CN221041118U - Power tube, power circuit and power module - Google Patents
Power tube, power circuit and power module Download PDFInfo
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- CN221041118U CN221041118U CN202322691103.4U CN202322691103U CN221041118U CN 221041118 U CN221041118 U CN 221041118U CN 202322691103 U CN202322691103 U CN 202322691103U CN 221041118 U CN221041118 U CN 221041118U
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- 238000005452 bending Methods 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000005669 field effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000003032 molecular docking Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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Abstract
The utility model discloses a power tube, a power circuit and a power module, wherein the power tube comprises: a chip; the first pin is arranged on one side of the chip; the second pin is arranged on one side of the chip, which is away from the first pin; the third pin is arranged on the same side of the chip as the second pin, the first pin and the second pin are both bent and connected with the chip and have the same bending direction so as to be connected with a welding hole on the driving plate, the third pin is bent and connected with the chip, and the cross section area of the first pin is larger than that of the second pin and the third pin. The technical scheme of the utility model improves the convenience of the power module during assembly.
Description
Technical Field
The present utility model relates to the field of electronic components, and in particular, to a power tube, a power circuit, and a power module.
Background
In order to reduce the development cost of the whole product, a single tube of a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET, abbreviated as MOS, metal-Oxide semiconductor field effect transistor, abbreviated as Metal-Oxide semiconductor field effect transistor) is often used to assemble a rectifying module and an inverting module so as to replace a power module in the market.
Existing such power modules generally include: the MOS single tube, the aluminum substrate, the power pin and the control pin are connected with the driving plate to form a complete circuit. The MOS single tube is welded on the aluminum substrate through reflow soldering, and then the copper column and the independent pin needle are used for respectively connecting the aluminum substrate and the driving plate, wherein the copper column is used as a power pin, and the independent pin needle is used as a control pin.
The power module has the problem of complicated assembly.
Disclosure of utility model
The utility model mainly aims to provide a power tube, which aims to improve the simplicity of a power module in assembly.
In order to achieve the above object, the present utility model provides a power tube, comprising:
A chip;
The first pin is arranged on one side of the chip;
the second pin is arranged on one side of the chip, which is away from the first pin;
The third pin is arranged on the same side of the chip with the second pin, the first pin and the second pin are both connected with the chip in a bending way and have the same bending direction so as to be connected with a welding hole on a driving plate, the third pin is connected with the chip in a bending way, and the cross section area of the first pin is larger than that of the second pin and the third pin.
Optionally, the power tube further includes a plastic package body, the plastic package body is disposed outside the chip, and the first pin, the second pin and the third pin are all disposed through the plastic package body.
Optionally, the first pin and the second pin are bent towards a first direction, the first direction is perpendicular to the bottom surface of the plastic package body, the third pin is towards a second direction, and the second direction is perpendicular to the first direction and faces away from the direction of the plastic package body.
Optionally, the third pin is a patch pin.
Optionally, the first pin, the second pin and the third pin are bent towards a first direction, and the first direction is perpendicular to the bottom surface of the plastic package body.
Optionally, the power tube includes one of the first pins; and/or the number of the groups of groups,
The power tube comprises two second pins, and the two second pins are arranged at intervals; and/or the number of the groups of groups,
The power tube comprises three third pins, and the three third pins are arranged at intervals.
The utility model also proposes a power circuit comprising:
The power supply comprises at least one upper tube, wherein the upper tube is a power tube as described above, the first pin of the upper tube is used for being connected with an anode input, the second pin of the upper tube is used for transmitting signals, and the third pin of the upper tube is used for outputting current;
The power supply comprises at least one lower tube, wherein the lower tube is a power tube as described above, the first pin of the lower tube is used for outputting voltage, the second pin of the lower tube is used for transmitting signals, the third pin of the lower tube is used for being connected with negative electrode input, and the chip of the lower tube is electrically connected with the corresponding third pin of the upper tube;
The first pin, the second pin and the third pin of the upper tube are all used for being electrically connected with a driving plate.
The utility model also proposes a power module comprising:
A driving plate;
At least one power circuit as described above, the first pin, the second pin of the upper tube of the power circuit, and the first pin, the second pin, and the third pin of the lower tube of the power circuit are all electrically connected with the driving board.
