CN220272457U - Splicing platform, silicon wafer conveying device and coating system - Google Patents

Abstract

The application relates to a splicing platform, a silicon wafer conveying device and a coating system. The bearing piece is provided with a bearing surface for bearing the silicon wafer and a plurality of locating pieces which are arranged on the bearing surface and are used for being abutted with the silicon wafer for locating. The positioning piece comprises a positioning section and a guiding section connected with the positioning section. The locating section is connected with the bearing surface, and the locating section is used for being in butt location with the silicon chip side, and the guide section is equipped with the guide surface, and the distance S of the central axis O of guide surface and setting element is in the direction from the top of guide section to the guide section bottom increase gradually. In the process of placing the silicon wafer on the bearing surface in alignment, the silicon wafer is guided by the guide sections of the positioning pieces, slides downwards along the guide surfaces of the guide sections, is gradually corrected in position by the guide surfaces and falls on the bearing surface, and is positioned by abutting with the side edge of the silicon wafer through the positioning sections, so that the position of the silicon wafer can be accurately positioned, the lapping defect of the silicon wafer can be reduced, the fragment rate can be reduced, and the conveying efficiency can be improved.

Description

Splicing platform, silicon wafer conveying device and coating system

Technical Field

The application relates to the technical field of silicon wafer carrying, in particular to a splicing platform, a silicon wafer conveying device and a film coating system.

Background

When solar cells are produced, a coating process of a silicon wafer is generally involved, specifically, the silicon wafer is conveyed into a coating system, and the front side and the back side of the silicon wafer are coated by adopting a related chemical vapor deposition process.

In the related art, a plurality of silicon wafers are adsorbed through a gantry swing arm, transferred and conveyed onto a splicing platform, positioning pins are arranged on the splicing platform, and the silicon wafers are positioned through the positioning pins. Then, the translational motion of the splicing platform drives a plurality of silicon chips on the splicing platform to be conveyed into the transmission runway mechanism. The splicing platform reduces the height of the splicing platform, so that a plurality of silicon chips on the splicing platform are transferred to the transmission runway mechanism and are sent into the basket by the transmission runway mechanism, and finally the basket drives the plurality of silicon chips to finish overturning. After the silicon wafer is turned over by 180 degrees, the silicon wafer enters the next film coating chamber for corresponding treatment.

However, after the silicon wafer is transferred onto the splicing platform by the gantry swing arm, the lapping defect is easy to occur, and in the process of entering the basket, the silicon wafer collides with the basket to cause fragments, and finally the silicon wafer is required to be stopped for maintenance, so that the conveying efficiency is lower.

Disclosure of Invention

Based on the defects in the prior art, the splicing platform, the silicon wafer conveying device and the film coating system can reduce the silicon wafer lapping defects, further reduce the fragment rate and improve the conveying efficiency.

A tab platform, the tab platform comprising:

the bearing piece is provided with a bearing surface for bearing the silicon wafer and a plurality of positioning pieces which are arranged on the bearing surface and are used for being abutted with the silicon wafer for positioning; each locating piece comprises a locating section and a guide section connected with the locating section, the locating section is connected with the bearing surface, the locating section is used for being in butt joint with the side edge of the silicon wafer for locating, the guide section is provided with a guide surface, and the distance S between the guide surface and the central axis O of the locating piece is gradually increased in the direction from the top end of the guide section to the bottom end of the guide section.

In one embodiment, all the positioning members comprise a plurality of longitudinal columns which are sequentially arranged at intervals along the first direction and a plurality of transverse rows which are sequentially arranged at intervals along the second direction; each longitudinal row comprises a plurality of first locating pieces which are sequentially arranged at intervals along the second direction, and each transverse row comprises a plurality of second locating pieces which are sequentially arranged at intervals along the first direction.

In one embodiment, the guide section has a circular, elliptical or polygonal cross-sectional profile along the central axis O of the positioning member; and/or the guide surface is intersected with a plane passing through the central axis O to obtain an intersecting line, wherein the intersecting line comprises one or more of a circular arc line, an elliptic arc line, a parabola and a straight line.

In one embodiment, the tab platform further comprises an inductor disposed on the bearing surface; the sensor is used for sensing whether the silicon wafer on the bearing surface is lapped or not.

