CN220172575U - High-power laser coaxial packaging base - Google Patents
High-power laser coaxial packaging base Download PDFInfo
- Publication number
- CN220172575U CN220172575U CN202321750561.4U CN202321750561U CN220172575U CN 220172575 U CN220172575 U CN 220172575U CN 202321750561 U CN202321750561 U CN 202321750561U CN 220172575 U CN220172575 U CN 220172575U
- Authority
- CN
- China
- Prior art keywords
- base
- ring
- power laser
- copper
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052802 copper Inorganic materials 0.000 claims abstract description 44
- 239000010949 copper Substances 0.000 claims abstract description 44
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 23
- 239000000956 alloy Substances 0.000 claims abstract description 23
- 239000011521 glass Substances 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 230000004927 fusion Effects 0.000 claims abstract description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 19
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 4
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000005219 brazing Methods 0.000 abstract description 8
- 230000000712 assembly Effects 0.000 abstract description 3
- 238000000429 assembly Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Landscapes
- Semiconductor Lasers (AREA)
Abstract
The utility model discloses a high-power laser coaxial packaging base, which relates to the field of lasers and comprises a copper base and a boss arranged on the copper base, wherein two mounting holes are formed in the position, away from the boss, of the copper base, one side, corresponding to the mounting holes, of the boss is a chip mounting position, a metal ring is brazed at the top edge of the copper base, the high-power laser coaxial packaging base also comprises two groups of wire assemblies, each wire assembly comprises a lead column and an alloy ring, the alloy rings are sleeved on the outer sides of the lead columns, glass rings are sealed between the alloy rings and the lead columns in a fusion manner, so that a stable airtight wire assembly is formed, and the wire assemblies are sealed in the mounting holes in a non-matching manner through brazing.
Description
Technical Field
The utility model belongs to the field of lasers, and particularly relates to a high-power laser coaxial packaging base.
Background
As high-power semiconductor lasers are increasingly used in the fields of display illumination, medical treatment, sensing, etc., the packaging requirements in the industry are increasing.
At present, the base adopts partial oxygen-free copper (only the bonding position of the chip), and not all the oxygen-free copper.
The coaxial packaging mode has continuous power smaller than 500mw, the brazing process precision of the oxygen-free copper at the chip position and the base is difficult to control, the assembly and process difficulties are high, the heat dissipation capacity is inferior to that of all the oxygen-free copper, and the problems of high heat resistance, small heat dissipation interface and low power exist.
Therefore, we propose a high power laser coaxial package base to solve the above-mentioned problems.
Disclosure of Invention
Aiming at the existing base, part of oxygen-free copper (only the bonding position of a chip) is adopted, not all the oxygen-free copper is adopted, the continuous power of a coaxial packaging mode is less than 500mw, the brazing process precision of the oxygen-free copper at the chip position and the base is difficult to control, the assembly and process difficulties are high, the heat dissipation capacity is inferior to that of all the oxygen-free copper, and the problems of high thermal resistance, small heat dissipation interface and low power exist.
The utility model solves the technical problems by adopting the scheme that: the utility model provides a coaxial encapsulation base of high-power laser, includes the boss that sets up on copper base and the copper base, two mounting holes have been seted up to the position that the boss was kept away from to the copper base, and one side that the boss corresponds the mounting hole is chip mounting department, copper base's top edge brazing has the metal ring.
The lead wire assembly comprises a lead wire column and an alloy ring, wherein the alloy ring is sleeved on the outer side of the lead wire column, and a glass ring is sealed between the alloy ring and the lead wire column in a fusion way, so that the stable airtight lead wire assembly is formed.
The wire assembly is sealed in the mounting hole by soldering mismatch.
As a preferable technical scheme of the utility model, the metal ring is an iron-nickel metal ring, and the alloy ring is an iron-nickel alloy ring.
In a preferred embodiment of the present utility model, the lead post is a lead of 0.5mm or more.
As a preferable technical scheme of the utility model, the lead post is an iron-nickel alloy copper-clad lead.
As a preferred embodiment of the present utility model, the alloy ring has an outer diameter of 0.8 to 2.0. 2.0 mm and a wall thickness of 0.1 to 0.3mm.
As a preferable technical scheme of the utility model, the glass ring is made of glass with expansion coefficient matched with that of the iron-nickel alloy.
As a preferable technical scheme of the utility model, the copper base is integrally formed by punching oxygen-free copper.
Compared with the prior art, the utility model has the beneficial effects that:
1. the utility model realizes the problem of consistency of the mounting position and the integral precision of the chip by using the copper base integrally formed by stamping the oxygen-free copper, and has good body heat dissipation function of the oxygen-free copper, thereby controlling the temperature of the high-power laser and ensuring the high-power laser to work stably.
2. The utility model realizes stable air tightness and conductivity by adopting the matching sealing of the lead post, the alloy ring and the glass ring.
3. The utility model realizes unmatched pressure sealing by welding the lead assembly and the mounting hole through a brazing process, and absorbs most of stress of expansion and contraction through a soft brazing material.
