CN2587129Y - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN2587129Y
CN2587129Y CN02287910U CN02287910U CN2587129Y CN 2587129 Y CN2587129 Y CN 2587129Y CN 02287910 U CN02287910 U CN 02287910U CN 02287910 U CN02287910 U CN 02287910U CN 2587129 Y CN2587129 Y CN 2587129Y
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China
Prior art keywords
substrate
baseplate
circuit board
chip
adjusting screw
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Expired - Fee Related
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CN02287910U
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张华富
陈荣哲
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置，包括一第一基板、一第二基板、一调节螺丝及若干固定螺丝。该第一基板上冲设有若干接触部，这些接触部的深度取决于电路板上各芯片的高度，组装时，将第一基板套设于电路板上装设有芯片的一面，将第二基板置于另一面，通过固定螺丝将第一基板、电路板及第二基板固定于一体，且将调节螺丝穿过第一基板、电路板及第二基板中心的调节螺孔而调节第一基板与电路板芯片结合的松紧度，从而改善第一基板与电路板的芯片的接触程度，且通过导热性能良好的调节螺丝将热量从第一基板传导于第二基板，从而增大散热面积进而达到良好的散热效果。

Description

散热装置
【技术领域】
本实用新型是关于一种散热装置，特别是关于一种可降低精密度要求、提高生产效率且增大散热面积的散热装置。
【背景技术】
在空间有限的电子设备中，如PCI电路板，无足够空间使用散热座排除热量，现有技术通常采用一设有若干凸部的散热板盖套于电路板上需散热的芯片上，这种散热板的凸部须具有高精密度以与各个不同高度的芯片达成紧密贴合状进而有效散热，通过固定螺丝将该散热板固定于PCI电路板上，这些固定螺丝只是将该散热板的四角固定于PCI电路板的四角上，而无法调节散热板的凸部与PCI电路板上的芯片接触的程度，所以散热板的接触部与PCI电路板上的芯片接触的程度完全取决于散热板加工的精密度，如散热板的精密度不高则导致散热板上的凸部与芯片接触不够紧密而影响芯片的散热。高精密度要求使得生产效率低、成本高，而且仅一块散热板的作用并不足以及时迅速地排除芯片产生的热量。
【发明内容】
本实用新型的目的在于提供一种可降低精密度要求、提高生产效率且增大散热面积的散热装置。
本实用新型的目的是通过下列技术方案实现的：本实用新型散热装置，包括一第一基板、一第二基板、一调节螺丝及若干固定螺丝。该第一基板上冲设有若干接触部，这些接触部的深度取决于电路板上各芯片的高度，组装时，将第一基板套设于电路板上装设有芯片的一面，将第二基板置于另一面，通过固定螺丝将第一基板、电路板及第二基板固定于一体，且将调节螺丝穿过第一基板、电路板及第二基板中心的调节螺孔而调节第一基板与电路板芯片结合的松紧度，从而改善第一基板与电路板的芯片的接触程度，且通过导热性能良好的调节螺丝将热量从第一基板传导于第二基板，从而增大散热面积进而达到良好散热之效果。
与现有技术相比较，本实用新型降低了精密度要求、提高了生产效率且增大了散热面积的。
【附图说明】
图1是本实用新型散热装置的立体分解图。
图2是本实用新型散热装置与电路板的组合图。
【具体实施方式】
请参阅图1，本实用新型散热装置包括一第一基板10、一第二基板30、若干固定螺丝50及一调节螺丝60。该散热装置是固定于PCI电路板70上以扩大芯片散热面。该电路板70上开设有穿孔72及中心孔74，可通过固定螺丝50及调节螺丝60将该第一基板10固定于PCI电路板70的装设有芯片(未标号)的一面且将第二基板30装设于其另一面。
该第一基板上设有若干接触部12，该等接触部12呈凸状。该第一基板的四角处设有固定脚一(未标号)，该等固定脚上分别开设有一固定孔16，该第一基板中央位置处开设有一调节螺孔14以供调节螺丝60穿设。
该第二基板的四角处对应于第一基板的固定脚一设有固定脚二(未标号)，该等固定脚二上分别开设有一固定孔34，第二基板的中央位置处对应于第一基板的调节螺孔14开设有一调节螺孔32。
该调节螺丝60是由导热性能良好的材料制成。
请一并参阅图2，组装时，将第一基板10套设于PCI电路板70的装设有芯片的一面，使其接触部12套于电路板70的芯片(未标号)上，将第二基板30置于电路板70的另一面，且使第一基板10的固定孔16、第二基板30的固定孔34与PCI电路板70的穿孔72对齐，将固定螺丝50依次穿过固定孔16、穿孔72及固定孔34，而将第一基板10、PCI电路板70及第二基板30锁固于一体。
再将调节螺丝60依次穿过第一基板10的调节螺孔14、PCI电路板上的中心孔74及第二基板30的调节螺孔32，通过调节螺丝60使第一基板10的接触部12与PCI电路板70的芯片(未标号)达成紧密接触，第一基板10、PCI电路板70、第二基板30便有效地结合于一体。第一基板10的接触部12与PCI电路板70的芯片(未标号)间的紧密接触可使得热量有效地从芯片传导于第一基板10，且第一基板10的热量可通过导热性能良好之调节螺丝60进一步传导于第二基板30，因此可使得芯片产生的热量及时迅速地排除，且因调节螺丝60可调节第一基板10的接触部12与PCI电路板70的芯片(未标号)接触的松紧度，可降低第一基板10的加工精度要求，所以提高了生产效率，降低了加工成本。

Claims (5)

1.一种散热装置，用于电路板上的芯片散热，包括一基板、至少一调节螺丝和若干固定螺丝，该基板上设有若干接触部，该等接触部的高度取决于电板板上各芯片的高度，基板四角各设有一固定孔，其特征在于：该基板上设有一调节螺孔以供调节螺丝穿设于其中。
2.如权利要求1所述的散热装置，其特征在于：该基板的接触部呈凸状。
3.如权利要求1所述的散热装置进一步包括一第二基板，该第二基板设有一与第一基板的调节螺孔对应的调节螺孔。
4.如权利要求3所述的散热装置，其特征在于：该调节螺丝由导热性能良好之材料制成。
5.如权利要求3所述的散热装置，其特征在于：该第二基板对应于第一基板的固定孔设有固定孔。
CN02287910U 2002-09-12 2002-11-19 散热装置 Expired - Fee Related CN2587129Y (zh)

Applications Claiming Priority (2)

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US10/242,225 US6603665B1 (en) 2002-09-12 2002-09-12 Heat dissipating assembly with thermal plates
US10/242,225 2002-09-12

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US6603665B1 (en) 2003-08-05

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Granted publication date: 20031119

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