CN220894494U

CN220894494U - LED display defect detection device

Info

Publication number: CN220894494U
Application number: CN202322697301.1U
Authority: CN
Inventors: 董昆宇
Original assignee: Ziyangsheng Optoelectronics Technology Zibo Co ltd
Current assignee: Ziyangsheng Optoelectronics Technology Zibo Co ltd
Priority date: 2023-10-08
Filing date: 2023-10-08
Publication date: 2024-05-03
Anticipated expiration: 2033-10-08

Abstract

The utility model discloses an LED display defect detection device, which comprises a test platform, a jig frame and a plurality of probes, wherein the jig frame is arranged on the test platform; each group of probes is connected with a first electrode and a second electrode on each LED test strip so as to realize display defect detection of a plurality of LED test strips on a row at the same time. The device can solve the problem of low LED test efficiency of the wafer, realizes batch test of the wafer LEDs, and can remarkably improve the test efficiency.

Description

LED display defect detection device

Technical Field

The utility model relates to the technical field of wafer testing, in particular to an LED display defect detection device.

Background

The resistance value of the inside of an LED (LIGHTING EMITTING Diode) needs to be detected after the LED is produced, the existing detection device detects the LED through a plurality of probes such as double probes or four probes, and the large-batch detection of each LED strip on a wafer cannot be realized in the detection process, so that the detection rate is too low. For example, dual probe testing can only meet the testing of one LED strip on a wafer per test, and if testing of all LED strips on a positive wafer is desired, the efficiency is quite low.

In view of the technical problem that the existing inspection device cannot inspect a large number of LED strips or at least one row of LED strips on the whole wafer at the same time, it is necessary to provide an LED display defect inspection device to improve the efficiency of inspecting LED display defects.

Disclosure of utility model

The present utility model aims to solve at least one of the technical problems in the related art to some extent. Therefore, an object of the present utility model is to provide an LED display defect detecting device, which can test the whole wafer, realize the row detection, and simultaneously consider one row of product detection, so as to improve the product detection efficiency.

In order to achieve the above purpose, the utility model is realized by the following technical scheme:

The LED display defect detection device comprises a test platform, a jig frame and a plurality of probes, wherein the jig frame is arranged on the test platform, the plurality of probes are arranged on the jig frame through corresponding probe supports, the test platform is used for placing wafers, each row of the wafers is provided with a plurality of LED test strips, and each LED test strip is provided with a first electrode and a second electrode; wherein each two adjacent probes in the plurality of probes are in a group, each group of probes is connected with the first electrode and the second electrode on each LED test strip so as to realize the display defect detection of a plurality of LED test strips on a row at the same time

Preferably, the device further comprises two guide rails, the guide rails are arranged above the wafer and located on two sides of the wafer, and the jig frame is arranged on the two guide rails and can slide on the two guide rails.

Preferably, each probe support is slidably connected to the jig frame.

Preferably, each guide rail is provided with an optical scale for feeding back the current position of the jig frame.

Preferably, the device further comprises a driver connected with the jig frame and used for driving the jig frame to move on the two guide rails.

Preferably, the driver is further connected to each probe support, and is used for driving each probe support to slide on the jig frame.

Preferably, the device further comprises a test power supply connected with each probe for supplying power to the wafer so as to electrify the LED test strips to be tested on each row.

Preferably, the device further comprises a processor connected with each probe for acquiring the electric signals of each LED test strip, processing the electric signals and outputting the display defect detection result information of each LED test strip.

The utility model has at least the following technical effects:

The utility model provides an LED display defect detection device, which comprises a test platform, a jig frame and a plurality of probes, wherein the jig frame is arranged on the test platform, the probes are arranged on the jig frame through corresponding probe brackets, a wafer can be placed on the test platform, each row of the wafer is provided with a plurality of LED test strips, each LED test strip is provided with a first electrode and a second electrode, each two adjacent probes are in a group, each group of probes is connected with the first electrode and the second electrode on each LED test strip, in addition, two guide rails are arranged above the wafer, optical scales are arranged on the two guide rails, a driver can be respectively connected with each probe bracket and the jig frame during actual test, each probe is connected with a test power supply and a processor, then each probe bracket is driven to respectively slide to the position of a target LED test strip, each group of probes is connected with the corresponding first electrode and second electrode for electrifying test, and display defect detection result information is output through the processor, and therefore, the display defect detection of one row of LEDs can be realized simultaneously. After detecting one row of products, the driver can drive the jig frame to slide to the target row position on the guide rail so as to simultaneously realize the detection of the other row of products, wherein the driver can obtain the current position of the jig frame through the cursor ruler so as to drive the jig frame to the target row position. Furthermore, the device can be further provided with a plurality of jig frames on the guide rail so as to realize multi-row product measurement at the same time, thereby improving the detection efficiency of the LED display defects.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

Fig. 1 is a schematic structural diagram of an LED display defect detecting device according to an embodiment of the present utility model.

Detailed Description

The present embodiment is described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

An LED display defect detecting apparatus of the present embodiment is described below with reference to the drawings.