In one embodiment, the sensor is provided with a light emitting portion and a light receiving portion corresponding to the light emitting portion, and the distance between the light emitting portion and the light receiving portion and the supporting surface is greater than the thickness of the silicon wafer.

In one embodiment, the tab platform further comprises an alarm electrically connected to the sensor, wherein the alarm is used for performing an alarm action when the sensor senses that the silicon wafer has a lap.

The silicon wafer conveying device comprises the splicing platform.

In one embodiment, the silicon wafer conveying device further comprises:

the first transplanting assembly comprises a first moving mechanism and a plurality of first adsorption pieces connected with the first moving mechanism, the first adsorption pieces are used for adsorbing and fixing or loosening silicon wafers, and the first moving mechanism is used for driving the first adsorption pieces to switch between a first feeding position and a first discharging position;

the turnover assembly comprises a supporting piece, a rotating piece rotatably connected with the supporting piece and a plurality of second adsorption pieces connected to the rotating piece, wherein the second adsorption pieces are used for adsorbing and fixing or loosening silicon wafers; when the first adsorption piece moves to a first blanking position, the second adsorption piece is positioned right below the first adsorption piece and is used for receiving the silicon wafer loosened by the first adsorption piece; the rotating piece is used for driving the plurality of second adsorption pieces on the rotating piece to turn over;

the second transplanting assembly comprises a second moving mechanism, the second moving mechanism is connected with the splicing platform and is used for driving the splicing platform to switch between a second feeding position and a second discharging position, and when the splicing platform is located at the second feeding position, the splicing platform is located under the overturning assembly; and

the third transplanting assembly comprises a third moving mechanism and a plurality of third absorbing parts connected with the third moving mechanism, the third absorbing parts are used for absorbing and fixing or loosening silicon wafers, the third moving mechanism is used for driving the third absorbing parts to switch between a third feeding position and a third discharging position, when the splicing platform is located at the second discharging position, the third absorbing parts are located at the third feeding position, and when the third absorbing parts are located at the third feeding position, the third absorbing parts are located right above the splicing platform and are used for absorbing and fixing the silicon wafers on the splicing platform.

In one embodiment, the flipping assembly further comprises a motor, a drive wheel, a plurality of driven wheels, and a transmission element; the number of the rotating parts is multiple, each rotating part is correspondingly connected with each driven wheel, the transmission element is respectively connected with the driving wheel and all the driven wheels, and the motor is connected with the driving wheel.

A coating system comprises the silicon wafer conveying device.

Above-mentioned splicing platform, silicon chip conveyor and coating film system, because the distance S of the central axis O of guide surface and setting element is in the direction from the top of guide section to the guide section bottom increase gradually, with the silicon chip counterpoint in-process of putting down on the bearing surface like this, the guide section of a plurality of setting elements is led the silicon chip, the silicon chip slides downwards along the guide surface of guide section, by the guide surface correction position gradually and fall into on the bearing surface, carry out the butt location through the setting section with the silicon chip side, so, not only can make the accurate location in position of silicon chip, can also reduce the silicon chip overlap defect, and then can reduce the piece rate, improve conveying efficiency.

Drawings

FIG. 1 is a top view block diagram of a tab platform according to one embodiment of the present application.

Fig. 2 is a view of the positioning member shown in fig. 1.

Fig. 3 is a schematic structural diagram of a silicon wafer conveying device according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of the first carrier in fig. 3 carrying a silicon wafer.

Fig. 5 is a schematic bottom view of the first mounting plate of the first transplanting assembly of fig. 3.

Fig. 6 is a schematic top view of the flip assembly of fig. 3.

Fig. 7 is a schematic bottom view of the second mounting plate of the third transplanting assembly of fig. 3.

