PI substrates 300 during LLO, and PI substrates 300 are caused to damage；In addition, during LLO
The interface of PI substrates 300 and glass substrate 300 can generate amount of heat, these heats may be by PI substrates 300 to TFT layer
400 transmit with OLED luminescent layers 500, and the precision circuit inside TFT layer 400 is caused to be damaged, and organic in OLED luminescent layers 500
The heat resistance of luminescent material is poor, it is thus possible to reduce the light extraction efficiency of flexible OLED display panel and shorten its service life.
, it is necessary to carry out repeatedly round-trip LLO processing procedures particularly when the size of flexible OLED display panel is larger, so it is easier to cause
Flexible OLED display panel is damaged.
Fig. 2 causes the schematic diagram that flexible OLED display panel is damaged for laser lift-off processing procedure, as shown in Fig. 2, carrying out LLO
When, laser output section 100 is scanned from left to right, and dotted arrow direction represents heat transmission direction, LLO processes in the left figure of Fig. 2
In, the focus of laser is located at the interface of glass substrate 200 and PI substrates 300, and PI substrates 300 is easily made perforated phenomenon, Fig. 2 occur
Right figure in pattern of oval shapes in PI substrates 300 be the hole 350 represented on PI substrates 300；In addition, during LLO, heat
It can be transmitted through PI substrates 300 to TFT layer 400 and OLED luminescent layers 500, TFT layer 400 and OLED luminescent layers 500 is made to be heated
More, since TFT layer 400 is containing a large amount of precision circuits, OLED luminescent layers 500 contain luminous organic material, therefore transmit a large amount of
Heat can cause TFT layer 400 and OLED luminescent layers 500 to damage and influence its service life.
The content of the invention
It is an object of the invention to provide a kind of production methods of flexible display panels, can subtract in laser lift-off processing procedure
Less or contacting directly for laser and flexible base board is avoided, reduce the possibility that flexible base board is damaged；And the laser lift-off system of avoiding
The heat generated in journey causes to damage to TFT layer and OLED luminescent layers, promotes the production yield of flexible display panels.
To achieve the above object, the present invention provides a kind of production method of flexible display panels, includes the following steps：
Step 1 provides rigid bearing plate, and sacrificial layer is formed in the rigid bearing plate；The sacrificial layer includes first
Sacrificial layer and positioned at first sacrificial layer periphery and second sacrificial layer closely coupled with it；Second sacrificial layer is included in
Reflecting layer, Heat transmission layer and the insulated thermal insulating layer being cascading from bottom to up in the rigid bearing plate；
Step 2 forms flexible base board on the sacrificial layer；
Step 3 forms display device layer, the flexible base board and the display being positioned above on the flexible base board
Part layer collectively forms flexible display panels；
Step 4 makes the first sacrificial layer be separated with rigid bearing plate using laser lift-off processing procedure, so as to fulfill Flexible Displays face
Plate is separated in the position of the first sacrificial layer and rigid bearing plate；
Step 5 makes the second sacrificial layer be separated with rigid bearing plate by the way of physical action, so as to fulfill Flexible Displays
Panel is separated in the position of the second sacrificial layer and rigid bearing plate.
The upper surface flush of first sacrificial layer and the second sacrificial layer；The thickness of first sacrificial layer and the second sacrificial layer
Degree is 10 μm -15 μm；The rigid bearing plate is glass substrate；The material of first sacrificial layer is metal oxide.
The material in the reflecting layer includes silver；The thickness in the reflecting layer is 1 μm -2 μm.
The material of the Heat transmission layer is high heat conductance layer structure material or high heat conductivity metal material；The high fever
Conductance layer structure material is graphite or graphene；The high heat conductivity metal material includes aluminium, iron, one kind in lead or more
Kind；The thickness of the Heat transmission layer is 7 μm -10 μm.
The material of the insulated thermal insulating layer is organic insulation or inorganic insulating material；The organic insulation bag
Include polybenzimidazoles and the one or more in polyimides；The inorganic insulating material is included in silicon nitride and silica
It is one or more；The thickness of the insulated thermal insulating layer is 1 μm -2 μm.
The material of the flexible base board is polyimides；The display device layer be included on the flexible base board from down toward
On the buffer layer, TFT layer, the OLED luminescent layers that are cascading；The material of the buffer layer is included in silicon nitride and silica
One or more.