Fig. 1 is a schematic structural diagram of an LED display defect detecting device according to an embodiment of the present utility model. As shown in fig. 1, the LED display defect detection device includes a test platform (not shown in the drawing), a jig frame and a plurality of probes, the jig frame is disposed on the test platform, the plurality of probes are disposed on the jig frame through corresponding probe supports, the test platform is used for placing a wafer, each row of the wafer has a plurality of LED test strips, a first electrode and a second electrode are disposed on each LED test strip, and the first electrode and the second electrode are respectively an anode and a cathode of an LED for realizing the test of the LED in the LED test strips.

Further, every two adjacent probes in the plurality of probes are in a group, and each group of probes can be connected with the first electrode and the second electrode on each LED test strip so as to realize batch detection of display defects of a plurality of LED test strips on a row at the same time. It should be noted that the number of probes can be adjusted according to the requirement, wherein each probe support is slidably connected with the jig frame, so that the position of the probes can be adjusted according to the requirement.

With continued reference to fig. 1, the apparatus further includes two guide rails disposed above the wafer and located at two sides of the wafer, and a jig frame disposed on the two guide rails and capable of sliding on the two guide rails, wherein a direction in which the jig frame is disposed is perpendicular to a direction in which the two guide rails are disposed. In this embodiment, each guide rail is provided with an optical scale, which can be used to feed back the current position of the jig frame.

Further, the device also comprises a driver which is connected with the jig frame and used for driving the jig frame to move on the two guide rails. The driver is also connected with each probe support and used for driving each probe support to slide on the jig frame.

Specifically, when testing is required to be performed on all LED products in a certain row, the driver can drive the probe support to respectively adjust the positions of all probes to the positions of the target LED test strips, and then probe wiring test is performed. After testing all LED products in one row, the driver can drive the jig frame to slide along the direction perpendicular to the arrangement direction of the jig frame, slide to the position of the other target row, and drive the probe support, so that the testing of all LED products in the other row is realized simultaneously.

It should be noted that, in order to improve the detection efficiency, a plurality of jig frames may be further provided, and the plurality of jig frames are respectively disposed on the two guide rails, so as to realize batch detection of multiple rows of LED products simultaneously.

Further, the device also comprises a test power supply, namely a source meter, which is connected with each probe and used for providing power for the wafer, so that current passes through the LED test strips to be tested on each row, and LED luminescence and electrical property measurement are realized.

Further, the apparatus includes a processor coupled to each probe. The processor may include a signal acquisition unit and a signal processing unit, where the signal acquisition unit may be configured to acquire electrical signals, such as resistance information, lighting data information, and the like, of each LED test strip, and then input the electrical signals to the signal processing unit for processing, and output display defect detection result information of each LED test strip.

In actual test, the driver can be connected with each probe support and the jig frame respectively, each probe is connected with the test power supply and the processor, then each probe support is driven to slide to the position of the target LED test belt respectively, each group of probes is connected with the corresponding first electrode and second electrode for conducting power-on test, and the processor outputs display defect detection result information, so that the detection of the display defects of a row of LEDs can be realized simultaneously. After detecting one row of products, the driver can drive the jig frame to slide to the target row position on the guide rail so as to simultaneously realize the detection of the other row of products, wherein the driver can obtain the current position of the jig frame through the cursor ruler so as to drive the jig frame to the target row position. Therefore, batch testing of the wafer LEDs can be realized.

The device can improve the detection efficiency of the electrical detection equipment, wherein the detection efficiency is more than 10 times of that of the double-probe type detection equipment, and therefore a large amount of time can be saved. Moreover, by using the device, all products of the positive wafer can be tested, and the lighting condition of each product is found. Therefore, the device can solve the problem of low LED test efficiency of the wafer, and realize batch test of the wafer LEDs, thereby remarkably improving the test efficiency.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

While the present utility model has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the utility model. Many modifications and substitutions of the present utility model will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the utility model should be limited only by the attached claims.

Claims

1. The LED display defect detection device is characterized by comprising a test platform, a jig frame and a plurality of probes, wherein the jig frame is arranged on the test platform, the plurality of probes are arranged on the jig frame through corresponding probe supports, the test platform is used for placing wafers, each row of the wafers is provided with a plurality of LED test strips, and each LED test strip is provided with a first electrode and a second electrode; each group of probes is connected with a first electrode and a second electrode on each LED test strip so as to realize display defect detection of a plurality of LED test strips on a row at the same time.

2. An LED display defect detection apparatus as set forth in claim 1, further comprising:

The two guide rails are arranged above the wafer and positioned on two sides of the wafer, and the jig frame is arranged on the two guide rails and can slide on the two guide rails.

3. The LED display defect detection apparatus of claim 1, wherein each of said probe holders is slidably coupled to said jig frame.

4. The LED display defect detection apparatus of claim 2, wherein each guide rail is provided with an optical scale for feeding back the current position of the jig frame.

5. An LED display defect detection apparatus as set forth in claim 2, further comprising:

And the driver is connected with the jig frame and used for driving the jig frame to move on the two guide rails.

6. An LED display defect detection apparatus as set forth in claim 5, wherein the driver is further coupled to each of the probe holders for driving each of the probe holders to slide on the jig frame.

7. An LED display defect detection apparatus as set forth in claim 1, further comprising:

And the test power supply is connected with each probe and used for providing power for the wafer so as to electrify the LED test strips to be tested on each row.

8. An LED display defect detection apparatus as set forth in claim 1, further comprising:

And the processor is connected with each probe and used for acquiring the electric signals of each LED test strip, processing the electric signals and outputting the display defect detection result information of each LED test strip.