CN209993862U - Heat abstractor and fiber laser - Google Patents
Heat abstractor and fiber laser Download PDFInfo
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- CN209993862U CN209993862U CN201921072933.6U CN201921072933U CN209993862U CN 209993862 U CN209993862 U CN 209993862U CN 201921072933 U CN201921072933 U CN 201921072933U CN 209993862 U CN209993862 U CN 209993862U
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Abstract
The utility model relates to the technical field of fiber lasers, and discloses a heat dissipation device and a fiber laser, wherein the heat dissipation device comprises a first substrate, a second substrate, a plurality of first fins and a plurality of second fins, and the first substrate and the second substrate are arranged oppositely; the first fin is arranged on one side surface of the first substrate facing the second substrate, and the other side surface of the first substrate is used for mounting an optical module of the optical fiber laser; the second fin is arranged on one side surface, facing the first substrate, of the second substrate, and the other side surface of the second substrate is used for mounting an electrical module of the optical fiber laser; the heat dissipation area of the first fins is larger than that of the second fins. The heat dissipation device is compact in structure, can effectively reduce the highest temperature of the optical fiber laser system, particularly the highest temperature of each heating element of the optical module, solves the problem that the heat dissipation of the optical side and the electrical side of the optical fiber laser is uneven, and improves the stability and the safety of the optical fiber laser system.
Description
Technical Field
The utility model relates to a fiber laser technical field especially relates to a heat abstractor and fiber laser.
Background
Existing fiber lasers are generally cooled by air or water to dissipate heat. The fiber laser has the characteristics of high photoelectric conversion efficiency, low power consumption, simple structure and the like, and is widely applied to the fields of industrial processing, communication, medical treatment, chemical industry, aviation and the like. The thermal effect is an important index of the stability of the fiber laser system, and if the heat accumulation is too much, the pump LD and the active fiber are damaged, so that in the fiber laser system, it is necessary to perform thermal design research on key power devices, and effective heat dissipation measures are taken to continuously improve the thermal reliability of the fiber laser and prolong the service life of the fiber laser. It is particularly noted that the optics in fiber lasers are sensitive to temperature and are very temperature demanding. Therefore, it is very important to control the temperature of the fiber laser optical module.
At present, the air-cooled fiber laser is widely applied due to the characteristics of small volume, high integration degree and strong environmental adaptability. However, the existing air-cooled fiber laser mainly adopts a box packaging structure, and an air-cooled system is utilized to intensively and integrally dissipate heat inside the box, although the heat dissipation system is simple to process, the heat dissipation effect is poor, and particularly for a high-power pulse fiber laser, the internal system structure is complex, the number of components is large, and the problem of uneven heat dissipation is easily caused.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model provides a heat abstractor and fiber laser for solve the uneven problem of current air-cooled fiber laser heat dissipation, with the stability and the security that improve fiber laser.
The embodiment of the utility model provides a heat dissipation device, including first base plate, second base plate, a plurality of first fins and a plurality of second fins, first base plate and the relative setting of second base plate; the first fin is arranged on one side surface, facing the second substrate, of the first substrate, and the other side surface of the first substrate is used for mounting an optical module of the optical fiber laser; the second fin is arranged on one side surface, facing the first substrate, of the second substrate, and the other side surface of the second substrate is used for mounting an electrical module of the optical fiber laser; the heat dissipation area of the first fin is larger than that of the second fin.
The optical module comprises a pump and an optical fiber, and the height of the part of the first fin corresponding to the pump is larger than that of the part of the first fin corresponding to the optical fiber.
The first fins correspond to the second fins one to one; the shape of the first fin is complementary to that of the second fin, and the first fin and the second fin are matched.
The first fin is an L-shaped fin, the long side of the L-shaped fin is fixedly connected to the first base plate, the short side of the L-shaped fin faces the second base plate, the long side of the L-shaped fin corresponds to the optical fiber, and the short side of the L-shaped fin corresponds to the pump; the second fins are rectangular fins, and the rectangular fins are arranged between the long edges of the L-shaped fins and the second base plate and are opposite to the short edges of the L-shaped fins.