Optionally, the power module further includes an insulating metal substrate, the chip of the upper tube and the chip of the lower tube are both fixed on the insulating metal substrate and electrically connected with the insulating metal substrate, and the third pin of the upper tube is electrically connected with the chip of the lower tube through the insulating metal substrate.
Optionally, the chip of the upper tube and the chip of the lower tube are disposed on the same side of the insulating metal substrate, and the power module further includes a radiator disposed on a side of the insulating metal substrate facing away from the chip.
Optionally, the power module further includes a heat conducting member, where the heat conducting member is disposed between the insulating metal substrate and the heat sink, and the heat conducting member is attached to a surface of the insulating metal substrate to transfer heat generated by the insulating metal substrate to the heat sink.
The power tube in the technical scheme of the embodiment of the utility model comprises a chip, a first pin, a second pin and a third pin, wherein the cross section area of the first pin is larger than that of the second pin and the third pin, the first pin is a power pin and is used for transmitting electric energy, the second pin and the third pin are signal pins and are used for transmitting signals, the first pin and the second pin are arranged on two sides of the chip, and the second pin and the third pin are arranged on the same side of the chip, so that the power pin and the signal pin of the power tube can be distinguished conveniently. When the power tube is assembled into the power module, after the positions of the chip are fixed, the positions of the first pin, the second pin and the third pin are also fixed, so that the assembly operation is reduced, the bending directions of the first pin and the second pin are the same, and the power tube is convenient to connect with the driving plate, thereby improving the convenience of the power module during assembly. On the other hand, compare with adopting copper post and contact pin, first pin, second pin and third pin directly set up on the chip, and the relative position precision between pin and the chip is higher, and the position deviation is easier to control, aligns more easily when being connected with the drive plate and forming power module, and then has improved power module's production efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a power tube according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of another embodiment of a power tube according to the present utility model;
Fig. 3 is a schematic structural diagram of a MOS single tube before forming a power tube according to the present utility model;
FIG. 4 is a schematic diagram of a power module according to an embodiment of the utility model;
fig. 5 is a schematic diagram of a half-bridge topology of a power module of the present utility model.
Reference numerals illustrate:
| Reference numerals | Name of the name | Reference numerals | Name of the name |
| 100 | Power tube | 110 | Chip |
| 120 | First pin | 130 | Second pin |
| 140 | Third pin | 200 | MOS single tube |
| 300 | Driving plate | 400 | IMS plate |
| 500 | Radiator | 600 | Heat conducting piece |
| 101 | Upper pipe | 102 | Lower pipe |
The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout includes three parallel schemes, for example "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
The utility model provides a power tube.
Referring to fig. 1 to 2, fig. 1 is a schematic structural diagram of an embodiment of a power tube according to the present utility model, and fig. 2 is a schematic structural diagram of another embodiment of a power tube according to the present utility model.
In an embodiment of the present utility model, the power tube 100 includes:
a chip 110;
the first pin 120 is arranged on one side of the chip 110;
The second pin 130 is arranged on one side of the chip 110 away from the first pin 120;
The third pin 140 and the second pin 130 are arranged on the same side of the chip 110, the first pin 120 and the second pin 130 are both bent and connected with the chip 110 in the same bending direction so as to be connected with the welding hole on the driving plate 300, the third pin 140 is bent and connected with the chip 110, and the cross section area of the first pin 120 is larger than that of the second pin 130 and the third pin 140.
