CN220253747U - Heat abstractor and laser instrument - Google Patents
Heat abstractor and laser instrument Download PDFInfo
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- CN220253747U CN220253747U CN202321819989.XU CN202321819989U CN220253747U CN 220253747 U CN220253747 U CN 220253747U CN 202321819989 U CN202321819989 U CN 202321819989U CN 220253747 U CN220253747 U CN 220253747U
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- end plate
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- heat
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 107
- 239000002131 composite material Substances 0.000 claims abstract description 19
- 230000003287 optical effect Effects 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 230000003014 reinforcing effect Effects 0.000 claims description 14
- 239000007769 metal material Substances 0.000 abstract description 9
- 238000002360 preparation method Methods 0.000 abstract description 2
- 239000013307 optical fiber Substances 0.000 description 8
- 238000005086 pumping Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 5
- 238000005728 strengthening Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses heat abstractor and laser instrument, the device include heat dissipation body and frame, and the heat dissipation body is used for installing the optical module and the electrical module of laser instrument, is equipped with the heat dissipation passageway in the heat dissipation body, and the frame adopts combined material preparation to form, and the side of heat dissipation body is located to the frame, and the frame is equipped with air intake and the air outlet of relative arrangement, heat dissipation passageway intercommunication air intake and air outlet. The optical module and the electrical module are installed through the heat dissipation body, the heat dissipation body dissipates heat for the optical module and the electrical module, the frame is made of composite materials, and compared with metal materials, the frame is lighter in weight and low in cost, and the problems that the weight of the heat dissipation device is middle and the cost is high due to the fact that the heat dissipation device is made of metal materials in the prior art are solved.
Description
Technical Field
The application belongs to the technical field of lasers, and particularly relates to a heat dissipation device and a laser.
Background
The laser has the characteristics of high photoelectric conversion rate, low power consumption, simple structure and the like, and is widely applied to the fields of industrial processing, communication, medical treatment, chemical industry, aviation and the like. The thermal effect is an important index of the stability of the laser system, and if excessive heat accumulation can cause damage to the pumping LD, damage to the active optical fiber, etc., therefore, in the laser system, it is necessary to perform heat dissipation treatment on the key power device, and effective heat dissipation measures are adopted to continuously improve the reliability of the laser.
In the related art, an air-cooled radiator is generally adopted to radiate heat for a laser, and as the power of the laser increases, the number of used pumping sources increases, the volume of the laser also increases, and as the radiator shell is prepared from a metal material, the radiator has larger volume, heavy weight and high processing cost.
Disclosure of Invention
The embodiment of the application provides a heat abstractor and a laser to solve current because of the radiator casing adopts metal material preparation to form, lead to radiator weight in, problem with high costs.
In a first aspect, an embodiment of the present application provides a heat dissipating device, including:
the radiating body is used for installing an optical module and an electrical module of the laser, and a radiating channel is arranged in the radiating body;
the frame is made of composite materials, the side edge of the radiating body is arranged on the frame, an air inlet and an air outlet which are oppositely arranged are formed in the frame, and the radiating channel is communicated with the air inlet and the air outlet.
Optionally, the frame includes:
the first end plate is positioned at the front side of the heat dissipation body and detachably connected with the heat dissipation body, and the air outlet is formed in the first end plate;
the second end plate is positioned at the rear side of the heat dissipation body and detachably connected with the heat dissipation body, and the air inlet is formed in the second end plate.
Optionally, the first end plate includes first plate body and second plate body, first plate body is close to one side of heat dissipation body is equipped with first sunk area and first strengthening rib, first sunk area is located air outlet one side, part first strengthening rib is located in the first sunk area, first sunk area with the adaptation of second plate body, the second plate body shutoff first sunk area, the second plate body is located a side in the first sunk area is equipped with the second strengthening rib.
Optionally, the second plate body and the first plate body around the first concave area are buckled and connected through a first buckle piece.
Optionally, the second end plate includes third plate body and fourth plate body, the third plate body is close to one side of heat dissipation body is equipped with two second sunk areas, two the second sunk areas are located the both sides of air intake, be equipped with the third strengthening rib on the third plate body in the second sunk area, the second sunk area with the adaptation of fourth plate body, the fourth plate body shutoff the second sunk area, the fourth plate body is located a side in the second sunk area is equipped with the fourth strengthening rib.
Optionally, the fourth plate body and the third plate body around the second concave area are buckled and connected through a second buckle piece.
