CN220796658U - Multi-chip integrated circuit packaging device - Google Patents
Multi-chip integrated circuit packaging device Download PDFInfo
- Publication number
- CN220796658U CN220796658U CN202322159466.3U CN202322159466U CN220796658U CN 220796658 U CN220796658 U CN 220796658U CN 202322159466 U CN202322159466 U CN 202322159466U CN 220796658 U CN220796658 U CN 220796658U
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- packaging
- driving
- feeding
- braid
- guide rail
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 108
- 230000005540 biological transmission Effects 0.000 claims description 17
- 230000001502 supplementing effect Effects 0.000 claims description 6
- 230000000007 visual effect Effects 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a multi-chip integrated circuit packaging device, which comprises a first feeding mechanism, a second feeding mechanism, a grabbing mechanism and a packaging mechanism, wherein the second feeding mechanism is arranged on one side of the first feeding mechanism and is used for driving a packaging braid to do linear motion, the packaging braid comprises a plurality of packaging grooves distributed along a linear array, the grabbing mechanism is used for grabbing chips to a feeding station and placing the chips in one of the packaging grooves, the packaging mechanism comprises a feeding roller and a packaging belt wound on the feeding roller, and an adhesive surface of the packaging belt can be adhered to the upper surface of the packaging braid so as to close an opening of the packaging groove. Placing chips in packaging grooves of a packaging braid one by one, and then packaging openings of the packaging grooves through the packaging braid, so that one packaging groove can only be used for placing one chip, and a plurality of chips can be placed through one packaging braid; the safety of chip packaging is guaranteed, and the chips are prevented from being damaged due to the fact that the chips are placed together.
Description
Technical Field
The present utility model relates to the field of chip packaging devices, and in particular, to a multi-chip integrated circuit packaging device.
Background
The integrated circuit is called IC for short; microcircuits (microcircuits), microchips, chips/dies (chips) are one way in electronics to miniaturize circuits (mainly including semiconductor devices, also including passive components, etc.) and are often manufactured on semiconductor wafer surfaces. In the packaging process of integrated circuits or chips, one or more chips are generally placed together through a packaging box, but due to unreasonable transportation or storage, a plurality of chips in one packaging box are easy to collide and rub with each other, so that certain damage is caused to the chips, and the use of the chips is affected.
Disclosure of Invention
In view of the above, the utility model discloses a multi-chip integrated circuit packaging device which can independently package a plurality of chips and improve the safety of chip storage and transportation.
The utility model discloses a multi-chip integrated circuit packaging device, which comprises:
the first feeding mechanism is used for conveying the chip to be packaged;
the second feeding mechanism is arranged on one side of the first feeding mechanism and used for driving the packaging braid to do linear motion, the packaging braid comprises a plurality of packaging grooves distributed along a linear array, and the openings of the packaging grooves are upward;
the grabbing mechanism is used for grabbing the chip to a feeding station and placing the chip in one of the packaging grooves;
the packaging mechanism comprises a feeding roller and a packaging belt wound on the feeding roller, wherein the bonding surface of the packaging belt can be bonded to the upper surface of the packaging braid so as to close the opening of the packaging groove.
Further, the first feeding mechanism comprises a first feeding bracket, a first guide rail plate, a second guide rail plate and a first driving assembly, wherein the first guide rail plate and the second guide rail plate are both fixed on the first feeding bracket, the first guide rail plate and the second guide rail plate are oppositely arranged at intervals to form a guide rail groove, and the first driving assembly can drive a chip in the guide rail groove to do linear motion; the transmission tail end of the guide rail groove is provided with a grabbing groove grabbed by the grabbing mechanism.
Further, the first driving assembly comprises a first driving motor and a first transmission belt, the first transmission belt is arranged on the first feeding bracket through a plurality of belt pulleys, the first driving motor can drive the first transmission belt to move, and a transmission surface of the first transmission belt is positioned below the guide rail groove and used for driving the chip to move along the guide rail groove.
Further, the second feeding mechanism comprises a second feeding bracket, a linear groove, a second driving assembly and a third driving assembly, the second driving assembly and the third driving assembly are respectively arranged at two ends of the linear groove, the packaging braid is arranged in the linear groove, and the second driving assembly and the third driving assembly can drive the packaging braid to do linear motion in the linear groove.
Further, the second driving assembly and the third driving assembly have the same structure, the second driving assembly and the third driving assembly comprise a second driving motor, a first feeding roller and a second feeding roller, and the first feeding roller and the second feeding roller are respectively and rotatably arranged at the upper end and the lower end of the packaging braid and clamp the packaging braid; the second driving motor can drive the first feeding roller or the second feeding roller to rotate so as to drive the packaging braid.
