CN213152680U - Water-cooling heat dissipation structure and motor controller - Google Patents
Water-cooling heat dissipation structure and motor controller Download PDFInfo
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- CN213152680U CN213152680U CN202021787156.6U CN202021787156U CN213152680U CN 213152680 U CN213152680 U CN 213152680U CN 202021787156 U CN202021787156 U CN 202021787156U CN 213152680 U CN213152680 U CN 213152680U
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application provides a water-cooling heat radiation structure and a motor controller, and belongs to the technical field of heat radiation. The water-cooling heat dissipation structure comprises a water-cooling bottom plate and a metal substrate, an independent water-cooling flow channel is arranged inside the water-cooling bottom plate, the metal substrate is installed on the water-cooling bottom plate, and the metal substrate is used for arranging power devices. The water-cooling heat dissipation structure dissipates heat of the power device in a water-cooling heat dissipation mode, can efficiently carry away heat emitted by the power device, improves heat dissipation efficiency, and has a good heat dissipation effect.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a water-cooling heat dissipation structure and a motor controller.
Background
At present, when a motor controller is subjected to heat dissipation, a circuit board with a power device is generally attached to a heat dissipation aluminum substrate, and heat on the heat dissipation aluminum substrate is taken away by means of natural cooling or air cooling heat dissipation of an external environment by utilizing the heat dissipation capacity of the heat dissipation aluminum substrate, so that heat dissipation is realized, and the heat dissipation effect of the heat dissipation structure is poor.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a water-cooling heat radiation structure and a motor controller to improve the problem that the heat radiation effect of the existing heat radiation structure for radiating a power device is poor.
In a first aspect, an embodiment of the present application provides a water-cooling heat dissipation structure, including a water-cooling bottom plate and a metal substrate:
an independent water-cooling flow channel is arranged inside the water-cooling bottom plate;
the metal substrate is arranged on the water-cooling bottom plate and used for arranging power devices.
In the technical scheme, the metal substrate is used for arranging the power device, namely the power device is directly arranged on the water-cooling bottom plate, and heat generated by the work of the power device can be directly transferred to the metal substrate; because the metal substrate is arranged on the water-cooling bottom plate, the heat on the metal substrate can be transferred to the water-cooling bottom plate in a heat conduction mode; because the independent water-cooling flow channel is arranged in the water-cooling bottom plate, heat on the water-cooling bottom plate (heat which is emitted by a power device and is transferred to the water-cooling bottom plate in a heat conduction mode) is carried away by flowing water, and the heat exchange efficiency is enhanced. The water-cooling heat dissipation structure dissipates heat of the power device in a water-cooling heat dissipation mode, can efficiently carry away heat emitted by the power device, improves heat dissipation efficiency, and has a good heat dissipation effect.
In addition, the water-cooling heat dissipation structure of the embodiment of the application also has the following additional technical characteristics:
in some embodiments of the present application, the water-cooled heat dissipation structure further includes a thermally conductive adhesive layer;
the heat-conducting bonding layer is located between the metal substrate and the water-cooling bottom plate, and the metal substrate is bonded with the water-cooling bottom plate through the heat-conducting bonding layer.
Among the above-mentioned technical scheme, can bond metal substrate and water-cooling bottom plate together through the heat conduction adhesive linkage to fix metal substrate and water-cooling bottom plate together. The heat-conducting bonding layer has heat-conducting capacity, and heat on the metal substrate can be smoothly transferred to the water-cooling bottom plate.
In some embodiments of the present application, the water-cooled bottom plate includes a plate body and a boss protruding from an upper surface of the plate body;
the heat conduction bonding layer is arranged between the upper surface of the boss and the lower surface of the metal substrate.
Among the above-mentioned technical scheme, be equipped with the boss in the water-cooling bottom plate, the setting of boss is convenient for guarantee the roughness of the bonding face of water-cooling bottom plate and metal substrate (the roughness of the upper surface of water-cooling bottom plate), guarantees the inseparable bonding of metal substrate and water-cooling bottom plate, reinforcing radiating effect.
In some embodiments of the present application, the material of the thermal conductive adhesive layer includes thermal conductive silicone grease.
Among the above-mentioned technical scheme, the material of heat conduction adhesive linkage is heat conduction silicone grease, and it has excellent heat conductivity, strengthens the heat conduction efficiency between metal substrate and the water-cooling bottom plate.
