CN221354616U - PCB board of soft or hard combination leveling formula pressfitting - Google Patents
PCB board of soft or hard combination leveling formula pressfitting Download PDFInfo
- Publication number
- CN221354616U CN221354616U CN202323456427.6U CN202323456427U CN221354616U CN 221354616 U CN221354616 U CN 221354616U CN 202323456427 U CN202323456427 U CN 202323456427U CN 221354616 U CN221354616 U CN 221354616U
- Authority
- CN
- China
- Prior art keywords
- layer
- prepreg layer
- flow prepreg
- soft
- core board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000011889 copper foil Substances 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 239000010410 layer Substances 0.000 description 90
- 239000012790 adhesive layer Substances 0.000 description 22
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Abstract
The utility model discloses a soft and hard combined flat laminated PCB (printed circuit board), which comprises a flexible core board, a first copper foil layer, a first flow prepreg layer, a second copper foil layer and a second flow prepreg layer, wherein a plurality of upper grooves are formed on an upper rigid core board unit, and a plurality of first filling parts which are respectively filled in the upper grooves in a one-to-one correspondence manner are arranged on the first flow prepreg layer; the lower rigid core plate unit is arranged between the second flow prepreg layer and the flexible core plate, a plurality of lower grooves are formed in the lower rigid core plate unit, and the second flow prepreg layer is provided with a plurality of second filling parts which are respectively filled in the plurality of lower grooves in a one-to-one correspondence manner. The utility model can utilize the first filling parts of the first flow prepreg layer to be respectively filled in the plurality of upper grooves of the upper rigid core board unit in a one-to-one correspondence manner, and can improve the flatness of the PCB, thereby effectively improving the quality of the PCB.
Description
Technical Field
The utility model relates to the field of PCB boards, in particular to a soft and hard combined flat press-fit PCB board.
Background
With the development of technology, PCB boards adopting soft and hard combination are widely used. In the manufacturing process of the soft and hard combined type PCB, after an upper steel plate, an upper three-in-one component, an upper rigid core plate unit, a flexible core plate, a lower rigid core plate unit, a lower three-in-one component and a lower steel plate are overlapped together, the first lamination is performed to form a sub-plate, then an outer layer pattern of the sub-plate is manufactured, and then the second lamination is performed to form the soft and hard combined type PCB. The upper three-in-one assembly and the lower three-in-one assembly comprise a first release film, a PE film and a second release film which are sequentially arranged from top to bottom. However, the surface roughness phenomenon is easy to occur after one-time lamination, and the flatness of the PCB is affected, so that the quality of the final PCB is easily affected.
Disclosure of utility model
In order to overcome the defects of the prior art, the utility model aims to provide the soft and hard combined flat press-fit PCB which can improve the flatness of the PCB, thereby effectively improving the quality of the PCB.
The utility model adopts the following technical scheme:
A soft and hard combined flat press-fit PCB comprises a flexible core board, a first copper foil layer, a first flow prepreg layer, a second copper foil layer and a second flow prepreg layer; the first flow prepreg layer is arranged above the flexible core plate, the first copper foil layer is arranged above the first flow prepreg layer, an upper rigid core plate unit is arranged between the first flow prepreg layer and the flexible core plate, a plurality of upper grooves are formed at one end, close to the first flow prepreg layer, of the upper rigid core plate unit, and a plurality of first filling parts which are respectively filled in the upper grooves in a one-to-one correspondence manner are arranged on the first flow prepreg layer; the second flow prepreg layer is positioned below the flexible core board, and the second copper foil layer is arranged below the second flow prepreg layer; a plurality of lower grooves are formed in one end, close to the second flow prepreg layer, of the lower rigid core plate unit, and the second flow prepreg layer is provided with a plurality of second filling parts which are respectively filled in the lower grooves in a one-to-one correspondence mode.
The overhead rigid core board unit includes at least one first FR4 core board.
The upper rigid core board unit comprises at least two first FR4 core boards which are sequentially arranged from top to bottom, and any two adjacent first FR4 core boards are bonded through a first bonding layer; the overhead groove is disposed on a first FR4 core board adjacent to the first flow prepreg layer.
The first bonding layer is a first middle prepreg layer; the first middle prepreg layer comprises a plurality of first non-flowing prepregs.
The first FR4 core board comprises a first FR4 medium layer and a first FR4 inner copper layer, and the first FR4 inner copper layer is arranged on the first FR4 medium layer.
The underlying rigid core board unit includes at least one second FR4 core board.
The lower rigid core board unit comprises at least two second FR4 core boards which are sequentially arranged from top to bottom, and any two adjacent second FR4 core boards are bonded through a second bonding layer; the undercut groove is disposed on a second FR4 core board adjacent to the second flow prepreg layer.
