KR20150070544A - Organic Light Emitting Display Device and Method of manufacturing the same - Google Patents

Abstract

The present invention relates to an organic light emitting display device, comprising a light emitting part emitting light into an active area and a penetrating part not emitting light, and a manufacturing method thereof. The organic light emitting display device includes: a thin film transistor formed on a substrate; a first electrode formed on the thin film transistor; an organic layer formed on the first electrode; and a second electrode formed on the organic layer. The thin film transistor and the first and second electrodes are formed in the light emitting part but are not formed in the penetrating part. According to the present invention, as the second electrode as well as the thin film transistor and the first electrode are only in the light emitting part but are not formed in the penetrating part, the permeability of the penetrating part is able to be improved.

Description

[0001] The present invention relates to an organic light emitting display device and a method of manufacturing the same.

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an organic light emitting display, and more particularly, to an organic light emitting display having a light emitting portion and a transmissive portion.

The OLED display has a structure in which a light emitting layer is formed between a cathode for injecting electrons and an anode for injecting holes, and the electrons generated in the cathode and the electrons generated in the anode When the injected holes are injected into the light emitting layer, injected electrons and holes are coupled to generate an exciton, and the generated excitons drop from the excited state to the ground state, To display an image.

BACKGROUND ART [0002] In recent years, studies have been made on transparent organic light emitting display devices, and organic light emitting display devices having a light emitting portion that emits light in an active region for displaying an image and a transmissive portion that does not emit light have been developed .

Hereinafter, an OLED display device including a conventional light emitting portion and a transmissive portion will be described with reference to the drawings.

FIG. 1A is a schematic plan view of a conventional OLED display, and FIG. 1B is a schematic cross-sectional view of a conventional OLED display.

As shown in FIGS. 1A and 1B, a conventional organic light emitting display includes a light emitting portion and a transmissive portion.

The light emitting portion is a region for emitting light. Such a light emitting portion includes a red (R) pixel for emitting red (R) light, a green (G) pixel for emitting green (G) light, and a blue (B) pixel for emitting blue .

Each of the pixels formed in the light emitting portion includes a thin film transistor 20, a planarization layer 30, a bank layer 40, a first electrode 50, an organic layer 60, And electrodes 70 are sequentially formed.

The transmissive portion is a region that does not emit light. Therefore, unlike the light emitting portion, the transmissive portion does not include a pixel for emitting light.

The transmissive portion has a structure in which a planarization layer 30, a bank layer 40, an organic layer 60, and a second electrode 70 are sequentially formed on a substrate 10.

Since the conventional organic light emitting display device has a transmissive portion that does not emit light in the active region, the front and back surfaces of the organic light emitting display device can be transmitted through the transmissive portion, have.

However, in such a conventional organic light emitting diode display, since the second electrode 70 is formed not only in the light emitting portion but also in the transmissive portion, the transmissivity of the transmissive portion is reduced due to the second electrode 70.

In addition, since the second electrode 70 functions as a common electrode, the second electrode 70 is formed on the entire surface of the substrate in the related art, thereby forming the second electrode 70 in the transmissive portion. However, even if the second electrode 70 is made of a conductive material with good transparency, if the second electrode 70 is formed on the transmissive portion, the transmissivity of the transmissive portion is reduced.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an organic light emitting diode (OLED) display device and a method of manufacturing the same, which can improve the transmissivity of a transmissive portion.

In order to achieve the above object, the present invention provides an organic light emitting diode display including a light emitting portion emitting light in an active region and a light transmitting portion not emitting light, wherein the organic light emitting display comprises a thin film transistor ; A first electrode formed on the thin film transistor; An organic layer formed on the first electrode; And a second electrode formed on the organic layer, wherein the thin film transistor, the first electrode, and the second electrode are formed in the light emitting portion, but are not formed in the transmissive portion A display device is provided.

According to another aspect of the present invention, there is provided a method of manufacturing an OLED display device including a light emitting portion emitting light in an active region and a transmissive portion not emitting light, the method comprising: forming a thin film transistor on a substrate; Forming a first electrode, a contact pad, and a contact wiring on the thin film transistor; Forming a sacrificial layer on the contact pad; Forming an organic layer on the first electrode and the sacrificial layer; Removing the sacrificial layer and the organic layer formed on the sacrificial layer through a lift-off process to expose the contact pad; And forming a second electrode from an upper surface of the organic layer formed on the first electrode to a top surface of the exposed contact pad, wherein the thin film transistor, the first electrode, The organic light emitting display device according to claim 1,

According to the present invention as described above, the following effects can be obtained.