Optionally, a conductive film is sprayed on a side surface of the first end plate, which faces the heat dissipation body;
and/or, a conductive film is sprayed on one side surface of the second end plate, which faces the heat dissipation body.
Optionally, a copper nut is embedded in the first end plate, and the first end plate is detachably connected with the heat dissipation body through the copper nut;
and/or, the second end plate is embedded with a copper nut, and the second end plate is detachably connected with the heat dissipation body through the copper nut.
Optionally, the frame is made of a composite material consisting of PC material and ABS material.
In a second aspect, embodiments of the present application further provide a laser, including: the heat dissipating device of any of the above.
According to the heat dissipation device and the laser, the optical module and the electrical module are installed through the heat dissipation body, the heat dissipation body dissipates heat for the optical module and the electrical module, the frame is made of a composite material, compared with a metal material, the weight of the frame is light, the cost is low, and the problems that the weight of the heat dissipation device is middle and the cost is high due to the fact that the heat dissipation body is made of the metal material are solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort to a person skilled in the art.
For a more complete understanding of the present application and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts throughout the following description.
Fig. 1 is a first axial side view of a heat dissipating device according to an embodiment of the present application.
Fig. 2 is a second axial side view of the heat dissipating device according to the embodiment of the present application.
Fig. 3 is a perspective view of a heat dissipating body of the heat dissipating device according to the embodiment of the present application.
Fig. 4 is an exploded view of yet another structure of a heat dissipating device according to an embodiment of the present disclosure.
Fig. 5 is a perspective view of a first end plate of a heat dissipating device according to an embodiment of the present application.
Fig. 6 is an exploded view of a first end plate of a heat dissipating device according to an embodiment of the present disclosure.
Fig. 7 is a further exploded view of a first end plate of a heat sink according to an embodiment of the present disclosure.
Fig. 8 is a perspective view of a second end plate of the heat dissipating device according to the embodiment of the present application.
Fig. 9 is an exploded view of a second end plate of the heat dissipating device according to the embodiment of the present application.
Fig. 10 is a further exploded view of a second end plate of a heat sink provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The embodiment of the application provides a heat abstractor to solve current optical module and concentrate the problem that sets up and lead to the radiating effect poor.
Referring to fig. 1 and 2, fig. 1 is a first axial side view of a heat dissipating device provided in an embodiment of the present application, and fig. 2 is a second axial side view of the heat dissipating device provided in an embodiment of the present application.
The embodiment of the application provides a heat dissipating device, which comprises a heat dissipating body 100 and a frame 200.
Referring to fig. 3, fig. 3 is a perspective view of a heat dissipating body of the heat dissipating device according to the embodiment of the present application.
The heat dissipation body 100 adopts an integral structure, the heat dissipation body 100 is of a rectangular block structure, one side surface of the heat dissipation body 100 is used for installing an optical module of a laser such as a pumping source, the other side surface of the heat dissipation body 100 is used for installing an electrical module of the laser such as a circuit board, a plurality of fins are arranged in the heat dissipation body 100, heat dissipation channels 110 are formed between adjacent fins, and the heat dissipation channels 110 penetrate through two ends of the heat dissipation body 100. The frame 200 is made of a composite material, the frame 200 comprises a first end plate 230 and a second end plate 240, the first end plate 230 and the second end plate 240 are made of a composite material, the first end plate 230 is located on the front side of the heat dissipation body 100, the first end plate 230 is detachably connected with the heat dissipation body 100, an air outlet 220 is formed in the first end plate 230, the second end plate 240 is located on the rear side of the heat dissipation body 100 and detachably connected with the heat dissipation body 100, and an air inlet 210 is formed in the second end plate 240. The holding part 112 is arranged on the side edge of the heat dissipation body 100, the holding part 112 is a concave area, the operation of a user handle is facilitated, the penetrating threading holes 111 are formed in the positions, close to the side edge, of the heat dissipation body 100, the threading holes 111 are communicated with the upper side surface and the lower side surface of the heat dissipation body 100, all optical fibers or wires can penetrate through devices on the two sides of the heat dissipation body 100 from the threading holes 111, the optical fibers or wires are prevented from being exposed, the attractiveness is influenced, and the optical fibers or wires are protected.
It can be appreciated that the first end plate 230 and the second end plate 240 of the frame 200 are made of composite materials, compared with the frame 200 made of metal materials by injection molding, the frame 200 has a short mold development period and a simple manufacturing process, the cost of the frame 200 is reduced by about 50% compared with that of the metal materials, the processing cost of the laser is reduced, and under the same specification, the weight of the frame 200 is 20% -30% lighter than that of the metal materials, thereby being beneficial to the development of the laser to high power and large volume.