The second bonding layer is a second middle prepreg layer; the second middle prepreg layer comprises a plurality of second non-flowing prepregs.
The second FR4 core board comprises a second FR4 dielectric layer and a second FR4 inner copper layer, and the second FR4 inner copper layer is arranged on the second FR4 dielectric layer.
The flexible core plate and the upper rigid core plate unit are bonded through an upper bonding layer; the flexible core plate and the underlying rigid core plate unit are bonded by an underlying bonding layer.
Compared with the prior art, the utility model has the beneficial effects that:
According to the soft and hard combined flat laminated PCB, the first filling parts of the first flow prepreg layer are respectively filled in the upper grooves of the upper rigid core plate unit in a one-to-one correspondence manner, and the second filling parts of the second flow prepreg layer are respectively filled in the lower grooves of the lower rigid core plate unit in a one-to-one correspondence manner, so that the flatness of the PCB can be improved, and the quality of the PCB can be effectively improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
10. A flexible core panel; 20. a first copper foil layer; 30. a first flow prepreg layer; 31. a first filling section; 40. a second copper foil layer; 50. a second flow prepreg layer; 51. a second filling portion; 60. an upper rigid core board unit; 61. an upper groove; 62. a first FR4 core board; 63. a first adhesive layer; 64. a first FR4 dielectric layer; 65. a first FR4 inner copper layer; 66. a raised part is arranged on the upper part; 70. a lower rigid core board unit; 71. a lower groove; 72. a second FR4 core board; 73. a second adhesive layer; 74. a second FR4 dielectric layer; 75. a second FR4 inner copper layer; 76. a lower protruding part; 81. an adhesive layer is arranged on the upper part; 82. an adhesive layer is arranged under the adhesive layer.
Detailed Description
The present utility model will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, on the premise of no conflict, the following embodiments or technical features may be arbitrarily combined to form new embodiments.
As shown in fig. 1, a soft and hard combined flat laminated PCB board includes a flexible core board 10, a first copper foil layer 20, a first flow prepreg layer 30, a second copper foil layer 40 and a second flow prepreg layer 50; the first flow prepreg layer 30 is located above the flexible core board 10, the first copper foil layer 20 is disposed above the first flow prepreg layer 30, an upper rigid core board unit 60 is disposed between the first flow prepreg layer 30 and the flexible core board 10, a plurality of upper grooves 61 are formed at one end of the upper rigid core board unit 60 near the first flow prepreg layer 30, and the first flow prepreg layer 30 is provided with a plurality of first filling parts 31 which are respectively filled in the plurality of upper grooves 61 in a one-to-one correspondence manner; the second flow prepreg layer 50 is located below the flexible core board 10, and the second copper foil layer 40 is disposed below the second flow prepreg layer 50; a lower rigid core board unit 70 is disposed between the second flow prepreg layer 50 and the flexible core board 10, a plurality of lower grooves 71 are formed at one end of the lower rigid core board unit 70 near the second flow prepreg layer 50, and the second flow prepreg layer 50 is provided with a plurality of second filling parts 51 respectively filling the plurality of lower grooves 71 in a one-to-one correspondence.
The soft and hard combined flat laminated PCB provided by the utility model has the advantages that the first filling parts 31 of the first flow prepreg layer 30 are respectively filled in the upper grooves 61 of the upper rigid core plate unit 60 in a one-to-one correspondence manner, and the second filling parts 51 of the second flow prepreg layer 50 are respectively filled in the lower grooves 71 of the lower rigid core plate unit 70 in a one-to-one correspondence manner, so that the flatness of the PCB can be improved, the phenomenon of uneven surface of the PCB is avoided, and the quality of the PCB can be effectively improved.
The overhead rigid core board unit 60 includes at least a first FR4 core board 62. Specifically, the upper rigid core board unit 60 includes at least two first FR4 core boards 62 sequentially arranged from top to bottom, and any two adjacent first FR4 core boards 62 are bonded by a first adhesive layer 63; the upper groove 61 is disposed on the first FR4 core board 62 adjacent to the first flow prepreg layer 30. The first FR4 core 62 includes a first FR4 dielectric layer 64 and a first FR4 inner copper layer 65, the first FR4 inner copper layer 65 being disposed on the first FR4 dielectric layer 64. By adopting the above arrangement for the upper rigid core plate unit 60, the performance requirements of the upper rigid core plate unit 60 can be satisfied, and the manufacturing cost can be reduced.
The first adhesive layer 63 is a first middle prepreg layer; the first middle prepreg layer comprises a plurality of first non-flowing prepregs.