According to the present invention, since not only the thin film transistor and the first electrode but also the second electrode are formed only in the light emitting portion and are not formed in the transmissive portion, the transmissivity of the transmissive portion can be improved.

FIG. 1A is a schematic plan view of a conventional OLED display, and FIG. 1B is a schematic cross-sectional view of a conventional OLED display.
2 is a schematic plan view of an OLED display according to an embodiment of the present invention.
3 is a cross-sectional view of line II in Fig.
4 is a cross-sectional view taken along line II-II in Fig.
5A to 5G are cross-sectional views illustrating a manufacturing process of an OLED display according to an exemplary embodiment of the present invention.

The term "on " as used herein is meant to encompass not only when a configuration is formed on the immediate surface of another configuration, but also to the extent that a third configuration is interposed between these configurations.

The modifiers such as " first "and " second" described in the present specification do not mean the order of the corresponding configurations, but are intended to distinguish the corresponding configurations from each other.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

2 is a schematic plan view of an OLED display according to an embodiment of the present invention.

As shown in FIG. 2, the organic light emitting diode display according to an embodiment of the present invention includes a light emitting portion and a transmissive portion in an active region for displaying an image.

The light-emitting portion and the transmissive portion may be alternately arranged in rows as shown in the figure, but are not limited thereto. For example, the light emitting unit and the transmitting unit may be alternately arranged in columns.

The light emitting portion is a region for emitting light and includes a first pixel x, a second pixel y, and a third pixel z.

The first pixel x may be a red pixel that emits red light and the second pixel y may be a green pixel that emits green light. And the third pixel z may be a blue (B) pixel that emits blue (B) light.

However, the present invention is not limited thereto, and may further include white (W) pixels for emitting white light in addition to the first to third pixels (x, y, z). Also, the arrangement among the first to third pixels (x, y, z) may be changed in various ways known in the art.

The size of the first pixel (x) is larger than the size of the second pixel (y). In addition, the size of the third pixel z is larger than the size of the second pixel y. In addition, the first pixel (x) and the third pixel (z) have the same size. Therefore, as shown in the figure, a blank region is formed between the first pixel (x) and the third pixel (z) so as to face the second pixel (y) (610) may be formed.

That is, the reason why the size of the second pixel y is smaller than the size of the first pixel x and the third pixel z is to form the contact pad 610, .

Generally, the light emitting efficiency of the green (G) pixel among the red (R) pixel, the green (G) pixel and the blue (B) pixel is the most excellent. Therefore, it is preferable that the second pixel (y) having a relatively small size is formed of green (G) pixels in terms of luminous efficiency. However, the present invention is not limited thereto, and the second pixel y may be composed of a red (R) pixel or a blue (B) pixel.

Each of the first pixel (x), the second pixel (y), and the third pixel (z) includes first electrodes 500x, 500y, and 500z spaced upward and downward with an organic layer therebetween for emitting light, And a second electrode (800).

The first electrodes 500x, 500y, and 500z are patterned for each pixel, and are electrically connected to the driving thin film transistors in the respective pixels.

As described above, since the size of the second pixel y is smaller than the sizes of the first pixel x and the third pixel z, the first electrode (y) 500y is smaller than the size of the first electrode 500x patterned in the first pixel x and the size of the first electrode 500z patterned in the third pixel z. The size of the first electrode 500x formed in the first pixel x is the same as the size of the first electrode 500z formed in the third pixel z.

The same size throughout this specification should be construed to include not only the case in which the dimensions of certain constructions and other constructions are exactly the same, but also the case where an aberration occurs in the course of the process.

The second electrode 800 corresponds to at least one pixel, and preferably corresponds to a plurality of pixels, as shown by way of example, as the first pixel (x), the second pixel (y) May be pattern-formed so as to correspond to the entire pixel z. That is, the second electrode 800 may be patterned to correspond to the first pixel x, the second pixel y, and the third pixel z, A plurality of substrates 800 may be formed on the substrate 100. However, the second electrode 800 in which a plurality of electrodes are formed on the substrate 100 must be formed in a pattern corresponding to the entire first pixel x, the second pixel y, and the third pixel z It does not.

Since the second electrode 800 functions as a common electrode, the plurality of second electrodes 800 formed on the substrate 100 are electrically connected to each other. In this manner, the contact wiring 600 and the contact pad 610 are applied to electrically connect the plurality of second electrodes 800. [

It is preferable that the contact wiring 600 is formed between the light emitting portion and the transmissive portion to prevent a decrease in transmittance.

