CN218498030U - Film sticking device - Google Patents

Abstract

The application relates to a pad pasting device. The film sticking device comprises a film sticking module, a feeding module and a discharging module, wherein the film sticking module is used for sticking films on the pieces to be stuck, the feeding module comprises a feeding mechanical arm module, a first feeding module and a second feeding module, and the first feeding module is used for loading a plurality of pieces to be stuck which are arranged in a stacked mode and are right-side-up; the second feeding module is used for placing a plurality of pieces to be pasted, which are arranged in a stacked mode, are pasted with films on the front sides, and are upward in the back sides; the feeding manipulator module is used for moving the piece to be pasted of the first feeding module or the second feeding module to the film pasting platform at the feeding station. The blanking module comprises a blanking manipulator module, a first blanking module and a second blanking module, and the blanking manipulator module is used for moving a piece to be pasted after film pasting to the first blanking module or the second blanking module. This application is through setting up first unloading module of going up and unloading module and second, can compromise the pad pasting that the semiconductor carries out solid brilliant or bonding wire technology front and back, has improved pad pasting efficiency.

Description

Film sticking device

Technical Field

The application relates to the technical field of film sticking, in particular to a film sticking device.

Background

Quad Flat No-lead (QFN) is one of the semiconductor surface mount Package technologies. In the related art semiconductor package, it is generally required to apply a film to the semiconductor before die bonding or wire bonding to prevent leakage of the molding resin during the subsequent molding.

However, the conventional semiconductor package device has low film sticking efficiency.

Disclosure of Invention

In view of the above, it is necessary to provide a film laminating apparatus for solving the problem of low film laminating efficiency of the conventional semiconductor packaging apparatus.

The application provides a pad pasting device includes:

the film sticking module comprises a film sticking platform for bearing a piece to be stuck, a moving module and a film sticking mechanism; the moving module is connected with the film sticking platform so as to drive the film sticking platform to move from the feeding station to the film sticking station or from the film sticking station to the feeding station along a first direction; the film sticking mechanism is used for sticking a film on a piece to be stuck on the film sticking station; and

the feeding module comprises a feeding manipulator module, a first feeding module and a second feeding module, wherein the first feeding module is used for loading a plurality of pieces to be pasted which are arranged in a stacked mode and face upwards; the second feeding module is used for placing a plurality of pieces to be pasted, which are arranged in a stacked mode, are pasted with films on the front sides, and are upward in the back sides; the feeding manipulator module is used for moving the piece to be pasted of the first feeding module or the second feeding module to the film pasting platform at the feeding station;

the blanking module comprises a blanking manipulator module, a first blanking module and a second blanking module, wherein the blanking manipulator module is used for moving a piece to be pasted after film pasting to the first blanking module or the second blanking module.

This application sets up above-mentioned pad pasting module, material loading module and unloading module to the material loading module includes material loading manipulator module, first material loading module and second material loading module, and the unloading module includes unloading manipulator module, first unloading module and second unloading module, thereby makes the pad pasting device that this application provided can compromise to not fixing brilliant or the semiconductor wafer pad pasting of bonding wire and to fixing brilliant or the semiconductor frame pad pasting that the bonding wire was accomplished.

In one embodiment, the film sticking mechanism comprises a material rolling module, a material receiving module and a film sticking component;

the coil material module is used for releasing the film with the protective film;

the material receiving module is used for rolling up the protective film released by the material rolling rotating shaft so as to separate the protective film from the thin film;

the film sticking part is configured to be capable of sticking the film separated from the protective film to the piece to be stuck on the film sticking station.

In one embodiment, the film pasting component comprises a roller driving motor, a cutter driving cylinder and a film pasting part, and the film pasting part comprises a first direction F ₁ The cutter, the film sticking sucker and the film sticking roller are arranged at intervals;

the film sticking sucker is used for sticking the film separated from the protective film on a piece to be stuck on the film sticking station;

the roller driving motor is connected with the film sticking roller to drive the film sticking roller to roll the film on the piece to be stuck so that the film can be fixed on the piece to be stuck on the film sticking platform moving along the first direction;

the cutter drives actuating cylinder and is connected with the cutter to drive the cutter and cut the film, and remain and be located the film on waiting to paste the piece.

In one embodiment, the material receiving module comprises a material receiving rotating shaft and a material receiving driving mechanism;

the material receiving driving mechanism is connected with the material receiving rotating shaft to drive the material receiving rotating shaft to roll up the protective film released by the material rolling rotating shaft so as to separate the protective film from the film.

In one embodiment, the film sticking platform is provided with a plurality of vacuum holes for adsorbing the piece to be stuck so as to fix the piece to be stuck on the film sticking platform.

