CN220253748U - Heat abstractor and laser instrument - Google Patents
Heat abstractor and laser instrument Download PDFInfo
- Publication number
- CN220253748U CN220253748U CN202321821640.XU CN202321821640U CN220253748U CN 220253748 U CN220253748 U CN 220253748U CN 202321821640 U CN202321821640 U CN 202321821640U CN 220253748 U CN220253748 U CN 220253748U
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- plate body
- heat dissipation
- plate
- fin
- radiating
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 91
- 238000005086 pumping Methods 0.000 claims abstract description 9
- 239000000835 fiber Substances 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 5
- 239000004519 grease Substances 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 11
- 230000005611 electricity Effects 0.000 abstract 1
- 239000013307 optical fiber Substances 0.000 description 12
- 238000012545 processing Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Semiconductor Lasers (AREA)
- Lasers (AREA)
Abstract
The application discloses heat abstractor and laser instrument, this device includes first heat dissipation body and second heat dissipation body, and first heat dissipation body includes first plate body and first fin, and first fin is located one side of first plate body, and first fin includes first heat dissipation section and second heat dissipation section, and first plate body that first heat dissipation section corresponds is used for installing the pumping source, is equipped with supporting part on the first plate body that second heat dissipation section corresponds, and supporting part is used for installing the electricity module; the second heat dissipation body is relative with first heat dissipation body setting, and the second heat dissipation body includes second plate body and second fin, and one side that the second plate body deviates from first plate body is equipped with a fine groove of dish, and the second fin sets up in one side that the second plate body is close to first plate body, and the second fin is relative with a fine groove of dish, and the second fin is laminated with the second heat dissipation section, and first heat dissipation section is laminated with the second plate body. The optical module and the electrical module are reasonably arranged, the heat dissipation effect is good, and the reliability of the laser is improved.
Description
Technical Field
The application belongs to the technical field of lasers, and particularly relates to a heat dissipation device and a laser.
Background
The laser has the characteristics of high photoelectric conversion rate, low power consumption, simple structure and the like, and is widely applied to the fields of industrial processing, communication, medical treatment, chemical industry, aviation and the like. The thermal effect is an important index of the stability of the laser system, and if excessive heat accumulation can cause damage to the pumping LD, damage to the active optical fiber, etc., therefore, in the laser system, it is necessary to perform heat dissipation treatment on the key power device, and effective heat dissipation measures are adopted to continuously improve the reliability of the laser.
In the related art, an air cooling mode is generally adopted to dissipate heat of the laser. The air-cooled radiator is provided with an upper substrate, a lower substrate, an upper fin and a lower fin, wherein the upper substrate is used for installing an optical module, the lower substrate is used for installing an electrical module, the upper fin is used for radiating the optical module, the lower fin is used for radiating the electrical module, the heat consumption of the optical module is far higher than that of the electrical module, the optical module is arranged in a concentrated mode, and the radiating effect is poor.
Disclosure of Invention
The embodiment of the application provides a heat abstractor and a laser to solve the problem that the heat dissipation effect is poor because of concentrated setting of the existing optical module.
In a first aspect, an embodiment of the present application provides a heat dissipating device, including:
the first radiating body comprises a first plate body and a first fin, the first fin is arranged on one side of the first plate body, the first fin comprises a first radiating section and a second radiating section, the first plate body corresponding to the first radiating section is used for mounting a pumping source, a supporting part is arranged on the first plate body corresponding to the second radiating section, and the supporting part is used for mounting an electrical module;
the second heat dissipation body, with first heat dissipation body sets up relatively, the second heat dissipation body includes second plate body and second fin, the second plate body deviates from one side of first plate body is equipped with a fine groove of dish, a fine groove of dish is used for coiling optic fibre, the second fin set up in the second plate body is close to one side of first plate body, the second fin with a fine groove of dish is relative, the second fin with the laminating of second heat dissipation section, first heat dissipation section with the laminating of second plate body.
Optionally, the method further comprises:
the side plates are arranged on two sides of the first fin and are positioned between the first plate body and the second plate body, two ends of each side plate are respectively connected with the first plate body and the second plate body, threading holes are formed in the side plates, through holes corresponding to the threading holes are formed in the first plate body and the second plate body, and the threading holes are communicated with the through holes.