The contact pad 610 is connected to the contact wiring 600. For example, the contact pad 610 may be branched from the contact wiring 600. That is, the contact pad 610 and the contact wiring 600 may be integrally formed. However, the present invention is not limited thereto, and the contact pad 610 and the contact wiring 600 may be connected to each other while having a separate structure.

The contact pad 610 is connected to the second electrode 800. That is, each of the plurality of contact pads 610 is connected to each of the plurality of second electrodes 800.

Accordingly, the plurality of second electrodes 800 are connected to the contact wirings 600 through the plurality of contact pads 610. Therefore, a common voltage may be applied to the plurality of second electrodes 800 through the contact wiring 600.

The contact pad 610 may be formed on the same layer as the first electrodes 500x, 500y, and 500z. In order to form the contact pad 610 on the same layer as the first electrodes 500x, 500y, and 500z, the size of the first electrode 500y in the second pixel y is relatively reduced And a contact pad 610 is formed in the free space. For this reason, the size of the second pixel y is smaller than that of the first pixel x and the third pixel z.

The transmissive portion is a region that does not emit light. Therefore, unlike the light emitting portion, the transmissive portion does not include a pixel for emitting light. That is, a basic wiring is formed in the transmissive portion but a thin film transistor or the like is not formed.

Hereinafter, an OLED display according to an exemplary embodiment of the present invention will be described in detail with reference to a cross-sectional structure.

FIG. 3 is a cross-sectional view taken along the line I-I of FIG. 2, illustrating a region where a contact pad 610 connected to the second electrode 800 is formed.

As shown in FIG. 3, the light emitting portion and the transmissive portion are formed on the substrate 100.

The light emitting portion includes a thin film transistor 200, a planarization layer 300, a bank layer 400, a first electrode 500y, a contact pad 610, a contact wiring 600, an organic layer 700, (Not shown).

A planarization layer 300, a bank layer 400, and an organic layer 700 are formed on the transmissive portion.

The substrate 100 may be made of glass, or a transparent plastic, such as polyimide, which is capable of bending or rolling, but is not limited thereto.

The thin film transistor 200 is formed on the substrate 100, but is not formed in the transmissive portion but only in the light emitting portion. The thin film transistor 200 may be a switching thin film transistor or a driving thin film transistor. The thin film transistor 200 may be formed in various forms known in the art such as a bottom gate structure in which a gate electrode is formed below a semiconductor layer or a top gate structure in which a gate electrode is formed on a semiconductor layer .

The planarization layer 300 is formed on the thin film transistor 200. The planarization layer 300 is formed on both the light emitting portion and the transmissive portion to planarize the surface of the substrate. The planarization layer 300 may be made of an organic insulation material such as photoacryl, but is not limited thereto.

The bank layer 400 is formed on the planarization layer 300. The bank layer 400 is formed at a boundary between individual pixels to divide the pixel region. The bank layer 400 is formed at a boundary between the light emitting portion and the transmissive portion, and is also formed at the boundary between the first electrode 500y and the contact pad 610 in the light emitting portion. However, the bank layer 400 formed at the boundary between the first electrode 500y and the contact pad 610 may be omitted.

The first electrode 500y is formed on the planarization layer 300, and is formed in the pixel region partitioned by the bank layer 400, in particular. The first electrode 500y is formed in the light emitting portion but is not formed in the transmissive portion. The first electrode 500y is electrically connected to the thin film transistor 200 through a contact hole formed in the planarization layer 300. The first electrode 500y may function as an anode.

The contact pad 610 is formed on the planarization layer 300 in the same manner as the first electrode 500y. That is, the contact pad 610 is spaced apart from the first electrode 500y in the same layer as the first electrode 500y.

The contact wiring 600 is connected to the contact pad 610 on the planarization layer 300. The contact wiring 600 overlaps the bank layer 400 formed between the light emitting portion and the transmissive portion.

The organic layer 700 is formed on the first electrode 500y in the light emitting portion.

The organic layer 700 includes a hole injecting layer, a hole transporting layer, an emitting layer, an electron transporting layer, and an electron injecting layer, though not shown in detail. The hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer may be omitted, except for the light emitting layer.

The emission layer may emit red (R) light, green (G) light, or blue (B) light for each pixel. In some cases, the emission layer may emit white light. In this case, a separate color filter may be further provided for each pixel. The light emitting layer for emitting white light may be a combination of a red light emitting layer, a green light emitting layer, and a blue light emitting layer, or may be a combination of an orange light emitting layer and a blue light emitting layer. Besides, the light emitting layer for emitting the white light may be changed into various forms known in the art.