In one embodiment, the film sticking module comprises a plurality of film sticking platforms arranged at intervals along the second direction;

the film sticking module also comprises a film sticking driving module which is connected with the film sticking mechanism so as to drive the film sticking mechanism to move along a second direction, so that a piece to be stuck on a film sticking station of any film sticking platform is stuck with a film;

the first direction and the second direction intersect each other.

In one embodiment, the second feeding module comprises a transfer mechanism, the transfer mechanism is used for transferring a to-be-pasted member with a front film pasted and an upward back, and the transfer mechanism and the first feeding module are respectively positioned at two opposite sides of the feeding station along the second direction;

the feeding manipulator module is positioned on one side of the film sticking module along the first direction and comprises a manipulator driving mechanism and a manipulator which is connected with the manipulator driving mechanism and used for picking up a piece to be stuck;

the manipulator driving mechanism is used for driving the manipulator to move along a second direction or a third direction so that the manipulator can move the part to be pasted with the front side facing upwards or the back side facing upwards to the film pasting platform at the feeding station;

the first direction, the second direction and the third direction intersect each other.

In one embodiment, the second feeding module further comprises a second feeding mechanism, the second feeding mechanism is positioned on one side of the feeding manipulator module, which is far away from the film sticking module along the first direction, and comprises a feeding transfer mechanism and a feeding loading part for loading a plurality of to-be-stuck pieces which are stacked, are stuck with films on the front side and are upward in back side;

the feeding transfer mechanism is connected with the feeding loading part so as to drive the piece to be pasted on the feeding loading part to move to the transfer mechanism along the first direction.

In one embodiment, the transfer mechanism comprises two transfer transmission parts which are used for bearing the piece to be pasted and are arranged at intervals along the second direction, and an adjusting component;

the adjusting component is connected with the at least one transfer transmission part so as to adjust the distance between the two transfer transmission parts according to the size of the piece to be pasted along the second direction.

In one embodiment, the first blanking module and the first feeding module have the same structure;

the first blanking module and the first feeding module are both positioned on the same side of the film sticking module in the second direction and are arranged at intervals in the first direction;

the second blanking module and the second feeding module are identical in structure and are respectively located on two opposite sides of the film sticking module along the first direction.

Drawings

FIG. 1 is a schematic structural diagram of a film pasting device according to an embodiment of the present application;

FIG. 2 is a top view of a film application device according to one embodiment of the present application;

FIG. 3A is a front view of a film attachment mechanism provided in accordance with one embodiment of the present application;

FIG. 3B is a schematic structural diagram of a film application mechanism according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a film sticking platform and a mobile module according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a feeding robot module according to an embodiment of the present application;

fig. 6 is a schematic structural view of a second feeding mechanism provided in an embodiment of the present application;

fig. 7 is a schematic structural diagram of a transfer mechanism according to an embodiment of the present application.

Description of reference numerals:

a film sticking device 1000;

a film sticking module 100;

a film sticking mechanism 1;

a film-sticking member 11; a roller drive motor 111; a cutter driving cylinder 112; a film-attaching portion 113; a film sticking suction head 1131; a cutter 1132; a film roller 1133;

a coil stock module 12; a coil stock spindle 121; a coil drive mechanism 122; a coil translation mechanism 123;

a material receiving module 13; a material receiving rotating shaft 131; the material receiving drive mechanism 132;

a film pasting platform 2; vacuum holes 21;

a moving module 3;

a film sticking driving module 4;

a feeding module 200;

a first feeding module 201;

a second feeding module 202;

a second feed mechanism 2021; a loading section 20211; a feed transfer mechanism 20212; a first feed transfer mechanism 202121; a second feed transfer mechanism 202122; a feeding push rod portion 202123;

a relay mechanism 2022; a relay transmission section 20221; an adjustment assembly 20222;

a feeding manipulator module 203; a feeding manipulator 2031; a manipulator drive mechanism 2032;

a blanking module 300;

a first blanking module 301;

a second blanking module 302;

a second blanking mechanism 3021; a blanking loader 30211; a blanking transfer mechanism 30212; a first blanking transfer mechanism 302121; a second blanking transfer mechanism 302122; a blanking push rod part 302123;

a feeding manipulator module 303; and a feeding manipulator 3031.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiment in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and therefore the application is not limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are for purposes of illustration only and do not denote a single embodiment.

The inventors of the present application have found through research that, in a semiconductor package according to the related art, it is necessary to not only film a semiconductor before die bonding or wire bonding of the semiconductor, but also film a semiconductor frame after die bonding or wire bonding of the semiconductor, thereby preventing leakage of a molding resin during subsequent molding. However, in the conventional semiconductor packaging device, it is generally difficult to simultaneously bond the films before die bonding or wire bonding and after die bonding or wire bonding of the semiconductor frame, which results in low film bonding efficiency of the semiconductor.