Further, the grabbing mechanism comprises a grabbing bracket, a fourth driving component, a fifth driving component and a vacuum suction head, wherein the fourth driving component is fixed on the grabbing bracket and can drive the fifth driving component to move in the X-axis direction, and the fifth driving component is connected with the fourth driving component and can drive the vacuum suction head to move in the vertical direction; the fourth driving assembly and the fifth driving assembly can drive the chip to move from the grabbing groove to the feeding station through the vacuum suction head.
Further, a visual identification device and a light supplementing device are arranged above the feeding station, and the visual identification device is arranged right above the feeding station; the light supplementing device is located on one side above the feeding station.
Further, the packaging braid feeding device further comprises a pressing mechanism, wherein the pressing mechanism is arranged at one side of the feeding station along the conveying direction of the packaging braid;
the pressing mechanism comprises a driving cylinder and a pressing die, and the driving cylinder can drive the pressing die to bond the two sides of the packaging belt to the packaging braid.
Further, the pressing mold comprises a first pressing assembly and a second pressing assembly, and the first pressing assembly and the second pressing assembly respectively act on two side positions of the packaging braid;
the first pressing assembly and the second pressing assembly comprise an upper pressing plate and a lower pressing plate, and the upper pressing plate and the lower pressing plate are respectively positioned at the upper end and the lower end of the packaging braid and respectively clamp the packaging braid;
the two upper pressing plates are connected with the driving air cylinder through the connecting piece, and the driving air cylinder can drive the two upper pressing plates to move in the vertical direction at the same time.
Compared with the prior art, the technical scheme disclosed by the utility model has the beneficial effects that:
the chips are placed in the packaging grooves of the packaging braid one by one through the cooperation of the first feeding mechanism, the second feeding mechanism and the grabbing mechanism, and then the openings of the packaging grooves are packaged through the packaging braid, so that only one chip can be placed in one packaging groove, and a plurality of chips can be placed in one packaging braid; the safety of chip packaging is guaranteed, and the chips are prevented from being damaged due to the fact that the chips are placed together.
Drawings
FIG. 1 is a schematic diagram of a package device;
FIG. 2 is a schematic diagram of a package braid;
fig. 3 is a schematic structural view of the first feeding mechanism;
FIG. 4 is a schematic diagram of a second feeding mechanism and a packaging mechanism;
FIG. 5 is a schematic structural view of a second feeding bracket;
FIG. 6 is a schematic view of the structure of the gripping mechanism;
fig. 7 is a schematic structural diagram of the pressing mechanism.
Detailed Description
The following description of the embodiments of the present utility model will be made with reference to the drawings in which the embodiments of the present utility model are clearly and fully described, it should be noted that when one component is considered to be "connected" to another component, it may be directly connected to the other component, or there may be an intervening component at the same time. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. It should also be noted that the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, unless otherwise specifically defined and limited; either mechanically or electrically, or by communication between two components. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.
It should be further noted that, in the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1 and fig. 2, the utility model discloses a multi-chip integrated circuit packaging device 100, which comprises a first feeding mechanism 10, a second feeding mechanism 20, a grabbing mechanism 30, a packaging mechanism 40 and a pressing mechanism 50, wherein the first feeding mechanism 10 is used for conveying chips to be packaged, the second feeding mechanism 20 is arranged at one side of the first feeding mechanism 10 in the X-axis direction and is used for driving a packaging braid 70 to do linear motion, the packaging braid 70 comprises a plurality of packaging grooves 71 distributed along a linear array, and the openings of the packaging grooves 71 are upward; the grabbing mechanism 30 is used for grabbing a chip to a feeding station and placing the chip in one of the packaging grooves 71, the packaging mechanism 40 comprises a feeding roller 41 and a packaging belt 42 wound around the feeding roller 41, an adhesive surface of the packaging belt 42 can be adhered to an upper surface of the packaging braid 70 to close an opening of the packaging groove 7, and the pressing mechanism 50 is used for pressing the packaging belt 42 onto the packaging braid 70 to tightly adhere the packaging belt 42.
In this application, the two sides of the packaging braid 70 are provided with bonding edges 72, and the two bonding edges 72 are respectively located at two sides of the packaging groove 71.
As shown in fig. 3, further, the first feeding mechanism 10 includes a first feeding bracket 11, a first guide rail plate 12, a second guide rail plate 13, and a first driving assembly 15, where the first guide rail plate 12 and the second guide rail plate 13 are both fixed on the first feeding bracket 11, the first guide rail plate 12 and the second guide rail plate 13 are oppositely arranged at intervals to form a guide rail groove 14, and the first driving assembly 15 can drive the chip in the guide rail groove 14 to make a linear motion; the conveying end of the guide rail groove 14 is provided with a grabbing groove 141 grabbed by the grabbing mechanism 30, the first driving assembly 10 can convey chips to the grabbing groove 141 one by one, and the grabbing mechanism 30 can move the chips in the grabbing groove 141 to the feeding station and place the chips in one of the packaging grooves 71.
