CN2664183Y

CN2664183Y - Heat sink

Info

Publication number: CN2664183Y
Application number: CN 200320117975
Authority: CN
Inventors: 李学坤; 夏万林; 刘后本
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2003-11-08
Filing date: 2003-11-08
Publication date: 2004-12-15
Anticipated expiration: 2013-11-08

Abstract

A heat sink comprises two radiators and at least a thermotube. Each radiator is provided with a base and a plurality of cooling fins arranged on the base; the bottoms of the bases of the two radiators are opposite and separated in a certain distance to form a holding space; the holding space can hold a board card and heating electronic components arranged on the board card combining tightly. Two ends of the thermotube are connected with the two radiators respectively and combined closely.

Description

Heat abstractor

[technical field]

The utility model is about a kind of heat abstractor, particularly a kind ofly uses heat pipe that heat-generating electronic elements is dispelled the heat and saves the heat abstractor of the useful space.

[background technology]

Along with the fast development of electronics and information industry, electronic component disposal abilities such as the wafer of video card are strengthened day by day, and the heat of generation all increases with it, and the heat abstractor of its adapted is also in constantly improvement and innovation.Typical traditional heat-dissipating device is made up of a pedestal and the some radiating fins that are located on the pedestal, with thermal conductivity good metal heat exchange pattern electronic component is dispelled the heat merely, but enhancing along with the running frequency of electronic component, the contacted part of the pedestal of this heat abstractor and electronic component place is because of the untimely thermal-arrest gradually of dispelling the heat heats up, and causes the electronic component temperature to rise and extremely unfavorable to electronic component normal operation and life-span.

For this reason, the people in the industry is applied to the electronic radiation field with heat pipe, heat pipe is to inject an amount of easily evaporation hydraulic fluid in a hollow low pressure tubular body, form capillary structure on its inner surface of tube wall, the heat pipe evaporation ends absorbs heat from thermal source makes its inner hydraulic fluid evaporation, its steam flows to the heat pipe condensation end that is connected with radiator or other heat dissipation element rapidly and is back to the heat pipe evaporation ends after the liquefaction that is condensed, the heat that makes thermal source of refluxing so repeatedly be transmitted to fast radiator or other heat dissipation element and towards periphery the space distribute, thereby improved the radiating efficiency of traditional heat-dissipating device, solved the thermal-arrest intensification problem on the pedestal.

The dealer utilizes the superconduction pyrogen reason of above-mentioned heat pipe to develop a kind of heat abstractor, be to connect two radiators that are docking together by heat pipe, make it closely contact with the heater element surface and then dispel the heat by the pedestal of a radiator wherein, its concrete structure sees also Fig. 1, and this heat abstractor comprises first and second radiator 1,2 that is superimposed and the heat pipe 7 that is connected this first and second radiator 1,2.Wherein, all establish the hole 8 that heating tube 7 is installed with on the pedestal 3,4 of first and second radiator 1,2, the pedestal 3 of above-mentioned first radiator 1 contacts with electronic component, and the radiating fin 5 of second radiator 2 by its radiating fin 6 and first radiator 1 connects, above-mentioned heat abstractor dispels the heat simultaneously because of two radiators of heat transfer 1,2 of heat pipe 7, thereby has increased its heat transfer area and area of dissipation simultaneously.But, above-mentioned heat abstractor stacks mutually because of two radiators 1,2, it is highly bigger, be sticked and when the electronic component one side, easily interfere with other element of the electronic system of the above-mentioned heat abstractor of whole use, and the weight of heat abstractor is bigger, when being sticked integrated circuit board one side on motherboard, whole integrated circuit board is subjected to the effect of out-of-balance force, integrated circuit board produces one side tension another side with the golden finger of slot junction with contacting of slot and crosses unfavorable phenomenons such as pine when the time is longer, even causes the distortion or the damage of integrated circuit board and slot etc.So this structure remains further to be improved.

[summary of the invention]

The purpose of this utility model is to provide a kind of heat abstractor of saving space and good heat dissipation effect.

The purpose of this utility model is achieved through the following technical solutions:

Heat abstractor of the present utility model is made up of second radiator and at least one heat pipe.Each radiator has a pedestal and the some radiating fins that are located on the pedestal, the base bottom surface of this second radiator is relative and separated by a distance and form an accommodation space, can be installed with integrated circuit board in this accommodation space and is positioned at the heat-generating electronic elements on the integrated circuit board and combines closely.Above-mentioned heat pipe two ends are connected to above-mentioned second radiator and combine closely.

The utility model is compared with prior art has following advantage: because the second radiator branch that heat pipe of the present utility model is connected is listed in the integrated circuit board both sides, make at the heat abstractor of heat-generating electronic elements one side shared height and gravity and all reduce half, saved the useful space of using the system of the utility model heat abstractor, and the integrated circuit board two sides are stressed than balance, the integrated circuit board distortion of heat-generating electronic elements be difficult for to take place is installed or damages and cause phenomenons such as loose contact with slot, in addition, the radiator at the integrated circuit board back side is not only assisted another radiator heat-dissipation by heat pipe, and has distributed the part heat that the heat-generating electronic elements back side is sent.

With reference to the accompanying drawings, the utility model will be further described in conjunction with the embodiments.

[description of drawings]

Fig. 1 is the three-dimensional exploded view of a heat abstractor in the prior art.