Referring to fig. 4, fig. 4 is an exploded view of yet another structure of a heat dissipating device according to an embodiment of the present application.
In other embodiments, the heat dissipation body 100 adopts a split structure, the heat dissipation body 100 includes a first heat dissipation element 120 and a second heat dissipation element 130, the first heat dissipation element 120 includes a first panel 121 and a first fin 122 that are integrally formed, the first panel 121 is used for mounting a pumping source and an electrical module of a laser, the second heat dissipation element 130 includes a second panel 131 and a second fin 132 that are integrally formed, the second panel 131 is used for mounting an optical fiber of the laser, and the second fin 132 is partially bonded and butted with the first fin 122. The frame 200 is made of a composite material, the frame 200 comprises a first end plate 230, a second end plate 240 and two side plates 260, the frame 200 is arranged on the periphery of the heat dissipation body 100 in a surrounding mode, the side plates 260 are located between the first face plate 121 and the second face plate 131, the side plates 260 are detachably connected with the first face plate 121 and the second face plate 131, the first end plate 230 is located on the front side of the heat dissipation body 100, the first end plate 230 is detachably connected with the heat dissipation body 100, an air outlet 220 is formed in the first end plate 230, the second end plate 240 is located on the rear side of the heat dissipation body 100 and detachably connected with the heat dissipation body 100, and an air inlet 210 is formed in the second end plate 240.
The first fin 122 is an L-shaped plate arranged transversely, the second fin 132 is a rectangular plate, the first fin 122 is provided with a first heat dissipation section and a second heat dissipation section, the other side face of the first panel 121 corresponding to the first heat dissipation section is used for installing a pumping source, the first heat dissipation section is used for dissipating heat of the pumping source, the other side face of the first panel 121 corresponding to the second heat dissipation section is used for installing an electrical module, and the second heat dissipation section is used for dissipating heat of the electrical module. The second fin 132 is attached to the second heat dissipation section, the first heat dissipation section is attached to the second panel 131, and the sum of the heights of the second fin 132 and the first heat dissipation section is the same as the height of the first heat dissipation section, so that the heat dissipation requirements of the optical module and the electrical module of the laser are met.
Referring to fig. 5, 6 and 7, fig. 5 is a perspective view of a first end plate of a heat dissipating device provided in an embodiment of the present application, fig. 6 is an exploded view of the first end plate of the heat dissipating device provided in an embodiment of the present application, and fig. 7 is a further exploded view of the first end plate of the heat dissipating device provided in an embodiment of the present application.
In some embodiments, the first end plate 230 includes a first plate 231 and a second plate 232 made of composite materials, a first concave area 233 and a first reinforcing rib 234 are disposed on a side, close to the heat dissipation body 100, of the first plate 231, the first concave area 233 is located on the upper side of the air outlet 220, the air outlet 220 is a rectangular opening, a part of the first reinforcing rib 234 is located in the first concave area 233, the first concave area 233 is adapted to the second plate 232, the first concave area 233 and the second plate 232 are rectangular, the second plate 232 seals the first concave area 233, a second reinforcing rib 235 is disposed on a side, close to the first concave area 233, of the second plate 232, and a side, away from the second reinforcing rib 235, is a plane, and is attached to the front end of the heat dissipation body 100.
It can be appreciated that the first end plate 230 is formed by combining a first plate body 231 and a second plate body 232 made of composite materials, and the first plate body 231 and the second plate body 232 are both provided with reinforcing rib structures, so that the structural strength of the first end plate 230 is ensured to meet the requirements.
In the above embodiment, as shown in fig. 5 and 6, the second plate 232 is fastened to the first plate 231 around the first recess 233 by the first fastening member 236.
It can be appreciated that the first fastening member 236 includes a plurality of clamping grooves 2361 disposed on the second plate 232 and a plurality of protrusions 2362 disposed on the first plate 231, the clamping grooves 2361 are disposed at intervals along the circumference of the first recess 233, the clamping grooves 2361 are communicated with the first recess 233, the protrusions 2362 are disposed at intervals along the circumference of the first plate 231, the protrusions 2362 are aligned with the clamping grooves 2361, and when the first plate 231 is assembled with the second plate 232, the protrusions 2362 are disposed in the clamping grooves 2361, so that the first plate 231 and the second plate 232 are facilitated.