The distance between the short side of the L-shaped fin and the second base plate is 0.1-0.3 mm, the distance between the long side of the L-shaped fin and the rectangular fin is 0.1-0.3 mm, and the distance between the short side of the L-shaped fin and the rectangular fin is 0.2-0.6 mm.
The cooling fan is arranged in the shell, and an air outlet of the cooling fan faces the first fin.
The wind direction of the heat radiation fan is perpendicular to the height direction of the first fin.
The embodiment of the utility model provides a still provide a fiber laser, including above-mentioned heat abstractor, still including install in the optical module of first base plate with install in the electricity module of second base plate.
And the heat conduction layers are coated between the optical module and the first substrate and between the electrical module and the second substrate.
Wherein, the heat conduction layer is a heat conduction silicone layer.
The embodiment of the utility model provides a heat abstractor and fiber laser, wherein heat abstractor is including relative first base plate and the second base plate that sets up, and a plurality of first fins and the second fin of setting between first base plate and second base plate, realize the heat dissipation to the optical module of fiber laser through setting up a plurality of first fins on first base plate, realize the heat dissipation to the electrical module of fiber laser through set up a plurality of second fins on the first base plate, the heat radiating area of first fin is greater than the heat radiating area of second fin simultaneously, therefore under the same air-cooled condition, this heat abstractor is greater than the heat radiating capacity to the electrical module to the heat radiating capacity of optical module, according to the heat distribution "suitable in place" of system, cooled maximize design has been realized. The heat dissipation device is compact in structure, can effectively reduce the highest temperature of the optical fiber laser system, particularly the highest temperature of each heating element of the optical module, solves the problem that the heat dissipation of the optical side and the electrical side of the optical fiber laser is uneven, and improves the stability and the safety of the optical fiber laser system.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is an isometric view of a heat sink in an embodiment of the invention;
FIG. 2 is an isometric view of the heat sink of FIG. 1 in another orientation;
FIG. 3 is a right side view of the heat sink of FIG. 1;
fig. 4 is a rear view of a heat sink in an embodiment of the invention;
fig. 5 is a schematic structural diagram of a heat dissipation device in an embodiment of the present invention;
description of reference numerals:
1: a first substrate; 2: a second substrate; 3: a first fin;
4: a second fin; 5: pumping; 6: an optical fiber;
7: an MOS tube; 8: a heat radiation fan; 9: a package housing;
91: a front panel; 92: a rear panel; 93: a left side plate;
94: a right side plate; 10: a thermally conductive silicone layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the embodiments of the present invention, it should be noted that the terms "first" and "second" are used for clearly indicating the numbering of the product parts and do not represent any substantial difference unless explicitly stated or limited otherwise. The front, the back, the upper, the lower, the left and the right are based on the directions shown in the attached drawings. The specific meaning of the above terms in the embodiments of the present invention can be understood by those skilled in the art according to specific situations.
It is to be understood that, unless otherwise expressly specified or limited, the term "coupled" is used broadly, and may, for example, refer to directly coupled devices or indirectly coupled devices through intervening media. The specific meaning of the above terms in the embodiments of the present invention can be understood in specific cases by those skilled in the art.
Fig. 1 is an isometric view of a heat dissipation device in an embodiment of the present invention, fig. 2 is an isometric view of the heat dissipation device in fig. 1 in another direction, fig. 3 is a right side view of the heat dissipation device in fig. 1, fig. 4 is a rear view of a heat dissipation device in an embodiment of the present invention, as shown in fig. 1 to 4, a heat dissipation device provided in an embodiment of the present invention includes a first substrate 1, a second substrate 2, a plurality of first fins 3, and a plurality of second fins 4, where the first substrate 1 and the second substrate 2 are disposed opposite to each other.
The first fin 3 is provided on one side surface of the first substrate 1 facing the second substrate 2, and the other side surface of the first substrate 1 is used for mounting an optical module of the fiber laser. The second fin 4 is disposed on one side surface of the second substrate 2 facing the first substrate 1, and the other side surface of the second substrate 2 is used for mounting an electrical module of the fiber laser. The heat dissipation area of the first fins 3 is larger than that of the second fins 4.