10. A tab platform; 11. a support; 12. a positioning piece; 121. a positioning section; 122. a guide section; 1221. a guide surface; 1222. intersecting lines; 123. a column; 1231. a first positioning member; 124. a transverse row; 1241. a second positioning member; 125. a groove; 13. an inductor; 131. a light emitting part; 132. a light receiving section; 133. a first inductor; 134. a second inductor; 20. a silicon wafer; 30. a first transplanting assembly; 31. a first moving mechanism; 32. a first absorbent member; 33. a first mounting plate; 40. a flip assembly; 41. a support; 42. a rotating member; 43. a second adsorption member; 44. a motor; 45. a driving wheel; 46. driven wheel; 47. a transmission element; 50. a second transplanting assembly; 51. a second moving mechanism; 60. a third transplanting assembly; 61. a third movement mechanism; 62. a third adsorption member; 63. a second mounting plate; 70. a first chamber; 71. a first carrier plate; 80. a second chamber; 81. and a second carrier plate.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

As described in the background art, after the silicon wafer in the prior art is transferred onto the tab platform by the gantry swing arm, the problem of lapping defect easily occurs, and research by the applicant finds that the reason for this problem is that in the related art, in order to improve the accurate positioning of the silicon wafer, multiple sides of the silicon wafer are respectively positioned by multiple positioning pins, and the positioning accuracy is higher when the distance between the sides of the silicon wafer and the positioning pins is smaller, however, the lapping defect easily occurs in the process of lowering the silicon wafer onto the tab platform.

Based on the reasons, the application provides a splicing platform, a silicon wafer conveying device and a coating system, which can reduce the silicon wafer lapping defect, further reduce the fragment rate and improve the conveying efficiency.

Referring to fig. 1 and 2, fig. 1 shows a top view block diagram of a tab platform 10 according to an embodiment of the present application. Fig. 2 shows a view of the positioning member 12 shown in fig. 1. An embodiment of the present application provides a splicing platform 10, where the splicing platform 10 includes a support 11. The supporting member 11 is provided with a supporting surface for supporting the silicon wafer 20 and a plurality of positioning members 12 which are arranged on the supporting surface and are used for being abutted with the silicon wafer 20 for positioning. Each positioning member 12 includes a positioning section 121 and a guide section 122 connected to the positioning section 121. The positioning section 121 is connected with the supporting surface, the positioning section 121 is used for being abutted to the side edge of the silicon wafer 20 for positioning, the guiding section 122 is provided with a guiding surface 1221, and the distance S between the guiding surface 1221 and the central axis O of the positioning piece 12 gradually increases in the direction from the top end of the guiding section 122 to the bottom end of the guiding section 122.

In the above-mentioned tab platform 10, since the distance S between the guide surface 1221 and the central axis O of the positioning member 12 gradually increases in the direction from the top end of the guide section 122 to the bottom end of the guide section 122, in this way, the guide sections 122 of the positioning member 12 guide the silicon wafer 20 in the process of positioning the silicon wafer 20 onto the support surface, the silicon wafer 20 slides down along the guide surface 1221 of the guide section 122, is gradually corrected by the guide surface 1221 and falls onto the support surface, and is positioned by abutting the side edge of the positioning section 121 with the silicon wafer 20. Therefore, the position of the silicon wafer 20 can be accurately positioned, the lapping defect of the silicon wafer 20 can be reduced, the fragment rate can be reduced, and the conveying efficiency can be improved.

Wherein the silicon wafer 20 includes, but is not limited to, square, circular, oval, or other regular and irregular shapes. In this embodiment, the silicon wafer 20 is specifically taken as an example of square, and accordingly, a plurality of positioning members 12 are respectively arranged on each side edge of the Fang Xingzhuang silicon wafer 20, so as to position the silicon wafer 20. Of course, when the silicon wafer 20 adopts other shapes, the arrangement mode of the plurality of positioning pieces 12 on the supporting surface can be flexibly adjusted, and the positioning pieces can be respectively abutted with a plurality of parts around the silicon wafer 20 to realize positioning.

Referring to fig. 1, in one embodiment, all of the positioning members 12 include a plurality of columns 123 sequentially spaced apart along the first direction and a plurality of rows 124 sequentially spaced apart along the second direction. Each column 123 includes a plurality of first positioning members 1231 sequentially spaced apart along the second direction, and each row 124 includes a plurality of second positioning members 1241 sequentially spaced apart along the first direction. Therefore, when the plurality of silicon wafers 20 are transported on the supporting surface and the plurality of silicon wafers 20 are arranged in a rectangular array on the supporting surface, every two adjacent longitudinal columns 123 are respectively positioned on two opposite sides of the plurality of silicon wafers 20 arranged along the second direction, so as to play a role in positioning the plurality of silicon wafers 20 arranged along the second direction in the first direction, every two adjacent transverse rows 124 are respectively positioned on two opposite sides of the plurality of silicon wafers 20 arranged along the first direction, so as to play a role in positioning the plurality of silicon wafers 20 arranged along the first direction in the second direction, and therefore, the positioning of the plurality of silicon wafers 20 arranged in the rectangular array in the first direction and the second direction can be realized.