Further, the first driving assembly 15 includes a first driving motor 151 and a first transmission belt 152, the first transmission belt 152 is disposed on the first feeding bracket 11 through a plurality of belt pulleys, the first driving motor 151 may drive the first transmission belt 152 to move, and a transmission surface of the first transmission belt 152 is located below the guide rail groove 14 and is used for driving the chip to move along the guide rail groove 14. In this application, the conveying surface of the first conveying belt 152 is attached to the first rail plate 12 and the second rail plate 13.
As shown in fig. 4 and 5, further, the second feeding mechanism 20 includes a second feeding support 21, a linear slot 211, a second driving assembly 22 and a third driving assembly 23, the second driving assembly 22 and the third driving assembly 23 are respectively disposed at two ends of the linear slot 211, the packaging braid 70 is disposed in the linear slot 211, and the second driving assembly 22 and the third driving assembly 23 can both drive the packaging braid 70 to make a linear motion in the linear slot 211. When the packaging braid 70 just enters the second feeding mechanism 20, the second driving assembly 22 is configured to drive the packaging braid 0 to move along the linear slot 211 until the packaging braid 70 completely passes through the second driving assembly 22, at this time, the end of the packaging braid 70 is already in driving engagement with the third driving assembly 23, and the third driving assembly 23 continues to drive the packaging braid 70 until the packaging braid 70 completely passes through the linear slot 211.
The second driving assembly 22 and the third driving assembly 23 have the same structure, the second driving assembly 22 and the third driving assembly 23 each include a second driving motor, a first feeding roller 231 and a second feeding roller 232, and the first feeding roller 231 and the second feeding roller 232 are respectively rotatably disposed at the upper end and the lower end of the packaging braid 70 and clamp the packaging braid 70; the second driving motor may drive the first feeding roller 231 or the second feeding roller 232 to rotate so as to drive the packaging braid 70. In this application, the second driving motor drives the second feeding roller 232.
As shown in fig. 6, the grabbing mechanism 30 includes a grabbing bracket, a fourth driving component 31, a fifth driving component 32 and a vacuum suction head 33, wherein the fourth driving component 31 is fixed on the grabbing bracket and can drive the fifth driving component 32 to move in the X-axis direction, and the fifth driving component 32 is connected to the fourth driving component 31 and can drive the vacuum suction head 33 to move in the vertical direction; the fourth driving component 31 and the fifth driving component 32 can drive the chip to move from the grabbing groove 141 to the feeding station through the vacuum suction head 33. In this application, the fourth drive assembly 31 and the fifth drive assembly 32 are both belt drives.
As shown in fig. 4, a visual recognition device 60 and a light supplementing device 61 are arranged above the feeding station, and the visual recognition device 60 is arranged right above the feeding station; the light supplementing device 61 is located at one side above the feeding station.
Further, one end of the encapsulation tape 42 is wound around the feeding roller 41, and the other end is extended above the encapsulation tape 70 and is adhered to the encapsulation tape 70 by a plurality of guide wheels.
As shown in fig. 2 and 7, the pressing mechanism 50 is disposed at one side of the feeding station along the conveying direction of the packaging braid 70;
the pressing mechanism 50 includes a driving cylinder 51 and a pressing mold 52, and the driving cylinder 51 can drive the pressing mold 52 to adhere the two sides of the encapsulation tape 42 to the encapsulation braid 70.
The press-fit die 52 includes a first press-fit component 521 and a second press-fit component 522, and the first press-fit component 521 and the second press-fit component 522 respectively act on two side positions of the packaging braid 70; the first pressing component 521 and the second pressing component 522 each include an upper pressing plate 5211 and a lower pressing plate 5212, and the upper pressing plate 5211 and the lower pressing plate 5212 are respectively located at the upper end and the lower end of the packaging braid 70 and respectively clamp the packaging braid 70; the two upper pressure plates 5211 are connected to the driving cylinder 51 through a connecting piece 53, and the driving cylinder 51 can drive the two upper pressure plates 5211 to move in the vertical direction at the same time. In this application, the upper platen 5211 and the lower platen 5212 respectively clamp the pressing edge 72, so that the bonding surface of the encapsulation tape 42 is firmly bonded to the encapsulation braid 70.
The two lower pressure plates 5212 may be integrally formed. A buffer spring 5213 is disposed between the upper pressure plate 5211 and the connecting piece 53.
The present utility model can be embodied in various forms and modifications without departing from the broad spirit and scope of the utility model, and the above-described embodiments are intended to be illustrative of the utility model, but not limiting the scope of the utility model.