Specifically, in the present embodiment, the first substrate 1 and the second substrate 2 are parallel to each other, the first substrate 1 is disposed directly above the second substrate 2, the plurality of first fins 3 are disposed on the lower surface of the first substrate 1 at intervals along the length direction of the first substrate 1, and the first fins 3 are perpendicular to the first substrate 1. The plurality of second fins 4 are arranged on the upper surface of the second substrate 2 at intervals along the length direction of the second substrate 2, and the second fins 4 are perpendicular to the second substrate 2. The heat dissipation area of the first fins 3 is larger than that of the second fins 4.
The upper surface of the first substrate 1 is used for mounting optical modules of a fiber laser, such as a pump 5, an optical fiber 6, and the like, and the lower surface of the second substrate 2 is used for mounting electrical modules of the fiber laser, such as a MOS transistor 7 and the like, wherein the MOS transistor 7 is a metal (metal), oxide (oxide), semiconductor (semiconductor) field effect transistor, abbreviated as a MOS transistor. According to the heat distribution of the system, the heat consumption of the optical module is higher than that of the electrical module, so that the area of the first fin 3 on the side of the optical module is increased to be larger than that of the second fin 4 on the side of the electrical module, the heat dissipation of the part with high heat consumption is more, the integral heat dissipation effect of the fiber laser can be balanced, and the problem of uneven heat dissipation is solved.
In addition, the first substrate 1 and the second substrate 2 may also be disposed at a certain angle, and the rest of the components may be adjusted accordingly, which is not described herein again.
The embodiment provides a heat dissipation device, including relative first base plate and the second base plate that sets up, and set up a plurality of first fins and second fin between first base plate and second base plate, realize the heat dissipation to the optical module of fiber laser through setting up a plurality of first fins on first base plate, realize the heat dissipation to the electrical module of fiber laser through set up a plurality of second fins on the second base plate, the heat radiating area of first fin is greater than the heat radiating area of second fin simultaneously, therefore under the same air-cooled condition, this heat dissipation device is greater than the heat radiating capacity to the electrical module to the heat radiating capacity of optical module, according to the heat distribution "fit to the ground" of system, the maximize design of cooling has been realized. The heat dissipation device is compact in structure, can effectively reduce the highest temperature of the optical fiber laser system, particularly the highest temperature of each heating element of the optical module, solves the problem that the heat dissipation of the optical side and the electrical side of the optical fiber laser is uneven, and improves the stability and the safety of the optical fiber laser system.
Further, as shown in fig. 1 to 3, the optical module includes a pump 5 mounted on a front portion of the upper surface of the first substrate 1 and an optical fiber 6 mounted on a rear portion, and a height of a portion of the first fin 3 corresponding to the pump 5 is greater than a height of a portion of the first fin 3 corresponding to the optical fiber. According to the heat distribution of the system, the heat consumption of the pump 5 of the optical module is higher than that of the optical fiber 6, and the higher the height of the fin is, the stronger the heat dissipation capability is, so that the height of the part of the first fin 3 corresponding to the pump 5 is increased, the heat dissipation capacity of the first fin to the pump 5 is larger than that to the optical fiber 6, and the whole heat dissipation effect is further balanced.
Further, as shown in fig. 1 to 3, the first fins 3 correspond to the second fins 4 one by one, that is, the number of the first fins 3 is equal to that of the second fins 4. The shape of the first fin 3 is complementary to the shape of the second fin 4, and the first fin 3 and the second fin 4 are matched. The shape of the first fins 3 in this embodiment in combination with the shape of the second fins 4 occupy just the entire gap between the first base plate 1 and the second base plate 2, maximizing the use of the space available for heat dissipation.
Further, as shown in fig. 1 to 3, the first fin 3 is an inverted L-shaped fin, the long side of the L-shaped fin is fixed to the first base plate 1, and the short side of the L-shaped fin faces the second base plate 2. And the long side of the L-shaped fin corresponds to the optical fiber 6 and the short side of the L-shaped fin corresponds to the pump 5. The second fin 4 is a rectangular fin which is arranged between the long side of the L-shaped fin and the second base plate 2 and is arranged opposite to the short side of the L-shaped fin. The L-shaped fins and the rectangular fins are complementary to form a larger rectangular fin.