Optionally, a holding part is arranged on one side surface of the side plate, which faces away from the first fin.
Optionally, the method further comprises:
the front panel is positioned at one end of the first radiating body and one end of the second radiating body, the front panel is detachably connected with the first plate body and the second plate body, and an air outlet is formed in the front panel;
the rear panel is positioned at the other ends of the first radiating body and the second radiating body, the rear panel is detachably connected with the first plate body and the second plate body, and a plurality of radiating fans are arranged on the rear panel.
Optionally, the front panel and the rear panel are made of a composite material.
Optionally, the support portion includes a plurality of support columns, the support column with first plate body detachable connection, the support column is used for fixed circuit board.
Optionally, the support portion includes a boss, the boss with the connection can be dismantled to the first plate body, the boss is used for fixed seed source.
Optionally, a heat conduction silicone grease layer is arranged between the boss and the first plate body.
Optionally, the fixing frame is arranged on the second plate body and is positioned on one side of the second plate body away from the first plate body, and the fixing frame is detachably connected with the second plate body.
In a second aspect, embodiments of the present application further provide a laser, including: the heat dissipating device of any of the above.
According to the heat dissipation device and the laser, the first heat dissipation body and the second heat dissipation body are arranged, the first fins comprise the first heat dissipation section and the second heat dissipation section, the first heat dissipation section is attached to the second plate body, the second heat dissipation section is attached to the second fins, the first plate body corresponding to the first heat dissipation section is used for installing a pumping source, the first plate body corresponding to the second heat dissipation section is provided with the supporting portion for installing an electrical module, the second heat dissipation body is used for installing an optical fiber with more heat, the structure of the first heat dissipation body and the second heat dissipation body and devices installed on the first heat dissipation body and the second heat dissipation body are reasonably arranged, the heat dissipation requirements of an optical module and an electrical module of the laser are met, the problem that the heat dissipation effect is poor due to the concentrated arrangement of the existing optical module is overcome, the optical module and the electrical module are reasonably arranged, and the heat dissipation effect is good, and the reliability of the laser is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort to a person skilled in the art.
For a more complete understanding of the present application and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts throughout the following description.
Fig. 1 is a first axial side view of a heat dissipating device according to an embodiment of the present application.
Fig. 2 is a second axial side view of the heat dissipating device according to the embodiment of the present application.
Fig. 3 is an exploded view of a heat dissipating device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The embodiment of the application provides a heat abstractor to solve current optical module and concentrate the problem that sets up and lead to the radiating effect poor.
Referring to fig. 1, fig. 2 and fig. 3, fig. 1 is a first axial side view of a heat dissipating device provided in an embodiment of the present application, fig. 2 is a second axial side view of the heat dissipating device provided in an embodiment of the present application, and fig. 3 is an exploded view of the heat dissipating device provided in an embodiment of the present application.
A heat dissipating device includes a first heat dissipating body 100 and a second heat dissipating body 200.
The first heat dissipation body 100 includes a first plate body 110 and a first fin 120, the first plate body 110 is a rectangular plate, the first plate body 110 and the first fin 120 are in an integrated structure, the first fin 120 is arranged on one side of the first plate body 110, the first fin 120 is provided with a first heat dissipation section 121 and a second heat dissipation section 122, the other side surface of the first plate body 110 corresponding to the first heat dissipation section 121 is used for installing a pumping source, the first heat dissipation section 121 is used for dissipating heat of the pumping source, a supporting portion 112 is arranged on the other side surface of the first plate body 110 corresponding to the second heat dissipation section 122, the supporting portion 112 is used for installing an electrical module, and the second heat dissipation section 122 is used for dissipating heat of the electrical module.