The inventor of the present application has conducted extensive research and has designed a film pasting apparatus 1000, which can not only paste a film on a semiconductor wafer without die bonding or wire bonding, but also paste a film on a semiconductor frame completed with die bonding or wire bonding, and has high film pasting efficiency.

The film laminating module 100 of the film laminating apparatus 1000 provided in the present application is described below with reference to the accompanying drawings.

As shown in fig. 1-2, a film laminating apparatus 1000 according to an embodiment of the present disclosure includes a film laminating module 100, a feeding module 200, and a discharging module 300.

Refer to the drawings1-2, the film sticking module 100 comprises a film sticking platform 2 for bearing a piece to be stuck, a moving module 3 and a film sticking mechanism 1, wherein the moving module 3 is connected with the film sticking platform 2 to drive the film sticking platform 2 to move along a first direction F ₁ The film sticking mechanism 1 is used for sticking a film to a piece to be stuck on the film sticking station.

Referring to fig. 1, the feeding module 200 includes a feeding manipulator module 203, a first feeding module 201 and a second feeding module 202, where the first feeding module 201 is used for loading a plurality of pieces to be attached which are stacked and face up; the second feeding module 202 is used for placing a plurality of pieces to be attached which are arranged in a stacked manner, are provided with films on the front sides and are upward on the back sides; the feeding manipulator module 203 is used for moving the part to be attached of the first feeding module 201 or the second feeding module 202 to the film attaching platform 2 at the feeding station.

Referring to fig. 1, the discharging module 300 includes a discharging manipulator module 303, a first discharging module 301, and a second discharging module 302, and the discharging manipulator module is configured to move the piece to be attached after the film is attached to the first discharging module 301 or the second discharging module 302.

The die bonding of a semiconductor is to bond a semiconductor wafer to a frame made of copper. In the present application, the to-be-bonded device may be a semiconductor wafer without die bonding or wire bonding, or a semiconductor frame with die bonding or wire bonding, that is, for a semiconductor wafer with die bonding or wire bonding, the surface of the semiconductor wafer with the frame is bonded with the film. Then, the semiconductor chips that are not subjected to die bonding or wire bonding are transported by the first loading module 201 and the first unloading module 301 respectively matching with the loading robot module 203 and the unloading robot module 303, and the semiconductor frames that have been die bonded or wire bonded are transported by the second loading module 202 and the second unloading module 302 respectively matching with the loading robot module 203 and the unloading robot module 303 and the transfer mechanism 2022.

When the film sticking device 1000 is used, a plurality of pieces to be stuck which are arranged in a stacked manner and have the right surfaces facing upwards can be loaded on the first loading module 201, then the pieces to be stuck are moved to the film sticking module 100 by the loading manipulator module 203 for film sticking, and after the film sticking is completed, the pieces to be stuck are moved to the first unloading module 301 by the unloading manipulator module 303.

When the film pasting device 1000 is used, a plurality of pieces to be pasted which are arranged in a stacked manner and are pasted with films on the front side and face upwards on the back side can be loaded on the second feeding module 202, then the feeding manipulator module 203 moves the piece to be pasted to the film pasting module 100 for pasting, and after the pasting, the discharging manipulator module 303 moves the piece to be pasted to the second discharging module 302.

This application makes pad pasting device 1000 can accomplish above-mentioned process through setting up first material loading module 201, first unloading module 301, second material loading module 202, second unloading module 302, material loading manipulator module 203 and unloading manipulator module 303, can carry out the pad pasting to the semiconductor wafer that does not carry out solid brilliant or bonding wire technology, also can carry out the pad pasting to the semiconductor frame that has solid brilliant or bonding wire accomplished.

Referring to fig. 1-2 and 4, the film sticking module 100 includes a plurality of film sticking platforms 2 and a film sticking driving module 4, the plurality of film sticking platforms 2 being along a second direction F ₂ The film sticking driving module 4 is arranged at intervals and positioned below the film sticking mechanism 1 and connected with the film sticking mechanism 1 so as to drive the film sticking mechanism 1 to move along the second direction F ₂ And (4) moving. This application sets up a plurality of pad pasting platforms 2 in pad pasting device 1000's below, and a plurality of pad pasting platforms 2 are followed second direction F ₂ Arranged at intervals, so that the film sticking mechanism 1 can be arranged along the second direction F ₂ And moving the film to the position above the film sticking station of any film sticking platform 2 so as to stick a film on the to-be-stuck piece on the film sticking station of any film sticking platform 2.

From this, be convenient for pad pasting mechanism 1 carries out the pad pasting to the piece of treating that is located pad pasting platform 2 to reduced pad pasting mechanism 1's idle latency, reached the effect that improves pad pasting efficiency.