In addition, the shape of the first fin 3 and the second fin 4 may also be other shapes, such as a trapezoid, a triangle, a U shape, and the like, which is not limited herein.
Further, as shown in FIG. 5, the L-shaped fins (first fins 3) have a short side thereof spaced from the second base plate 2 by a distance L1Is 0.1mm-0.3mm, and the distance L between the long side of the L-shaped fin (the first fin 3) and the rectangular fin (the second fin 4)2Is 0.1mm-0.3mm, and the distance L between the short side of the L-shaped fin (the first fin 3) and the rectangular fin (the second fin 4)3Is 0.2mm-0.6 mm.
Further, as shown in fig. 1 to 4, a heat dissipation fan 8 is further included, and an air outlet of the heat dissipation fan 8 faces the first fin 3. Furthermore, the wind direction of the heat dissipation fan 8 is perpendicular to the height direction of the first fins 3, that is, the wind outlet of the heat dissipation fan 8 faces the first fins 3. By making the axis of the air outlet of the heat dissipation fan 8 perpendicular to the height direction of the first fins 3, the heat dissipation area is maximally utilized.
In addition, a certain gradient can be formed between the air outlet of the cooling fan 8 and the first fins 3, so that the airflow guidance of the cooling fan 8 is realized, the wind resistance is reduced, and the air inlet volume is increased.
Further, as shown in fig. 1 to 4, the heat dissipating apparatus further includes an encapsulating housing 9, and the encapsulating housing 9 includes a front panel 91, a rear panel 92, a left side panel 93 and a right side panel 94 surrounding the peripheries of the first substrate 1 and the second substrate 2. Specifically, the front panel 91 is used for installing and fixing the heat dissipation fan 8, and the rear panel 92 is provided with an air outlet and an electrical interface. The left side plate 93 and the right side plate 94 are used for fixing the first substrate 1 and the second substrate 2, so that the relative positions of the two are not changed, and the detachable installation can be realized by adopting screw connection.
The embodiment of the utility model provides a still provide a fiber laser, including above-mentioned heat abstractor, still including installing the optics module on first base plate 1 and installing the electricity module on second base plate 2.
Further, a heat conductive layer is coated between the optical module and the first substrate 1, and a heat conductive layer is also coated between the electrical module and the second substrate 2. Further, the heat conducting layer is a heat conducting silicone layer 10.
In a specific embodiment, the first substrate 1 and the second substrate 2 are 346mm long and 5mm thick. The first fins 3 are inverted L-shaped fins. The second fins 4 are 18mm high and 200mm long. A distance L between the short side of the first fin 3 and the second base plate 21Is 0.2mm, and the distance L between the long side of the first fin 3 and the second fin 42Is 0.2mm, and the distance L between the short side of the first fin 3 and the second fin 43The spacing was 0.4 mm. The total heat loss of the upper optical module is 480W, wherein the total heat loss of the pump 5 is 350W and the heat loss of the optical fiber 6 is 130W. The total heat loss of the lower electrical module, i.e., the MOS transistor 7, is 100W. The maximum temperature of the optical module side in operation was measured by experiment to be 48.6 deg.c, the maximum temperature of the electrical side to be 50 deg.c, and the temperature difference of the maximum temperatures of both sides to be 1.4 deg.c. Compared with the existing air-cooled heat dissipation device, the maximum temperature is reduced by 5.2 ℃, and the thermal reliability of the system is improved. And the highest temperature is transferred from the optical module to the electric module, so that the optical module of the optical fiber laser can be effectively ensured to work under a reliable temperature condition, and the safety risk of the system is reduced. The temperature difference of the highest temperature of the two sides is reduced from 7.2 ℃ to 1.4 ℃, and the problem of uneven heat dissipation of the optical side and the electrical side of the fiber laser is effectively solved.