It should be noted that, the first direction is shown by a double arrow a in fig. 1, that is, the transverse direction; the second direction is indicated by double arrow b in fig. 1, i.e. the longitudinal direction.

It should be noted that the number of columns 123 includes, but is not limited to, 2, 3, 4, 5, 10, etc. Further, the number of rows 124 includes, but is not limited to, 2, 3, 4, 5, 10, etc.

In one embodiment, the number of columns 123 is, for example, 10, and the number of rows 124 is, for example, 10, to enable positioning of the 9x9 rectangular array arrangement of silicon wafers 20.

Optionally, the positioning member 12 includes, but is not limited to, a positioning pin, and a groove 125 with a shape of a Chinese character 'i', cross, or quincuncial is provided on the top surface of the positioning pin, so as to facilitate the disassembling and assembling operation of the positioning member 12 by the screwdriver.

Referring to fig. 2, in one embodiment, the guide section 122 has a cross-sectional profile along the central axis O of the positioning member 12 that is regular, as well as irregular, such as circular, elliptical, or polygonal. Wherein the polygon includes triangle, quadrangle, pentagon, hexagon, etc.

Referring to fig. 2, in the present embodiment, the guide section 122 has a circular cross-sectional profile along the central axis O of the positioning member 12. In this way, the positioning member 12 can be used to guide and calibrate the silicon wafer 20 at each position in the circumferential direction, and particularly in this embodiment, the silicon wafer 20 on the opposite sides thereof can be guided and calibrated.

Referring to FIG. 2, in one embodiment, the guide surface 1221 intersects a plane passing through the central axis O to form an intersecting line 1222, the intersecting line 1222 including one or more of a circular arc line, an elliptical arc line, a parabolic line, and a straight line.

Referring to FIG. 2, in one embodiment, the intersection 1222 is, for example, a straight line disposed at an angle to the central axis O, and the guide segment 122 has a circular cross-sectional profile along the central axis O of the positioning member 12. Thus, the guiding section 122 is in a shape of a semi-conical frustum, the intersecting line 1222 is correspondingly a bus in a shape of a conical frustum, and the guiding section 122 has better self-resetting capability and relatively higher alignment precision.

Referring to fig. 1, in one embodiment, the tab platform 10 further includes a sensor 13 disposed on the support surface. The sensor 13 is used for sensing whether the silicon wafer 20 on the bearing surface is lapped or not. Thus, when the silicon wafer 20 has the lapping defect, the sensor 13 can sense correspondingly and timely, correspondingly prompt the staff to process timely, and enable the machine to stop running timely, so that the risk of fragments can be reduced.

In one embodiment, the sensor 13 includes, but is not limited to, an optocoupler sensor, an ultrasonic sensor, a magnetic sensor, etc., and can be specifically and flexibly adjusted and set according to practical requirements, so long as the sensor can be used for sensing the lapping defect of the silicon wafer 20 on the supporting surface.

Referring to fig. 1, in one embodiment, the sensor 13 is provided with a light emitting portion 131 and a light receiving portion 132 corresponding to the light emitting portion 131. The distance between the light emitting part 131 and the light receiving part 132 and the supporting surface is larger than the thickness of the silicon wafer 20. Thus, when the silicon wafer 20 is normally placed on the supporting surface, since the distances between the light emitting portion 131 and the light receiving portion 132 and the supporting surface are larger than the thickness of the silicon wafer 20, in other words, the light emitted by the light emitting portion 131 is higher than the upper surface of the silicon wafer 20, the silicon wafer 20 cannot interfere with the light emitted by the light emitting portion 131, so that the situation that the lapping defect does not exist is correspondingly judged. On the contrary, when the silicon wafer 20 has the edge bonding defect, the silicon wafer 20 will block the light emitted by the light emitting portion 131, so that the light receiving portion 132 cannot receive the light, and accordingly it can be determined that the edge bonding defect exists.