In the laser lift-off processing procedure of the step 4, the focus of laser is located at the interface of rigid bearing plate and sacrificial layer.
In the step 5, use physical action mode make the second sacrificial layer it is separated with rigid bearing plate operation for：It adopts
Insulated thermal insulating layer is cut along the direction parallel to rigid bearing plate with cutter, makes the second sacrificial layer and rigid bearing plate
It is kept completely separate.
Preferably, the production method of the flexible display panels further includes：Step 6, by sacrificial layer from flexible base board surface
Removal, removes so as to fulfill sacrificial layer from flexible display panels.
The step 6 makes sacrificial layer be removed from flexible base board surface using the method for supersound process or plasma treatment.
Beneficial effects of the present invention：The production method of the flexible display panels of the present invention passes through in rigid bearing plate and flexibility
Sacrificial layer is set between the flexible base board of display panel, and the sacrificial layer includes the first sacrificial layer and positioned at first sacrificial layer
Peripheral and second sacrificial layer closely coupled with it, the setting of the sacrificial layer can be reduced or avoided in laser lift-off processing procedure
Laser and flexible base board contact directly, and reduce the possibility that flexible base board is damaged；In addition, by being set in the first sacrificial layer periphery
The second sacrificial layer is put, can speed up the lateral transport of heat, the longitudinal direction transmission of heat is reduced, so as to avoid in laser lift-off processing procedure
The heat of generation causes to damage to TFT layer and OLED luminescent layers, promotes the production yield of flexible display panels.
In order to be further understood that the feature of the present invention and technology contents, refer to below in connection with the detailed of the present invention
Illustrate and attached drawing, however attached drawing is only provided with reference to illustrating to use, being not used for being any limitation as the present invention.
Description of the drawings
Below in conjunction with the accompanying drawings, it is described in detail by the specific embodiment to the present invention, technical scheme will be made
And other beneficial effects are apparent.
In attached drawing,
Fig. 1 is a kind of schematic diagram of generation type of existing PI substrates；
Fig. 2 causes the schematic diagram that flexible OLED display panel is damaged for laser lift-off processing procedure；
Fig. 3 is the flow chart of the production method of the flexible display panels of the present invention；
Fig. 4 is the schematic diagram of the step 1 of the production method of the flexible display panels of the present invention；
Fig. 5 is the close-up schematic view of the second sacrificial layer；
Fig. 6 is the microstructure schematic diagram of the single lamellar structure of the layer structure material for Heat transmission layer；
Fig. 7 is the schematic diagram of the step 2 of the production method of the flexible display panels of the present invention；
Fig. 8 is the schematic diagram of the step 3 of the production method of the flexible display panels of the present invention；
Fig. 9 is the schematic diagram of the step 4 of the production method of the flexible display panels of the present invention；
Figure 10 is the schematic diagram of the step 5 of the production method of the flexible display panels of the present invention；
Figure 11 is the schematic diagram of the step 6 of the production method of the flexible display panels of the present invention.
Specific embodiment
Further to illustrate the technological means and its effect of the invention taken, below in conjunction with being preferably implemented for the present invention
Example and its attached drawing are described in detail.
Referring to Fig. 3, the present invention provides a kind of production method of flexible display panels, include the following steps：
Step 1, as shown in figure 4, provide rigid bearing plate 10, in the rigid bearing plate 10 formed sacrificial layer 20；Institute
Stating sacrificial layer 20 includes the first sacrificial layer 21 and is sacrificed positioned at 21 periphery of the first sacrificial layer and closely coupled with it second
Layer 22；As shown in figure 5, second sacrificial layer 22 is included in what is be cascading from bottom to up in the rigid bearing plate 10
Reflecting layer 221, Heat transmission layer 222 and insulated thermal insulating layer 223.
Specifically, the upper surface flush of 21 and second sacrificial layer 22 of the first sacrificial layer.First sacrificial layer 21 with
The thickness of second sacrificial layer 22 is 10 μm -15 μm.
Specifically, the rigid bearing plate 10 is glass substrate.
Specifically, the material of first sacrificial layer 21 is metal oxide, such as molybdenum oxide.
Specifically, first sacrificial layer 21 can be formed at by the method for coating in rigid bearing plate 10, it can also
It is adhered to using shaping membrane material by glue material in rigid bearing plate 10.
Specifically, the reflecting layer 221 is can be to the film that laser is reflected, the material bag in the reflecting layer 221
Include reflective materials such as silver-colored (Ag).