"idle latency" refers to: in the film sticking process, the material loading module 200 is used for conveying a piece to be stuck to the film sticking module 100 and sticking a film, the film sticking platform 2 is used for conveying the piece to be stuck to the film sticking station to the blanking station, if only one film sticking platform 2 is arranged, the film sticking mechanism 1 is used for waiting for the film sticking platform 2 to convey the piece to be stuck with the film to be stuck to the blanking station, and then the piece to be stuck to the film sticking station is conveyed to the next piece to be stuck to the film sticking station by returning to the material loading station, so that the film sticking mechanism 1 can have the time for waiting for the film sticking platform 2 to move back and forth for transportation, and the waiting time is idle. It is conceivable that the feeding manipulator 2031 waits for a waiting time during the entire feeding, discharging and film laminating process, so that the film laminating efficiency is low.

And in the present application a plurality of second directions F are provided ₂ The pad pasting platforms 2 that lay at the interval make pad pasting module 100 accomplish on the pad pasting platform 2 treat that the piece after the pad pasting directly carries out the pad pasting to treating on another pad pasting platform 2, and material loading manipulator 2031 also can pick up treating to treat to paste to different pad pasting platforms 2 on, the circulation is reciprocal, has improved pad pasting efficiency naturally.

As shown in fig. 1, a first direction F ₁ And a second direction F ₂ Intersecting each other two by two. In particular, a first direction F ₁ And a second direction F ₂ Perpendicular to each other, e.g. first direction F ₁ Parallel to the length direction of the film sticking platform 2, a second direction F ₂ Parallel to the width direction of the film platform 2.

Fig. 3 is a schematic structural diagram and a front view of a film sticking mechanism 1 provided in an embodiment of the present application. Referring to fig. 3, the film sticking mechanism 1 includes a roll module 12, a material receiving module 13 and a film sticking component 11, the roll module 12 is used for releasing a film with a protective film, the roll module 12 includes a roll rotating shaft 121 and a roll driving mechanism 122, and the material receiving module 13 is used for rolling up the protective film released by the roll rotating shaft 121 to separate the protective film from the film; the film sticking part 11 is configured to be able to stick a film detached from the protective film to a member to be stuck on the film sticking station.

Referring to fig. 3, the film with the protective film is wound on the winding shaft 121 of the winding module 12, and the winding shaft 121 is connected to the winding driving mechanism 122 and is driven by the winding driving mechanism 122 to rotate and release the film with the protective film. The coil driving mechanism 122 may be a driving device such as a motor or an air cylinder.

In some embodiments, the roll module 12 includes a roll translation mechanism 123, and the roll translation mechanism 123 is configured to drive the roll spindle 121 along the first direction F ₁ Move, and the film sticking mechanism 1The rest components are matched to support the flat-drawn film, so that the film sticking of the film sticking component 11 is facilitated.

Referring to fig. 3, the material receiving module 13 includes a material receiving rotation shaft 131 and a material receiving driving mechanism 132, the material receiving driving mechanism 132 is connected to the material receiving rotation shaft 131 to drive the material receiving rotation shaft 131 to roll up the protection film released by the material winding rotation shaft 121, so as to separate the protection film from the film.

That is, the material collecting rotating shaft 131 connected to the material collecting driving mechanism 132 takes up the protective film released from the roll rotating shaft 121 under the driving of the material collecting driving mechanism 132, and separates the protective film and the film in cooperation with the roll module 12 and other components of the film sticking mechanism 1.

In some embodiments, other components of the film sticking mechanism 1 may be configured as rollers, that is, the film separated from the protective film may be pulled by the additionally configured rollers to reach the film sticking component 11. The material receiving driving mechanism 132 may be a motor or a motor to provide power for the rotation of the material receiving rotation shaft 131.

Referring to fig. 3, the film coating member 11 includes a roller driving motor 111, a cutter driving cylinder 112, and a film coating portion 113, and the film coating portion 113 includes a first direction F ₁ The film sticking device comprises a cutter 1132, a film sticking suction head 1131 and a film sticking roller 1133 which are arranged at intervals, wherein the film sticking suction head 1131 is used for sticking a film separated from a protective film on a to-be-stuck member positioned on a film sticking station, a roller driving motor 111 is connected with the film sticking roller 1133 to drive the film sticking roller 1133 to roll the film on the to-be-stuck member so that the film can be fixed on the to-be-stuck member on a film sticking platform 2 moving along a first direction, and a cutter driving cylinder 112 is connected with the cutter 1132 to drive the cutter 1132 to cut the film and retain the film positioned on the to-be-stuck member; first direction F ₁ A second direction F ₂ And a third direction F ₃ Intersecting each other two by two.