Referring to fig. 1, in one embodiment, the sensor 13 includes a plurality of first sensors 133 sequentially spaced apart along a first direction and a plurality of second sensors 134 sequentially spaced apart along a second direction. Thus, the first sensors 133 can sense whether the plurality of columns 123 have a lap edge defect, respectively; the second sensors 134 can sense whether the bridging defect exists in the transverse rows 124. The combination of the sensing judgment result in the longitudinal direction and the sensing judgment result in the transverse direction can accurately obtain whether the edge bonding defect exists on the bearing surface, and meanwhile, compared with the mode that one or more sensors 13 are configured at the corresponding positions of each silicon wafer 20 in the related art, the structure is simpler, and the cost is lower.

Of course, as some alternative solutions, one or more sensors 13 may be uniformly distributed at the positions where each silicon wafer 20 is placed, or one or more sensors 13 may be respectively disposed at some positions where the lapping defect is likely to occur, which may be specifically and flexibly adjusted and set according to actual requirements, and is not limited herein.

In one embodiment, the tab platform 10 further includes an alarm (not shown) electrically connected to the sensor 13. The alarm is used for performing alarm action when the sensor 13 senses that the silicon wafer 20 has the lapping edge. Therefore, the warning device is used for warning the lapping edges, and correcting the lapping edges in time, so that the risk of fragments is reduced, the working efficiency is improved, and the coating quality is improved.

Specifically, the warning device includes, but is not limited to, a light warning device, a voice warning device, a vibrator, a display, and the like.

Referring to fig. 1 and 3, fig. 3 is a schematic structural diagram of a silicon wafer conveying device according to an embodiment of the present application. In one embodiment, a silicon wafer transport apparatus includes the tabbed platform 10 of any of the embodiments described above.

In the silicon wafer conveying device, the distance S between the guide surface 1221 and the central axis O of the positioning member 12 is gradually increased in the direction from the top end of the guide section 122 to the bottom end of the guide section 122, so that the guide sections 122 of the positioning member 12 guide the silicon wafer 20 in the process of positioning the silicon wafer 20 on the supporting surface, the silicon wafer 20 slides downwards along the guide surface 1221 of the guide section 122, the position of the silicon wafer 20 is gradually corrected by the guide surface 1221 and falls on the supporting surface, and the positioning section 121 and the side edge of the silicon wafer 20 are abutted for positioning, so that the position of the silicon wafer 20 is accurately positioned, the lapping defect of the silicon wafer 20 can be reduced, the fragment rate can be reduced, and the conveying efficiency is improved.

Referring to fig. 1 and 3, in one embodiment, the silicon wafer conveying apparatus further includes: a first transplanting assembly 30, a flipping assembly 40, a second transplanting assembly 50, and a third transplanting assembly 60.

Wherein, the first transplanting assembly 30 comprises a first moving mechanism 31 and a plurality of first absorbing members 32 connected with the first moving mechanism 31. The first suction member 32 includes, but is not limited to, a vacuum chuck for suction holding or releasing the silicon wafer 20. The first moving mechanism 31 is used for driving the first absorbing member 32 to switch between a first loading position and a first unloading position.

Referring to fig. 3 and 6, fig. 6 shows a schematic top view of the flipping assembly 40 in fig. 3. The flipping assembly 40 includes a supporting member 41, a rotating member 42 rotatably coupled to the supporting member 41, and a plurality of second absorbing members 43 coupled to the rotating member 42. The second suction member 43 includes, but is not limited to, a vacuum chuck for suction holding or releasing the silicon wafer 20. When the first absorbent member 32 is moved to the first blanking position, the second absorbent member 43 is positioned directly below the first absorbent member 32 and is adapted to receive the silicon wafer 20 released by the first absorbent member 32. The rotating member 42 is configured to turn over the plurality of second absorbing members 43 thereon.

In addition, the second transplanting assembly 50 includes a second moving mechanism 51. The second moving mechanism 51 is connected to the splicing platform 10, and the second moving mechanism 51 is used for driving the splicing platform 10 to switch between a second feeding position and a second discharging position. When the tab platform 10 is in the second loading position, the tab platform 10 is located directly below the flip assembly 40.