Specifically, the thickness in the reflecting layer 221 is 1 μm -2 μm.
Specifically, the reflecting layer 221 can be formed at by the method for sputtering in rigid bearing plate 10, can also use
Shaping membrane material is adhered to by glue material in rigid bearing plate 10.
Specifically, the material of the Heat transmission layer 222 is high heat conductance layer structure material or high heat conductivity metal material
Material.
Preferably, the material of the Heat transmission layer 222 is high heat conductance layer structure material, layered structural material tool
There is two layers or more than two layers of lamellar structure, Fig. 6 illustrates the microstructure of the single lamellar structure of layer structure material.It is logical
It is high heat conductance layer structure material to cross the material selection of Heat transmission layer 222, is conducive to transmit heat in the horizontal direction, and
It is unfavorable for heat vertically to transmit, so as to which heat conduction be reduced or avoided into flexible base board 30.
Specifically, the high heat conductance layer structure material can be the layer structures carbon materials such as graphite or graphene,
From the point of view of control production cost, the high heat conductance layer structure material is preferably graphite.
Specifically, the high heat conductivity metal material includes the one or more in aluminium (Al), iron (Fe), lead (Pb).
Specifically, the thickness of the Heat transmission layer 222 is 7 μm -10 μm.
Specifically, the Heat transmission layer 222 can be adhered on reflecting layer 221 by glue material.
Specifically, the material of the insulated thermal insulating layer 223 can be organic insulation or inorganic insulating material, preferably
For organic insulation.Wherein, the organic insulation includes polybenzimidazoles (PBI) and one kind in polyimides (PI)
Or it is a variety of, the inorganic insulating material includes silicon nitride (Si3N4) and silica (SiO2) in one or more.
The insulated thermal insulating layer 223 can prevent reflecting layer 221 and Heat transmission layer 222 and the Flexible Displays face being subsequently formed
The internal circuit connection of plate 50, plays the role of insulation protection.Furthermore it is also possible to which heat is prevented to be transmitted to flexible base board 30, promote
Heat is made quickly to transmit in the horizontal direction.
Specifically, the thickness of the insulated thermal insulating layer 223 is 1 μm -2 μm.
Specifically, the insulated thermal insulating layer 223 can be adhered on Heat transmission layer 222 by glue material.
Step 2, as shown in fig. 7, on the sacrificial layer 20 formed flexible base board 30.
Specifically, the material of the flexible base board 30 is polyimides (PI).
Preferably, as shown in fig. 7, the flexible base board 30 passes through the coating polyimide precursor solution on sacrificial layer 20
It is formed after (PI liquid) 31 is cured.
Step 3, as shown in figure 8, forming display device layer 40, the flexible base board 30 and position on the flexible base board 30
Square display device layer 40 collectively forms flexible display panels 50 thereon.
Specifically, the display device layer 40 be included in be cascading from bottom to up on the flexible base board 30 it is slow
Rush layer 41, TFT layer 42, OLED luminescent layers 43.
Specifically, the material of the buffer layer 41 includes silicon nitride and the one or more in silica.
Step 4, as shown in figure 9, using laser lift-off (LLO) processing procedure the first sacrificial layer 21 is made to divide with rigid bearing plate 10
From being separated so as to fulfill flexible display panels 50 in the position of the first sacrificial layer 21 and rigid bearing plate 10.
As shown in figure 9, in the laser lift-off processing procedure of the step 4, laser output section 80 is scanned from left to right, the coke of laser
Point is located at rigid bearing plate 10 and the interface of sacrificial layer 20.