In some embodiments of the present application, the water-cooled heat dissipation structure further includes a connector:
the connecting piece is used for mechanically fixing the metal substrate and the water-cooling bottom plate.
Among the above-mentioned technical scheme, metal substrate passes through connecting piece mechanical fastening with the water-cooling bottom plate, guarantees the fastness after metal substrate is connected with the water-cooling bottom plate.
In some embodiments of the present application, the water-cooled heat dissipation structure further comprises a heat conductive housing;
the heat conduction shell is fixed on the water-cooling bottom plate.
Among the above-mentioned technical scheme, the heat conduction shell is fixed in the water-cooling bottom plate, and the setting of heat conduction shell can increase holistic heat radiating area, reinforcing radiating effect.
In some embodiments of the present application, the heat conducting housing is fixed to the top of the water-cooled base plate, and the metal substrate is located inside the heat conducting housing.
Among the above-mentioned technical scheme, the heat conduction shell is fixed in the top of water-cooling bottom plate, and metal substrate is located the heat conduction shell, and the heat conduction shell can play fine guard action to the power device on the metal substrate.
In some embodiments of the present application, the thermally conductive shell is welded to the water-cooled floor; or
The heat conduction shell and the water-cooling bottom plate are of an integrally formed structure.
Among the above-mentioned technical scheme, heat conduction shell and water-cooling bottom plate both weld or integrated into one piece for the whole that constitutes by heat conduction shell and water-cooling bottom plate has good heat conductivity, reinforcing radiating effect.
In some embodiments of the present application, the water-cooled bottom plate is made of metal.
Among the above-mentioned technical scheme, the water-cooling bottom plate is the metal material for the water-cooling bottom plate has fine heat conduction heat energy, makes the heat on the metal substrate can transmit for the water-cooling bottom plate more high-efficiently.
In a second aspect, an embodiment of the present application provides a motor controller, which includes a power device and the above water-cooling heat dissipation structure, where the power device is disposed on a metal substrate.
Among the above-mentioned technical scheme, the water-cooling heat radiation structure dispels the heat to the power device through the radiating mode of water-cooling in the machine controller, can take away the heat that the power device sent high-efficiently, has improved the radiating efficiency, and the radiating effect is better.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic view of a water-cooling heat dissipation structure according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural view of the water-cooled bottom plate shown in FIG. 1;
fig. 3 is a schematic view of a water-cooling heat dissipation structure according to some embodiments of the present disclosure;
FIG. 4 is a schematic view illustrating a connection between a metal substrate and a water-cooled bottom plate in the water-cooled heat dissipation structure shown in FIG. 3;
fig. 5 is a schematic view of a water-cooling heat dissipation structure according to still other embodiments of the present application;
fig. 6 is a schematic structural diagram of a motor controller according to an embodiment of the present application.
Icon: a water-cooled bottom plate 10; a water-cooled runner 11; a water inlet 12; a water outlet 13; a plate body 14; a boss 15; a first mounting hole 16; a metal substrate 20; a second mounting hole 21; a thermally conductive adhesive layer 30; a thermally conductive housing 40; a connecting member 50; a water-cooling heat dissipation structure 100; a power device 110; a motor controller 200.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present application, it should be noted that the indication of orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship which is usually placed when the product of the application is used, or the orientation or positional relationship which is usually understood by those skilled in the art, or the orientation or positional relationship which is usually placed when the product of the application is used, and is only for the convenience of describing the application and simplifying the description, but does not indicate or imply that the indicated device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the application.
Examples
The embodiment of the application provides a water-cooling heat dissipation structure 100, which dissipates heat to a power device 110 in a water-cooling heat dissipation manner, and can effectively improve heat dissipation efficiency so as to achieve a good heat dissipation effect. The specific structure of the water-cooling heat dissipation structure 100 will be described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic view of a water-cooling heat dissipation structure 100 according to an embodiment of the present disclosure. The water-cooling heat dissipation structure 100 includes a water-cooling bottom plate 10 and a metal substrate 20, wherein an independent water-cooling runner 11 is provided inside the water-cooling bottom plate 10, the metal substrate 20 is mounted on the water-cooling bottom plate 10, and the metal substrate 20 is used for arranging the power device 110.