Of course, in addition to this, the first adhesive layer 63 may be a resin adhesive layer, as long as the adhesive effect between two adjacent first FR4 core boards 62 can be achieved, but the first adhesive layer 63 is a first middle prepreg layer comprising a plurality of first non-flowing prepregs, which is the best mode of the present utility model, so that the problem of glue overflow between the first FR4 core boards 62 can be avoided.
Specifically, the overhead groove 61 is disposed on a first FR4 inner copper layer 65 of the first FR4 core board 62 adjacent to the first flow prepreg layer 30.
The underlying rigid core board unit 70 includes at least one second FR4 core board 72. The lower rigid core board unit 70 includes at least two second FR4 core boards 72 sequentially arranged from top to bottom, and any two adjacent second FR4 core boards 72 are bonded by a second bonding layer 73; the undercut groove 71 is disposed on a second FR4 core board 72 adjacent to the second flow prepreg layer 50. The second FR4 core 72 includes a second FR4 dielectric layer 74 and a second FR4 inner copper layer 75, the second FR4 inner copper layer 75 being disposed on the second FR4 dielectric layer 74. By adopting the above arrangement for the lower rigid core plate unit 70, the performance requirements of the lower rigid core plate unit 70 can be satisfied, and the manufacturing cost can be reduced.
The second adhesive layer 73 is a second middle prepreg layer; the second middle prepreg layer comprises a plurality of second non-flowing prepregs.
Of course, in addition to this, the second adhesive layer 73 may be a resin adhesive layer, as long as the adhesive effect between two adjacent second FR4 core boards 72 can be achieved, but the second adhesive layer 73 is a second middle prepreg layer comprising a plurality of first non-flowing prepregs, which is the best mode of the present utility model, so that the problem of glue overflow between the second FR4 core boards 72 can be avoided.
The undercut 71 is disposed on a second FR4 inner copper layer 75 of a second FR4 core board 72 adjacent to the second flow prepreg layer 50.
The flexible core board 10 and the upper rigid core board unit 60 are bonded by an upper bonding layer 81; the flexible core 10 and the underlying rigid core unit 70 are bonded by an underlying adhesive layer 82. Specifically, the upper adhesive layer 81 and the lower adhesive layer 82 include a plurality of third non-flowing prepregs.
Of course, in addition to the above, the above adhesive layer 81 and the below adhesive layer 82 may be resin adhesive layers, which can serve as adhesive between the flexible core 10 and the above rigid core unit 60 and between the flexible core 10 and the below rigid core unit 70, but the above adhesive layer 81 and the below adhesive layer 82 are all made of a plurality of third non-flowing prepregs, which is the most preferred embodiment of the present utility model, so that the problem of glue overflow between the flexible core 10 and the above rigid core unit 60 and between the flexible core 10 and the below rigid core unit 70 can be avoided.
The upper rigid core board unit 60 is further provided with an upper window, the flexible core board 10 is provided with an upper cover film corresponding to the upper window, the lower rigid core board unit 70 is further provided with a lower window, and the flexible core board 10 is provided with a lower cover film corresponding to the lower window.
Specifically, the end of the upper rigid core board unit 60 near the first flow prepreg layer 30 is further formed with a plurality of upper protruding portions 66, the plurality of upper protruding portions 66 and the plurality of upper grooves 61 are alternately arranged, the first flow prepreg layer 30 includes a first main covering body, the plurality of first filling portions 31 are arranged on the first main covering body, and the first main covering body covers and is attached to the upper protruding portions 66. The end of the lower rigid core board unit 70 near the second flow prepreg layer 50 is further formed with a plurality of lower protruding parts 76, the plurality of lower protruding parts 76 and the plurality of lower grooves 71 are alternately arranged, the second flow prepreg layer 50 comprises a second main cover body, the plurality of second filling parts 51 are arranged on the second main cover body, and the second main cover body covers and is attached to the lower protruding parts 76. By adopting the arrangement, the flatness of the PCB can be improved, and the PCB is convenient to manufacture and form.
The above embodiments are only preferred embodiments of the present utility model, and the scope of the present utility model is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present utility model are intended to be within the scope of the present utility model as claimed.
