KR20100099945A - Led inspection apparatus - Google Patents

Abstract

PURPOSE: An LED inspection apparatus is provided to reduce time of collecting data by automating supplying and cutting a board, power supply, and a production test. CONSTITUTION: A magazine(2) accepts a plurality of substrates. A first transfer unit(3) receives the substrate from the magazine. A cutting machine(4) cuts a part of a connection line connecting a LED chip and the substrate. A second transfer unit(5) transfers the substrate. A position-fixing unit(6) arranges the substrate a right position to be contact a electrode wire. A power supply unit(7) contacts the electrode wire to the LED chip. An integrating sphere(8) centers emitted light.

Description

Chip LED Inspection Equipment {LED INSPECTION APPARATUS}

The present invention relates to an inspection apparatus for a chip LED, and more particularly, to inspect the plurality of chip LEDs formed on a substrate to produce a compounding ratio of phosphors to produce a tablet having a color and brightness suitable for a standard. Advanced inspection equipment for obtaining characteristics and data prior to dispenser operation.

In general, LED (LED) is an abbreviation of light emitting diode (light emitting diode) has recently been used as an important light source in addition to incandescent, fluorescent.

These LEDs are mainly planted in a button and used a lot as a small display light source, but in recent years, a lot of high-brightness products have been developed by improving their size and brightness.

In particular, high brightness and very small size LEDs are commonly referred to as chip LEDs.

The chip LED is usually manufactured by planting a large number on a rectangular substrate, and in the final step, each chip LED is cut and used.

The final stage of the manufacturing process of the chip LED is to check the quality by applying power to each chip LED planted on the substrate to test the lighting, color, brightness, and the like.

However, in the conventional production method of chip LEDs, the lot-specific sample strips are processed in the whole process, and then the product characteristic data is collected from the final inspection equipment to compare the compounding ratio of the dispensed phosphors. In order to demonstrate the characteristics of the chip, the fluorescent material was mixed again to produce the product in full scale. However, the invention of this instrument allows the inspection using a fluorescence filter prior to the dispenser process to collect the chip characteristic data and immediately start mass production. .

The conventional method has a problem in that data is collected after about one day has passed, and the strip for collecting data is disposed of as defective, and the expensive phosphor is also discarded.

The present invention has been made to solve the above problems of the prior art, a series of processes for supplying, cutting, powering, inspecting quality, and discharging finished products of a substrate in which chip LEDs are planted can be implemented by an automatic system. Its purpose is to provide chip LED inspection equipment that can improve productivity by reducing data collection time, reduce loss of unnecessary raw materials and minimize the occurrence rate of defects.

The object of the present invention described above,

A magazine in which a plurality of chip LEDs are planted in a planting hole and a plurality of substrates having a plurality of through holes formed on an outer circumference thereof are accommodated; First transfer means for receiving and transferring a substrate from the magazine; A cutter for cutting a part of a connection line connecting the chip LED and the substrate to prevent a short circuit after positioning the transferred substrate; Second transfer means for moving the substrate; Position fixing means for aligning the transferred substrate in position for electrode line contact; A power supply unit for emitting light by contacting + and-electrode lines to each chip LED of the transferred substrate; An integrating sphere for concentrating the light emitted from the power applying unit; A detector for inspecting the integrating sphere to determine whether it is defective; And it can be achieved by the inspection equipment of the chip LED including a display unit for displaying the inspection data on the screen.

The cutting machine, the lower fixture for supporting the lower portion of the substrate; An upper fixture supporting an upper portion of the substrate; A cutter unit which cuts a part of a connection line connecting the chip LED and the substrate and has a cutter in contact with the cutting table; And a power unit for elevating the cutter unit.

The lower fixture and the upper fixture, the base is inserted into the guide pin is inserted into the through hole of the substrate; And a cylinder device for elevating the base.

The position fixing means includes an upper bed having a clamping groove into which a substrate is inserted into a lower surface thereof; Elevating means for elevating the upper bed; A lower bed installed at a lower portion of the upper bed and having an alignment pin inserted into a through hole of a substrate on an upper surface thereof and aligned in a fixed position; And elevating means for elevating the lower bed.

