CN221687524U

CN221687524U - MOSFET chip packaging structure

Info

Publication number: CN221687524U
Application number: CN202323287861.6U
Authority: CN
Inventors: 吉炜
Original assignee: Wuxi Qianye Micro Nano Technology Co ltd
Current assignee: Wuxi Qianye Micro Nano Technology Co ltd
Priority date: 2023-12-04
Filing date: 2023-12-04
Publication date: 2024-09-10
Anticipated expiration: 2033-12-04

Abstract

The utility model relates to the technical field of chip packaging, in particular to a MOSFET chip packaging structure, which comprises: the bottom plate that chip and heat conduction material were made, the top of chip is connected with first source pin through the copper strips, the copper strips passes through the resin and links to each other with first source pin, the conducting end of the bottom of chip links to each other with the second source pin, the bottom of chip passes through the resin and links to each other with the second source pin, the top of bottom plate is equipped with a plurality of ventilative holes, ventilative hole links to each other with ventilative outer hole through ventilative passageway, ventilative outer hole sets up on the terminal surface of bottom, the top of bottom is equipped with the guard frame, guard frame swing joint shell, accessible bottom plate, the heat that produces the chip is transferred, improve packaging structure's heat dispersion, and through setting up ventilative hole and ventilative outer hole, utilize ventilative passageway to communicate with each other it, can convey the heat that the chip bottom produced in the ventilative outer hole through ventilative hole, improve packaging structure's heat dispersion.

Description

MOSFET chip packaging structure

Technical Field

The utility model relates to the technical field of chip packaging, in particular to a MOSFET chip packaging structure.

Background

A MOSFET (metal oxide semiconductor field effect transistor) is a field effect transistor that controls a semiconductor by using an electric field effect. Since MOSFETs have characteristics that enable low power consumption voltage control, they have been widely used in recent years in a large number of electronic devices including power supplies, automotive electronics, computers, smart phones, and the like.

At present, MOSFET packaging mainly adopts TO, SOT, SOP, QFP, QFN and other forms, the chip is wrapped in a plastic package, the size of the device is increased by the plastic package, the requirement of the semiconductor on light, short, thin and small development is not met, heat generated during the operation of the chip cannot be timely conducted away or dissipated, the improvement of MSOFET performance is restricted, and in addition, the packaging technology is based on a single chip, and the problems of low production efficiency and high packaging cost exist.

The MOSFET performance, particularly the current carrying capability, is largely dependent on the heat dissipation and the conduction resistance of the current, which is dependent on the conduction path length (i.e., closely related to the thickness of the chip), which in turn is largely dependent on the packaging form.

Therefore, it is necessary to provide a MOSFET chip package structure to solve the above technical problems.

Disclosure of utility model

In order to solve the technical problems, the utility model provides a MOSFET chip packaging structure.

The utility model provides a MOSFET chip packaging structure, which comprises: the bottom plate that chip and heat conduction material were made, the top of chip is connected with first source pin through the copper strips, the copper strips passes through the resin and links to each other with first source pin, the conducting end of the bottom of chip links to each other with the second source pin, the bottom of chip passes through the resin and links to each other with the second source pin, first source pin and second source pin install the both ends at the bottom plate top respectively, the top of bottom plate is equipped with a plurality of ventilative holes, ventilative hole passes through ventilative passageway and links to each other with ventilative outer hole, ventilative outer hole sets up on the terminal surface of bottom, the top of bottom is equipped with the guard frame, pass through the resin bonding between shell and the guard frame.

Through setting up ventilative hole and ventilative outer hole, utilize ventilative passageway to communicate with each other it, can pass through ventilative hole transfer to ventilative outer hole with the heat that the chip bottom produced in, further improve packaging structure's heat dispersion to through setting up the protection frame, be convenient for link to each other protection frame and shell on the one hand, on the other hand can restrict the resin through the protection frame, prevent when passing through the resin with the shell and link to each other, prevent that the resin from outwards overflowing, cause the influence to the chip, influence the normal operation of chip.

Preferably, the ventilation inner hole is in a truncated cone-shaped structure, and the size of one end of the ventilation inner hole, which faces the outer side of the bottom plate, is smaller than the size of the other end of the ventilation inner hole.

Preferably, the ventilation outer hole is in a truncated cone structure, the size of one end of the ventilation outer hole, facing the inner side of the bottom plate, is larger than the size of the other end of the ventilation outer hole, and the filter screen is arranged at one end of the ventilation outer hole, facing the outer side.

Preferably, the top of the shell is made of metal, and the bottom plate is made of metal.

Preferably, the chip is connected with the ventilation inner hole through a heat conduction pipe, and the heat conduction pipe is made of metal.