Referring to fig. 3, a cutter 1132, a film sticking suction head 1131 and a film sticking roller 1133 are arranged along a first direction F ₁ The arrangement is spaced. The film sticking part 11 is used for sticking a film which is separated from a protective film on a piece to be stuck on the film sticking platform 2 on the film sticking station, after the piece to be stuck on the film sticking platform 2 is conveyed to the film sticking station, the film sticking part 113 is driven by a motor or an electric motor to be positioned on the film sticking platformThe piece to be pasted on the table 2 moves to enable the film adsorbed by the film pasting suction head 1131 to be pasted on the surface of the piece to be pasted on the film pasting station, and the film pasting platform 2 is driven by the moving module 3 to move along the first direction F ₁ While moving, the cutter 1132 connected with the cutter driving cylinder 112 cuts the film with fixed length according to the setting under the driving of the cutter driving cylinder 112, and keeps the cut film with fixed length on the piece to be pasted, and then the pasting roller 1133 connected with the roller driving motor 111 rolls back and forth on the piece to be pasted under the driving of the roller driving motor 111 to paste the film pasted on the piece to be pasted, namely, the film can be fixed along the first direction F by the rolling of the pasting roller 1133 ₁ And the piece to be pasted on the moving film pasting platform 2 is finished by the film pasting part 11.

Fig. 4 is a schematic structural diagram of the film pasting platform 2 and the moving module 3 according to an embodiment of the present application. Referring to fig. 4, the film sticking module 100 is provided with a film sticking platform 2 for carrying a piece to be stuck. The piece to be pasted is picked up by the feeding manipulator 2031 to the film pasting platform 2 located at the feeding station, the film pasting platform 2 can fix the piece to be pasted on the film pasting platform 2, then the film pasting platform 2 bears the piece to be pasted and moves from the feeding station to the film pasting station under the driving of the moving module 3, the film pasting component 11 pastes the film on the piece to be pasted located at the feeding station, and the film pasting platform 2 pastes the film again under the driving of the moving module 3 along the first direction F ₁ And moving to a blanking station. Wherein, the movable module 3 can be set up to guide rail and movable block integrated configuration, and the movable block bears pad pasting platform 2 and moves on the guide rail under the drive such as motor or motor promptly.

Referring to fig. 4, the film platform 2 includes a plurality of vacuum holes 21 for adsorbing the to-be-pasted member so as to be able to fix the to-be-pasted member to the film platform 2. The film sticking module also comprises a negative pressure device communicated with the vacuum hole 21, and negative pressure can be formed at the vacuum hole 21 by utilizing the negative pressure device, so that a piece to be stuck can be adsorbed and fixed on the film sticking platform 2. The negative pressure device may be a vacuum pump or the like.

The following describes the feeding module 200 of the film laminating apparatus 1000 provided in the present application according to the accompanying drawings.

As shown in fig. 1, the film sticking device 1000 of the present application further includes a feeding module 200, and the feeding module 200 is used for transporting the piece to be stuck to the film sticking station so that the film sticking mechanism 1 sticks the piece to be stuck to the film. The feeding module 200 includes a first feeding module 201, a second feeding module 202, and a feeding robot module 203. The first feeding module 201 and the feeding manipulator module 203 are matched to transport a semiconductor to-be-bonded component which is not subjected to die bonding or wire bonding, and the second feeding module 202 and the feeding manipulator module 203 are matched to transport a semiconductor to-be-bonded component which is subjected to die bonding or wire bonding. That is, the first loading module 201 and the second loading module 202 share one loading robot module 203.

As shown in fig. 1, the first feeding module 201 may be disposed around the first feeding module along a third direction F ₃ The long rod extending for a certain length and the bottom of the long rod are provided with loading structures of frame-shaped surrounding pieces so as to load a plurality of pieces to be pasted which are stacked and face-up and are not pasted with films. Wherein the first direction F ₁ A second direction F ₂ And a third direction F ₃ Intersecting each other two by two.

In some embodiments, the first feeding module 201 may further be provided with a paper-separating storage structure disposed on the loading structure along the second direction F ₂ One side extended for storing the piece to be pasted which is not pasted with the film.

Fig. 6 is a schematic structural diagram of a second feeding mechanism 2021 according to an embodiment of the present application.

Referring to fig. 1, the second feeding module 202 further includes a second feeding mechanism 2021, the second feeding mechanism 2021 is located on a side of the feeding manipulator module 203 away from the film sticking module 100 along the first direction, and includes a feeding transfer mechanism 20212 and a feeding loading portion 20211 for loading a plurality of to-be-pasted members which are stacked, front-faced and back-faced upward; the feeding and transferring mechanism 20212 is connected to the feeding and loading portion 20211 to drive the to-be-pasted members on the feeding and loading portion 20211 to move to the transferring mechanism 2022 along the first direction.