The power tube 100 in one embodiment of the present utility model includes a chip 110, a first pin 120, a second pin 130, and a third pin 140, where the cross-sectional area of the first pin 120 is larger than that of the second pin 130 and the third pin 140, the first pin 120 is a power pin for accessing positive input or output voltage, the second pin 130 is a signal pin for transmitting signals, the third pin 140 is used for accessing negative input, the first pin 120 and the second pin 130 are disposed at two sides of the chip 110, and the second pin 130 and the third pin 140 are disposed at the same side of the chip 110, so as to facilitate distinguishing the power pin and the signal pin of the power tube 100. When the power tube 100 is assembled into the power module, after the positions of the chip 110 are fixed, the positions of the first pin 120, the second pin 130 and the third pin 140 are also fixed, so that the assembly operation is reduced, and the bending directions of the first pin 120 and the second pin 130 are the same, so that the power tube is convenient to connect with the driving plate 300, and the convenience of the power module in assembly is improved. On the other hand, compared with the copper column and the contact pin, the first pin 120, the second pin 130 and the third pin 140 are directly arranged on the chip 110, the relative position precision between the pins and the chip 110 is higher, the position deviation is easier to control, the alignment is easier when the pins are connected with the driving plate 300 to form a power module, and the production efficiency of the power module is further improved.
In an embodiment of the present utility model, optionally, the number of the second pins 130 is at least two, specifically, at least one of the second pins 130 may be used as a kelvin emitter, and at least one of the second pins 130 may be used as a gate.
In this embodiment of the present utility model, optionally, the number of the third pins 140 is at least one, at least one third pin 140 is used as an emitter, and the number of the third pins 140 may be determined according to design parameters of the power tube, for example, according to current magnitude, power magnitude, and the like.
Referring to fig. 1 to 3, the power tube 100 in the embodiment shown in fig. 1 and the power tube 100 in the embodiment shown in fig. 2 may be directly manufactured and formed, or may be packaged into a flat-wing MOS single tube 200 shown in fig. 3, and then manufactured into the power tube 100 shown in fig. 1 or fig. 2 by using two sets of rib cutting forming dies. The power pins need to be supplied with larger current in the working process, generally 15A-75A, so that the first pins 120 need to be thicker pins, that is, the cross section of the first pins 120 is larger, and the signal pins do not need to be pins with larger cross sections in order to reduce the cost. In this embodiment, the cross-sectional area of the first pin 120 is larger than that of the second pin 130, and the second pin 130 and the third pin 140 have the same shape and specification, so that the types of pins can be reduced, the complexity of the manufacturing process is reduced, the manufacturing is convenient, the production efficiency is improved, and the production cost is reduced.
Optionally, the power tube 100 further includes a plastic package body disposed outside the chip 110, and the first pin 120, the second pin 130, and the third pin 140 are all disposed through the plastic package body.
In this embodiment, a plastic package body is disposed outside the chip 110, the size of the chip 110 is small, the plastic package body plays a role in protecting and supporting the chip 110, the specific shape of the plastic package body can be adjusted and designed according to the needs, and the functional requirements can be met, which is not limited herein.
Optionally, the first pins 120 and the second pins 130 are bent towards a first direction, the first direction is perpendicular to the bottom surface of the plastic package body, the third pins 140 are towards a second direction, and the second direction is perpendicular to the first direction and faces away from the plastic package body.
In this embodiment, the first pin 120 and the second pin 130 are bent towards the first direction, and the first direction is perpendicular to the bottom surface of the plastic package body, so that the plastic package body is convenient to butt against the driving board 300 on one hand, and the manufacturing difficulty is low on the other hand, so that the precision control during manufacturing is convenient. The third pin 140 faces the second direction, and in this embodiment, the third pin 140 is bent twice, and is bent in the opposite direction to the first direction, and is bent obliquely in the direction away from the chip 110, so as to facilitate docking with the IMS board 400, thereby facilitating docking with the IMS board 400.
Optionally, the third pin 140 is a patch type pin.
In this embodiment, the third pin 140 is a patch-type pin, and the manufacturing process is mature, so as to improve the reliability of the power tube 100.
Optionally, the first pins 120, the second pins 130, and the third pins 140 are bent towards a first direction, and the first direction is perpendicular to the bottom surface of the plastic package body.
In this embodiment, the first pin 120, the second pin 130 and the third pin 140 are all bent towards the first direction, and the first direction is perpendicular to the bottom surface of the plastic package body, so that the plastic package body is convenient to dock with the driving board 300 on one hand, and the manufacturing difficulty is low on the other hand, so that the precision control during manufacturing is facilitated.