When laser exposes to the first sacrificial layer 21, the irradiation of laser cause the first sacrificial layer 21 and rigid bearing plate 10 it
Between adhesion strength decline so that rigid bearing plate 10 separates with the first sacrificial layer 21 and generates gap；When laser exposes to second
During sacrificial layer 22, due to the presence in reflecting layer 221, be irradiated to laser on the second sacrificial layer 22 can along the left figure of Fig. 9 dotted line
Arrow direction reflects away, and can so reduce the heat entered in the second sacrificial layer 22, makes the second sacrificial layer 22 and first
Larger temperature gradient is formed between sacrificial layer 21, is advantageously implemented heat between the first sacrificial layer 21 and the second sacrificial layer 22
Lateral transport.As shown in the right figure of Fig. 9, after the completion of laser lift-off processing procedure, the first sacrificial layer 21 divides with rigid bearing plate 10
It opens, contains amount of heat inside the first sacrificial layer 21 at this time, since the presence of the second sacrificial layer 22 can be such that heat is sacrificed from first
Layer 21 is largely transmitted to the second sacrificial layer 22 (direction 3), reduces heat from the first sacrificial layer 21 to flexible base board 30, TFT layer
The transmission of 42 and OLED luminescent layers 43 (direction 2) effectively prevents flexible base board 30 by damage from laser, and reduces and be transmitted to
The heat of TFT layer 42 and OLED luminescent layers 43 effectively protects flexible base board 30, TFT layer 42 and OLED luminescent layers 43.Treat that laser is shelled
It scatters and disappears and finishes from the heat that processing procedure generates, the operation of following step 5 can be carried out.
Step 5, as shown in Figure 10, the second sacrificial layer 22 is made to be separated with rigid bearing plate 10 by the way of physical action,
It is separated so as to fulfill flexible display panels 50 in the position of the second sacrificial layer 22 and rigid bearing plate 10.
Optionally, in the step 5, the second sacrificial layer 22 is made to be separated with rigid bearing plate 10 by the way of physical action
Operation be：Insulated thermal insulating layer 223 is cut along parallel to the direction of rigid bearing plate 10 using cutter, is made second sacrificial
Domestic animal layer 22 is kept completely separate with rigid bearing plate 10.
Preferably, the production method of flexible display panels of the invention further includes：As shown in figure 11, step 6, by sacrificial layer
20 remove from 30 surface of flexible base board, are removed so as to fulfill sacrificial layer 20 from flexible display panels 50.
Specifically, supersound process or the method for plasma treatment, which may be employed, in the step 6 makes sacrificial layer 20 from flexible base
30 surface of plate removes.
In conclusion the present invention provides a kind of production method of flexible display panels, by rigid bearing plate and flexibility
Sacrificial layer is set between the flexible base board of display panel, and the sacrificial layer includes the first sacrificial layer and positioned at first sacrificial layer
Peripheral and second sacrificial layer closely coupled with it, the setting of the sacrificial layer can be reduced or avoided in laser lift-off processing procedure
Laser and flexible base board contact directly, and reduce the possibility that flexible base board is damaged；In addition, by being set in the first sacrificial layer periphery
The second sacrificial layer is put, can speed up the lateral transport of heat, the longitudinal direction transmission of heat is reduced, so as to avoid in laser lift-off processing procedure
The heat of generation causes to damage to TFT layer and OLED luminescent layers, promotes the production yield of flexible display panels.
The above, for those of ordinary skill in the art, can be with technique according to the invention scheme and technology
Other various corresponding changes and deformation are made in design, and all these changes and deformation should all belong to the claims in the present invention
Protection domain.
Claims (10)
1. a kind of production method of flexible display panels, which is characterized in that include the following steps：
Step 1 provides rigid bearing plate (10), and sacrificial layer (20) is formed in the rigid bearing plate (10)；The sacrificial layer
(20) the first sacrificial layer (21) is included and positioned at first sacrificial layer (21) periphery and second sacrificial layer closely coupled with it
(22)；Second sacrificial layer (22) is included in the reflecting layer being cascading from bottom to up in the rigid bearing plate (10)
(221), Heat transmission layer (222) and insulated thermal insulating layer (223)；
Step 2 forms flexible base board (30) on the sacrificial layer (20)；
Step 3 forms display device layer (40) on the flexible base board (30), the flexible base board (30) and is positioned above
Display device layer (40) collectively form flexible display panels (50)；
Step 4 makes the first sacrificial layer (21) be separated with rigid bearing plate (10) using laser lift-off processing procedure, aobvious so as to fulfill flexibility
Show that panel (50) is separated in the position of the first sacrificial layer (21) and rigid bearing plate (10)；
Step 5 makes the second sacrificial layer (22) be separated with rigid bearing plate (10) by the way of physical action, so as to fulfill flexibility
Display panel (50) is separated in the position of the second sacrificial layer (22) and rigid bearing plate (10).
2. the production method of flexible display panels as described in claim 1, which is characterized in that first sacrificial layer (21) with
The upper surface flush of second sacrificial layer (22)；The thickness of first sacrificial layer (21) and the second sacrificial layer (22) is 10 μm-
15μm；The rigid bearing plate (10) is glass substrate；The material of first sacrificial layer (21) is metal oxide.