The second feeding mechanism 2021 is used for storing the to-be-attached component which is die-bonded or wire-bonded, and transporting the to-be-attached component from the feeding loading portion 20211 to the transferring mechanism 2022.

The loading section 20211 may be configured as a plurality of magazine cases with grooves for storing the parts to be attached. The loading part is connected with a feeding transfer mechanism 20212 to drive the parts to be pasted on the feeding loading part 20211 along the first direction F ₁ The material is moved from the feeding transfer mechanism 20212 to the transfer mechanism 2022.

Referring to fig. 6, the feed transfer mechanism 20212 includes a first feed transfer mechanism 202121 and a second feed transfer mechanism 202122. The first feeding transfer mechanism 202121 is disposed along the second direction F ₂ A plurality of extended conveyor belt structures for loading a plurality of cartridge magazine, the conveyor belt carrying the cartridge magazine driven by a motor or the like in a second direction F ₂ And conveying to convey the magazine loaded with the parts to be pasted to one end of the conveyor belt close to the second feeding and transferring mechanism 202122 so that the second feeding and transferring mechanism 202122 can pick up the magazine.

Referring to fig. 6, the second feeding transfer mechanism 202122 is provided so as to be movable in the third direction F ₃ The second feeding transfer mechanism 202122 may be a combination of a clamping fixture and an up-down lifting module, wherein the clamping fixture is a combination of a cross bar and a fixing block, which are driven by a driving component such as a motor or a cylinder to clamp and clamp up and down, so as to clamp the cartridge magazine on the first feeding transfer mechanism 202121, and the up-down lifting module is connected to the fixing clamp and driven by a driving component such as a motor or a cylinder to drive the fixing clamp to move along the third direction F ₃ A lifting structure.

Referring to fig. 6, the feeding transfer mechanism 20212 includes a feeding push rod portion 202123, when the second feeding transfer mechanism 202122 clamps the magazine and moves to a specific position, the feeding push rod portion 202123 is used to push out the to-be-pasted material loaded in the magazine to the transfer mechanism 2022, and the feeding push rod portion 202123 is disposed along the first direction F ₁ An extended push rod capable of pushing the piece to be pasted out of the magazine and a driving structure for providing power to the push rod, wherein the driving structure can be configured as a driving device such as a motor.

Referring to fig. 1 and 6, the second feeding mechanism 2021 loads the parts to be attached by arranging a plurality of magazine cartridges, and the magazine cartridges are all placed on the first feeding and transferring mechanism 202121, and are transported to an end close to the second feeding and transferring mechanism 202122 by a conveyor belt, and then the second feeding and transferring mechanism 202122 carries and clamps the magazine cartridges along the third direction F ₃ Lifting to a specific position and moving in a first direction F ₁ The moving push rod drives the part to be pasted loaded in the magazine of the cartridge along a first direction F ₁ And pushed out to the relay mechanism 2022.

Referring to fig. 6, the first feeding and transferring mechanisms 202121 may be provided in two, and respectively extend along the third direction F ₃ The first feeding and transferring mechanism 202121 is arranged at intervals, that is, the first feeding and transferring mechanism 202121 is arranged into an upper layer and a lower layer, so that the effect of loading more pieces to be pasted is achieved.

Fig. 7 is a schematic structural diagram of a transfer mechanism 2022 according to an embodiment of the present application. Referring to fig. 1, 2 and 7, the second feeding module 202 includes a transferring mechanism 2022, the transferring mechanism 2022 is used for transferring a to-be-pasted member with a front side pasted film and a back side facing upward, and the to-be-pasted member and the first feeding module 201 are respectively located at the feeding station along the second direction F ₂ To opposite sides of the panel.

Referring to fig. 7, the transferring mechanism 2022 comprises a second direction F for carrying the part to be attached ₂ Two transfer transmission parts 20221 arranged at intervals and an adjusting component 20222, wherein the adjusting component 20222 is connected with at least one transfer transmission part 20221 to follow the piece to be pasted along the second direction F ₂ The pitch between the two relay transmission sections 20221 is adjusted.

The two transfer transmission portions 20221 extend along a first direction and are used for carrying the to-be-pasted material, and the transfer transmission portions 20221 are driven by a driving device such as a motor to carry the to-be-pasted material conveyed by the second feeding mechanism 2021 along the first direction F ₁ And moving the part to be attached to a proper position so that the feeding manipulator module 203 can pick the part to be attached to the feeding station of the film attaching platform 2. The adjustment assembly 20222 may be provided as a lead screw in driving connection with a motor, but is not limited thereto.