The power applying unit may include: a body having a first electrode line in contact with a connection line of a chip LED of the substrate and a second electrode line in contact with a substrate; Elevating means for elevating the body; And a power supply line for supplying an anode and a cathode to the first and second electrode lines, respectively.

According to the present invention, it is possible to inspect the quality by automatically applying power to a plurality of chip LEDs planted on a substrate and automatically supplying power, and it is possible to mass-produce the inspected lead frame immediately. The cutting process is also automatically performed to prevent short-circuit accidents, thereby enabling fast and accurate inspection by the automated process, and reducing the data collection time and reducing the occurrence of defects through process improvement.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a front view showing the overall configuration of the inspection equipment of the chip LED according to the present invention, Figure 2 is a plan view showing an example of a chip LED substrate applied to the present invention.

As shown in Figure 1 and 2, the inspection equipment (A) of the chip LED according to the present invention,

A magazine 2 in which a plurality of chip LEDs 120 are planted in the planting holes 150 and a plurality of substrates 100 in which a plurality of through holes 110 are formed on an outer circumference thereof are accommodated;

First transfer means (3) for receiving and transferring the substrate (100) from the magazine (2);

A cutter (4) for cutting a portion of the connection lines (102, 104) connecting the chip LED (120) and the substrate (100) to prevent short circuits after positioning the transferred substrate (100);

Second transfer means (5) for moving the substrate (100);

Position fixing means (6) for aligning the transferred substrate (100) to a correct position;

A power supply unit 7 for emitting light by contacting the electrode lines 74 and 75 to each chip LED 120 of the transferred substrate 100;

An integrating sphere 8 for concentrating the light emitted from the power applying unit 7 and determining whether or not it is defective by a detector;

And a display unit 9 for displaying the inspection data on the screen.

Each main structure is explained in more detail.

Figure 3 is an enlarged front view of the "cutting machine" in the inspection equipment of the chip LED according to the present invention of FIG.

As shown in FIG. 3, the cutter 4

A lower fixture 42 supporting a lower portion of the substrate 100 and having a cutting table 423 formed thereon;

An upper fixture 44 supporting an upper portion of the substrate 100;

A cutter unit 46 for cutting a portion of the connection lines 102 and 104 connecting the chip LED 120 and the substrate 100 and having a cutter 462 in contact with the cutting table 423;

And a power unit 47 for elevating the cutter unit 46.

The cutter 462 is coupled to each other by adjusting the interval or shape depending on the cutting position and shape.

The power unit 47 is for raising and lowering the cutter unit 46, and is a cylinder device for lifting by hydraulic or pneumatic pressure.

Therefore, as the power unit 47 is periodically lifted, the cutter 462 is moved up and down, thereby repeating the descending cutting and rising waiting process.

In this case, a portion cut by the cutter 462 is connected to both sides of the chip LED 120 and the connection lines 102 and 104 connected to the substrate 100, and one side connection line 102 and 104 is cut out of the two connection lines 102 and 104. will be. The cut part c cut in this way is for preventing a short circuit. This is illustrated in detail in FIG. 8 to be described later.

Therefore, the + electrode wire 74 to be described later is in contact with the substrate 100 so that the + pole is energized, and-the electrode wire 75 is in contact with the cut connection lines 102 and 104-the pole is energized so that the chip LED 120 Light emission.

Of course, the polarities of the + and − electrode wires 74 and 75 are always determined due to the characteristics of the ordinary LED 120.

The lower fixture 42 and the upper fixture 44,

A base on which a guide pin p1 is inserted into the through hole 110 of the substrate 100;

It is comprised by the cylinder apparatus which raises and lowers the said base.

That is, the upper fixture 44 is moved downward to guide pin (p1) is inserted into the through hole 110 of the substrate 100 from the top to the bottom, the lower fixture 42 is the guide pin (p1) The through hole 110 of the substrate 100 is operated to fit from the bottom to the top.

In addition, the upper and lower fixtures 44 and 42 are set to repeat the lifting operation continuously and are linked with the operation cycle of the power unit 47 of the cutter 462.

That is, after the substrate 100 is fixed by the operation of the upper and lower fixtures 44 and 42, the cutter 462 is operated to set the cutting.