The organic layer 700 may be formed on the planarization layer 300 in the transmissive portion. However, since no light is emitted from the transmissive portion, the organic layer 700 in the transmissive portion can be omitted. On the other hand, among the plurality of layers constituting the organic layer 700, only the light emitting layer is formed in the transmissive portion, and other layers (the hole injecting layer, the hole transporting layer, the electron transporting layer and the electron injecting layer) Or may be formed in the transmissive portion.

The second electrode 800 is formed on the organic layer 700 in the light emitting portion. The second electrode 800 is not formed in the transmissive portion, thereby improving the transmissivity of the transmissive portion.

The second electrode 800 is connected to the contact pad 610. That is, the second electrode 800 is electrically connected to the contact pad 610 via the upper surface of the bank layer 400 formed on the boundary between the first electrode 500y and the contact pad 610 from the top surface of the organic layer 700, . Accordingly, the second electrode 800 is connected to the contact wiring 600 through the contact pad 610. The second electrode 800 may function as a cathode.

Although not shown, a passivation layer, a sealing layer, and an upper film may be sequentially formed on the second electrode 800.

The passivation layer serves to prevent moisture from penetrating into the organic layer 700. The passivation layer may be formed of a plurality of layers in which different inorganic materials are stacked, Layer. ≪ / RTI >

The sealing layer functions to adhere the upper film to the passivation layer, and may also function to prevent water from penetrating into the organic layer 700. Such a sealing layer can be formed using various materials known in the art. For example, the sealing layer 800 may be formed using a barrier film structure such as a double-sided tape, or may be formed by coating a liquid adhesive material such as a sealant and then curing.

The upper film may be a protective film, a polarizing film of antireflection property, or a touch screen film formed with a touch electrode.

FIG. 4 is a cross-sectional view taken along line II-II of FIG. 2, illustrating a region where the contact pad 610 is not formed.

As shown in FIG. 4, the light emitting portion and the transmissive portion are formed on the substrate 100.

A thin film transistor 200, a planarization layer 300, a bank layer 400, a first electrode 500x, an organic layer 700, and a second electrode 800 are formed in the light emitting portion.

A planarization layer 300, a bank layer 400, and an organic layer 700 are formed on the transmissive portion.

The thin film transistor 200 is formed on the substrate 100 and is formed only in the light emitting portion without being formed in the transmissive portion.

The planarization layer 300 is formed on the thin film transistor 200. The planarization layer 300 is formed on both the light emitting portion and the transmissive portion to planarize the surface of the substrate.

The bank layer 400 is formed on a boundary between individual pixels on the planarization layer 300 to partition a pixel region. The bank layer 400 is formed at the boundary between the light emitting portion and the transmissive portion.

The first electrode 500x is formed on the planarization layer 300, and is formed in the pixel region partitioned by the bank layer 400, in particular. The first electrode 500x is formed in the light emitting portion but is not formed in the transmissive portion. The first electrode 500x is electrically connected to the thin film transistor 200 through a contact hole formed in the planarization layer 300.

The organic layer 700 is formed on the first electrode 500x in the light emitting portion.

The organic layer 700 may be formed on the planarization layer 300 in the transmissive portion, but the organic layer 700 in the transmissive portion may be omitted as described above. In addition, among the plurality of layers constituting the organic layer 700, only the light emitting layer may be formed in the transmissive portion by forming the other layers on the entire surface of the substrate without a mask.

The second electrode 800 is formed on the organic layer 700 in the light emitting portion. The second electrode 800 is not formed in the transmissive portion.

Although not shown, a passivation layer, a sealing layer, and an upper film may be sequentially formed on the second electrode 800.

5A to 5G are cross-sectional views illustrating a manufacturing process of an OLED display device according to an exemplary embodiment of the present invention, which corresponds to a cross-sectional view taken along line I-I of FIG.

5A, a thin film transistor 200 is formed on a substrate 100, and a planarization layer 300 is formed on the thin film transistor 200. Referring to FIG.

The thin film transistor 200 is not formed in the transmissive portion but only in the light emitting portion.

The planarization layer 300 is formed on both the light emitting portion and the transmissive portion.

The detailed structure of the thin film transistor 200 and the planarization layer 300 is as described above, and various forming methods known in the art can be used.

5B, a first electrode 500y, a contact pad 610, and a contact wiring 600 are formed on the planarization layer 300. Next, as shown in FIG.