4. According to the utility model, the brazing of the metal ring and the copper base is added, so that the resistance welding process of the copper base and the client iron-nickel alloy pipe cap is realized, and the client process requirements are met.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic top view of the present utility model;
FIG. 3 is an exploded view of the present utility model.
In the figure: 1 copper base, 11 mounting hole, 2 boss, 3 metal ring, 41 lead column, 42 alloy ring, 43 glass ring, 44 solder material.
Detailed Description
The utility model will be further described with reference to the drawings and examples.
Referring to fig. 1-3, the present utility model provides a technical solution for a coaxial packaging base of a high-power laser:
embodiment one:
according to the embodiment shown in fig. 1-3, the high-power laser comprises a copper base 1 and a boss 2 arranged on the copper base 1, wherein two mounting holes 11 are formed in the position, away from the boss 2, of the copper base 1, one side, corresponding to the mounting holes 11, of the boss 2 is a chip mounting part, the problem of consistency of the chip mounting position and the whole precision is achieved by using the copper base 1 formed by integrally punching oxygen-free copper, and a good body heat dissipation function of the oxygen-free copper is achieved, so that the temperature of the high-power laser is controlled, and the high-power laser works stably.
The top edge of the copper base 1 is soldered with a metal ring 3, the metal ring 3 is an iron-nickel metal ring 3, the resistance welding process of the copper base 1 and a customer iron-nickel alloy pipe cap is realized, and the customer process requirements are met.
The lead wire assembly comprises a lead wire column 41 and an alloy ring 42, wherein the alloy ring 42 is an iron-nickel alloy ring 42, the outer diameter of the alloy ring 42 is 0.8-2.0 mm, the wall thickness is 0.1-0.3 mm, the lead wire column 41 is a lead wire with the thickness of more than 0.5mm, the lead wire column 41 can be covered with iron-nickel alloy copper, the alloy ring 42 is sleeved on the outer side of the lead wire column 41, and a glass ring 43 is sealed between the alloy ring 42 and the lead wire column 41 in a fusion manner, so that a stable airtight lead wire assembly is formed;
the wire assembly is sealed in the mounting hole 11 by a solder mismatch.
The manufacturing method of the high-power laser coaxial packaging base comprises the following steps:
s1, prefabricating an alloy ring 42, a glass ring 43, a lead wire column 41 and a copper base 1, wherein the copper base 1 is integrally formed by punching oxygen-free copper;
s2, respectively coarsening and performing weak oxidation pretreatment on the alloy ring 42 and the lead column 41;
s3, sintering at the high temperature of 600-1200 ℃ for 5-25 minutes, and sealing glass between the alloy ring 42 and the lead post 41 in a fusion manner to form a glass ring 43, so as to form a stable airtight wire assembly, wherein the glass ring 43 adopts glass matched with the expansion coefficient of the iron-nickel alloy;
s4, using a soldering material 44, and respectively sealing the two lead assemblies in the two mounting holes 11 of the copper base 1 in a non-matching way through a soldering process, so that the soldering material 44 can absorb a certain difference of thermal expansion;
and S5, brazing the metal ring 3 at the top edge of the copper base 1.
Claims (7)
1. The utility model provides a coaxial encapsulation base of high-power laser, includes the boss that sets up on copper base and the copper base, and two mounting holes have been seted up to the position that the boss was kept away from to the copper base, and one side that the boss corresponds the mounting hole is chip mounting department, its characterized in that: a metal ring is brazed on the top edge of the copper base;
the lead wire assembly comprises a lead wire column and an alloy ring, wherein the alloy ring is sleeved on the outer side of the lead wire column, and a glass ring is sealed between the alloy ring and the lead wire column in a fusion way to form a stable airtight lead wire assembly;
the wire assembly is sealed in the mounting hole by soldering mismatch.
2. The high power laser coaxial package base of claim 1, wherein: the metal ring is an iron-nickel metal ring, and the alloy ring is an iron-nickel alloy ring.
3. The high power laser coaxial package base of claim 1, wherein: the lead post is a lead with the thickness of more than 0.5 mm.
4. The high power laser coaxial package base of claim 1, wherein: the lead post is an iron-nickel alloy copper-clad lead.
5. The high power laser coaxial package base of claim 1 or 2, wherein: the outer diameter of the alloy ring is 0.8 to 2.0 mm, and the wall thickness is 0.1 to 0.3mm.
6. The high power laser coaxial package base of claim 1, wherein: the glass ring adopts glass matched with the expansion coefficient of the iron-nickel alloy.
7. The high power laser coaxial package base of claim 1, wherein: the copper base is integrally formed by punching oxygen-free copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321750561.4U CN220172575U (en) | 2023-07-05 | 2023-07-05 | High-power laser coaxial packaging base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321750561.4U CN220172575U (en) | 2023-07-05 | 2023-07-05 | High-power laser coaxial packaging base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220172575U true CN220172575U (en) | 2023-12-12 |
Family
ID=89066092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321750561.4U Active CN220172575U (en) | 2023-07-05 | 2023-07-05 | High-power laser coaxial packaging base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220172575U (en) |
-
2023
- 2023-07-05 CN CN202321750561.4U patent/CN220172575U/en active Active
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