Referring to fig. 8, 9 and 10, fig. 8 is a perspective view of a second end plate of the heat dissipating device provided in the embodiment of the present application, fig. 9 is an exploded view of the second end plate of the heat dissipating device provided in the embodiment of the present application, and fig. 10 is a further exploded view of the second end plate of the heat dissipating device provided in the embodiment of the present application.
In some embodiments, the second end plate 240 includes a third plate 241 and a fourth plate 242 made of composite materials, two second concave regions 243 are disposed on one side of the third plate 241 near the heat dissipation body 100, the second concave regions 243 are rectangular grooves, the two second concave regions 243 are located on the upper and lower sides of the air inlet 210, third reinforcing ribs 244 are disposed on the third plate 241 in the second concave regions 243, the second concave regions 243 are adapted to the fourth plate 242, the fourth plate 242 is a rectangular plate, the fourth plate 242 seals the second concave regions 243, a side of the fourth plate 242 located in the second concave regions 243 is provided with fourth reinforcing ribs 245, a side of the fourth plate 242 facing away from the fourth reinforcing ribs 245 is a plane, and the fourth plate 242 is attached to the heat dissipation body 100.
It can be appreciated that the second end plate 240 is formed by combining a third plate body 241 and a fourth plate body 242 made of composite materials, and the third plate body 241 and the fourth plate body 242 are both provided with reinforcing rib structures, so that the structural strength of the second end plate 240 is ensured to meet the requirements.
In some embodiments, referring to fig. 8 and 9, the fourth plate 242 is fastened to the third plate 241 around the second recess 243 by a second fastening device 246.
In this embodiment, the second fastening piece 246 has the same structure as the first fastening piece 236, so that the third plate 241 and the fourth plate 242 are convenient to assemble, and the processing technology of the second end plate 240 is simple.
In some embodiments, a side of the first end plate 230 facing the heat dissipating body 100 is sprayed with a conductive film; and/or, a side of the second end plate 240 facing the heat dissipation body 100 is sprayed with a conductive film.
By forming a shielding layer by coating conductive films on the sides of the first and second end plates 230 and 240, the influence of the electrical signal can be shielded.
In some embodiments, referring to fig. 6, a copper nut 250 is embedded in the first end plate 230, a plurality of copper nuts 250 are disposed at edges of the first plate body 231 of the first end plate 230 near the upper side and the lower side, the copper nuts 250 on the first end plate 230 correspond to screw holes on the heat dissipation body 100, pins penetrate through the copper nuts 250 to be connected with the heat dissipation body 100, the first end plate 230 is detachably connected with the heat dissipation body 100 through the copper nuts 250, the heat dissipation device has a simple processing technology, the copper nuts 250 have high structural strength, and the reliability of the heat dissipation device is guaranteed.
In some embodiments, referring to fig. 8, a copper nut 250 is embedded in the second end plate 240, a plurality of copper nuts 250 are provided at edges of the second end plate 240 near the upper side or the lower side, the copper nuts 250 of the second end plate 240 correspond to screw holes on the heat dissipation body 100, pins penetrate through the copper nuts 250 to be connected with the heat dissipation body 100, the second end plate 240 is detachably connected with the heat dissipation body 100 through the copper nuts 250, the heat dissipation device has a simple processing technology, the copper nuts 250 have high structural strength, and the reliability of the heat dissipation device is guaranteed.
In some embodiments, the bezel 200 is made of a composite material composed of PC material and ABS material.
The frame 200 is made of a composite material composed of PC material and ABS material, and the composite material has the advantages of high strength, light weight and low cost, and reduces the weight and cost of the frame 200 while guaranteeing the overall structural strength of the heat sink.
In addition, the heat dissipating device has a fan and a fan mounting cover, and the fan is located at one side of the air inlet 210, and the fan is detachably connected to the second end plate 240, so that the fan is convenient to replace and maintain.
The embodiment of the application also provides a laser, which comprises the heat dissipation device of any one of the embodiments.