Preferably, the number of the first source pins and the second source pins is multiple, and the first source pins and the second source pins are equidistantly distributed at two ends of the top of the bottom plate.

Compared with the related art, the MOSFET chip packaging structure provided by the utility model has the following beneficial effects:

1. According to the utility model, the heat generated by the chip can be transferred through the bottom plate by arranging the bottom plate made of the heat conducting material, so that the heat dissipation performance of the packaging structure is improved, and the heat generated by the bottom of the chip can be transferred into the air-permeable outer hole through the air-permeable inner hole by arranging the air-permeable inner hole and communicating the air-permeable outer hole through the air-permeable channel, so that the heat dissipation performance of the packaging structure is further improved;

2. According to the utility model, the ventilation inner hole is of the round table structure with the big upper part and the small lower part, so that the hot air in the shell can be conveniently dispersed by increasing the contact area between the ventilation inner hole and the inside of the shell, and the ventilation inner hole 10 is of the round table structure with the small outside and the big inside, so that the contact area between the big ventilation outer hole and the inside of the outside can be reduced, and the outside dust can be prevented from entering the inside of the shell;

3. According to the utility model, the heat conduction pipe made of metal is arranged, so that the heat on the chip can be conveniently transferred into the ventilation inner hole, and the heat dissipation efficiency of the chip is improved.

Drawings

Fig. 1 is a schematic structural diagram of a preferred embodiment of a MOSFET chip package structure according to the present utility model;

FIG. 2 is a schematic diagram of the inside of a MOSFET chip package structure shown in FIG. 1;

FIG. 3 is a schematic view of the air-permeable inner and outer holes shown in FIG. 1;

reference numerals in the drawings: 1. a bottom plate; 2. a housing; 3. a first source lead; 4. a second source lead; 5. a breathable outer aperture; 6. a protective frame; 7. a chip; 8. a heat conduction pipe; 9. copper strips; 10. a ventilation inner hole; 11. and a ventilation channel.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the embodiments of the present utility model, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate an azimuth or a positional relationship based on that shown in the drawings, or an azimuth or a positional relationship in which the product of the present utility model is conventionally put when used, it is merely for convenience of describing the present utility model and simplifying the description, and it does not indicate or imply that the apparatus or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.

Furthermore, the terms "horizontal," "vertical," "overhang" and the like, if any, do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the embodiments of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

A novel implementation of a MOSFET chip package structure is described in detail below with reference to specific embodiments.

Referring to fig. 1 to 3, the MOSFET chip package structure provided by the present utility model includes: the bottom plate 1 that chip 7 and heat conduction material were made, the top of chip 7 is connected with first source pin 3 through copper strips 9, copper strips 9 link to each other with first source pin 3 through the resin, the conducting end of the bottom of chip 7 is connected with second source pin 4, the bottom of chip 7 is connected with second source pin 4 through the resin, first source pin 3 and second source pin 4 are installed respectively at the both ends at bottom plate 1 top, the top of bottom plate 1 is equipped with a plurality of ventilative holes 10, ventilative hole 10 is connected with ventilative outer hole 5 through ventilative passageway 11, ventilative outer hole 5 sets up on the terminal surface of bottom, the top of bottom is equipped with protection frame 6, through the resin bonding between shell 2 and the protection frame 6.

It should be noted that: through setting up the bottom plate 1 that the heat conduction material was made, accessible bottom plate 1, the heat that produces chip 7 carries out the transmission, improve packaging structure's heat dispersion, and through setting up ventilative hole 10 and ventilative outer hole 5, utilize ventilative passageway 11 to communicate with each other it, ventilative hole 10 does not communicate with each other with the external world, ventilative hole 10 does not communicate with each other with shell 2 inside, can pass through ventilative hole 10 with the heat that produces in the chip 7 bottom and convey ventilative outer hole 5, further improve packaging structure's heat dispersion, and through setting up protective frame 6, be convenient for link to each other protective frame 6 and shell 2 on the one hand, on the other hand can restrict the resin through protective frame 6, prevent when passing through the resin with shell 2 and link to each other, prevent that the resin from outwards spilling over, influence chip 7, influence the normal operation of chip 7.

In the embodiment of the present utility model, referring to fig. 3, the ventilation inner hole 10 has a truncated cone structure, and a dimension of one end of the ventilation inner hole 10 facing the outer side of the base plate 1 is smaller than a dimension of the other end of the ventilation inner hole 10.

It should be noted that: through setting the ventilative hole 10 to big-end-up's round platform structure, the accessible increases ventilative hole 10 and the inside area of contact of shell 2, is convenient for dispel the inside steam of shell 2.