The second heat dissipation body 200 includes a second plate body 210 and a second fin 220, the second plate body 210 is a rectangular plate, the second plate body 210 has the same size as the first plate body 110, one side of the second plate body 210 is provided with the second fin 220, the second plate body 210 and the second fin 220 are integrally formed, the first plate body 110 and the second plate body 210 are oppositely arranged, one side of the second plate body 210, which is away from the first plate body 110, is provided with a fiber coiling groove 221, the fiber coiling groove 221 is used for coiling optical fibers, the second fin 220 is arranged on one side, close to the first plate body 110, of the second plate body 210, the second fin 220 is opposite to the fiber coiling groove 221, and the second fin 220 is used for dissipating heat for the optical fibers in the fiber coiling groove 221. The first fin 120 is an L-shaped plate arranged transversely, the second fin 220 is a rectangular plate, the second fin 220 is attached to the second heat dissipation section 122, the first heat dissipation section 121 is attached to the second plate 210, and the sum of the heights of the second fin 220 and the first heat dissipation section 121 is the same as the height of the first heat dissipation section 121.
It can be appreciated that by setting the first heat dissipation body 100 and the second heat dissipation body 200, the first fin 120 includes the first heat dissipation section 121 and the second heat dissipation section 122, the first heat dissipation section 121 is attached to the second plate 210, the second heat dissipation section 122 is attached to the second fin 220, the first plate 110 corresponding to the first heat dissipation section 121 is used for installing the pump source, the first plate 110 corresponding to the second heat dissipation section 122 is provided with the supporting portion 112 for installing the electric module, the second heat dissipation body 200 is used for installing the optical fiber with more heat, the structure of the first heat dissipation body 100 and the second heat dissipation body 200 and the devices installed on the first heat dissipation body 100 and the second heat dissipation body 200 are reasonably set, the heat dissipation requirement of the optical module and the electric module of the laser are met, the problem that the heat dissipation effect is poor due to the concentrated setting of the existing optical module is overcome, the optical module and the electric module are reasonably arranged, the heat dissipation effect is good, and the reliability of the laser is improved.
In some embodiments, referring to fig. 3, the heat dissipation plate further includes a side plate 300, the side plate 300 is a rectangular plate, two side plates 300 are disposed on two sides of the first fin 120, the side plates are located between the first plate 110 and the second plate 210, two ends of the side plate 300 are detachably connected with the first plate 110 and the second plate 210 through bolts, a through threading hole 310 is formed in the side plate 300, the threading hole 310 is located inside the side plate 300 and extends along the height direction of the side plate 300, a via hole 130 corresponding to the threading hole 310 is formed in the first plate 110, a via hole 130 corresponding to the threading hole 310 is formed in the second plate 210, and the threading hole 310 is communicated with the via hole 130.
By providing the threading hole 310 in the side plate 300, and opening the via hole 130 in the first plate 110 and the second plate 210, the threading hole 310 communicates with the via hole 130. The optical fibers or wires on one side of the first plate 110 can pass through the through holes 130 on the first plate 110, enter the threading holes 310, pass out of the through holes 130 on the second plate 210 and are led to the second plate 210, so that the optical connection or the electrical connection between the first plate 110 and the second plate 210 is realized, all the optical fibers or wires pass through the side plates 300, the optical fibers or wires are prevented from being exposed, the appearance is prevented from being influenced, and the optical fibers or wires are protected.
In some embodiments, as shown in fig. 1, a side of the side plate 300 facing away from the first fin 120 is provided with a grip portion 320.
It can be appreciated that the holding portion 320 may be a handle disposed on the side plate 300, or may be a recessed area disposed on the side plate 300, so as to be convenient for a user to hold, and integrally transfer the laser.
In some embodiments, referring to fig. 1 and 2, a front panel 400 and a rear panel 500 are also included.
The front panel 400 is located at one end of the first heat dissipating body 100 and the second heat dissipating body 200, the front panel 400 is detachably connected to the first board 110 and the second board 210, for example, by bolting, and an air outlet 410 is provided on the front panel 400. The rear panel 500 is located at the other ends of the first and second heat dissipating bodies 100 and 200, the rear panel 500 is detachably connected to the first and second plate bodies 110 and 210, and a plurality of heat dissipating fans 510 are disposed on the rear panel 500.