Fig. 2 is the three-dimensional exploded view of the utility model heat abstractor.

Fig. 3 is the three-dimensional assembly diagram of the utility model heat abstractor.

[embodiment]

Please consult Fig. 2 and Fig. 3 simultaneously, the utility model heat abstractor is the two sides that folder is established vertical integrated circuit board 70 grades that are installed on the computer main frame panel, and the contour heat-generating electronic elements of its wafer (figure does not show) is dispelled the heat.

Above-mentioned heat abstractor comprises second radiator 10,10 ' and two heat pipes 40.Radiator 10,10 ' all has a pedestal 12, arranges on these pedestal 12 end faces to form to have some radiating fins 14 of gas channel and be formed with air stream outlet 16.Surround around these radiating fins 14 on said base 12 edges and form sidewall 18, wherein sidewall 18 is to open wide in the part of corresponding said flow outlet 16.Said base 12 is surrounded by above-mentioned sidewall 18 away from air stream outlet 16 parts and is formed the recess 20 that is not provided with radiating fin 14, establishes a fan 22 in this recess 20.One surrounds the corresponding dissipating cover 26 of shape that forms with sidewall 18 establishes by concavo-convex fit system envelope and is fixed on above-mentioned radiating fin 14 and fan 22 tops, and the position of corresponding fan 22 forms an air inlet 28.Above-mentioned second radiator 10,10 ' pedestal 12 edges and install on integrated circuit board 70 relative positions of electronic component and all offer most first through holes 30 plug in it for most fasteners 50, and radiator 10,10 ' is presetted on integrated circuit board 70 two sides.Around the integrated circuit board electronic component and on the second radiator 10,10 ' pedestal, 12 relative positions, be provided with second through hole 30 ', second through hole 30 ' of radiator 10 pedestals 12 is provided with internal thread, plug wherein for screw 52, radiator 10,10 ' closely is fixed on integrated circuit board 70 two sides.The appropriate location forms the groove 24 of two most of radiating fins 14 that are parallel to each other and connect on above-mentioned radiator 10, the 10 ' pedestal 12, above-mentioned two heat pipes 40 take the shape of the letter U, the two ends of each heat pipe 40 are installed with respectively in the groove 24 of opposite side on second radiator 10,10 ' pedestal 12, and combine closely by modes such as heat-conducting glue or tin cream welding, this moment, above-mentioned second radiator 10,10 ' pedestal, 12 bottom surfaces were relative and parallel, these two pedestals, 12 bottom surfaces are separated by a distance, and this distance is substantially equal to integrated circuit board 70 and electronic component thickness sum, thereby forms an accommodation space 60 jointly.

When above-mentioned heat abstractor is fixed on the integrated circuit board 70, its second radiator 10, folder is established integrated circuit board 70 in the accommodation space 60 between 10 ', pedestal 12 bottom surfaces of radiator 10 electronical elements surface on integrated circuit board 70 that is sticked, and pedestal 12 bottom surfaces of radiator 10 ' and integrated circuit board 70 back sides fit, fastener 50 and second radiator 10,10 ' and integrated circuit board 70 on first through hole 30 match, screw 52 and second radiator 10,10 ' and integrated circuit board 70 on second through hole 30 ' match, and with second radiator 10, combine closely with the electronical elements surface and integrated circuit board 70 back sides respectively in 10 ' pedestal, 12 bottom surfaces.

Be appreciated that ground, second radiator structure of the present utility model is not limited thereto, and the structure of this second radiator also can be inequality, can ccontaining integrated circuit board 70 and the accommodation space of electronic component as long as can form one between the second radiator.

Claims

1. heat abstractor, comprise second radiator and at least one heat pipe, each radiator has a pedestal and the some radiating fins that are located on the pedestal, above-mentioned heat pipe two ends are connected to above-mentioned second radiator, it is characterized in that: the base bottom surface of above-mentioned second radiator is relative and separated by a distance and form an accommodation space, can be installed with integrated circuit board in this accommodation space and be positioned at heat-generating electronic elements on the integrated circuit board.

2. heat abstractor as claimed in claim 1 is characterized in that: above-mentioned radiating fin is positioned at base top surface, and forms gas channel.

3. heat abstractor as claimed in claim 1 is characterized in that: be equiped with a fan on above-mentioned at least one radiator.

4. heat abstractor as claimed in claim 2 is characterized in that: above-mentioned at least one radiator base surrounded by edges forms sidewall, and this sidewall also surrounds the recess that formation is not provided with radiating fin, is provided with a fan in recess.

5. heat abstractor as claimed in claim 4 is characterized in that: above-mentioned corresponding sidewall seals above some radiating fins and fan and establishes a dissipating cover, and the corresponding position of fan of this dissipating cover is established an air inlet.

6. heat abstractor as claimed in claim 1 is characterized in that: above-mentioned second radiator pedestal appropriate position forms the groove that at least one heating tube that connects most of radiating fin is installed with.

7. heat abstractor as claimed in claim 1 is characterized in that: the pedestal of above-mentioned second radiator is provided with at least one through hole on the integrated circuit board of second radiator being fixed on for fastener plugs.

8. heat abstractor as claimed in claim 1 is characterized in that: above-mentioned accommodation space thickness is substantially equal to integrated circuit board and electronic component thickness sum.