Optionally, the power tube 100 includes a first pin 120; and/or the number of the groups of groups,
The power tube 100 includes two second pins 130, and the two second pins 130 are spaced apart; and/or the number of the groups of groups,
The power tube 100 includes three third pins 140, and the three third pins 140 are disposed at intervals.
In this embodiment, one first pin 120 is provided, two second pins 130 are provided, three third pins 140 are provided, and the distance between two adjacent second pins 130 is far smaller than the distance between two adjacent second pins 130 and third pins 140, so that different signal pins can be distinguished conveniently, and assembly efficiency is improved.
The utility model also proposes a power circuit comprising:
At least one upper tube 101, the upper tube 101 is the power tube 100, a first pin 120 of the upper tube 101 is used for being connected with an anode input, a second pin 130 of the upper tube 101 is used for transmitting signals, and a third pin 140 of the upper tube 101 is used for outputting current;
At least one down tube 102, the down tube 102 is the power tube 100 described above, a first pin 120 of the down tube 102 is used for outputting a voltage, a second pin 130 of the down tube 102 is used for transmitting a signal, and a third pin 140 of the down tube 102 is used for accessing a negative input;
The first pin 120 and the second pin 130 of the upper tube 101 and the first pin 120, the second pin 130 and the third pin 140 of the lower tube 102 are all used for electrically connecting with the driving board 300.
In the embodiment of the present utility model, the power circuit includes at least one upper tube 101 and at least one lower tube 102, where the upper tube 101 and the lower tube 102 respectively adopt the above-mentioned power tube 100, and the specific structures of the upper tube 101 and the lower tube 102 refer to the above-mentioned embodiment. Compared with the adoption of copper columns and pins, the power tube 100 is adopted to manufacture a power circuit, the first pin 120, the second pin 130 and the third pin 140 are directly arranged on the chip 110, the relative position precision between the pins and the chip 110 is higher, the position deviation is easier to control, the alignment is easier when the power tube is connected with the driving plate 300, and the production efficiency of the power module is further improved. The pin of the power tube 100 is utilized to realize the functions of the contact pin and the copper column, so that the cost of the power module is reduced, the power module can be miniaturized, and the power density of the product is improved. In this embodiment, the upper tube 101 is a power tube 100 as shown in fig. 1, and the lower tube 102 is a power tube 100 as shown in fig. 2.
In the embodiment of the present utility model, the power circuit may be any one of a half-bridge circuit, a full-bridge circuit, and an H-bridge circuit, and the number of upper pipes 101 and lower pipes 102 included in the power circuit is determined according to an actual circuit topology type. For example, when the power circuit is a half-bridge circuit, the power circuit includes an upper tube and a lower tube, the first pin 120 of the upper tube 101 is connected to the positive input, the third pin 140 of the lower tube 102 is connected to the negative input, the first pin 120 of the lower tube 102 is used as a voltage output end, a part of the second pin 130 of the upper tube 101 may be used as a gate pin, a part of the second pin may be used as a kelvin emitter pin, the lower tube 102 is the same, and the third pin 140 of the upper tube 101 is connected to the chip of the lower tube 102, so as to realize that the third pin 140 of the upper tube 101 is electrically connected to the first pin 120 of the lower tube 102. The connection relationship between the upper tube 101 and the lower tube 102 in the full-bridge circuit and the H-bridge circuit and the like can refer to the existing full-bridge circuit and the H-bridge circuit topology, and are not described herein.
The utility model also proposes a power module comprising:
A driving plate 300;
the power circuit according to at least one of the foregoing embodiments, wherein the first pin and the second pin of the upper tube of the power circuit and the first pin, the second pin and the third pin of the lower tube of the power circuit are all electrically connected with the driving board, and in particular, the connection between the upper tube and the driving board and the connection between the lower tube and the driving board can be directly realized through direct plug-in connection.