On the other hand, the front and rear ends of the cutter 4 is further provided with a front and rear movement means 45 for sequentially entering the substrate 100, and discharge the cut substrate 100.

The front and rear movement means 45 is composed of a body having a needle pin 451 inserted from the through-hole 110 formed at the front end of the substrate 100, and a power unit 47 for repeatedly moving forward and backward the body. do.

The power unit 47 includes a cylinder 472 and a link section 474 which sequentially repeat horizontal and vertical motions.

Therefore, the power unit 47 is a basic operation method to perform the cutting operation of the cutter unit installed on the lower portion by the lifting operation, and the front and by the link section 474 connected to the power unit 47 The rear movement means 45 may be provided in parallel with the power driven back and forth.

That is, the forward and rearward movement means 45 forwards the body and the needle pin 451 subordinate to it by sequentially implementing the vertical motion that rises after the horizontal motion in the forward direction, the horizontal motion in the backward direction, and the vertical motion that descends. -> Up-> Reverse-> Down movement is performed sequentially to move the substrate continuously.

Figure 4 is an enlarged front view of the "position fixing means" in the inspection equipment of the chip LED according to the present invention of Figure 1, Figure 5 is a "position fixing means" in the inspection equipment of the chip LED according to the present invention of FIG. The enlarged plan view.

4 and 5, the position fixing means 6,

An upper bed 62 having a clamping groove 622 into which the substrate 100 is inserted;

Elevating means (L) for elevating the upper bed (62);

Drive means for reciprocating the upper bed (62) from a position fixing means (6) to the power applying portion (7);

A lower bed (64) installed below the upper bed (62) and having an alignment pin (p2) inserted into a through hole (110) of the substrate (100) on an upper surface thereof to align it in position;

Lifting means (L) for raising and lowering the lower bed (64).

The upper bed 62 has a rectangular plate shape and is provided with a gripping groove 622 formed in the lower surface to insert the substrate 100, and the gripping groove 622 has a side end of the substrate 100. The protrusion 623 is formed inwardly.

The upper bed 62 functions to transport the substrate 100 by reciprocating from the position fixing means 6 to the power applying unit 7 by a driving means.

The lower bed 64 has four alignment pins p2 vertically formed thereon, and the number of the alignment pins p2 may be added or subtracted, and the alignment pins p2 may be formed in the tub of the substrate 100. Is inserted into the ball 110.

Therefore, the four alignment pins p2 are inserted into the four through holes 110 of the substrate 100 to align the substrate 100.

Lifting means (L) for operating the upper bed 62 and the lower bed 64 is preferably a cylinder device, the rod of the cylinder device is connected to the upper bed 62 or lower bed 64, the appearance of the rod In conjunction with the operation, the upper bed 62 or the lower bed 64 is moved up and down.

Figure 6 is an enlarged front view of the "power supply unit" in the inspection equipment of the chip LED according to the present invention of FIG.

As shown in Fig. 6, the power applying unit 7

A body 72 in which connection lines 102 and 104 of the chip LED 120 of the substrate 100 and + and − electrode lines 74 and 75 contacting the substrate 100 are formed;

Elevating means (L) for elevating the body (72);

It is composed of a power supply for supplying a positive electrode and a negative electrode to the +,-electrode lines (74, 75), respectively.

The elevating means (L) is applied to the cylinder device described above.

7 is an enlarged view showing a state in which the "power supply unit" in contact with the LED in the inspection equipment of the chip LED according to the present invention.

As shown in FIG.

The + electrode line 74 is in contact with the substrate 100 so that the + pole is energized, and the-electrode line 75 is in contact with the cut connection lines 102 and 104-and the pole is energized so that the chip LED 120 emits light. This is only one example and it is obvious that the polarity may be applied to suit the characteristics of the LED.

The chip LED 120 emits light by applying the power, and the characteristic of the emitted light is analyzed in the integrating sphere 8.

The integrating sphere 8 is for acquiring accurate optical measurement and temperature characteristics of a sample in which the optical characteristic change according to the thermal resistance of a light source such as an LED exists. A substantially spherical hollow is formed inside the hollow inner circumference. The surface is surface-treated to diffusely reflect incident light. Moreover, the detector for detecting the light reflected in the hollow interior is provided.