The first electrode 500y is formed in the light emitting portion, the contact pad 610 is also formed in the light emitting portion, and the contact wiring 600 is formed in the boundary region between the light emitting portion and the transmissive portion.

The first electrode 500y and the contact pad 610 are spaced apart from each other. The contact pad 610 and the contact wiring 600 are connected to each other.

The first electrode 500y, the contact pad 610, and the contact wiring 600 may be formed of the same material through the same process, but are not limited thereto.

Next, as shown in FIG. 5C, the bank layer 400 is formed on the planarization layer 300.

The bank layer 400 is formed at a boundary between individual pixels. Accordingly, the bank layer 400 is formed at the boundary between the light emitting portion and the transmissive portion, and is also formed at the boundary between the first electrode 500y and the contact pad 610 in the light emitting portion. However, the bank layer 400 may not be formed at the boundary between the first electrode 500y and the contact pad 610. [

Next, as shown in FIG. 5D, a sacrificial layer 650 is formed on the contact pad 610.

The sacrificial layer 650 is for removing the organic layer 700 formed on the upper surface of the sacrificial layer 650 through a lift off process as described later.

The sacrificial layer 650 may be formed using photoresist, but is not limited thereto.

5E, an organic layer 700 is formed on the first electrode 500y and the contact pad 610 in the light emitting portion, and an organic layer 700 is formed on the planarization layer 300 in the transmissive portion do.

As described above, the organic layer 700 may not be formed in the transmissive portion, or an organic layer 700 including only a plurality of layers except the light emitting layer may be formed.

The specific structure of the organic layer 700 is as described above, and a variety of methods known in the art can be used for the forming process.

Next, as shown in FIG. 5F, the sacrificial layer 650 and the organic layer 700 formed on the sacrificial layer 650 are removed through a lift-off process. Then, the contact pad 610 is exposed.

Next, as shown in FIG. 5G, a second electrode 800 is formed in the light emitting portion.

The second electrode 800 is formed on the upper surface of the organic layer 700 on the first electrode 500y via the upper surface of the bank layer 400 formed on the boundary between the first electrode 500y and the contact pad 610, To the upper surface of the exposed contact pad 610.

The second electrode 800 is not formed in the transmissive portion.

Meanwhile, although not shown, a passivation layer, a sealing layer, and an upper film may be sequentially formed on the second electrode 800 by various methods known in the art.

100: substrate 200: thin film transistor
300: planarization layer 400: bank layer
500x, 500y, 500z: first electrode 600: contact wiring
610: contact pad 700: organic layer
800: Second electrode

Claims (10)

An organic light emitting diode (OLED) display including a light emitting portion emitting light in an active region and a transmitting portion not emitting light,
A thin film transistor formed on a substrate;
A first electrode formed on the thin film transistor;
An organic layer formed on the first electrode; And
And a second electrode formed on the organic layer,
Wherein the thin film transistor, the first electrode, and the second electrode are formed in the light emitting portion, but are not formed in the transmissive portion. The method according to claim 1,
And a contact pad connected to the second electrode. 3. The method of claim 2,
And a contact wiring connected to the contact pad, wherein the contact wiring is formed between the light emitting portion and the transmissive portion. 3. The method of claim 2,
And the contact pad is formed on the same layer as the first electrode. 5. The method of claim 4,
And a bank layer is further formed between the contact pad and the first electrode. The method according to claim 1,
And the second electrode is patterned to correspond to a plurality of pixels formed in the light emitting portion. The method according to claim 1,
The light emitting unit includes a first pixel, a second pixel, and a third pixel,
Wherein the size of the second pixel is smaller than the size of the first pixel and the size of the third pixel. 8. The method of claim 7,
And the contact pad is formed between the first pixel and the third pixel while facing the second pixel. 8. The method of claim 7,
And the second pixel comprises a green pixel that emits green light. A method of manufacturing an organic light emitting display device including a light emitting portion that emits light in an active region and a transmissive portion that does not emit light,
Forming a thin film transistor on a substrate;
Forming a first electrode, a contact pad, and a contact wiring on the thin film transistor;
Forming a sacrificial layer on the contact pad;
Forming an organic layer on the first electrode and the sacrificial layer;
Removing the sacrificial layer and the organic layer formed on the sacrificial layer through a lift-off process to expose the contact pad; And
And forming a second electrode from the top surface of the organic layer formed on the first electrode to the top surface of the exposed contact pad,
Wherein the thin film transistor, the first electrode, and the second electrode are formed in the light emitting portion but not in the transmissive portion.

Images