CN220191283U - Radiator and domain controller with same - Google Patents

Abstract

The utility model provides a radiator and a domain controller with the radiator, wherein the radiator of the domain controller comprises a shell, a phase-change medium accommodating cavity is formed in the shell, a joint surface jointed with a chip is further formed in the shell, a radiating piece is arranged on one side, far away from the joint surface, of the radiator, and the phase-change medium accommodating cavity is located between the joint surface and the radiating piece. By the technical scheme provided by the utility model, the problem that the air cooling heat dissipation in the related technology cannot meet the heat dissipation requirement of the chip can be solved.

Description

Radiator and domain controller with same

Technical Field

The utility model relates to the technical field of intelligent automobiles, in particular to a radiator and a domain controller with the same.

Background

With the intelligent propulsion of automobiles, an on-board controller becomes a core control component of the intelligent automobile. The application of the domain controller enables the data information to be transmitted in the functional module through the Ethernet protocol of the central gateway, so that the extremely high information transmission speed is achieved.

In the related art, the domain controller includes a plurality of high-power chips, however, due to the limitation of the whole vehicle structure, a part of domain controllers cannot adopt a water cooling structure to dissipate heat, and only air cooling can be adopted for natural heat dissipation.

However, the heat dissipation requirement of the chip cannot be met by adopting an air cooling heat dissipation mode.

Disclosure of Invention

The utility model provides a radiator and a domain controller with the same, which are used for solving the problem that air cooling heat dissipation in the related art cannot meet the heat dissipation requirement of a chip.

According to one aspect of the utility model, there is provided a radiator of a domain controller, the radiator of the domain controller comprising a housing having a phase change medium accommodating cavity, the housing further having a bonding surface bonded to a chip, a radiator member being provided on a side of the radiator remote from the bonding surface, the phase change medium accommodating cavity being located between the bonding surface and the radiator member.

Further, the shell is provided with a boss which is arranged in a protruding mode, and the end face of the boss forms an attaching face.

Further, the boss is provided with an accommodating groove, and a notch of the accommodating groove is communicated with the phase change medium accommodating cavity.

Further, the cross-sectional dimension of the accommodating groove is gradually reduced in a direction in which the notch of the accommodating groove is directed to the groove bottom thereof.

Further, the casing includes apron and bottom plate, and the outer edge of apron towards one side of bottom plate is provided with annular arch, and the bottom plate is connected with annular arch, and the surperficial of apron, the bellied inside wall of annular and the surperficial common phase change medium of bottom plate hold the chamber, and the radiating part setting is on the apron.

Further, the heat dissipation piece comprises a plurality of heat dissipation fins, the plurality of heat dissipation fins are arranged at intervals along the length direction of the heat sink, and each heat dissipation fin extends along the width direction of the heat sink.

Further, the heat sink of the domain controller further includes: the liquid inlet channel is provided with a first liquid inlet and a second liquid inlet which are communicated, the first liquid inlet is arranged on the outermost radiating fin in the length direction of the radiator, the second liquid inlet is arranged on the shell, and the second liquid inlet is communicated with the phase change medium accommodating cavity; the first blocking piece is used for blocking the first liquid inlet.

Further, the liquid inlet channel comprises a first section and a second section which are communicated, the first liquid inlet is formed in the first section, the second liquid inlet is formed in the second section, the first section penetrates through the heat radiating fins on the outermost side, a second blocking piece is further arranged on the shell, and the second blocking piece is located on one side, away from the first liquid inlet, of the heat radiating fins on the outermost side and used for blocking the first section.

Further, the first blocking piece comprises a blocking screw, and the blocking screw is arranged at the first liquid inlet and is in threaded fit with the first liquid inlet.

According to another aspect of the present utility model, there is provided a domain controller including: the PCB is provided with a chip; and the radiator of the domain controller is provided with the radiator of the domain controller, and the bonding surface of the radiator of the domain controller is bonded with the chip.

According to the technical scheme, the shell of the radiator of the domain controller is provided with the phase-change medium accommodating cavity, the phase-change medium accommodating cavity is filled with the phase-change medium, the bonding surface of the shell is bonded with the chip, when the chip of the PCB works, the heat of the chip is transferred to the phase-change medium through the bonding surface, the phase-change medium absorbs heat and is converted from a liquid phase to a gas phase, then the phase-change medium is contacted with the shell far away from the bonding surface, the heat is transferred to the shell at the side, and meanwhile, the heat is converted from the gas phase to the liquid phase, and then drops to the shell close to the bonding surface. The heat transferred to the housing is heat exchanged with air by the heat sink. And the heat dissipation function of the chip is realized by the reciprocating circulation.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model. In the drawings:

FIG. 1 illustrates an exploded view of a heat sink of a domain controller provided in accordance with an embodiment of the present utility model;

FIG. 2 shows a schematic structural view of the cover plate of FIG. 1;

FIG. 3 shows a schematic structural view of the base plate of FIG. 1;

fig. 4 shows a front view of the base plate of fig. 1.

Wherein the above figures include the following reference numerals:

10. a housing; 11. a bonding surface; 12. a heat sink; 121. a heat radiation fin; 13. a boss; 131. a receiving groove; 14. a cover plate; 141. an annular protrusion; 15. a bottom plate; 16. a second blocking member;

20. and a liquid inlet flow channel.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the utility model, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 to 4, an embodiment of the present utility model provides a radiator of a domain controller, where the radiator of the domain controller includes a housing 10 having a phase-change medium accommodating cavity, the housing 10 further has a bonding surface 11 bonded to a chip, a heat dissipation member 12 is disposed on a side of the radiator away from the bonding surface 11, and the phase-change medium accommodating cavity is located between the bonding surface 11 and the heat dissipation member 12.

According to the technical scheme, the shell 10 of the radiator of the domain controller is provided with the phase-change medium accommodating cavity, the phase-change medium accommodating cavity is filled with the phase-change medium, the joint surface 11 of the shell 10 is jointed with the chip, when the chip of the PCB works, the joint surface 11 is used for transferring heat of the chip to the phase-change medium, the phase-change medium absorbs heat and is converted from a liquid phase to a gas phase, then the phase-change medium contacts with the shell 10 at one side far from the joint surface 11, the heat is transferred to the shell 10 at the side, and meanwhile, the gas phase is converted into the liquid phase, and then the liquid phase is dripped into the shell 10 at one side close to the joint surface 11. The heat transferred to the housing 10 is heat exchanged with the air by the heat sink 12. And the heat dissipation function of the chip is realized by the reciprocating circulation.

In this embodiment, the phase change medium has a gaseous phase that is vaporized by heat absorption and a liquid phase that is liquefied by heat release, and the heat dissipation medium can be switched between the gaseous phase and the liquid phase to transfer the heat of the chip to the heat dissipation element 12.

The heat sink 12 may be provided in various structures, such as a heat dissipation fan.

It should be noted that different phase change media can be set according to the actual temperature of the chip, and the following table is specific:

the phase change medium is selected as an organic working medium, has high heat value and high phase change heat absorption capacity, and has the characteristics of low toxicity, low corrosiveness and the like. In addition, the organic working medium with the corresponding boiling point can be selected according to the chip temperature, and the application is flexible.

In this embodiment, since the maximum ambient temperature during the thermal test of the domain controller is 85 ℃, the critical temperature of the selected organic working medium should be higher than 85 ℃, and the temperature of most chips is limited to 150 ℃, so that the organic working medium should be guaranteed to change phase at about 140 ℃.

As shown in fig. 1 and 4, the housing 10 has a boss 13 provided in a convex manner, and an end surface of the boss 13 forms the fitting surface 11. By adopting the structure, the joint surface 11 arranged by utilizing the protrusion is jointed with the chip, and the processing is convenient.

As shown in fig. 1 and 3, the boss 13 is provided with a receiving groove 131, and a slot of the receiving groove 131 communicates with the phase change medium receiving chamber. With the above structure, on the one hand, the liquid phase change medium can be accommodated by the accommodation groove 131 so as to correspond to the chip. Meanwhile, the housing groove 131 is provided by the boss 13, so that the thickness of the housing 10 can be reduced.

Of course, a flow channel may be provided in the phase change medium accommodating chamber, and the phase change medium of the liquid phase may be converged into the accommodating groove 131 along the flow channel.

As shown in fig. 3, the cross-sectional dimension of the accommodating groove 131 gradually decreases in a direction in which the notch of the accommodating groove 131 is directed toward the groove bottom thereof. With the above structure, the flow resistance of the phase change medium can be reduced to be rapidly flown into the accommodating groove 131.

As shown in fig. 1, the casing 10 includes a cover plate 14 and a bottom plate 15, an annular protrusion 141 is disposed on an outer edge of a side of the cover plate 14 facing the bottom plate 15, the bottom plate 15 is connected with the annular protrusion 141, a phase change medium accommodating cavity is defined by a surface of the cover plate 14, an inner sidewall of the annular protrusion 141 and a surface of the bottom plate 15, and the heat dissipation element 12 is disposed on the cover plate 14. The shell 10 adopting the structure has the advantages of simple structure and convenient processing.

In this embodiment, the cover plate 14 and the base plate 15 are manufactured by a die-casting process. The height of the annular protrusion 141 is about 5mm, the boss 13 is provided on the bottom plate 15, and the wall thickness of the boss 13 is about 3 mm. The cover plate 14 and the bottom plate 15 are joined by brazing.

As shown in fig. 1 and 2, the heat sink 12 includes a plurality of heat radiating fins 121, the plurality of heat radiating fins 121 being disposed at intervals along a length direction of the heat sink, each heat radiating fin 121 extending along a width direction of the heat sink. The heat dissipation element 12 adopting the structure has the advantages of simple structure and convenient arrangement.

In the present embodiment, each of the heat dissipating fins 121 is the same as the width of the cover plate 14, and the outermost heat dissipating fin 121 is flush with the outer edge of the cover plate 14.

As shown in fig. 1 and 2, the radiator of the domain controller further includes a liquid inlet channel 20 and a first blocking member, the liquid inlet channel 20 has a first liquid inlet and a second liquid inlet which are communicated, the first liquid inlet is disposed on the outermost radiating fin 121 in the length direction of the radiator, the second liquid inlet is disposed on the housing 10, and the second liquid inlet is communicated with the phase change medium accommodating cavity; the first blocking piece blocks the first liquid inlet. By adopting the structure, the phase change medium can be filled into the phase change medium accommodating cavity by utilizing the liquid inlet channel 20, and the liquid inlet channel 20 is blocked by utilizing the first blocking piece, so that the device has the advantage of simple structure.

In this embodiment, the second liquid inlet is provided on the cover plate 14.

The liquid inlet flow channel 20 includes a first section and a second section, the first liquid inlet is disposed on the first section, the second liquid inlet is disposed on the second section, the first section penetrates through the outermost heat dissipation fins 121, and the housing 10 is further provided with a second blocking member 16, and the second blocking member 16 is located on one side of the outermost heat dissipation fins 121 away from the first liquid inlet and blocks the first section. Through setting the inlet channel to be the first section and the second section that are linked together, have simple structure, the advantage of being convenient for processing. Plugging the first end with the second plugging member 16 has the advantage of facilitating assembly.

In this embodiment, the second blocking member 16 is a block member.

Specifically, the first blocking piece comprises a blocking screw, and the blocking screw is arranged at the first liquid inlet and is in threaded fit with the first liquid inlet. The plugging screw is used for plugging the first liquid inlet, and has the advantages of being simple in structure and convenient to assemble.

In this embodiment, in order to improve the sealing property, an elastic pad is provided between the blocking screw and the outermost heat radiating fin 121, and a connection nut is provided on the heat radiating fin 121, and the blocking screw is connected with the connection nut.

Yet another embodiment of the present utility model provides a domain controller including: a PCB board and a radiator of the domain controller, wherein a chip is arranged on the PCB board; the bonding surface 11 of the radiator of the domain controller is bonded with the chip, and the radiator of the domain controller is the radiator of the domain controller. When the chip of the PCB works, the heat of the chip is transferred to the phase-change medium by the bonding surface 11, the phase-change medium absorbs heat and is converted from a liquid phase to a gas phase, then the gas phase is contacted with the shell 10 at one side far away from the bonding surface 11, the gas phase is converted into the liquid phase while the heat is transferred to the shell 10 at the side, and then the liquid phase is dripped to the shell 10 at one side close to the bonding surface 11. The heat transferred to the housing 10 is heat exchanged with the air by the heat sink 12. And the heat dissipation function of the chip is realized by the reciprocating circulation.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present utility model. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present utility model unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

In the description of the present utility model, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present utility model; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present utility model.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (9)

1. The radiator of the domain controller is characterized by comprising a shell (10) and a phase change medium accommodating cavity, wherein the shell (10) is further provided with a joint surface (11) jointed with a chip, a radiating piece (12) is arranged on one side of the radiator away from the joint surface (11), and the phase change medium accommodating cavity is positioned between the joint surface (11) and the radiating piece (12); the shell (10) is provided with a boss (13) which is arranged in a protruding mode, and the end face of the boss (13) forms the joint face (11).

2. A radiator of a domain controller according to claim 1, characterized in that the boss (13) is provided with a receiving groove (131), a notch of the receiving groove (131) being in communication with the phase change medium receiving cavity.

3. A domain controller heat sink according to claim 2, characterized in that the cross-sectional dimension of the receiving groove (131) gradually decreases in a direction in which the notch of the receiving groove (131) points to the groove bottom thereof.

4. The heat sink of a domain controller according to claim 1, wherein the housing (10) comprises a cover plate (14) and a bottom plate (15), an annular protrusion (141) is provided at an outer edge of a side of the cover plate (14) facing the bottom plate (15), the bottom plate (15) is connected with the annular protrusion (141), and a surface of the cover plate (14), an inner side wall of the annular protrusion (141), and a surface of the bottom plate (15) jointly enclose the phase change medium accommodating cavity, and the heat sink (12) is provided on the cover plate (14).

5. The heat sink of a domain controller according to any one of claims 1 to 4, wherein the heat sink (12) comprises a plurality of heat radiating fins (121), the plurality of heat radiating fins (121) being arranged at intervals along a length direction of the heat sink, each heat radiating fin (121) extending along a width direction of the heat sink.

6. The domain controller heat sink of claim 5, wherein the domain controller heat sink further comprises:

a liquid inlet flow channel (20), wherein the liquid inlet flow channel (20) is provided with a first liquid inlet and a second liquid inlet which are communicated, the first liquid inlet is arranged on the outermost radiating fin (121) in the length direction of the radiator, the second liquid inlet is arranged on the shell (10), and the second liquid inlet is communicated with the phase change medium accommodating cavity;

the first blocking piece is used for blocking the first liquid inlet.

7. The radiator of a domain controller according to claim 6, wherein the liquid inlet channel (20) comprises a first section and a second section which are communicated, the first liquid inlet is arranged at the first section, the second liquid inlet is arranged at the second section, the first section penetrates through the outermost radiating fin (121), a second blocking piece (16) is further arranged on the shell (10), and the second blocking piece (16) is located at one side, far away from the first liquid inlet, of the radiating fin (121) at the outermost side and is used for blocking the first section.

8. The domain controller heat sink of claim 6, wherein the first blocking member comprises a blocking screw disposed at and in threaded engagement with the first liquid inlet.

9. A domain controller, the domain controller comprising:

the PCB is provided with a chip;

-a heat sink of a domain controller, the attaching surface (11) of the heat sink of the domain controller being attached to the chip, the heat sink of the domain controller being a heat sink of a domain controller according to any one of claims 1 to 8.