Since the integrating sphere is a commonly known technique, it will be understood by those skilled in the art without detailed description thereof.

In addition to this, a display unit 9 is further provided for representing data extracted through the integrating sphere 8 and a detector (not shown) on the screen. The display section 9 is a normal monitor.

Although the present invention has been described in connection with the above-mentioned preferred embodiments, it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the invention, It is obvious that the claims fall within the scope of the claims.

1 is a front view showing the overall configuration of the inspection equipment of the chip LED according to the present invention.

Figure 2 is a plan view showing an example of a chip LED substrate applied to the present invention.

Figure 3 is an enlarged front view of the "cutting machine" in the inspection equipment of the chip LED according to the present invention of FIG.

Figure 4 is an enlarged front view of the "position fixing means" in the inspection equipment of the chip LED according to the present invention of FIG.

5 is an enlarged plan view of the "position fixing means" in the inspection equipment of the chip LED according to the present invention of FIG.

Figure 6 is an enlarged front view of the "power supply unit" in the inspection equipment of the chip LED according to the present invention of FIG.

Figure 7 is an enlarged view showing a state in which the "power supply unit" in contact with the "LED" in the inspection equipment of the chip LED according to the present invention.

Explanation of symbols on the main parts of the drawings

2: magazine 3: first transfer means

4 cutting machine 5 second transfer means

6; Position fixing means 7: power supply

8: integrating sphere 9: display unit

42: lower fixture 44: upper fixture

45: forward and rear movement means 46: cutter portion

74,75 electrode line 100 substrate

120: LED 102,104: connecting line

Claims (7)

A magazine in which a plurality of chip LEDs are planted in a planting hole and a plurality of substrates having a plurality of through holes formed on an outer circumference thereof are accommodated; First transfer means for receiving and transferring a substrate from the magazine; A cutter for cutting a part of a connection line connecting the chip LED and the substrate to prevent a short circuit after positioning the transferred substrate; Second transfer means for moving the substrate; Position fixing means for aligning the transferred substrate in position for electrode line contact; A power supply unit for emitting light by contacting + and-electrode lines to each chip LED of the transferred substrate; An integrating sphere for concentrating the light emitted from the power applying unit; A detector for inspecting the integrating sphere to determine whether it is defective; Display unit expressing inspection data on the screen Inspection equipment of the chip LED, characterized in that it comprises a. The method of claim 1, The cutting machine, A lower fixture supporting a lower portion of the substrate; An upper fixture supporting an upper portion of the substrate; A cutter unit which cuts a part of a connection line connecting the chip LED and the substrate and has a cutter in contact with the cutting table; Power unit for elevating the cutter unit Inspection equipment of the chip LED, characterized in that it comprises a. 3. The method of claim 2, The lower fixture and the upper fixture, A base having a guide pin inserted into the through hole of the substrate; Cylinder device for elevating the expectations Inspection equipment of the chip LED, characterized in that it comprises a. The method of claim 1, The position fixing means, An upper bed having a clamping groove into which a substrate is inserted; Elevating means for elevating the upper bed; Drive means for reciprocating the upper bed from a position fixing means to a power applying portion; A lower bed installed at a lower portion of the upper bed and having an alignment pin inserted into a through hole of a substrate on an upper surface thereof and aligned in a fixed position; Elevating means for elevating the lower bed Inspection equipment of the chip LED, characterized in that it comprises a. The method of claim 1, The power supply unit, A body having a first electrode line contacting the connection line of the chip LED of the substrate and a second electrode line contacting the substrate; Elevating means for elevating the body; A power line for supplying a positive electrode and a negative electrode to the first and second electrode lines, respectively Inspection equipment of the chip LED, characterized in that it comprises a. The method of claim 1, The first and the second transfer means is a test equipment of the chip LED, characterized in that the conveyor belt device consisting of a roller and a belt connecting the rollers spaced at a predetermined interval. The method according to claim 4 or 5, The elevating means is the inspection equipment of the chip LED, characterized in that the cylinder device having a rod which is lifted by hydraulic or pneumatic.

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