CN2627654Y - 热电模块 - Google Patents

热电模块 Download PDF

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Publication number
CN2627654Y
CN2627654Y CNU022926046U CN02292604U CN2627654Y CN 2627654 Y CN2627654 Y CN 2627654Y CN U022926046 U CNU022926046 U CN U022926046U CN 02292604 U CN02292604 U CN 02292604U CN 2627654 Y CN2627654 Y CN 2627654Y
Authority
CN
China
Prior art keywords
conductive layer
insulating substrate
thermoelectric
insulating
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU022926046U
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English (en)
Chinese (zh)
Inventor
尾上胜彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Application granted granted Critical
Publication of CN2627654Y publication Critical patent/CN2627654Y/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNU022926046U 2001-12-27 2002-12-26 热电模块 Expired - Lifetime CN2627654Y (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP397462/2001 2001-12-27
JP2001397462A JP4161572B2 (ja) 2001-12-27 2001-12-27 熱電モジュール

Publications (1)

Publication Number Publication Date
CN2627654Y true CN2627654Y (zh) 2004-07-21

Family

ID=19189198

Family Applications (2)

Application Number Title Priority Date Filing Date
CNU022926046U Expired - Lifetime CN2627654Y (zh) 2001-12-27 2002-12-26 热电模块
CNB021584516A Expired - Fee Related CN100356600C (zh) 2001-12-27 2002-12-26 热电模块

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNB021584516A Expired - Fee Related CN100356600C (zh) 2001-12-27 2002-12-26 热电模块

Country Status (3)

Country Link
US (1) US20030121540A1 (enExample)
JP (1) JP4161572B2 (enExample)
CN (2) CN2627654Y (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100356600C (zh) * 2001-12-27 2007-12-19 雅马哈株式会社 热电模块

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3999570B2 (ja) * 2002-05-29 2007-10-31 株式会社住田光学ガラス フィラメントランプ光量制御方法及びフィラメントランプ光量制御装置並びにフィラメントランプ光源装置
US20050183763A1 (en) * 2004-02-24 2005-08-25 Roger Christiansen Thermoelectric generation system utilizing a printed-circuit thermopile
WO2007047451A2 (en) * 2005-10-14 2007-04-26 Zt3 Technologies, Inc. Thermoelectric device produced by quantum confinement in nanostructures, and methods therefor
US20070084495A1 (en) * 2005-10-14 2007-04-19 Biprodas Dutta Method for producing practical thermoelectric devices using quantum confinement in nanostructures
US20070084499A1 (en) * 2005-10-14 2007-04-19 Biprodas Dutta Thermoelectric device produced by quantum confinement in nanostructures
US20070101737A1 (en) 2005-11-09 2007-05-10 Masao Akei Refrigeration system including thermoelectric heat recovery and actuation
US7310953B2 (en) * 2005-11-09 2007-12-25 Emerson Climate Technologies, Inc. Refrigeration system including thermoelectric module
US8658880B2 (en) * 2005-12-09 2014-02-25 Zt3 Technologies, Inc. Methods of drawing wire arrays
US20070131269A1 (en) * 2005-12-09 2007-06-14 Biprodas Dutta High density nanowire arrays in glassy matrix
US7767564B2 (en) * 2005-12-09 2010-08-03 Zt3 Technologies, Inc. Nanowire electronic devices and method for producing the same
US7559215B2 (en) * 2005-12-09 2009-07-14 Zt3 Technologies, Inc. Methods of drawing high density nanowire arrays in a glassy matrix
TWI405361B (zh) * 2008-12-31 2013-08-11 財團法人工業技術研究院 熱電元件及其製程、晶片堆疊結構及晶片封裝結構
CN101807662B (zh) * 2009-02-18 2012-09-05 财团法人工业技术研究院 热电元件及其制作方法、芯片堆叠结构及芯片封装结构
JP2011086737A (ja) * 2009-10-15 2011-04-28 Nippon Telegr & Teleph Corp <Ntt> 熱電変換モジュール
DE102010022668B4 (de) * 2010-06-04 2012-02-02 O-Flexx Technologies Gmbh Thermoelektrisches Element und Modul umfassend mehrere derartige Elemente
TWI443882B (zh) * 2010-11-15 2014-07-01 Ind Tech Res Inst 熱電轉換組件及其製造方法
JP5755895B2 (ja) * 2011-02-02 2015-07-29 電気化学工業株式会社 アルミニウム−ダイヤモンド系複合体及びその製造方法
KR101384981B1 (ko) * 2012-01-30 2014-04-14 연세대학교 산학협력단 열효율을 개선할 수 있는 구조를 갖는 열전 소자
DE102012102090A1 (de) * 2012-01-31 2013-08-01 Curamik Electronics Gmbh Thermoelektrisches Generatormodul, Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
KR20160094683A (ko) * 2015-02-02 2016-08-10 엘지이노텍 주식회사 차량용 음료수용장치
KR20190088701A (ko) * 2018-01-19 2019-07-29 엘지이노텍 주식회사 열전 소자
US11088037B2 (en) * 2018-08-29 2021-08-10 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device having probe pads and seal ring
CN112242480A (zh) * 2020-09-30 2021-01-19 西南电子技术研究所（中国电子科技集团公司第十研究所） 芯片级电子设备热电制冷方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687879A (en) * 1985-04-25 1987-08-18 Varo, Inc. Tiered thermoelectric unit and method of fabricating same
EP0843366B1 (en) * 1996-05-28 2006-03-29 Matsushita Electric Works, Ltd. Method for manufacturing thermoelectric module
JPH10190071A (ja) * 1996-12-20 1998-07-21 Aisin Seiki Co Ltd 多段電子冷却装置
JP2988432B2 (ja) * 1997-05-13 1999-12-13 日本電気株式会社 温度制御型半導体モジュール
US6492585B1 (en) * 2000-03-27 2002-12-10 Marlow Industries, Inc. Thermoelectric device assembly and method for fabrication of same
JP4161572B2 (ja) * 2001-12-27 2008-10-08 ヤマハ株式会社 熱電モジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100356600C (zh) * 2001-12-27 2007-12-19 雅马哈株式会社 热电模块

Also Published As

Publication number Publication date
JP2003197988A (ja) 2003-07-11
CN1428875A (zh) 2003-07-09
US20030121540A1 (en) 2003-07-03
JP4161572B2 (ja) 2008-10-08
CN100356600C (zh) 2007-12-19

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Effective date of abandoning: 20071219

AV01 Patent right actively abandoned

Effective date of abandoning: 20071219

C25 Abandonment of patent right or utility model to avoid double patenting