It can be seen from the above embodiment, the utility model provides a heat abstractor and fiber laser, wherein heat abstractor includes relative first base plate and the second base plate that sets up, and a plurality of first fins and the second fin of setting between first base plate and second base plate, realize the heat dissipation to the optical module of fiber laser through setting up a plurality of first fins on first base plate, realize the heat dissipation to the electrical module of fiber laser through set up a plurality of second fins on the first base plate, the heat radiating area of first fin is greater than the heat radiating area of second fin simultaneously, therefore under the same air-cooled condition, this heat abstractor is greater than the heat-sinking capability to the electrical module to the heat radiating capability of optical module, according to the heat distribution "suitable for the local" of system, cooled maximize design has been realized. The heat dissipation device is compact in structure, can effectively reduce the highest temperature of the optical fiber laser system, particularly the highest temperature of each heating element of the optical module, solves the problem that the heat dissipation of the optical side and the electrical side of the optical fiber laser is uneven, and improves the stability and the safety of the optical fiber laser system.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. A heat dissipation device is characterized by comprising a first base plate, a second base plate, a plurality of first fins and a plurality of second fins, wherein the first base plate and the second base plate are oppositely arranged; the first fin is arranged on one side surface, facing the second substrate, of the first substrate, and the other side surface of the first substrate is used for mounting an optical module of the optical fiber laser; the second fin is arranged on one side surface, facing the first substrate, of the second substrate, and the other side surface of the second substrate is used for mounting an electrical module of the optical fiber laser; the heat dissipation area of the first fin is larger than that of the second fin.
2. The heat dissipation device of claim 1, wherein the optical module comprises a pump and an optical fiber, and a height of a portion of the first fin corresponding to the pump is greater than a height of a portion of the first fin corresponding to the optical fiber.
3. The heat dissipating device of claim 2, wherein the first fins correspond one-to-one to the second fins; the shape of the first fin is complementary to that of the second fin, and the first fin and the second fin are matched.
4. The heat dissipation device as claimed in claim 3, wherein the first fin is an L-shaped fin, a long side of the L-shaped fin is fixedly connected to the first substrate, a short side of the L-shaped fin faces the second substrate, the long side of the L-shaped fin corresponds to the optical fiber, and the short side of the L-shaped fin corresponds to the pump; the second fins are rectangular fins, and the rectangular fins are arranged between the long edges of the L-shaped fins and the second base plate and are opposite to the short edges of the L-shaped fins.
5. The heat dissipation device as claimed in claim 4, wherein a distance between a short side of the L-shaped fin and the second base plate is 0.1mm-0.3mm, a distance between a long side of the L-shaped fin and the rectangular fin is 0.1mm-0.3mm, and a distance between a short side of the L-shaped fin and the rectangular fin is 0.2mm-0.6 mm.
6. The heat dissipating device of claim 1, further comprising a heat dissipating fan having an outlet facing the first fin.
7. The heat dissipating device as claimed in claim 6, wherein the wind direction of the heat dissipating fan is perpendicular to the height direction of the first fins.
8. A fiber laser comprising the heat sink of any of claims 1 to 7, further comprising an optical module mounted to the first substrate and an electrical module mounted to the second substrate.
9. The fiber laser of claim 8, wherein a thermally conductive layer is coated between the optical module and the first substrate and between the electrical module and the second substrate.
10. The fiber laser of claim 9, wherein the thermally conductive layer is a thermally conductive silicone layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921072933.6U CN209993862U (en) | 2019-07-10 | 2019-07-10 | Heat abstractor and fiber laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921072933.6U CN209993862U (en) | 2019-07-10 | 2019-07-10 | Heat abstractor and fiber laser |
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| CN209993862U true CN209993862U (en) | 2020-01-24 |
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| CN201921072933.6U Active CN209993862U (en) | 2019-07-10 | 2019-07-10 | Heat abstractor and fiber laser |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022110830A1 (en) * | 2020-11-26 | 2022-06-02 | 浙江热刺激光技术有限公司 | Air-cooled fiber laser |
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2019
- 2019-07-10 CN CN201921072933.6U patent/CN209993862U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022110830A1 (en) * | 2020-11-26 | 2022-06-02 | 浙江热刺激光技术有限公司 | Air-cooled fiber laser |
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