3. the production method of flexible display panels as described in claim 1, which is characterized in that the material of the reflecting layer (221)
Material includes silver；The thickness of the reflecting layer (221) is 1 μm -2 μm.
4. the production method of flexible display panels as described in claim 1, which is characterized in that the Heat transmission layer (222)
Material is high heat conductance layer structure material or high heat conductivity metal material；The high heat conductance layer structure material is graphite
Or graphene；The high heat conductivity metal material includes the one or more in aluminium, iron, lead；The Heat transmission layer (222)
Thickness is 7 μm -10 μm.
5. the production method of flexible display panels as described in claim 1, which is characterized in that the insulated thermal insulating layer (223)
Material be organic insulation or inorganic insulating material；The organic insulation includes polybenzimidazoles and polyimides
In one or more；The inorganic insulating material includes silicon nitride and the one or more in silica；It is described insulation every
The thickness of thermosphere (223) is 1 μm -2 μm.
6. the production method of flexible display panels as described in claim 1, which is characterized in that the material of the flexible base board (30)
Expect for polyimides；The display device layer (40) is included in what is be cascading from bottom to up on the flexible base board (30)
Buffer layer (41), TFT layer (42), OLED luminescent layers (43)；The material of the buffer layer (41) is included in silicon nitride and silica
One or more.
7. the production method of flexible display panels as described in claim 1, which is characterized in that the laser lift-off of the step 4
In processing procedure, the focus of laser is located at the interface of rigid bearing plate (10) and sacrificial layer (20).
8. the production method of flexible display panels as described in claim 1, which is characterized in that in the step 5, using physics
The mode of effect make the second sacrificial layer (22) it is separated with rigid bearing plate (10) operation be：Using cutter along parallel to rigidity
Insulated thermal insulating layer (223) is cut in the direction of loading plate (10), makes the second sacrificial layer (22) and rigid bearing plate (10) complete
It is fully separating.
9. the production method of flexible display panels as described in claim 1, which is characterized in that further include：Step 6 will sacrifice
Layer (20) is removed from flexible base board (30) surface, is removed so as to fulfill sacrificial layer (20) from flexible display panels (50).
10. the production method of flexible display panels as claimed in claim 9, which is characterized in that the step 6 is used at ultrasound
The method of reason or plasma treatment makes sacrificial layer (20) be removed from flexible base board (30) surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711322932.8A CN108054297B (en) | 2017-12-12 | 2017-12-12 | The production method of flexible display panels |
| PCT/CN2018/071849 WO2019114072A1 (en) | 2017-12-12 | 2018-01-09 | Method for manufacturing flexible display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711322932.8A CN108054297B (en) | 2017-12-12 | 2017-12-12 | The production method of flexible display panels |
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| CN108054297A true CN108054297A (en) | 2018-05-18 |
| CN108054297B CN108054297B (en) | 2019-10-11 |
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| WO (1) | WO2019114072A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109638178A (en) * | 2018-12-05 | 2019-04-16 | 武汉华星光电半导体显示技术有限公司 | Display device structure and manufacturing method |
| CN110556330A (en) * | 2019-09-12 | 2019-12-10 | 云谷（固安）科技有限公司 | supporting substrate, stripping device, flexible display panel and preparation method thereof |
| CN110634403A (en) * | 2019-08-29 | 2019-12-31 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and manufacturing method thereof |
| CN110783389A (en) * | 2019-10-31 | 2020-02-11 | 云谷（固安）科技有限公司 | Manufacturing method of flexible display screen and flexible display screen of temporary substrate to be stripped |
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| CN110783389A (en) * | 2019-10-31 | 2020-02-11 | 云谷（固安）科技有限公司 | Manufacturing method of flexible display screen and flexible display screen of temporary substrate to be stripped |
| CN111574379A (en) * | 2020-05-13 | 2020-08-25 | 深圳市华星光电半导体显示技术有限公司 | Hydrogel and preparation method thereof, flexible panel and preparation method thereof |
| CN112002740A (en) * | 2020-08-10 | 2020-11-27 | 深圳市华星光电半导体显示技术有限公司 | Substrate, separation method thereof and display panel |
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|---|---|
| WO2019114072A1 (en) | 2019-06-20 |
| CN108054297B (en) | 2019-10-11 |
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