The metal substrate 20 is used for arranging the power device 110, that is, the power device 110 is directly arranged on the water-cooled base plate 10, and heat generated by the operation of the power device 110 can be directly transferred to the metal substrate 20; because the metal substrate 20 is installed on the water-cooled bottom plate 10, the heat on the metal substrate 20 can be transferred to the water-cooled bottom plate 10 by heat conduction; because the independent water-cooling flow channel 11 is arranged inside the water-cooling bottom plate 10, heat on the water-cooling bottom plate 10 (heat generated by the power device 110 and transferred to the water-cooling bottom plate 10 in a heat conduction mode) is carried away by flowing water, and the heat exchange efficiency is enhanced. The water-cooling heat dissipation structure 100 dissipates heat of the power device 110 in a water-cooling heat dissipation manner, can efficiently carry away heat generated by the power device 110, improves heat dissipation efficiency, and has a good heat dissipation effect.
The water-cooled bottom plate 10 is mainly used for taking away water heat in the water-cooled runner 11 therein to achieve the purpose of heat dissipation. The water-cooled soleplate 10 is a plate-like structure which may be rectangular, circular, etc.
In order to ensure the heat conduction capability of the water-cooled bottom plate 10, the water-cooled bottom plate 10 is made of metal, such as copper, iron, aluminum, etc.
The water-cooling flow channel 11 in the water-cooling bottom plate 10 is independently arranged, and the water-cooling flow channel 11 in the water-cooling bottom plate 10 can be regarded as a pore channel arranged in the water-cooling bottom plate 10, so that the structure can ensure that the water-cooling bottom plate 10 has enough mechanical strength.
Please refer to fig. 2, which is a schematic structural diagram of the water-cooled bottom plate 10 shown in fig. 1. The water-cooling bottom plate 10 is a rectangular plate, the water-cooling flow channel 11 in the water-cooling bottom plate 10 is provided with a water inlet 12 and a water outlet 13, and the water inlet 12 and the water outlet 13 are arranged on the same side of the water-cooling bottom plate 10 so as to be connected with an external water supply device conveniently.
Of course, the water inlet 12 and the water outlet 13 may be disposed on two adjacent sides of the water-cooled bottom plate 10, or disposed on two opposite sides of the water-cooled bottom plate 10.
The water inlet 12 and the water outlet 13 may be used in connection with an external circulating water supply. After the circulating water supply device works, water provided by the circulating water supply device flows into the water cooling runner 11 from the water inlet 12, flows in the water cooling runner 11 and flows out from the water outlet 13, and flows back to the water inlet 12 again after being cooled, so that heat emitted by the power device 110 is continuously taken away.
The water-cooling flow channels 11 are arranged in the water-cooling bottom plate 10 in a bending manner, for example, the water-cooling flow channels 11 are bent into a plurality of U-shaped structures in the water-cooling bottom plate 10, so as to increase the heat dissipation area and improve the heat dissipation capability of the water-cooling bottom plate 10.
The metal substrate 20 is used to arrange the power device 110, and heat emitted from the power device 110 may be transferred to the metal substrate 20 by means of heat conduction. The metal substrate 20 may be an aluminum substrate or a copper substrate. The metal substrate 20 has a plate-like structure, which may be a rectangular plate, a circular plate, or the like.
The metal substrate 20 may be mounted on the water-cooled base plate 10 in various ways as long as heat exchange between the metal substrate 20 and the water-cooled base plate 10 is ensured.
In this embodiment, the metal substrate 20 and the water-cooled base plate 10 are connected by bonding.
Specifically, with continued reference to fig. 1, the water-cooled heat dissipation structure 100 further includes a heat conductive adhesive layer 30, the heat conductive adhesive layer 30 is located between the metal substrate 20 and the water-cooled base plate 10, and the metal substrate 20 and the water-cooled base plate 10 are bonded by the heat conductive adhesive layer 30.
The metal substrate 20 and the water-cooled base plate 10 are fixed together by bonding the metal substrate 20 and the water-cooled base plate 10 together through the heat conductive adhesive layer 30. The heat conducting adhesive layer 30 has a heat conducting capability, and ensures that heat on the metal substrate 20 can be smoothly transferred to the water-cooled base plate 10.
Illustratively, the material of the heat conductive adhesive layer 30 is heat conductive silicone grease, which has excellent heat conductivity and enhances the heat conduction efficiency between the metal substrate 20 and the water-cooled base plate 10.
In other embodiments, the thermal adhesive layer 30 may also be silicone thermal adhesive, epoxy AB adhesive, polyurethane adhesive, or the like.
