CN106449711B - The production method of flexible displayer - Google Patents

The production method of flexible displayer Download PDF

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Publication number
CN106449711B
CN106449711B CN201610947753.2A CN201610947753A CN106449711B CN 106449711 B CN106449711 B CN 106449711B CN 201610947753 A CN201610947753 A CN 201610947753A CN 106449711 B CN106449711 B CN 106449711B
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layer
flexible substrate
displayer
inorganic matter
flexible
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CN106449711A (en
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李朝
邱立峯
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The present invention provides a kind of production method of flexible displayer, by before making flexible substrate on the rigid substrate, form the flat inorganic matter film layer in a surface on the rigid substrate first, the coated polymer material in the inorganic matter film layer later, form flexible substrate, it can not only avoid the problem that flexible substrate is recessed and protrusion is bad caused by impurity particle of the rigid substrates surface because cleaning bad remaining, and the flexible substrate and rigid substrates can be made to can be easily separated in the removing processing procedure of flexible substrate and rigid substrates, protect flexible substrate from damage, to make the flexible substrate degree of planarization with higher of flexible displayer obtained, promote the oxygen resistance that blocks water of flexible substrate, and ensure the optical property of flexible displayer.

Description

The production method of flexible displayer
Technical field
The present invention relates to field of display technology more particularly to a kind of production methods of flexible displayer.
Background technique
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display, also referred to as Organic Electricity Electroluminescent display is a kind of emerging panel display apparatus, since it is simple with preparation process, at low cost, low in energy consumption, hair Brightness height, operating temperature wide adaptation range, volume be frivolous, fast response time, and is easily achieved colored display and large screen It shows, be easily achieved and match with driver ic, be easily achieved the advantages that Flexible Displays, thus there is wide application Prospect.
OLED can be divided into passive matrix OLED(Passive Matrix OLED, PMOLED according to driving method) and Active array type OLED(Active Matrix OLED, AMOLED) two major classes, i.e., directly addressing and thin film transistor (TFT) (TFT, Thin Film Transistor) two class of matrix addressing.Wherein, AMOLED has the pixel in array arrangement, belongs to actively Display type, luminous efficacy is high, is typically used as large scale display device high-definition.
OLED is generally included: substrate, the anode on substrate, hole injection layer (the Hole Inject on anode Layer, HIL), the hole transmission layer (Hole Transport Layer, HTL) on hole injection layer, be set to hole pass Luminescent layer on defeated layer, is set to electricity at the electron transfer layer on luminescent layer (Electron Transport Layer, ETL) Electron injecting layer (Electron Inject Layer, EIL) in sub- transport layer and the cathode on electron injecting layer. The principle of luminosity of OLED display device is semiconductor material and luminous organic material under electric field driven, by carrier injection and Composite guide photoluminescence.Specifically, OLED display device generallys use ITO pixel electrode and metal electrode respectively as the sun of device Pole and cathode, under certain voltage driving, electrons and holes are injected into electron transfer layer from cathode and anode respectively and hole passes Defeated layer, electrons and holes pass through electron transfer layer respectively and hole transmission layer moves to luminescent layer, and meet in luminescent layer, shape At exciton and excite light emitting molecule, the latter issues visible light by radiative relaxation.
For OLED compared with liquid crystal display panel (TFT-LCD), maximum advantage is exactly that can prepare large scale, ultra-thin flexibility A kind of device, existing production method of flexible displayer, includes the following steps:
Step 1 ', as shown in Figure 1, provide a glass substrate 100, (initial is cleaned to the glass substrate 100 Clean);
Step 2 ', as shown in Fig. 2, on the glass substrate 100 coating polyimide (Polyimide, PI), it is dry with After solidifying (Curing), a flexible substrate 200 is formed;
Step 3 ', as shown in figure 3, in the flexible substrate 200 make thin film transistor (TFT) array (TFT Array) layer 300, OLED device 400 is made in the thin film transistor array layer 300, and using thin film encapsulation technology (TFE) to described OLED device 400 is packaged with thin film transistor array layer 300, is formed in the flexible substrate 200 and OLED device 400 Coat the encapsulating structure layer 500 of the OLED device 400 and 300 outer surface of thin film transistor array layer;
Step 4 ', as shown in figure 4, using laser lift-off technique (LLO) technology by the flexible substrate 200 from the glass It is removed on substrate 100, a flexible displayer 600 is made.
It is above-mentioned flexibility displayer production method in, due to the step 1 ' in initial Clean cannot Impurity particle (Particle) on the glass substrate 100 is washed completely, causes 100 surface of glass substrate thick It is rough, so that the flexible substrate 200 formed on such glass substrate 100 is easy to produce protrusion and is recessed bad;Also, institute In the case where stating 100 rough surface of glass substrate, the flexible substrate 200 is easy to be tightly combined with the glass substrate 100, leads Cause the step 4 ' in laser lift-off processing procedure the flexible substrate 200 cannot be completely exfoliated from the glass substrate 100, make Remain on the glass substrate 100 at subtle polyimide film, so that the flexible substrate 200 be made to be damaged;With Upper two kinds of factors can cause the degree of planarization of the flexible substrate 200 to decline, and reduce blocking water for the flexible substrate 200 Oxygen performance, so that extraneous steam and oxygen is easily accessible in the flexible displayer 600 to the flexible substrate 200 The thin film transistor array layer 300 of top is corroded, while the degree of planarization decline of the flexible substrate 200 also can be to soft The optical property of property displayer 600 impacts.
Summary of the invention
The purpose of the present invention is to provide a kind of production methods of flexible displayer, can make flexibility obtained The flexible substrate of displayer degree of planarization with higher, promotes the oxygen resistance that blocks water of flexible substrate, and ensures The optical property of flexible displayer.
To achieve the above object, the present invention provides a kind of production method of flexible displayer, includes the following steps:
Step 1 provides a rigid substrates, cleans to the rigid substrates;
Step 2 forms the flat inorganic matter film layer in a surface on the rigid substrates;
Step 3, the coated polymer material in the inorganic matter film layer, it is dry with after solidification, form a flexible substrate;
Step 4 makes thin film transistor array layer in the flexible substrate, makes in the thin film transistor array layer Make OLED device, and the OLED device is packaged with thin film transistor array layer, in the flexible substrate and OLED device The encapsulating structure layer for coating the OLED device and thin film transistor array layer outer surface is formed on part;
Step 5 removes the flexible substrate from the inorganic matter film layer, and a flexible displayer is made.
The flexibility displayer includes flexible substrate, the thin film transistor (TFT) array in the flexible substrate It layer, the OLED device in the thin film transistor array layer and is set in the flexible substrate and OLED device and coats The encapsulating structure layer of the OLED device and thin film transistor array layer outer surface.
In the step 1, the rigid substrates are glass substrate;In the step 2, using plasma enhances chemical gas Phase sedimentation forms the inorganic matter film layer.
The material of the inorganic matter film layer includes at least one of silicon nitride and silica.
The inorganic matter film layer includes the first silicon nitride layer that successively lamination is arranged from top to bottom, silicon oxide layer and second Silicon nitride layer.
The inorganic matter film layer with a thickness of 1 μm~10 μm.
Preferably, the inorganic matter film layer with a thickness of 2 μm.
In the step 3, the polymer material is polyimides.
In the step 4, the OLED device is packaged with thin film transistor array layer using thin film encapsulation technology.
In the step 5, the flexible substrate is removed from the inorganic matter film layer using laser lift-off technique.
Beneficial effects of the present invention: a kind of production method of flexible displayer provided by the invention, by rigid Property substrate on make flexible substrate before, the flat inorganic matter film layer in a surface is formed on the rigid substrate first, later in institute Coated polymer material in inorganic matter film layer is stated, flexible substrate is formed, rigid substrates surface can not only be avoided bad because cleaning The impurity particle of remaining causes flexible substrate recess and the bad problem of protrusion, and can be in flexible substrate and rigid substrates It can be easily separated the flexible substrate and rigid substrates in removing processing procedure, protect flexible substrate from damage, to make obtained The flexible substrate of flexible displayer degree of planarization with higher promotes the oxygen resistance that blocks water of flexible substrate, and Ensure the optical property of flexible displayer.
For further understanding of the features and technical contents of the present invention, it please refers to below in connection with of the invention detailed Illustrate and attached drawing, however, the drawings only provide reference and explanation, is not intended to limit the present invention.
Detailed description of the invention
With reference to the accompanying drawing, by the way that detailed description of specific embodiments of the present invention, technical solution of the present invention will be made And other beneficial effects are apparent.
In attached drawing,
Fig. 1-4 is the schematic diagram of the production method of existing flexible displayer;
Fig. 5 is the flow chart of the production method of flexible displayer of the invention;
Fig. 6 is the schematic diagram of the step 1 of the production method of flexible displayer of the invention;
Fig. 7 is the schematic diagram of the step 2 of the production method of flexible displayer of the invention;
Fig. 8 is the schematic diagram of the step 3 of the production method of flexible displayer of the invention;
Fig. 9 is the schematic diagram of the step 4 of the production method of flexible displayer of the invention;
Figure 10 is the schematic diagram of the step 5 of the production method of flexible displayer of the invention.
Specific embodiment
Further to illustrate technological means and its effect adopted by the present invention, below in conjunction with preferred implementation of the invention Example and its attached drawing are described in detail.
Referring to Fig. 5, the present invention provides a kind of production method of flexible displayer, include the following steps:
Step 1, as shown in fig. 6, provide a rigid substrates 10, (initial is cleaned to the rigid substrates 10 Clean).
Specifically, the rigid substrates 10 are glass substrate in the step 1.
Step 2, as shown in fig. 7, forming the flat inorganic matter film layer 20 in a surface on the rigid substrates 10.
Specifically, using plasma enhances chemical vapour deposition technique (PECVD, Plasma in the step 2 Enhanced Chemical Vapor Deposition) form the inorganic matter film layer 20.
The degree of planarization on 10 surface of rigid substrates can be improved in the inorganic matter film layer 20, makes subsequent described rigid Property substrate 10 on the degree of planarization of flexible substrate 30 that is formed improve, and be conducive to subsequent flexible substrate 30 and the rigid base The separation of plate 10 protects the flexible substrate 30 injury-free during the separation process, is further ensured that the flexible substrate 30 Degree of planarization.
Specifically, the material of the inorganic matter film layer 20 includes silicon nitride (SiNx) and silica (SiOx) at least one Kind.
Preferably, as shown in fig. 7, the inorganic matter film layer 20 includes the first silicon nitride that successively lamination is arranged from top to bottom Layer 21, silicon oxide layer 23 and the second silicon nitride layer 22.
Specifically, the inorganic matter film layer 20 with a thickness of 1 μm~10 μm, preferably 2 μm.
Step 3, as shown in figure 8, in the inorganic matter film layer 20 coated polymer material, it is dry with solidification (Curing) Afterwards, a flexible substrate 30 is formed.
Specifically, the substrate as flexible displayer, the flexible substrate 30 needs to have good optical Can, chemical-resistance and the oxygen resistance that blocks water, with guarantee flexible displayer have preferable display quality with it is longer Service life.
It is obtained soft since flexible substrate 30 is formed in the flat inorganic matter film layer 20 in surface in the step 3 Property substrate 30 degree of planarization it is high, avoid flexible substrate caused by impurity particle of 10 surface of rigid substrates because cleaning bad remaining 30 recess and raised bad problem, promote the oxygen resistance that blocks water of flexible substrate 30, and ensure subsequent obtained flexible The optical property of displayer 70.
Preferably, in the step 3, the polymer material is polyimides (Polyimide, PI).
Step 4, as shown in figure 9, make thin film transistor array layer 40 in the flexible substrate 30, it is brilliant in the film OLED device 50 is made on body pipe array layer 40, and the OLED device 50 is packaged with thin film transistor array layer 40, The OLED device 50 and 40 appearance of thin film transistor array layer are coated in the flexible substrate 30 and formation in OLED device 50 The encapsulating structure layer 60 in face.
Preferably, in the step 4, the OLED device 50 is formed using vapour deposition method.
Preferably, in the step 4, using thin film encapsulation technology (TFE) to the OLED device 50 and thin film transistor (TFT) Array layer 40 is packaged.
Step 5, as shown in Figure 10, the flexible substrate 30 is removed from the inorganic matter film layer 20, it is flexible to be made one Displayer 70.
Specifically, the flexibility displayer 70 includes flexible substrate 30, thin in the flexible substrate 30 Film transistor array layer 40, the OLED device 50 in the thin film transistor array layer 40 and be set to the flexible substrate 30 in OLED device 50 and the encapsulating structure layer 60 of the cladding OLED device 50 and 40 outer surface of thin film transistor array layer.