Meanwhile, the third transplanting assembly 60 includes a third moving mechanism 61 and a plurality of third adsorbing members 62 connected to the third moving mechanism 61. The third suction member 62 includes, but is not limited to, a vacuum chuck for suction holding or releasing the silicon wafer 20. The third moving mechanism 61 is used for driving the third adsorbing member 62 to switch between a third loading position and a third unloading position. When the bonding pad platform 10 is located at the second discharging position and the third adsorption element 62 is located at the third loading position, the third adsorption element 62 is located directly above the bonding pad platform 10 and is used for adsorbing and fixing the silicon wafer 20 on the bonding pad platform 10.

In this way, the transport device is capable of transferring the silicon wafer 20 from the first chamber 70 to the second chamber 80 and performing a 180 degree flip action of the silicon wafer 20. Compared with the mode of adopting a basket to drive a plurality of silicon wafers 20 to turn over in the related art, the method has the advantages that the silicon wafers 20 are not required to enter and exit the basket, so that the chip risk of the silicon wafers 20 can be reduced, the abrasion of the silicon wafers 20 can be reduced, the position accuracy of the silicon wafers 20 can be improved, and the processing quality can be improved.

Referring to fig. 1, 3-7, in one embodiment, the transport and transfer of the silicon wafer 20 comprises the steps of:

step S110, the first moving mechanism 31 drives the plurality of first adsorption elements 32 to move to the first loading position, and the plurality of first adsorption elements 32 adsorb and fix the plurality of silicon wafers 20 on the first carrier 71 located inside the first chamber 70 and move to the first unloading position under the driving of the first moving mechanism 31;

referring to fig. 5, specifically, the first transplanting assembly 30 further includes a first mounting plate 33 connected to the first moving mechanism 31, and a plurality of first absorbing members 32 are connected to the first mounting plate 33.

Referring to fig. 3 to 6, in step S120, when the first suction member 32 moves the silicon wafer 20 to the first blanking position, the second suction member 43 is located directly under the first suction member 32 and is used for receiving the silicon wafer 20 released by the first suction member 32; the silicon wafer 20 on the first carrier 71 is arranged in an 18x9 manner, the first absorbing member 32 is arranged in a 3x9 manner, and the second absorbing member 43 is arranged in a 9x9 manner, that is, the first transplanting assembly 30 transfers the 9x9 silicon wafer 20 on the first carrier 71 to the second absorbing member 43 of the overturning assembly 40 in a three-time conveying manner.

Step S130, after the silicon wafer 20 is transferred onto the second adsorption member 43, the second adsorption member 43 adsorbs and fixes the silicon wafer 20, and the rotation member 42 drives the plurality of second adsorption members 43 thereon to turn over, so that the silicon wafer 20 achieves 180 DEG turning over.

In step S140, after the second adsorption element 43 drives the silicon wafer 20 to turn over by 180 °, the second moving mechanism 51 is used to drive the bonding pad platform 10 to move to the second feeding position, the bonding pad platform 10 is located directly under the turning assembly 40, and the second adsorption element 43 breaks vacuum to release the silicon wafer 20, so that the silicon wafer 20, for example, 9x9, is transferred onto the bonding pad platform 10.

In step S150, after the silicon wafer 20 is transferred onto the bonding pad platform 10, the second moving mechanism 51 drives the bonding pad platform 10 to move to the second discharging position, and simultaneously, the third moving mechanism 61 drives the third adsorbing member 62 to move to the third loading position, and the third adsorbing member 62 is located directly above the bonding pad platform 10 and is used for adsorbing and fixing the silicon wafer 20 on the bonding pad platform 10, so that the silicon wafer 20 on the bonding pad platform 10 is transferred onto the third transplanting assembly 60.

Referring to fig. 3 and 7, specifically, the third transplanting assembly 60 further includes a second mounting plate 63 connected to the third moving mechanism 61, and a plurality of third absorbing members 62 are connected to the second mounting plate 63.