Claims (9)
1. A multi-chip integrated circuit package, comprising:
the first feeding mechanism is used for conveying the chip to be packaged;
the second feeding mechanism is arranged on one side of the first feeding mechanism and used for driving the packaging braid to do linear motion, the packaging braid comprises a plurality of packaging grooves distributed along a linear array, and the openings of the packaging grooves are upward;
the grabbing mechanism is used for grabbing the chip to a feeding station and placing the chip in one of the packaging grooves;
the packaging mechanism comprises a feeding roller and a packaging belt wound on the feeding roller, wherein the bonding surface of the packaging belt can be bonded to the upper surface of the packaging braid so as to close the opening of the packaging groove.
2. The multi-chip integrated circuit packaging device according to claim 1, wherein the first feeding mechanism comprises a first feeding bracket, a first guide rail plate, a second guide rail plate and a first driving assembly, the first guide rail plate and the second guide rail plate are both fixed on the first feeding bracket, the first guide rail plate and the second guide rail plate are oppositely arranged at intervals to form a guide rail groove, and the first driving assembly can drive a chip in the guide rail groove to do linear motion; the transmission tail end of the guide rail groove is provided with a grabbing groove grabbed by the grabbing mechanism.
3. The multi-chip integrated circuit package device according to claim 2, wherein the first driving assembly comprises a first driving motor and a first transmission belt, the first transmission belt is arranged on the first feeding support through a plurality of belt pulleys, the first driving motor can drive the first transmission belt to move, and a transmission surface of the first transmission belt is positioned below the guide rail groove and used for driving the chip to move along the guide rail groove.
4. The multi-chip integrated circuit package device according to claim 3, wherein the second feeding mechanism comprises a second feeding bracket, a linear groove, a second driving assembly and a third driving assembly, the second driving assembly and the third driving assembly are respectively arranged at two ends of the linear groove, the package braid is arranged in the linear groove, and the second driving assembly and the third driving assembly can drive the package braid to do linear motion in the linear groove.
5. The multi-chip integrated circuit package device of claim 4, wherein the second driving assembly and the third driving assembly have the same structure, the second driving assembly and the third driving assembly each comprise a second driving motor, a first feeding roller and a second feeding roller, and the first feeding roller and the second feeding roller are respectively rotatably arranged at the upper end and the lower end of the packaging braid and clamp the packaging braid; the second driving motor can drive the first feeding roller or the second feeding roller to rotate so as to drive the packaging braid.
6. The multi-chip integrated circuit package of claim 5, wherein the gripping mechanism comprises a gripping bracket, a fourth driving component, a fifth driving component and a vacuum suction head, the fourth driving component is fixed on the gripping bracket and can drive the fifth driving component to move in the X-axis direction, and the fifth driving component is connected with the fourth driving component and can drive the vacuum suction head to move in the vertical direction; the fourth driving assembly and the fifth driving assembly can drive the chip to move from the grabbing groove to the feeding station through the vacuum suction head.
7. The multi-chip integrated circuit package device of claim 6, wherein a visual recognition device and a light supplementing device are arranged above the feeding station, and the visual recognition device is arranged right above the feeding station; the light supplementing device is located on one side above the feeding station.
8. The multi-chip integrated circuit package device of claim 7, further comprising a lamination mechanism disposed on a side of the loading station along the package tape transport direction;
the pressing mechanism comprises a driving cylinder and a pressing die, and the driving cylinder can drive the pressing die to bond the two sides of the packaging belt to the packaging braid.
9. The multi-chip integrated circuit package of claim 8, wherein the bonding mold comprises a first bonding assembly and a second bonding assembly, the first bonding assembly and the second bonding assembly acting on two side positions of the package braid, respectively;
the first pressing assembly and the second pressing assembly comprise an upper pressing plate and a lower pressing plate, and the upper pressing plate and the lower pressing plate are respectively positioned at the upper end and the lower end of the packaging braid and respectively clamp the packaging braid;
the two upper pressing plates are connected with the driving air cylinder through the connecting piece, and the driving air cylinder can drive the two upper pressing plates to move in the vertical direction at the same time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322159466.3U CN220796658U (en) | 2023-08-11 | 2023-08-11 | Multi-chip integrated circuit packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322159466.3U CN220796658U (en) | 2023-08-11 | 2023-08-11 | Multi-chip integrated circuit packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220796658U true CN220796658U (en) | 2024-04-16 |
Family
ID=90657638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322159466.3U Active CN220796658U (en) | 2023-08-11 | 2023-08-11 | Multi-chip integrated circuit packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220796658U (en) |
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2023
- 2023-08-11 CN CN202322159466.3U patent/CN220796658U/en active Active
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