Claims (10)
1. A PCB board of soft or hard combination leveling pressfitting, its characterized in that: the flexible core board comprises a flexible core board, a first copper foil layer, a first flow prepreg layer, a second copper foil layer and a second flow prepreg layer; the first flow prepreg layer is arranged above the flexible core plate, the first copper foil layer is arranged above the first flow prepreg layer, an upper rigid core plate unit is arranged between the first flow prepreg layer and the flexible core plate, a plurality of upper grooves are formed at one end, close to the first flow prepreg layer, of the upper rigid core plate unit, and a plurality of first filling parts which are respectively filled in the upper grooves in a one-to-one correspondence manner are arranged on the first flow prepreg layer; the second flow prepreg layer is positioned below the flexible core board, and the second copper foil layer is arranged below the second flow prepreg layer; a plurality of lower grooves are formed in one end, close to the second flow prepreg layer, of the lower rigid core plate unit, and the second flow prepreg layer is provided with a plurality of second filling parts which are respectively filled in the lower grooves in a one-to-one correspondence mode.
2. The soft and hard combined flat laminated PCB of claim 1, wherein: the overhead rigid core board unit includes at least one first FR4 core board.
3. The soft and hard combined flat laminated PCB of claim 2, wherein: the upper rigid core board unit comprises at least two first FR4 core boards which are sequentially arranged from top to bottom, and any two adjacent first FR4 core boards are bonded through a first bonding layer; the overhead groove is disposed on a first FR4 core board adjacent to the first flow prepreg layer.
4. The soft and hard combined flat laminated PCB of claim 3, wherein: the first bonding layer is a first middle prepreg layer; the first middle prepreg layer comprises a plurality of first non-flowing prepregs.
5. The soft and hard combined flat laminated PCB of claim 3, wherein: the first FR4 core board comprises a first FR4 medium layer and a first FR4 inner copper layer, and the first FR4 inner copper layer is arranged on the first FR4 medium layer.
6. The soft and hard combined flat laminated PCB of claim 1, wherein: the underlying rigid core board unit includes at least one second FR4 core board.
7. The soft and hard combined flat pressed PCB of claim 6, wherein: the lower rigid core board unit comprises at least two second FR4 core boards which are sequentially arranged from top to bottom, and any two adjacent second FR4 core boards are bonded through a second bonding layer; the undercut groove is disposed on a second FR4 core board adjacent to the second flow prepreg layer.
8. The soft and hard combined flat pressed PCB of claim 7, wherein: the second bonding layer is a second middle prepreg layer; the second middle prepreg layer comprises a plurality of second non-flowing prepregs.
9. The soft and hard combined flat pressed PCB of claim 7, wherein: the second FR4 core board comprises a second FR4 dielectric layer and a second FR4 inner copper layer, and the second FR4 inner copper layer is arranged on the second FR4 dielectric layer.
10. The soft and hard combined flat laminated PCB of claim 1, wherein: the flexible core plate and the upper rigid core plate unit are bonded through an upper bonding layer; the flexible core plate and the underlying rigid core plate unit are bonded by an underlying bonding layer.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221354616U true CN221354616U (en) | 2024-07-16 |
Family
ID=
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206442590U (en) | The structure-improved of Rigid Flex | |
| CN102933032B (en) | Printed wiring board lamination and copper block embedding method | |
| CN203618239U (en) | Pressing structure of rigid-flex printed circuit board | |
| CN211047454U (en) | Printed circuit board | |
| CN205961580U (en) | A compound glued membrane component that hinders for production of printed circuit board | |
| CN111565523A (en) | Manufacturing method of second-order copper block-buried circuit board | |
| CN221354616U (en) | PCB board of soft or hard combination leveling formula pressfitting | |
| CN110572958A (en) | Rigid-flex printed circuit board pressing structure and manufacturing method | |
| CN104754862A (en) | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate | |
| CN215729269U (en) | Photosensitive dry film for PCB | |
| CN206790781U (en) | Printed substrate is with covering copper composite plate | |
| CN102490435B (en) | Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method | |
| CN202357536U (en) | Metal-based copper-clad plate used for light-emitting diode (LED) for lighting | |
| CN115023070A (en) | Manufacturing method of semi-buried copper circuit board | |
| CN104582265A (en) | Implementation method of embedded capacitor and circuit board | |
| CN104717829A (en) | High-density bubble-free golden finger pressing structural slab and processing method thereof | |
| CN204350438U (en) | High density bubble-free golden finger pressing structure plate | |
| CN201750624U (en) | Improved laminar structure of PCB (printed circuit board) | |
| CN208273346U (en) | A kind of printed circuit board and electronic equipment | |
| CN219107796U (en) | Sinking type soft and hard combined circuit board | |
| CN108990262B (en) | Manufacturing process of double-sided thick copper circuit board | |
| CN219761425U (en) | Copper-buried pressing component capable of preventing glue overflow | |
| CN206212412U (en) | The reinforced flexible PCB of jigsaw | |
| CN217789984U (en) | High-voltage-resistant aluminum-based copper-clad plate | |
| CN205051970U (en) | Reinforcement steel sheet with fretwork exhaust layer and dull polish layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |