CN216054667U - Novel heat dissipation of discrete device of semiconductor device - Google Patents
Novel heat dissipation of discrete device of semiconductor device Download PDFInfo
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- CN216054667U CN216054667U CN202122155805.1U CN202122155805U CN216054667U CN 216054667 U CN216054667 U CN 216054667U CN 202122155805 U CN202122155805 U CN 202122155805U CN 216054667 U CN216054667 U CN 216054667U
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- heat sink
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Abstract
The utility model discloses a novel heat dissipation device of a discrete semiconductor device, which comprises an installation block, wherein one side of the installation block is provided with an installation plate, the upper end and the lower end of the installation plate are respectively provided with a second heat dissipation fin, the upper end of the second heat dissipation fin is fixedly provided with a plurality of heat dissipation fins, the two sides of the installation block are respectively provided with an installation groove, an installation hole is arranged between the installation grooves, one end of the installation block is fixedly provided with a connecting block, the two sides of the connecting block are provided with clamping grooves, and the other end of the installation block is fixedly provided with a plurality of pins. This kind of novel semiconductor discrete device's heat abstractor, simple structure is reasonable, the modern design, and easy operation is convenient, can effectively dispel the heat to semiconductor discrete device, and provides convenient when the installation, has higher practical value.
Description
Technical Field
The utility model relates to the technical field of heat dissipation devices, in particular to a novel heat dissipation device of a discrete semiconductor device.
Background
Semiconductor discrete devices, broadly referred to as semiconductor diodes, semiconductor triodes, triodes and semiconductor special devices, electronic products are divided into conductors and insulators, semiconductors are arranged between the conductors and the insulators according to the conductive performance of the electronic products, and semiconductor components are divided into discrete components and integrated components in a packaging form, such as: diodes, transistors, etc.
The existing discrete semiconductor device can generate larger heat when in use, and in order to timely dissipate the heat, a heat dissipation plate is usually arranged at the bottom of a mounting block, so that the heat is dissipated, but because the heat dissipation area of the existing discrete semiconductor device heat dissipation plate is smaller, the overall heat dissipation performance of the discrete semiconductor device is lower, and the heat dissipation is only limited to the dissipation of the heat at the bottom of the discrete semiconductor device, so that the improvement is made, and the novel heat dissipation device of the discrete semiconductor device is provided.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems, the utility model provides the following technical scheme:
the utility model discloses a novel heat dissipation device of a discrete semiconductor device, which comprises an installation block, wherein one side of the installation block is provided with an installation plate, the upper end and the lower end of the installation plate are respectively provided with a second heat dissipation fin, the upper end of the second heat dissipation fin is fixedly provided with a plurality of heat dissipation fins, the two sides of the installation block are respectively provided with an installation groove, an installation hole is formed between the installation grooves, one end of the installation block is fixedly provided with a connecting block, the two sides of the connecting block are provided with clamping grooves, and the other end of the installation block is fixedly provided with a plurality of pins.
As a preferred technical scheme of the utility model, first radiating fins are fixedly arranged inside the upper end and the lower end of the mounting plate, and the first radiating fins are made of copper metal.
As a preferred technical scheme of the utility model, a plurality of threaded holes are symmetrically formed in both sides of the mounting plate, and the mounting plate penetrates through the threaded holes through screws and is fixed on the outer side of the mounting block.
As a preferable technical scheme of the utility model, the upper ends of the first radiating fins are coated with radiating glue, and the radiating glue is heat-conducting silicone grease.
As a preferred technical scheme of the present invention, hooks are fixedly installed on both sides of the heat dissipation fins, hook grooves are formed on both sides of the mounting plate, and the heat dissipation fins are connected with the hook grooves by the hooks in a clamping manner.
As a preferred technical solution of the present invention, the second heat sink and the heat sink fins are made of aluminum alloy.
As a preferred technical scheme of the present invention, an alignment indicator is fixedly installed on one side of the upper end of the installation block, and the alignment indicator is electrically connected to the pin through a wire.
The utility model has the beneficial effects that:
1. according to the novel heat dissipation device for the discrete semiconductor device, the first cooling fins are fixedly arranged inside the upper end and the lower end of the mounting plate, so that the discrete semiconductor device can dissipate heat uniformly, the first cooling fins are made of copper metal, so that a better heat dissipation effect can be achieved, and the mounting plate can be stably fixed outside the mounting block by symmetrically arranging the threaded holes on the two sides of the mounting plate;
2. according to the novel heat dissipation device of the discrete semiconductor device, the upper end of the first heat dissipation sheet is coated with heat dissipation glue, so that the first heat dissipation sheet can dissipate heat better, the heat dissipation glue is heat conduction silicone grease which has excellent heat resistance, electrical insulation, heat conductivity and damping performance, and viscosity is insensitive to temperature, so that heat conduction and heat dissipation can be performed well, the two sides of the heat dissipation fins 3 are fixedly provided with the clamping hooks, and the clamping hooks are conveniently connected with the hook grooves in a clamping manner, so that the mounting is convenient;
3. according to the novel heat dissipation device of the discrete semiconductor device, the second heat dissipation fins and the heat dissipation fins are made of aluminum alloy materials, so that the discrete semiconductor device has certain heat dissipation performance and good hardness, damage is prevented, the alignment indicator lamp is fixedly mounted on one side of the upper end of the mounting block, and when pins are mounted, the pins are not aligned accurately, so that mounting personnel can be indicated, and convenience in mounting is improved; the utility model has simple and reasonable structure, novel design, simple and convenient operation, can effectively radiate the heat of the discrete semiconductor device, provides convenience in installation and has higher practical value.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
fig. 1 is a schematic perspective view of a heat dissipation device of a novel discrete semiconductor device according to the present invention;
fig. 2 is a schematic perspective expanded view of a heat dissipation device of a novel discrete semiconductor device according to the present invention;
fig. 3 is a schematic top view of a heat dissipation device of a novel discrete semiconductor device of the present invention.
In the figure: 1. mounting blocks; 2. mounting a plate; 3. heat dissipation fins; 4. connecting blocks; 5. a pin; 6. a card slot; 7. a threaded hole; 8. a first heat sink; 9. mounting grooves; 10. mounting holes; 11. a hook; 12. a hook groove; 13. a second heat sink; 14. and an alignment indicator light.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example (b): as shown in fig. 1-3, the heat dissipation device for a novel discrete semiconductor device of the present invention comprises an installation block 1, wherein an installation plate 2 is disposed on one side of the installation block 1, second heat dissipation fins 13 are disposed on both upper and lower ends of the installation plate 2, a plurality of heat dissipation fins 3 are fixedly mounted on the upper end of the second heat dissipation fins 13, installation grooves 9 are disposed on both sides of the installation block 1, installation holes 10 are disposed between the installation grooves 9, a connection block 4 is fixedly mounted on one end of the installation block 1, clamping grooves 6 are disposed on both sides of the connection block 4, and a plurality of pins 5 are fixedly mounted on the other end of the installation block 1.
Wherein, the inside equal fixed mounting in both ends has first fin 8 about mounting panel 2, and first fin 8 is the copper metal material, has first fin 8 through the inside equal fixed mounting in both ends about mounting panel 2, and the discrete device heat dissipation of being convenient for is even, is the copper metal material through first fin 8, makes it can reach better radiating effect.
Wherein, a plurality of screw holes 7 have been seted up to 2 equal symmetries in both sides of mounting panel, and mounting panel 2 passes screw hole 7 through the screw and fixes in the 1 outside of installation piece, has seted up a plurality of screw holes 7 through 2 equal symmetries in both sides of mounting panel, and the mounting panel 1 of being convenient for can stabilize fix in the 2 outsides of installation piece.
Wherein, 8 upper ends of first fin all are scribbled the heat dissipation and are glued, and the heat dissipation is glued and is glued for heat conduction silicone grease, all scribbles the heat dissipation through 8 upper ends of first fin and glue, and the heat dissipation that 8 first fins are better of being convenient for is glued through the heat dissipation and is heat conduction silicone grease, and heat conduction silicone grease has good heat resistance, electrical insulation nature, and the heat conductivity, damping nature, viscosity are insensitive to the temperature moreover, can carry out heat conduction heat dissipation well.
Wherein, the both sides of heat radiation fin 3 all fixed mounting have pothook 11, and the mounting panel 2 both sides have all been seted up hook slot 12, and heat radiation fin 3 passes through pothook 11 and is connected with hook slot 12 block, has pothook 11 through the equal fixed mounting in heat radiation fin 3 both sides, is convenient for be connected with hook slot 12 block through pothook 11, easy to assemble.
The second heat dissipation fins 13 and the heat dissipation fins 3 are made of aluminum alloy, and the second heat dissipation fins 13 and the heat dissipation fins 3 are made of aluminum alloy, so that the heat dissipation plate has certain heat dissipation performance and good hardness, and damage is prevented.
Wherein, mounting block 1 upper end one side fixed mounting has counterpoint pilot lamp 14, and counterpoint pilot lamp 14 passes through wire and pin 5 electric connection, has counterpoint pilot lamp 14 through mounting block 1 upper end one side fixed mounting, does not counterpoint the accuracy when pin 5 installs and can instruct the installer, has improved the convenience when installing.
The working principle is as follows: when in use, the mounting plate 2 is firstly arranged at the outer side of the mounting block 1, the mounting plate 2 passes through the threaded holes 7 through screws and is fixed at the outer side of the mounting block 1, a plurality of threaded holes 7 are symmetrically formed at the two sides of the mounting plate 2, the mounting plate 1 can be stably fixed at the outer side of the mounting block 2, the first radiating fins 8 are fixedly arranged inside the upper end and the lower end of the mounting plate 2, the discrete semiconductor device can radiate heat uniformly, the first radiating fins 8 are made of copper metal, the discrete semiconductor device can achieve better radiating effect, radiating glue is coated at the upper ends of the first radiating fins 8, the first radiating fins 8 can radiate heat better, the radiating glue is heat-conducting silicone grease, the heat-conducting silicone grease has excellent heat resistance, electrical insulation property, heat conductivity and damping property, the viscosity is not sensitive to temperature, heat can be conducted well, and the clamping hooks 11 are fixedly arranged at the two sides of the radiating fins 3, be convenient for be connected through pothook 11 and hook groove 12 block, easy to assemble, be the aluminum alloy material through second fin 13 and heat radiation fins 3, when making it have certain thermal diffusivity, also have fine hardness, prevent to damage, have counterpoint pilot lamp 14 through installation piece 1 upper end one side fixed mounting, do not counterpoint when pin 5 installs the accuracy and can instruct the installer.
Finally, it should be noted that: in the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a novel discrete device's of semiconductor heat abstractor, includes installation piece (1), its characterized in that, installation piece (1) one side is equipped with mounting panel (2), both ends all are equipped with second fin (13) about mounting panel (2), second fin (13) upper end fixed mounting has a plurality of heat radiation fins (3), mounting groove (9) have all been seted up to installation piece (1) both sides, mounting hole (10) have been seted up between mounting groove (9), installation piece (1) one end fixed mounting has connecting block (4), draw-in groove (6) have been seted up to connecting block (4) both sides, installation piece (1) other end fixed mounting has a plurality of pins (5).
2. The heat sink for discrete semiconductor devices as claimed in claim 1, wherein the mounting plate (2) has first heat sinks (8) fixedly mounted inside the upper and lower ends thereof, and the first heat sinks (8) are made of copper.
3. The heat sink for discrete semiconductor devices as claimed in claim 1, wherein a plurality of threaded holes (7) are symmetrically formed on both sides of the mounting plate (2), and the mounting plate (2) is fixed outside the mounting block (1) by screws passing through the threaded holes (7).
4. The heat sink for discrete semiconductor devices as claimed in claim 2, wherein the upper end of the first heat sink (8) is coated with a heat dissipation adhesive, and the heat dissipation adhesive is a heat conductive silicone grease.
5. The heat sink for semiconductor discrete devices as claimed in claim 1, wherein hooks (11) are fixedly installed on both sides of the heat sink fins (3), hook grooves (12) are opened on both sides of the mounting plate (2), and the heat sink fins (3) are connected with the hook grooves (12) by the hooks (11).
6. The heat sink for semiconductor discrete devices as claimed in claim 1, wherein the second heat sink (13) and the heat sink fins (3) are made of aluminum alloy.
7. The heat dissipation device of the novel discrete semiconductor device as claimed in claim 1, wherein an alignment indicator lamp (14) is fixedly mounted on one side of the upper end of the mounting block (1), and the alignment indicator lamp (14) is electrically connected with the pin (5) through a wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122155805.1U CN216054667U (en) | 2021-09-08 | 2021-09-08 | Novel heat dissipation of discrete device of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122155805.1U CN216054667U (en) | 2021-09-08 | 2021-09-08 | Novel heat dissipation of discrete device of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216054667U true CN216054667U (en) | 2022-03-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122155805.1U Active CN216054667U (en) | 2021-09-08 | 2021-09-08 | Novel heat dissipation of discrete device of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216054667U (en) |
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2021
- 2021-09-08 CN CN202122155805.1U patent/CN216054667U/en active Active
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