In step S160, after the silicon wafer 20 is transferred to the third transplanting assembly 60, the third moving mechanism 61 drives the third absorbing member 62 to move to the third discharging position, and the third absorbing member 62 breaks the vacuum to release the silicon wafer 20, so that the silicon wafer 20, for example, 9×9 is transferred to the second carrier 81 of the second chamber 80.

Referring to fig. 3 and 5, in one embodiment, the flipping assembly 40 further includes a motor 44, a driving wheel 45, a plurality of driven wheels 46, and a transmission element 47. The number of the rotating members 42 is plural, each rotating member 42 is correspondingly connected with each driven wheel 46, the transmission element 47 is respectively connected with the driving wheel 45 and all the driven wheels 46, and the motor 44 is connected with the driving wheel 45. Thus, when the motor 44 works, the plurality of rotating members 42 can be synchronously driven to rotate, and when the plurality of rotating members 42 rotate, all the second absorbing members 43 on each rotating member 42 synchronously rotate, so that the silicon wafers 20 of each column 123 can synchronously turn.

Referring to fig. 1 and 3, in one embodiment, a coating system includes the silicon wafer conveying device of any of the above embodiments.

In the film plating system, the distance S between the guide surface 1221 and the central axis O of the positioning element 12 is gradually increased in the direction from the top end of the guide section 122 to the bottom end of the guide section 122, so that the guide sections 122 of the positioning elements 12 guide the silicon wafer 20 in the process of positioning the silicon wafer 20 on the supporting surface, the silicon wafer 20 slides downwards along the guide surface 1221 of the guide section 122, the position of the silicon wafer 20 is gradually corrected by the guide surface 1221 and falls on the supporting surface, and the positioning section 121 and the side edge of the silicon wafer 20 are abutted for positioning, so that the position of the silicon wafer 20 is accurately positioned, the lapping defect of the silicon wafer 20 can be reduced, the fragment rate can be reduced, and the conveying efficiency can be improved.

It should be noted that, the "positioning section 121" may be a part of the "guiding section 122", that is, the "positioning section 121" and the other part of the "guiding section 122" are integrally manufactured; or may be a separate component from the other parts of the guide section 122, i.e., the positioning section 121 may be manufactured separately and then combined with the other parts of the guide section 122 into a whole.

In one embodiment, the moving direction of the first moving mechanism 31 includes, but is not limited to, two-dimensional movement along a plane parallel to the first mounting plate 33 as shown by a double arrow X1 in fig. 3, or three-dimensional operation in space, which specifically includes, but is not limited to, gantry swing arm, and can be flexibly adjusted and set according to actual needs, which is not limited herein.

In one embodiment, the moving direction of the second moving mechanism 51 includes, but is not limited to, two-dimensional movement along a plane parallel to the supporting surface as shown by a double arrow X2 in fig. 3, or three-dimensional operation in space, which specifically includes, but is not limited to, gantry swing arm, and can be flexibly adjusted and set according to actual needs, which is not limited herein.

In one embodiment, the moving direction of the third moving mechanism 61 includes, but is not limited to, two-dimensional movement along a plane parallel to the second mounting plate 63 as shown by a double arrow X3 in fig. 3, or three-dimensional operation in space, which specifically includes, but is not limited to, gantry swing arm, and can be flexibly adjusted and set according to actual needs, which is not limited herein.

The directions indicated by the arrows X1, X2, and X3 may be the same or different, and specifically, may be flexibly adjusted and set according to actual needs, which is not limited herein.

In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., these terms refer to the orientation or positional relationship based on the drawings, which are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In this application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims (10)

1. A tab platform (10), characterized in that the tab platform (10) comprises:

the supporting piece (11), the supporting piece (11) is provided with a supporting surface for supporting the silicon wafer (20) and a plurality of positioning pieces (12) which are arranged on the supporting surface and are used for being abutted with the silicon wafer (20) for positioning; each positioning piece (12) comprises a positioning section (121) and a guiding section (122) connected with the positioning section (121), the positioning section (121) is connected with the bearing surface, the positioning section (121) is used for being in butt positioning with the side edge of the silicon wafer (20), the guiding section (122) is provided with a guiding surface (1221), and the distance S between the guiding surface (1221) and the central axis O of the positioning piece (12) is gradually increased in the direction from the top end of the guiding section (122) to the bottom end of the guiding section (122).