Fig. 5 is a schematic structural diagram of a loading robot module 203 according to an embodiment of the present disclosure. Referring to fig. 1 and 5, the feeding robot module 203 is located at the lamination module 100 along the first direction F ₁ And includes a robot driving mechanism 2032, and a robot connected to the robot driving mechanism 2032 and configured to pick up the part to be attached. The manipulator driving mechanism 2032 is for driving the manipulator in the second direction F ₂ Or a third direction F ₃ And moving the workpiece to be pasted with the front side upward or the back side upward to the film pasting platform 2 at the feeding station by the manipulator.

Specifically, the feeding manipulator module 203 may pick up the part to be attached located at the first feeding module 201 and move the part to be attached to the film attaching platform 2 at the feeding station, and the feeding manipulator module 203 may also pick up the part to be attached located at the transferring mechanism 2022 of the second feeding module 202 and move the part to be attached to the film attaching platform 2 at the feeding station.

The feeding manipulator module 203 includes a manipulator driving mechanism 2032 for driving the feeding manipulator 2031 along the second direction F ₂ Or a third direction F ₃ And the loading manipulator 2031 is configured to move the part to be attached with its front side facing up or back side facing up to the film attaching platform 2 at the loading station.

In some embodiments, the loading robot module 203 is controlled to move in the second direction F ₂ The moving mechanism may be a moving device with a guide rail driven by a motor to control the feeding manipulator module 203 to move along the third direction F ₃ The moving mechanism may be provided as a lifting structure driven by an air cylinder.

Referring to fig. 5, the feeding robot module 203 further includes a feeding robot 2031 connected to the robot driving mechanism 2032 and configured to pick up a part to be attached. The feeding robot 2031 for picking up the to-be-attached material is not limited to a specific configuration, and in some embodiments, may be provided as a grasping structure, or as a suction mechanism with a negative pressure device, which may be set according to actual needs.

The following describes the blanking module 300 of the film laminating apparatus 1000 provided in the present application according to the accompanying drawings.

As shown in FIG. 1It shows that the pad pasting device 1000 of this application includes the unloading module 300 that is used for removing the piece of waiting that the pad pasting was accomplished from pad pasting module 100, and unloading module 300 includes first unloading module 301, second unloading module 302 and is used for removing the piece of waiting that accomplishes the pad pasting and be located the unloading station to first unloading module 301 or the unloading manipulator module 303 of second unloading module 302. The first blanking module 301 and the first feeding module 201 have the same structure, and the first blanking module 301 and the first feeding module 201 are both located on the film sticking module 100 along the second direction F ₂ On the same side and along a first direction F ₁ The second blanking module 302 and the second loading module 202 are arranged at intervals and have the same structure and are respectively arranged on the film sticking module 100 along the first direction F ₁ To opposite sides of the panel.

Referring to fig. 1, a semiconductor wafer without die bonding or wire bonding is moved from a first loading module 201 to a die attach module 100 by a loading manipulator module 203, and is attached to a film by the die attach module 100 and then moved from the die attach module 100 to a first unloading module 301 by a unloading manipulator module 303;

the semiconductor frame after die bonding or wire bonding is moved from the second feeding module 202 to the film attaching module 100 by the feeding manipulator module 203, and is moved from the film attaching platform 2 of the film attaching module 100 to the transfer mechanism 2022 by the discharging manipulator module 303 after film attaching is completed by the film attaching module 100, and the semiconductor frame after film attaching is moved to a certain position by the transfer transmission unit 20221 and then is stored by the discharging manipulator module 303 to the discharging loading unit 30211 of the second discharging module 302.

The second blanking module 302 includes a second blanking mechanism 3021, the second blanking mechanism 3021 includes a blanking loader 30211 and a blanking transfer mechanism 30212, the blanking transfer mechanism 30212 includes a first blanking transfer mechanism 302121, a second blanking transfer mechanism 302122 and a blanking push rod portion 302123, wherein the blanking loader 30211 and the blanking transfer mechanism 30212 are respectively identical in structure to the loading loader 20211 and the loading transfer mechanism 20212, and the blanking push rod portion 302123 is used for pushing the film-attached piece located in the transfer mechanism 2022 into the blanking loader 30211 clamped by the second blanking transfer mechanism 302122 to store the film-attached piece in the blanking loader 30211 of the second blanking module 302.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is specific and detailed, but not construed as limiting the scope of the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, and these are all within the scope of protection of the present application. Therefore, the protection scope of the present patent application shall be subject to the appended claims.