Referring to fig. 4, the power module includes a driving board and at least one power circuit in the foregoing embodiment, where the upper tube 101 and the lower tube 102 in the power circuit respectively use the foregoing power tube 100, and the specific structures of the upper tube 101 and the lower tube 102 refer to the foregoing embodiments. Compared with the adoption of copper columns and pins, the power module is manufactured by adopting the power tube 100, the first pin 120, the second pin 130 and the third pin 140 are directly arranged on the chip 110, the relative position precision between the pins and the chip 110 is higher, the position deviation is easier to control, the alignment is easier when the power module is connected with the driving plate 300, and the production efficiency of the power module is further improved. The pin of the power tube 100 is utilized to realize the functions of the contact pin and the copper column, so that the cost of the power module is reduced, the power module can be miniaturized, and the power density of the product is improved. In this embodiment, the upper tube 101 is a power tube 100 as shown in fig. 1, and the lower tube 102 is a power tube 100 as shown in fig. 2.
Optionally, the power module further includes an insulating metal substrate, and the power circuit is disposed on the insulating metal substrate. Specifically, the chip 110 of the upper tube 101 and the chip 110 of the lower tube 102 are both fixed on and electrically connected to the insulating metal substrate, and the third pin 140 of the upper tube 101 is electrically connected to the chip 110 of the lower tube 102 through the insulating metal substrate.
In this embodiment, the power module further includes an insulating metal substrate, that is, IMS (Insulated Metal Substrate, insulating metal substrate), and the chip 110 of the upper tube 101 and the chip 110 of the lower tube 102 are both disposed on the IMS board 400, so that the circuits in the power module are reduced, and the structure of the power module is simpler. The IMS board 400 includes three layers, namely, a circuit layer, a dielectric layer and a heat conducting layer, wherein the circuit layer is generally copper foil, the dielectric layer mainly has the functions of adhesion, insulation and heat conduction, and is generally various polymers or ceramics, and the heat conducting layer is metal-based, such as aluminum-based, copper-based or stainless steel-based, and the like, and mainly has the function of heat conduction, so that the heat dissipation performance of the circuit board is improved. By adopting the IMS plate 400, the heat generated during the operation of the power module is facilitated to be diffused, the operation temperature of the power module is quickened to be reduced, the power load of the power module is improved, and the service life of the power module is prolonged. A metal bottom plate for heat dissipation is provided at the bottom of the chip 110, and the chip 110 is soldered to the IMS board 400 through the corresponding metal bottom plate, thereby achieving fixation and conductive heat dissipation.
Optionally, the upper tube 101, lower tube 102, drive plate 300, and IMS plate 400 form a half bridge circuit.
Referring to fig. 1 to 2 and fig. 4 to 5, specifically, in this embodiment, the first pin 120 of the upper tube 101 is used as the collector C to connect with the driving board 300, three pins attached to the IMS board 400 on opposite sides of the first pin 120 of the upper tube 101 are the third pin 140 of the upper tube 101, the third pin 140 of the upper tube 101 is used as the emitter E, the third pin 140 of the upper tube 101 is connected to the bottom pad of the lower tube 102 through the surface copper sheet of the IMS board 400, two pins on the same side as the third pin 140 of the upper tube 101 are the second pins 130 of the upper tube 101, and the two second pins 130 of the upper tube 101 are respectively used as the gate G and the kelvin emitter K to connect with the driving board 300; the first pin 120 of the down tube 102 serves as a half-bridge output electrode S, two closely spaced thin pins on opposite sides of the first pin 120 of the down tube 102 serve as second pins 130 of the down tube 102, respectively serve as G-poles and K-poles, and the other three pins serve as third pins 140 of the down tube 102, serving as emitters E, thereby forming a half-bridge module.
Optionally, the chip 110 of the upper tube 101 and the chip 110 of the lower tube 102 are disposed on the same side of the insulating metal substrate, and the power module further includes a heat sink 500, where the heat sink 500 is disposed on a side of the insulating metal substrate facing away from the chip 110.
In this embodiment, the power module further includes a radiator 500, where the radiator 500 is disposed on a side of the IMS board 400 away from the chip 110, and the radiator 500 may adopt multiple forms such as liquid cooling or air cooling, so as to improve a heat dissipation effect of the power module, accelerate diffusion of heat generated during operation of the IMS board 400, thereby improving a power load of the power module, and prolong a service life of the power module.