The heat dissipation device comprises a heat dissipation body 100 and a frame 200, wherein the heat dissipation body 100 adopts an integrated structure, the heat dissipation body 100 is of a rectangular block structure, one side surface of the heat dissipation body 100 is provided with an optical module of a laser, such as a pumping source, the other side surface of the heat dissipation body 100 is provided with an electrical module, such as a circuit board, the heat dissipation body 100 is internally provided with a plurality of fins, heat dissipation channels 110 are formed between adjacent fins, and the heat dissipation channels 110 penetrate through two ends of the heat dissipation body 100. The frame 200 is made of a composite material, the frame 200 comprises a first end plate 230 and a second end plate 240, the first end plate 230 and the second end plate 240 are made of a composite material, the first end plate 230 is located on the front side of the heat dissipation body 100, the first end plate 230 is detachably connected with the heat dissipation body 100, an air outlet 220 is formed in the first end plate 230, the second end plate 240 is located on the rear side of the heat dissipation body 100 and detachably connected with the heat dissipation body 100, and an air inlet 210 is formed in the second end plate 240. The holding part 112 is arranged on the side edge of the heat dissipation body 100, the holding part 112 is a concave area, the operation of a user handle is facilitated, the penetrating threading holes 111 are formed in the positions, close to the side edge, of the heat dissipation body 100, the threading holes 111 are communicated with the upper side surface and the lower side surface of the heat dissipation body 100, all optical fibers or wires can penetrate through devices on the two sides of the heat dissipation body 100 from the threading holes 111, the optical fibers or wires are prevented from being exposed, the attractiveness is influenced, and the optical fibers or wires are protected.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
In the description of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features.
The foregoing has described in detail the heat dissipation device and the laser provided by the embodiments of the present application, and specific examples have been applied herein to illustrate the principles and embodiments of the present application, where the foregoing examples are provided to assist in understanding the methods and core ideas of the present application; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the ideas of the present application, the contents of the present specification should not be construed as limiting the present application in summary.
Claims (10)
1. A heat sink, comprising:
the radiating body is used for installing an optical module and an electrical module of the laser, and a radiating channel is arranged in the radiating body;
the frame is made of composite materials, the side edge of the radiating body is arranged on the frame, an air inlet and an air outlet which are oppositely arranged are formed in the frame, and the radiating channel is communicated with the air inlet and the air outlet.
2. The heat sink of claim 1, wherein the rim comprises:
the first end plate is positioned at the front side of the heat dissipation body and detachably connected with the heat dissipation body, and the air outlet is formed in the first end plate;
the second end plate is positioned at the rear side of the heat dissipation body and detachably connected with the heat dissipation body, and the air inlet is formed in the second end plate.
3. The heat dissipating device of claim 2, wherein the first end plate comprises a first plate body and a second plate body, a first concave area and a first reinforcing rib are arranged on one side of the first plate body, which is close to the heat dissipating body, the first concave area is positioned on one side of the air outlet, a part of the first reinforcing rib is positioned in the first concave area, the first concave area is matched with the second plate body, the second plate body seals the first concave area, and a second reinforcing rib is arranged on one side of the second plate body, which is positioned in the first concave area.
4. The heat dissipating device of claim 3, wherein the second plate is snap-fit with the first plate around the first recessed area by a first snap-fit.
5. The heat dissipating device according to claim 2, wherein the second end plate comprises a third plate body and a fourth plate body, two second concave areas are arranged on one side, close to the heat dissipating body, of the third plate body, the two second concave areas are located on two sides of the air inlet, third reinforcing ribs are arranged on the third plate body in the second concave areas, the second concave areas are matched with the fourth plate body, the fourth plate body seals the second concave areas, and fourth reinforcing ribs are arranged on one side, located in the second concave areas, of the fourth plate body.
6. The heat dissipating device of claim 5, wherein the fourth plate is snap-fit with the third plate around the second recessed area by a second snap-fit.
7. The heat dissipating device of claim 2, wherein a side of said first end plate facing said heat dissipating body is sprayed with a conductive film;
and/or, a conductive film is sprayed on one side surface of the second end plate, which faces the heat dissipation body.
8. The heat dissipating device of claim 2, wherein said first end plate is embedded with a copper nut, said first end plate being detachably connected to said heat dissipating body by said copper nut;
and/or, the second end plate is embedded with a copper nut, and the second end plate is detachably connected with the heat dissipation body through the copper nut.
9. The heat dissipating device of claim 1, wherein said bezel is made of a composite material comprising a PC material and an ABS material.
10. A laser, comprising: the heat dissipating device of any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321819989.XU CN220253747U (en) | 2023-07-11 | 2023-07-11 | Heat abstractor and laser instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321819989.XU CN220253747U (en) | 2023-07-11 | 2023-07-11 | Heat abstractor and laser instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220253747U true CN220253747U (en) | 2023-12-26 |
Family
ID=89232983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321819989.XU Active CN220253747U (en) | 2023-07-11 | 2023-07-11 | Heat abstractor and laser instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220253747U (en) |
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2023
- 2023-07-11 CN CN202321819989.XU patent/CN220253747U/en active Active
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