Claims (10)

1. A film laminating apparatus, comprising:

the film sticking module comprises a film sticking platform for bearing a piece to be stuck, a moving module and a film sticking mechanism; the moving module is connected with the film pasting platform so as to drive the film pasting platform to move from the feeding station to the film pasting station or from the film pasting station to the feeding station along a first direction; the film sticking mechanism is used for sticking a film on the piece to be stuck positioned on the film sticking station; and

the feeding module comprises a feeding manipulator module, a first feeding module and a second feeding module, and the first feeding module is used for loading a plurality of pieces to be pasted which are arranged in a stacked mode and face upwards; the second feeding module is used for placing a plurality of pieces to be pasted, which are arranged in a stacked mode, are pasted with films on the front sides, and the back sides of the pieces to be pasted face up; the feeding manipulator module is used for moving the piece to be pasted of the first feeding module or the second feeding module to the film pasting platform at the feeding station;

the blanking module comprises a blanking manipulator module, a first blanking module and a second blanking module, wherein the blanking manipulator module is used for moving the piece to be pasted to the first blanking module or the second blanking module after film pasting.

2. The film laminating device according to claim 1, wherein the film laminating mechanism comprises a material rolling module, a material receiving module and a film laminating part;

the coil material module is used for releasing the film with the protective film and comprises a coil material rotating shaft and a coil material driving mechanism;

the material receiving module is used for rolling the protective film released by the roll material rotating shaft so as to separate the protective film from the thin film;

the film pasting part is configured to be capable of pasting the film separated from the protective film on the piece to be pasted on the film pasting station.

3. The film sticking device according to claim 2, wherein the film sticking part comprises a roller driving motor, a cutter driving cylinder and a film sticking part, and the film sticking part comprises a cutter, a film sticking suction head and a film sticking roller which are arranged at intervals along the first direction;

the film sticking suction head is used for sticking the film separated from the protective film to the piece to be stuck on the film sticking station;

the roller driving motor is connected with the film sticking roller to drive the film sticking roller to roll the film on the piece to be stuck so that the film can be fixed on the piece to be stuck on the film sticking platform moving along the first direction;

the cutter driving cylinder is connected with the cutter to drive the cutter to cut the film and keep the film on the piece to be pasted.

4. The film laminating device as claimed in claim 2, wherein the material receiving module comprises a material receiving rotating shaft and a material receiving driving mechanism;

receive material actuating mechanism with receive the material pivot and be connected, in order to drive receive the roll-up material pivot roll-up the release of coil stock pivot the protection film, in order to separate the protection film with the film.

5. The film laminating device as claimed in claim 1, wherein a plurality of vacuum holes for adsorbing the piece to be laminated are formed on the film laminating platform so as to fix the piece to be laminated on the film laminating platform.

6. The film laminating device of claim 1, wherein the film laminating module comprises a plurality of film laminating platforms arranged at intervals along the second direction;

the film sticking module also comprises a film sticking driving module which is connected with the film sticking mechanism so as to drive the film sticking mechanism to move along the second direction, so that a film to be stuck on the film sticking station of any film sticking platform is stuck;

the first direction and the second direction intersect each other.

7. The film sticking device according to claim 1, wherein the second feeding module comprises a transfer mechanism, the transfer mechanism is used for transferring the piece to be stuck with the film on the front side and the back side facing upwards, and the transfer mechanism and the first feeding module are respectively positioned at two opposite sides of the feeding station along the second direction;

the feeding manipulator module is positioned on one side of the film sticking module along the first direction and comprises a manipulator driving mechanism and a manipulator which is connected with the manipulator driving mechanism and used for picking up the piece to be stuck;

the manipulator driving mechanism is used for driving the manipulator to move along the second direction or the third direction so that the manipulator can move the part to be pasted with the front side facing upwards or the back side facing upwards to the film pasting platform at the feeding station;

the first direction, the second direction and the third direction intersect each other.

8. The film laminating device according to claim 7, wherein the second feeding module further comprises a second feeding mechanism, the second feeding mechanism is located on one side of the feeding manipulator module, which is far away from the film laminating module along the first direction, and comprises a feeding transfer mechanism and a feeding loading part for loading a plurality of to-be-laminated pieces which are arranged in a stacked manner, are laminated on the front side and are faced upwards at the back side;

the feeding transfer mechanism is connected with the feeding loading part so as to drive the piece to be pasted on the feeding loading part to move to the transfer mechanism along the first direction.

9. The film laminating device as claimed in claim 7, wherein the transfer mechanism comprises two transfer transmission parts for carrying the piece to be laminated and arranged at intervals along the second direction, and an adjusting component;

the adjusting assembly is connected with at least one transfer transmission part so as to adjust the distance between the two transfer transmission parts according to the size of the piece to be pasted along the second direction.

10. The film laminating device as claimed in claim 7, wherein the first blanking module and the first feeding module are of the same construction;

the first blanking module and the first feeding module are both positioned on the same side of the film sticking module in the second direction and are arranged at intervals in the first direction;

the second blanking module and the second feeding module are identical in structure and are respectively located on two opposite sides of the film sticking module along the first direction.

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