In this embodiment, the water-cooled bottom plate 10 includes a plate body 14 and a boss 15, the boss 15 is protruded on the upper surface of the plate body 14, and the upper surface of the boss 15 is a flat plane. The heat conductive adhesive layer 30 is provided between the upper surface of the boss 15 and the lower surface of the metal substrate 20.
The upper surface of boss 15 is the upper surface of water-cooling bottom plate 10 promptly, adds man-hour to the upper surface of water-cooling bottom plate 10, only needs to process the upper surface of boss 15, is convenient for guarantee the roughness of the upper surface of water-cooling bottom plate 10, guarantees the inseparable bonding of metal substrate 20 and water-cooling bottom plate 10, reinforcing radiating effect.
The plate body 14 and the boss 15 are of an integrated structure, and the water-cooling runner 11 in the water-cooling bottom plate 10 is positioned in the plate body 14.
Illustratively, the height of the boss 15 is 1mm, i.e., the distance between the upper surface of the boss 15 and the upper surface of the plate body 14 is 1 mm. The boss 15 is located at an intermediate position of the upper surface of the plate body 14.
The boss 15 may be of various shapes, such as circular, square, etc.
In other embodiments, the water-cooled base plate 10 may be a flat plate, which is not formed with the bosses 15, and the metal substrate 20 is adhered to the upper surface of the water-cooled base plate 10 by the heat conductive adhesive layer 30.
Fig. 3 is a schematic view of a water-cooling heat dissipation structure 100 according to some embodiments of the present disclosure. In some embodiments of the present application, the water-cooled heat dissipation structure 100 further includes a heat conductive housing 40, and the heat conductive housing 40 is fixed to the water-cooled base plate 10. The heat conducting shell 40 can increase the whole heat radiating area and enhance the heat radiating effect.
Optionally, the heat-conducting casing 40 is fixed on top of the water-cooled base plate 10, the metal substrate 20 is located in the heat-conducting casing 40, and the heat-conducting casing 40 can protect the power device 110 on the metal substrate 20 well.
The heat conducting casing 40 is a hollow structure with openings at the top and the bottom, i.e. the heat conducting casing 40 is an enclosure structure. The metal substrate 20 is located at the bottom of the heat-conducting shell 40 and seals the bottom opening of the heat-conducting shell 40. The metal substrate 20 is located inside the heat conductive housing 40, and in the case where the power device 110 is disposed on the metal substrate 20, the power device 110 is also located inside the heat conductive housing 40.
The heat conductive housing 40 is also made of metal, such as copper, iron, or aluminum. In this embodiment, the material of the heat conductive housing 40 is the same as that of the water-cooled bottom plate 10.
The heat conduction shell 40 and the water-cooling bottom plate 10 can be connected in a welding mode, and can be of an integrally formed structure, and the heat conduction shell 40 and the water-cooling bottom plate 10 can enable the whole body formed by the heat conduction shell 40 and the water-cooling bottom plate 10 to have good heat conductivity, so that the heat dissipation effect is enhanced.
In other embodiments, the heat conducting shell 40 and the water-cooled base plate 10 may be mechanically connected, for example, the heat conducting shell 40 and the water-cooled base plate 10 are connected by screws.
Specifically, the lower end surface of the heat conductive housing 40 is bonded to the upper surface of the plate body 14 of the water-cooled floor panel 10.
Fig. 4 is a schematic view of the connection between the metal substrate 20 and the water-cooled bottom plate 10 in the water-cooled heat dissipation structure 100 shown in fig. 3. In some embodiments of the present application, in the case that the metal substrate 20 and the water-cooled base plate 10 are bonded together through the heat-conducting adhesive layer 30, the metal substrate 20 and the water-cooled base plate 10 are also mechanically fixed through the connecting member 50, so as to ensure that the heat-dissipating substrate is more firmly bonded to the heat-conducting shell 40.
Illustratively, the connector 50 is a locking pin.
The water-cooled bottom plate 10 is provided with a first mounting hole 16, and the metal substrate 20 is provided with a second mounting hole 21 at a position corresponding to the first mounting hole 16. The locking screws are tightly inserted into the second mounting holes 21 on the metal base plate 20 and the first mounting holes 16 on the water-cooled bottom plate 10, so that the metal base plate 20 and the water-cooled bottom plate 10 are mechanically fixed.
In other embodiments, the connecting member 50 can have other structures, for example, the connecting member 50 is a locking screw, in which case the first mounting hole 16 on the water-cooled base plate 10 is a screw hole for matching with the locking screw.