It can be understood that the overall structure of the heat dissipating device is formed by assembling the first heat dissipating body 100 and the second heat dissipating body 200, the two side plates 300, the front panel 400 and the rear panel 500, and the first heat dissipating body 100 and the second heat dissipating body 200 are assembled and fixed by the two side plates 300, the front panel 400 and the rear panel 500, and the first heat dissipating body 100 and the second heat dissipating body 200, the two side plates 300, the front panel 400 and the rear panel 500 are assembled after being prefabricated respectively, so that the processing technology is simple.
In some embodiments, referring to fig. 1 and 3, the front panel 400 and the rear panel 500 are made of a composite material.
The front panel 400 and the rear panel 500 are made of a composite material formed of a PC material and an ABS material, and the overall weight of the laser and the cost of the composite material are reduced compared to those made of a metal material in the related art.
In some embodiments, referring to fig. 1, the support 112 includes a plurality of support columns 1121, the support columns 1121 being detachably connected to the first board body 110, the support columns 1121 being used to fix the circuit board.
It can be appreciated that the support column 1121 is a copper column, an external thread is arranged on the copper column, a threaded hole is formed in the first plate body 110, the copper column is in threaded connection with the first plate body 110, the copper column can be detachably connected with the first plate body 110 through a fastening structure, the support column 1121 and the first heat dissipation body 100 adopt a split type structure, split processing is performed, the processing technology is simple, and the processing cost is reduced.
In some embodiments, referring to fig. 1, the support portion 112 includes a boss 1122, where the boss 1122 is detachably connected to the first plate 110, such as a pin hole formed in the boss 1122, and a pin hole formed in the first plate 110 at a position opposite to the boss 1122, where the boss 1122 is connected to the first plate 110 through a pin shaft, and the boss 1122 is used to fix a seed source. The boss 1122 and the first heat dissipation body 100 adopt a split structure, so that split processing is realized, the processing technology is simple, and the processing cost is reduced.
In some embodiments, a thermally conductive silicone grease layer is disposed between the boss 1122 and the first plate body 110. The heat conduction between the boss 1122 and the first plate body 110 is realized through the heat conduction silicone grease layer, the heat conduction effect of the heat conduction silicone grease layer is good, the heat dissipation effect of the boss 1122 is ensured, and the reliability of the seed source is improved.
In some embodiments, referring to fig. 2, the fixing frames 140 further include a plurality of fixing frames 140, where the fixing frames 140 are disposed on the second plate 210 and located on a side of the second plate 210 facing away from the first plate 110, and the fixing frames 140 are detachably connected with the second plate 210.
The fixing frame 140 comprises a cross plate and a vertical plate which are connected, the cross plate is detachably connected with the second plate body 210 through bolts, the vertical plate is perpendicular to the second plate body 210, the fixing frames 140 are distributed around the fiber coiling grooves 221, the fixing frames 140 are used for fixing wires or optical fibers, the fixing frames 140 and the second heat dissipation body 200 are of split structures, split processing is achieved, the processing technology is simple, and the processing cost is reduced.
The embodiment of the application also provides a laser, which comprises the heat dissipation device of any one of the above.
The heat dissipating device includes a first heat dissipating body 100 and a second heat dissipating body 200.
The first heat dissipation body 100 includes a first plate body 110 and a first fin 120, the first plate body 110 is a rectangular plate, the first plate body 110 and the first fin 120 are in an integrated structure, the first fin 120 is arranged on one side of the first plate body 110, the first fin 120 is provided with a first heat dissipation section 121 and a second heat dissipation section 122, a pumping source 700 is arranged on the other side surface of the first plate body 110 corresponding to the first heat dissipation section 121, the first heat dissipation section 121 dissipates heat for the pumping source 700, a supporting portion 112 is arranged on the other side surface of the first plate body 110 corresponding to the second heat dissipation section 122, the supporting portion 112 is provided with a circuit board 800 of an electrical module, and the second heat dissipation section 122 dissipates heat for the electrical module.