Optionally, the power module further includes a heat conducting member 600, where the heat conducting member 600 is disposed between the insulating metal substrate and the heat sink 500, and the heat conducting member 600 is attached to a surface of the insulating metal substrate to transfer heat generated by the insulating metal substrate to the heat sink 500.
In this embodiment, a heat conducting member 600 is further disposed between the IMS board 400 and the heat sink 500, and the heat conducting member 600 has a relatively high heat conductivity coefficient, so that heat generated by the IMS board 400 can be rapidly transferred to the heat sink 500, thereby accelerating heat diffusion on the IMS board 400, ensuring good operation of the power module, and prolonging the service life of the power module. The heat conductive member 600 may be a heat conductive silicone grease or a heat conductive silicone gel, etc. The heat conducting piece 600 is arranged on the surface of the IMS plate 400 in an attaching mode, so that on one hand, heat generated by the IMS plate 400 can be timely absorbed, and on the other hand, the assembly is convenient and quick, and the realization is easy.
The foregoing description is only of the optional embodiments of the present utility model, and is not intended to limit the scope of the utility model, and all the equivalent structural changes made by the description of the present utility model and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the utility model.
Claims (10)
1. A power tube, comprising:
A chip;
The first pin is arranged on one side of the chip;
the second pin is arranged on one side of the chip, which is away from the first pin;
The third pin is arranged on the same side of the chip with the second pin, the first pin and the second pin are both connected with the chip in a bending way and have the same bending direction so as to be connected with a welding hole on a driving plate, the third pin is connected with the chip in a bending way, and the cross section area of the first pin is larger than that of the second pin and the third pin.
2. The power tube of claim 1, further comprising a plastic package body disposed outside the chip, wherein the first pin, the second pin, and the third pin are all disposed through the plastic package body.
3. The power tube of claim 2, wherein the first pin and the second pin are bent in a first direction, the first direction is perpendicular to a bottom surface of the plastic package body, the third pin is oriented in a second direction, and the second direction is perpendicular to the first direction and is oriented away from the plastic package body.
4. The power tube of claim 3, wherein the third pin is a patch pin.
5. The power tube of claim 2, wherein the first pin, the second pin and the third pin are bent in a first direction, and the first direction is perpendicular to a bottom surface of the plastic package.
6. The power tube of claim 1, wherein the power tube comprises one of the first pins; and/or the number of the groups of groups,
The power tube comprises two second pins, and the two second pins are arranged at intervals; and/or the number of the groups of groups,
The power tube comprises three third pins, and the three third pins are arranged at intervals.
7. A power circuit, comprising:
At least one upper tube, the upper tube being the power tube as claimed in claim 1 or 2 or 3 or 4 or 6, the first pin of the upper tube being for accessing an anode input, the second pin of the upper tube being for transmitting a signal, the third pin of the upper tube being for outputting a current;
At least one down tube, wherein the down tube is a power tube as set forth in claim 1, 2, 5 or 6, the first pin of the down tube is used for outputting voltage, the second pin of the down tube is used for transmitting signals, the third pin of the down tube is used for accessing negative input, and the chip of the down tube is electrically connected with the corresponding third pin of the up tube;
The first pin, the second pin and the third pin of the upper tube are all used for being electrically connected with a driving plate.
8. A power module, comprising:
A driving plate;
The power circuit of at least one of the claim 7, wherein the first pin, the second pin, and the third pin of the upper tube of the power circuit and the first pin, the second pin, and the third pin of the lower tube of the power circuit are all electrically connected to the driving board.
9. The power module of claim 8, further comprising an insulating metal substrate, wherein the chip of the upper tube and the chip of the lower tube are both fixed to and electrically connected with the insulating metal substrate, and wherein the third pin of the upper tube is electrically connected with the chip of the lower tube through the insulating metal substrate.
10. The power module of claim 9, wherein the chip of the upper tube and the chip of the lower tube are disposed on a same side of the insulating metal base plate, the power module further comprising a heat sink disposed on a side of the insulating metal base plate facing away from the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322691103.4U CN221041118U (en) | 2023-10-08 | 2023-10-08 | Power tube, power circuit and power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202322691103.4U CN221041118U (en) | 2023-10-08 | 2023-10-08 | Power tube, power circuit and power module |
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