CN107359267A - A kind of AMOLED waterproof encapsulation structures - Google Patents
A kind of AMOLED waterproof encapsulation structures Download PDFInfo
- Publication number
- CN107359267A CN107359267A CN201710409969.8A CN201710409969A CN107359267A CN 107359267 A CN107359267 A CN 107359267A CN 201710409969 A CN201710409969 A CN 201710409969A CN 107359267 A CN107359267 A CN 107359267A
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- China
- Prior art keywords
- ltps
- oled
- insulating barrier
- layer
- back plane
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a kind of AMOLED waterproof encapsulation structures, including LTPS backboards, LTPS back plane circuitries layer, the luminous anode material layers of OLED, encapsulation cover plate, the first insulating barrier and the second insulating barrier are respectively equipped between LTPS backboards and LTPS back plane circuitry layers, between the luminous anode material layer of LTPS back plane circuitries layer and OLED, packaged glass glue-line is provided between LTPS backboards and encapsulation cover plate, punch to form spaced groove at the edge of the second insulating barrier, the section indention at the second insulating barrier edge, the groove are used to inject reinforcement glue.The section at the second insulating barrier edge is arranged to zigzag, played a supporting role between encapsulation cover plate and LTPS backboards, by alternately injecting reinforcement glue and silica gel into each groove, reinforcement glue is improving the bond strength between encapsulation cover plate and LTPS backboards, obstruct the infiltration path of water and oxygen, and silica gel also can effectively adsorb LTPS back plane circuitries layer and the luminous anode material layers of OLED, so as to effectively stop the infiltration of water and oxygen, reduce it and injured to caused by OLED.
Description
Technical field
The present invention relates to technical field of display panel, and in particular to a kind of AMOLED waterproof encapsulation structures.
Background technology
AMOLED is active matrix organic light-emitting diode (Active-matrix organic light emitting
Diode) due to actively luminous, ultra-thin, no angle limit, rollable, high image quality, all solid state, low energy consumption and operating temperature
The innate advantages such as scope is wide, therefore widely paid close attention to, and as the display mode of a new generation, be expected to turn into after traditional liquid
Crystalline substance shows the flat panel display of future generation after (LCD), is widely used in mobile phone screen, video screen, computer monitor
Deng field.
AMOLED is that OLED pixel is deposited or is integrated on tft array, and wherein OLED pixel, which has, is sequentially formed in base
LTPS back plane circuitries structure, anode, organic luminous layer and negative electrode on plate.But organic light emitting diode OLED short life is
The main bottleneck of AMOLED industry developments is restricted, and forms the electrode of OLED and the organic material of luminescent layer in air
Pollutant, steam and oxygen are all very sensitive, containing water, oxygen environment in easily occur electrochemical corrosion, to OLED
It is the main reason for causing OLED short lifes that device, which damages,.Therefore need effectively to encapsulate OLED, to
Prevent water, oxygen from entering inside OLED, extend OLED life-span.
At present, AMOLED method for packing mainly has three kinds：Glass-encapsulated technology, Metal Packaging technology and thin film encapsulation technology
(TFE), wherein being most widely used especially with glass-encapsulated technology, due to being inorganic encapsulated medium, so it blocks water and oxygen
It is very capable, it is particularly suitable for the OLED technology to water and oxygen sensitive, but gas easily occur when laser realizes frit packaging
The problems such as bubble and cracking, and frit is more fragile, can be easily separated.So AMOLED products work as base in current production process
After plate is bonded with cover-plate glass, a procedure is also added：Reinforcement glue is injected in substrate and cover-plate glass gap, further to add
Strong package strength.Generally plus reinforcement glue is to be added in the crack of base plate glass and cover-plate glass by mode for dispensing glue, is used
Routine techniques, due to the gap very little between two glass, make dispensing and infiltration glue relatively difficult.And this packaged type is once have
Oxygen and water are into then OLED life-spans and performance will substantially reduce.
The content of the invention
The present invention is intended to provide a kind of AMOLED waterproof encapsulation structures, solve be advantageous to encapsulation the injection of reinforcement glue,
Improve bond strength between encapsulation cover plate and LTPS backboards, packaging effect is good, is greatly reduced by the absorption property of silica gel
The infiltration of water and oxygen, effective waterproof action is played, be favorably improved the performance of OLED, extend OLED uses the longevity
The technical problem of life.
The present invention provides following technical scheme：
A kind of AMOLED waterproof encapsulation structures, including the luminous anode material of LTPS backboards, LTPS back plane circuitries layer, OLED
Layer, encapsulation cover plate, between LTPS backboards and LTPS back plane circuitry layers, LTPS back plane circuitries layer and OLED light anode material layer it
Between be respectively equipped with the first insulating barrier and the second insulating barrier, packaged glass glue-line is provided between LTPS backboards and encapsulation cover plate,
The edge of second insulating barrier punches to form spaced groove, the section indention at the second insulating barrier edge,
The groove is used to alternately inject reinforcement glue and silica gel.
Further, the LTPS back plane circuitries layer is OLED light emission drive circuit structure sheafs.
Further, the LTPS backboards and encapsulation cover plate are glass substrate.
Further, the spaced groove is zigzag, and for alternately injecting reinforcement glue and silica gel.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention passes through cutting the second insulating barrier edge
Face is arranged to zigzag, is played a supporting role between encapsulation cover plate and LTPS backboards, by alternately being injected into each groove
Reinforcement glue and silica gel, reinforcement glue obstruct water and oxygen while the bond strength between encapsulation cover plate and LTPS backboards is improved
Infiltration path, and silica gel also can effectively adsorb LTPS back plane circuitries layer and OLED and light and may ooze between anode material layer
The water and oxygen entered, so as to effectively stop the infiltration of water and oxygen, reduce it and injured to caused by OLED.This encapsulation side
The packaging effect of formula is good, is favorably improved the performance of OLED, extends the service life of OLED.
Brief description of the drawings
Fig. 1 is the front view of AMOLED encapsulating structures of the present invention；
Fig. 2 is the first diagrammatic cross-section of AMOLED encapsulating structures of the present invention；
Fig. 3 is the second diagrammatic cross-section of AMOLED encapsulating structures of the present invention.
Embodiment
Below in conjunction with the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described,
Obviously, described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Based in the present invention
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
Belong to the scope of protection of the invention.
A kind of AMOLED waterproof encapsulation structures of embodiment, including LTPS backboards 1, LTPS back plane circuitries layer 2, OLED light
Anode material layer 3, encapsulation cover plate 4, between LTPS backboards 1 and LTPS back plane circuitries layer 2, LTPS back plane circuitries layer 2 and OLED hair
The first insulating barrier 12 and the second insulating barrier 23 are respectively equipped between light anode material layer 3, LTPS backboards 1 and encapsulation cover plate 4 it
Between be provided with packaged glass glue-line 14, punch to form spaced groove 13 at the edge of second insulating barrier 23, described
The section indention at the edge of two insulating barrier 23, the groove 13 are used to alternately inject reinforcement glue and silica gel.
Fig. 2,3 respectively illustrate sectional view in Fig. 1 at the first hatching L1 and the second hatching L2, pass through comparison diagram 2
The spaced groove that injection reinforcement glue gold and silica gel can be specifically used for replacing with Fig. 3 is arranged on second insulating barrier 23
Edge.
The LTPS back plane circuitries layer 2 is OLED light emission drive circuit structure sheafs.The LTPS backboards 1 and encapsulation cover plate 4
It is glass substrate.The packaged glass glue-line 14 is Frit glass glue-lines, and the Frit glass glue-line is around the luminous sun of OLED
The collar region of periphery one of pole material layer 3.
Knot of the film layer structure between the effective Mask of LTPS backboard process between the LTPS backboards 1 and encapsulation cover plate 4
Structure, when doing LTPS back plane circuitries, isolating metal layer and metal level or the insulating barrier of effective interlayer, including the He of the first insulating barrier 12
Second insulating barrier 23.
Described metal level is to form the All Layers of LTPS back plane circuitries with there is active layer, and provides the luminous sun of OLED
Pole film layer, it is LTPS back plane circuitries layer 2 and the luminous anode material layers 3 of OLED in the present embodiment.
The present invention can make the infiltration of glue faster more equal by setting some incised grooves on the substrate at dispensing
It is even, and add the roughness of contact surface so that the contact area of LTPS backboards 1 and 4 liang of glass substrates of encapsulation cover plate increases, and mends
Potent fruit enhancing.And by the way of alternately reinforcement glue and silica gel is injected into each groove, in enhancing reinforcement packaging effect
While, because the stronger absorption property of silica gel can effectively play the effect of waterproof.
It is obvious to a person skilled in the art that the invention is not restricted to the details of the one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires rather than the explanation limits, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each
Embodiment only includes an independent technical scheme, and this narrating mode of specification is only this area for clarity
Technical staff should be using specification as an entirety, and the technical solutions in the various embodiments may also be suitably combined, forms this
The other embodiment that art personnel are appreciated that.
Claims (4)
1. a kind of AMOLED waterproof encapsulation structures, including the luminous anode material layer of LTPS backboards, LTPS back plane circuitries layer, OLED,
Encapsulation cover plate, between LTPS backboards and LTPS back plane circuitry layers, between the luminous anode material layer of LTPS back plane circuitries layer and OLED
The first insulating barrier and the second insulating barrier are respectively equipped with, packaged glass glue-line is provided between LTPS backboards and encapsulation cover plate, it is special
Sign is：Punch to form spaced groove at the edge of second insulating barrier, the section at the second insulating barrier edge
Indention, the groove are used to alternately inject reinforcement glue and silica gel.
A kind of 2. AMOLED waterproof encapsulation structures according to claim 1, it is characterised in that：The LTPS back plane circuitries layer
For OLED light emission drive circuit structure sheafs.
A kind of 3. AMOLED waterproof encapsulation structures according to claim 1, it is characterised in that：The LTPS backboards and encapsulation
Cover plate is glass substrate.
A kind of 4. AMOLED waterproof encapsulation structures according to claim 1, it is characterised in that：The spaced groove
For zigzag, and for alternately injecting reinforcement glue and silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710409969.8A CN107359267B (en) | 2017-06-02 | 2017-06-02 | A kind of AMOLED waterproof encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710409969.8A CN107359267B (en) | 2017-06-02 | 2017-06-02 | A kind of AMOLED waterproof encapsulation structure |
Publications (2)
| Publication Number | Publication Date |
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| CN107359267A true CN107359267A (en) | 2017-11-17 |
| CN107359267B CN107359267B (en) | 2019-03-08 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019114699A1 (en) * | 2017-12-15 | 2019-06-20 | 京东方科技集团股份有限公司 | Package structure, substrate and display panel |
| CN113219737A (en) * | 2021-04-20 | 2021-08-06 | 绵阳惠科光电科技有限公司 | Display panel and display device |
| WO2021164169A1 (en) * | 2020-02-18 | 2021-08-26 | 恩利克（浙江）智能装备有限公司 | Foldable amoled display screen structure and manufacturing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101833182A (en) * | 2010-04-13 | 2010-09-15 | 友达光电股份有限公司 | Panel display module with reinforced structure and manufacturing method thereof |
| CN205141030U (en) * | 2015-10-22 | 2016-04-06 | 信利（惠州）智能显示有限公司 | AMOLED packaging structure |
-
2017
- 2017-06-02 CN CN201710409969.8A patent/CN107359267B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101833182A (en) * | 2010-04-13 | 2010-09-15 | 友达光电股份有限公司 | Panel display module with reinforced structure and manufacturing method thereof |
| CN205141030U (en) * | 2015-10-22 | 2016-04-06 | 信利（惠州）智能显示有限公司 | AMOLED packaging structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019114699A1 (en) * | 2017-12-15 | 2019-06-20 | 京东方科技集团股份有限公司 | Package structure, substrate and display panel |
| US10680204B2 (en) | 2017-12-15 | 2020-06-09 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Encapsulation structure, substrate and display panel |
| WO2021164169A1 (en) * | 2020-02-18 | 2021-08-26 | 恩利克（浙江）智能装备有限公司 | Foldable amoled display screen structure and manufacturing method |
| CN113219737A (en) * | 2021-04-20 | 2021-08-06 | 绵阳惠科光电科技有限公司 | Display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107359267B (en) | 2019-03-08 |
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Effective date of registration: 20201228 Address after: 230000 northeast corner of the intersection of Jiudingshan road and Kuihe Road, Xinzhan District, Hefei City, Anhui Province Patentee after: HEFEI HUIKE JINYANG TECHNOLOGY Co.,Ltd. Address before: 230000 Hefei Huike Jinyang Technology Co., Ltd., east of Jiudingshan road and north of Kuihe Road, Xinzhan District, Hefei City, Anhui Province Patentee before: HEFEI HUIKE PRECISION DIE Co.,Ltd. |
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