In the step 5, since the surface that the flexible substrate 30 contacts with each other with the inorganic matter film layer 20 all has Higher degree of planarization, therefore, the flexible substrate 30 described in stripping process are easier to separate with inorganic matter film layer 20, energy It enough avoids flexible substrate 30 from being damaged in stripping process, the degree of planarization of the flexible substrate 30 is made to be guaranteed, from And the oxygen resistance that blocks water of flexible substrate 30 is promoted, and ensure the optical property of flexible displayer 70.
Specifically, in the step 5, using laser lift-off technique (LLO) by the flexible substrate 30 from the inorganic matter It is removed in film layer 20.
In conclusion the production method of flexible displayer of the invention, by making flexibility on the rigid substrate Before substrate, forms the flat inorganic matter film layer in a surface on the rigid substrate first, applied in the inorganic matter film layer later Polymer material is covered, flexible substrate is formed, rigid substrates surface can not only be avoided to make because cleaning the impurity particle of bad remaining At the bad problem of flexible substrate recess and protrusion, and can make in the removing processing procedure of flexible substrate and rigid substrates described Flexible substrate can be easily separated with rigid substrates, protect flexible substrate from damage, to make flexible displayer obtained Flexible substrate degree of planarization with higher, promote the oxygen resistance that blocks water of flexible substrate, and ensure that flexible AMOLED is aobvious Show the optical property of device.
The above for those of ordinary skill in the art can according to the technique and scheme of the present invention and technology Other various corresponding changes and modifications are made in design, and all these change and modification all should belong to the claims in the present invention Protection scope.

Claims (8)

1. a kind of production method of flexibility displayer, which comprises the steps of:
Step 1 provides a rigid substrates (10), cleans to the rigid substrates (10);
Step 2 forms the flat inorganic matter film layer (20) in a surface on the rigid substrates (10);
Step 3, the coated polymer material on the inorganic matter film layer (20), it is dry with after solidification, form a flexible substrate (30);
Step 4 makes thin film transistor array layer (40) on the flexible substrate (30), in the thin film transistor array layer (40) OLED device (50) are made on, and the OLED device (50) and thin film transistor array layer (40) are packaged, It is formed on the flexible substrate (30) and OLED device (50) and coats the OLED device (50) and thin film transistor array layer (40) the encapsulating structure layer (60) of outer surface;
Step 5 removes the flexible substrate (30) from the inorganic matter film layer (20), and a flexible displayer is made (70);
In the step 5, the flexible substrate (30) is removed from the inorganic matter film layer (20) using laser lift-off technique;
In the step 1, the rigid substrates (10) are glass substrate;In the step 2, using plasma enhances chemical gas Phase sedimentation forms the inorganic matter film layer (20).
2. the production method of flexibility displayer as described in claim 1, which is characterized in that the flexibility AMOLED is aobvious Show that device (70) includes flexible substrate (30), the thin film transistor array layer (40) being set on the flexible substrate (30), is set to institute It states the OLED device (50) on thin film transistor array layer (40) and is set on the flexible substrate (30) and OLED device (50) And the encapsulating structure layer (60) of the cladding OLED device (50) and thin film transistor array layer (40) outer surface.
3. the production method of flexibility displayer as described in claim 1, which is characterized in that the inorganic matter film layer (20) material includes at least one of silicon nitride and silica.
4. the production method of flexibility displayer as claimed in claim 3, which is characterized in that the inorganic matter film layer (20) include from top to bottom successively lamination setting the first silicon nitride layer (21), silicon oxide layer (23) and the second silicon nitride layer (22)。
5. the production method of flexibility displayer as described in claim 1, which is characterized in that the inorganic matter film layer (20) with a thickness of 1 μm~10 μm.
6. the production method of flexibility displayer as claimed in claim 5, which is characterized in that the inorganic matter film layer (20) with a thickness of 2 μm.
7. the production method of flexibility displayer as described in claim 1, which is characterized in that described in the step 3 Polymer material is polyimides.
8. the production method of flexibility displayer as described in claim 1, which is characterized in that in the step 4, use Thin film encapsulation technology is packaged the OLED device (50) and thin film transistor array layer (40).
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