The second heat dissipation body 200 includes a second plate body 210 and a second fin 220, the second plate body 210 is a rectangular plate, the second plate body 210 has the same size as the first plate body 110, one side of the second plate body 210 is provided with the second fin 220, the second plate body 210 and the second fin 220 are integrally formed, one side of the first plate body 110, which is away from the first plate body 110, is provided with a fiber coiling groove 221, optical fibers are coiled in the fiber coiling groove 221, the second fin 220 is arranged on one side, close to the first plate body 110, of the second plate body 210, the second fin 220 is opposite to the fiber coiling groove 221, and the second fin 220 is used for dissipating heat for the optical fibers in the fiber coiling groove 221. The first fin 120 is an L-shaped plate arranged transversely, the second fin 220 is a rectangular plate, the second fin 220 is attached to the second heat dissipation section 122, the first heat dissipation section 121 is attached to the second plate 210, and the sum of the heights of the second fin 220 and the first heat dissipation section 121 is the same as the height of the first heat dissipation section 121.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
In the description of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features.
The foregoing has described in detail the heat dissipation device and the laser provided by the embodiments of the present application, and specific examples have been applied herein to illustrate the principles and embodiments of the present application, where the foregoing examples are provided to assist in understanding the methods and core ideas of the present application; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the ideas of the present application, the contents of the present specification should not be construed as limiting the present application in summary.
Claims (10)
1. A heat sink, comprising:
the first radiating body comprises a first plate body and a first fin, the first fin is arranged on one side of the first plate body, the first fin comprises a first radiating section and a second radiating section, the first plate body corresponding to the first radiating section is used for mounting a pumping source, a supporting part is arranged on the first plate body corresponding to the second radiating section, and the supporting part is used for mounting an electrical module;
the second heat dissipation body, with first heat dissipation body sets up relatively, the second heat dissipation body includes second plate body and second fin, the second plate body deviates from one side of first plate body is equipped with a fine groove of dish, a fine groove of dish is used for coiling optic fibre, the second fin set up in the second plate body is close to one side of first plate body, the second fin with a fine groove of dish is relative, the second fin with the laminating of second heat dissipation section, first heat dissipation section with the laminating of second plate body.
2. The heat sink of claim 1, further comprising:
the side plates are arranged on two sides of the first fin and are positioned between the first plate body and the second plate body, two ends of each side plate are respectively connected with the first plate body and the second plate body, threading holes are formed in the side plates, through holes corresponding to the threading holes are formed in the first plate body and the second plate body, and the threading holes are communicated with the through holes.
3. The heat dissipating device of claim 2, wherein a side of said side plate facing away from said first fin is provided with a grip.
4. The heat sink of claim 1, further comprising:
the front panel is positioned at one end of the first radiating body and one end of the second radiating body, the front panel is detachably connected with the first plate body and the second plate body, and an air outlet is formed in the front panel;
the rear panel is positioned at the other ends of the first radiating body and the second radiating body, the rear panel is detachably connected with the first plate body and the second plate body, and a plurality of radiating fans are arranged on the rear panel.
5. The heat sink of claim 4 wherein the front and rear panels are made of a composite material.
6. The heat sink as recited in claim 1, wherein: the support part comprises a plurality of support columns, the support columns are detachably connected with the first plate body, and the support columns are used for fixing the circuit board.
7. The heat sink as recited in claim 1, wherein: the supporting part comprises a boss, the boss is detachably connected with the first plate body, and the boss is used for fixing a seed source.
8. The heat dissipating device of claim 7, wherein a thermally conductive silicone grease layer is disposed between said boss and said first plate.
9. The heat dissipating device of claim 1, further comprising a plurality of holders disposed on the second plate on a side of the second plate facing away from the first plate, the holders being detachably connected to the second plate.
10. A laser, comprising: the heat dissipating device of any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321821640.XU CN220253748U (en) | 2023-07-11 | 2023-07-11 | Heat abstractor and laser instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321821640.XU CN220253748U (en) | 2023-07-11 | 2023-07-11 | Heat abstractor and laser instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220253748U true CN220253748U (en) | 2023-12-26 |
Family
ID=89226472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321821640.XU Active CN220253748U (en) | 2023-07-11 | 2023-07-11 | Heat abstractor and laser instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220253748U (en) |
-
2023
- 2023-07-11 CN CN202321821640.XU patent/CN220253748U/en active Active
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