In the embodiment of the present utility model, referring to fig. 3, the ventilation outer hole 5 has a truncated cone structure, the size of one end of the ventilation outer hole 5 facing the inner side of the bottom plate 1 is larger than the size of the other end of the ventilation outer hole 5, and a filter screen is installed at one end of the ventilation outer hole 5 facing the outer side.

It should be noted that: through setting the ventilative outer hole 5 to the round platform structure of outside little inside big, accessible reduces ventilative outer hole 5 and external area of contact, prevents that external dust from entering into inside the shell 2.

In the embodiment of the present utility model, referring to fig. 1, the top of the housing 2 is made of metal, and the bottom plate 1 is made of metal.

It should be noted that: by setting the material of the case 2 and the bottom plate 1 to be a metal material, the heat dissipation efficiency of the chip 7 is improved by utilizing the good heat conductivity of the metal material.

In the embodiment of the present utility model, referring to fig. 2, the chip 7 is connected to the ventilation inner hole 10 through a heat conducting tube 8, and the heat conducting tube 8 is made of metal.

It should be noted that: the top and the bottom of heat pipe 8 accessible resin are connected with chip 7 and ventilative hole 10 respectively, through setting up the heat pipe 8 of metal material, in being convenient for with the heat transfer on the chip 7 to ventilative hole 10, further improve the radiating efficiency to chip 7.

In the embodiment of the present utility model, as shown in fig. 1, the number of the first source pins 3 and the second source pins 4 is plural, and the first source pins 3 and the second source pins 4 are equidistantly distributed at two ends of the top of the bottom plate 1.

The working principle of the MOSFET chip 7 packaging structure provided by the utility model is as follows:

Through setting up the bottom plate 1 that the heat conduction material was made, accessible bottom plate 1 carries out the transmission with the heat that chip 7 produced, improve packaging structure's heat dispersion, and communicate with each other it through setting up ventilative hole 10 and ventilative outer hole 5, utilize ventilative passageway 11 to communicate with each other it, can pass through ventilative hole 10 with the heat that chip 7 bottom produced and convey ventilative outer hole 5 in, further improve packaging structure's heat dispersion, and through setting up protective frame 6, be convenient for link to each other protective frame 6 and shell 2 on the one hand, on the other hand can restrict the resin through protective frame 6, prevent when passing through the resin with shell 2 and link to each other, prevent that the resin from outwards overflowing, cause the influence to chip 7, influence the normal operation of chip 7.

The circuits and control involved in the present utility model are all of the prior art, and are not described in detail herein.

The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.

Claims

1. A MOSFET chip package structure, comprising: the bottom plate (1) that chip (7) and heat conduction material were made, the top of chip (7) is connected with first source pin (3) through copper strips (9), copper strips (9) link to each other with first source pin (3) through resin, the conducting end and the second source pin (4) of the bottom of chip (7) link to each other, the bottom of chip (7) is passed through resin and is linked to each other with second source pin (4), both ends at bottom plate (1) top are installed respectively with second source pin (4) first source pin (3), the top of bottom plate (1) is equipped with a plurality of ventilative hole (10), ventilative hole (10) link to each other with ventilative outer hole (5) through ventilative passageway (11), ventilative outer hole (5) set up on the terminal surface of bottom plate (1), the top of bottom plate (1) is equipped with protection frame (6), through resin bonding between shell (2) and protection frame (6).

2. The MOSFET chip packaging structure according to claim 1, wherein the ventilation inner hole (10) has a truncated cone-shaped structure, and a dimension of one end of the ventilation inner hole (10) facing the outer side of the bottom plate (1) is smaller than a dimension of the other end of the ventilation inner hole (10).

3. The MOSFET chip packaging structure according to claim 2, wherein the ventilation outer hole (5) has a truncated cone structure, a size of one end of the ventilation outer hole (5) facing the inner side of the bottom plate (1) is larger than a size of the other end of the ventilation outer hole (5), and a filter screen is installed at one end of the ventilation outer hole (5) facing the outer side.

4. The MOSFET chip package according to claim 1, wherein the top of the housing (2) is made of metal, and the bottom plate (1) is made of metal.

5. The MOSFET chip packaging structure according to claim 1, wherein the chip (7) is connected with the ventilation inner hole (10) through a heat conduction pipe (8), and the heat conduction pipe (8) is made of metal.

6. The MOSFET chip package according to claim 1, wherein the number of the first source leads (3) and the second source leads (4) is plural, and the first source leads (3) and the second source leads (4) are equidistantly distributed at two ends of the top of the bottom plate (1).