The water-cooled base plate 10 has a plurality of first mounting holes 16 and a plurality of second mounting holes 21. Because the water-cooling bottom plate 10 is provided with the water-cooling runner 11 therein, the first mounting hole 16 on the water-cooling bottom plate 10 can be flexibly arranged according to the arrangement track of the water-cooling runner 11, so as not to affect the loop of the water-cooling runner 11.
Please refer to fig. 5, which is a schematic diagram of a water-cooling heat dissipation structure 100 according to still other embodiments of the present application. In some embodiments of the present application, the metal substrate 20 may be directly mechanically fixed to the water-cooled base plate 10 by the connecting member 50 without being bonded to the water-cooled base plate 10 by the thermal conductive adhesive layer 30. That is, the lower surface of the metal substrate 20 is directly attached to the upper surface of the water-cooled base plate 10, and the metal substrate 20 and the water-cooled base plate 10 are fixed together by the connecting member 50.
In addition, please refer to fig. 6, which is a schematic structural diagram of a motor controller 200 according to an embodiment of the present disclosure. The motor controller 200 includes the power device 110 and the water-cooling heat dissipation structure 100 in any of the above embodiments, and the power device 110 is disposed on the metal substrate 20.
The water-cooling heat dissipation structure 100 in the motor controller 200 dissipates heat to the power device 110 in a water-cooling heat dissipation manner, so that heat generated by the power device 110 can be efficiently taken away, the heat dissipation efficiency is improved, and the heat dissipation effect is good.
The power devices 110 are welded to the top of the metal substrate 20, and heat generated by the power devices 110 can be efficiently and quickly transferred to the metal substrate 20, so that the heat dissipation effect is enhanced.
Illustratively, the power device 110 is a MOS transistor.
It should be noted that, under the condition that the metal substrate 20 and the water-cooled bottom plate 10 are mechanically fixed by the connector 50, the second mounting holes 21 on the metal substrate 20 may be flexibly arranged according to the arrangement of the power devices 110, so as to avoid affecting the power devices 110.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (9)
1. A water-cooling heat dissipation structure, comprising:
the water-cooling bottom plate is internally provided with an independent water-cooling runner and is made of metal; and
and the metal substrate is arranged on the water-cooling bottom plate and used for arranging power devices.
2. The water-cooled heat dissipation structure according to claim 1, further comprising:
and the heat conduction bonding layer is positioned between the metal substrate and the water-cooling bottom plate, and the metal substrate is bonded with the water-cooling bottom plate through the heat conduction bonding layer.
3. The water-cooled heat dissipation structure according to claim 2, wherein the water-cooled bottom plate includes:
a plate body; and
the boss is convexly arranged on the upper surface of the plate body;
the heat conduction bonding layer is arranged between the upper surface of the boss and the lower surface of the metal substrate.
4. The water-cooled heat dissipation structure of claim 2, wherein the material of the heat-conducting adhesive layer comprises heat-conducting silicone grease.
5. The water-cooled heat dissipation structure according to any one of claims 1 to 4, further comprising:
and the connecting piece is used for mechanically fixing the metal substrate and the water-cooling bottom plate.
6. The water-cooled heat dissipation structure according to claim 1, further comprising:
and the heat conduction shell is fixed on the water-cooling bottom plate.
7. The water-cooled heat dissipation structure of claim 6, wherein the heat conduction housing is fixed on top of the water-cooled bottom plate, and the metal substrate is located in the heat conduction housing.
8. The water-cooled heat dissipation structure of claim 6 or 7, wherein the heat conductive housing is welded to the water-cooled bottom plate; or
The heat conduction shell and the water-cooling bottom plate are of an integrally formed structure.
9. A motor controller, comprising:
a power device; and
the water-cooled heat dissipation structure as recited in any one of claims 1 to 8, wherein the power device is disposed on the metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021787156.6U CN213152680U (en) | 2020-08-24 | 2020-08-24 | Water-cooling heat dissipation structure and motor controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021787156.6U CN213152680U (en) | 2020-08-24 | 2020-08-24 | Water-cooling heat dissipation structure and motor controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213152680U true CN213152680U (en) | 2021-05-07 |
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ID=75739597
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021787156.6U Expired - Fee Related CN213152680U (en) | 2020-08-24 | 2020-08-24 | Water-cooling heat dissipation structure and motor controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213152680U (en) |
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2020
- 2020-08-24 CN CN202021787156.6U patent/CN213152680U/en not_active Expired - Fee Related
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