2. The gusset platform (10) of claim 1, wherein all of the positioning members (12) comprise a plurality of columns (123) spaced apart in sequence along a first direction and a plurality of rows (124) spaced apart in sequence along a second direction; each column (123) comprises a plurality of first positioning elements (1231) which are sequentially arranged at intervals along the second direction, and each row (124) comprises a plurality of second positioning elements (1241) which are sequentially arranged at intervals along the first direction.

3. The tab platform (10) of claim 1, wherein the guide section (122) has a circular, oval or polygonal cross-sectional profile along the central axis O of the retainer (12); and/or the guiding surface (1221) intersects a plane passing through the central axis O to obtain an intersecting line (1222), the intersecting line (1222) comprising one or more of a circular arc line, an elliptical arc line, a parabolic line and a straight line.

4. The splicing platform (10) according to claim 1, wherein the splicing platform (10) further comprises an inductor (13) disposed on the bearing surface; the sensor (13) is used for sensing whether the silicon wafer (20) on the bearing surface is lapped or not.

5. The bonding pad platform (10) according to claim 4, wherein the sensor (13) is provided with a light emitting part (131) and a light receiving part (132) arranged corresponding to the light emitting part (131), and the distance between the light emitting part (131) and the light receiving part (132) and the bearing surface is larger than the thickness of the silicon wafer (20).

6. The tabbed platform (10) of claim 4, characterized in that the tabbed platform (10) further comprises an alarm electrically connected to the sensor (13), the alarm being adapted to perform an alarm action when the sensor (13) senses the presence of a lap of the silicon wafer (20).

7. A silicon wafer transport device, characterized in that it comprises a tabbed platform (10) according to any one of claims 1 to 6.

8. The silicon wafer transport apparatus according to claim 7, further comprising:

the first transplanting assembly (30), the first transplanting assembly (30) comprises a first moving mechanism (31) and a plurality of first absorbing parts (32) connected with the first moving mechanism (31), each first absorbing part (32) is used for absorbing and fixing or loosening a silicon wafer (20), and the first moving mechanism (31) is used for driving the first absorbing part (32) to switch between a first feeding position and a first discharging position;

the turnover assembly (40) comprises a supporting piece (41), a rotating piece (42) rotatably connected with the supporting piece (41) and a plurality of second adsorption pieces (43) connected to the rotating piece (42), wherein the second adsorption pieces (43) are used for adsorbing and fixing or loosening the silicon wafer (20); when the first adsorption element (32) moves to a first blanking position, the second adsorption element (43) is positioned right below the first adsorption element (32) and is used for receiving the silicon wafer (20) loosened by the first adsorption element (32); the rotating piece (42) is used for driving the second absorbing pieces (43) on the rotating piece to turn over;

the second transplanting assembly (50), the second transplanting assembly (50) comprises a second moving mechanism (51), the second moving mechanism (51) is connected with the splicing platform (10), the second moving mechanism (51) is used for driving the splicing platform (10) to switch between a second feeding position and a second discharging position, and when the splicing platform (10) is located at the second feeding position, the splicing platform (10) is located under the overturning assembly (40); and

the third transplanting assembly (60), the third transplanting assembly (60) comprises a third moving mechanism (61) and a plurality of third absorbing parts (62) connected with the third moving mechanism (61), the third absorbing parts (62) are used for absorbing and fixing or loosening silicon wafers (20), the third moving mechanism (61) is used for driving the third absorbing parts (62) to switch between a third feeding position and a third discharging position, and when the splicing platform (10) is located at the second discharging position, the third absorbing parts (62) are located right above the splicing platform (10) and are used for absorbing and fixing the silicon wafers (20) on the splicing platform (10).

9. The silicon wafer transport apparatus of claim 8, wherein the flipping assembly (40) further comprises a motor (44), a drive wheel (45), a plurality of driven wheels (46), and a transmission element (47); the number of the rotating pieces (42) is multiple, each rotating piece (42) is correspondingly connected with each driven wheel (46), the transmission element (47) is respectively connected with the driving wheels (45) and all the driven wheels (46), and the motor (44) is connected with the driving wheels (45).

10. A coating system comprising a silicon wafer transport device according to any one of claims 7 to 9.