CN217822744U - Airtight dampproofing radio frequency power tube shell base structure of gold tin sealing cap - Google Patents
Airtight dampproofing radio frequency power tube shell base structure of gold tin sealing cap Download PDFInfo
- Publication number
- CN217822744U CN217822744U CN202221550431.1U CN202221550431U CN217822744U CN 217822744 U CN217822744 U CN 217822744U CN 202221550431 U CN202221550431 U CN 202221550431U CN 217822744 U CN217822744 U CN 217822744U
- Authority
- CN
- China
- Prior art keywords
- power tube
- ceramic
- frequency power
- radio frequency
- sealing cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides an airtight damp-proofing radio frequency power tube shell base structure of gold tin sealing cap comprises flange, conducting strip, transition ring, carrier, pottery frame, lead wire and sealing ring from bottom to top in proper order. The utility model discloses a structural grouping of a plurality of metals and ceramic part satisfies the heat dissipation index requirement and the electric connection relation index requirement of device to realize the full-sealed of cavity. The utility model cuts the arc edge into straight edge at the welding position of the lead wire on the outer contour of the ceramic piece, which can improve the firmness of the lead wire; the inner cavity of the base is of a rectangular structure, so that the micro-assembly efficiency can be improved. The fully-sealed shell can prevent water vapor from entering, and the radio frequency power tube working under the high-temperature and high-humidity condition is guaranteed to avoid silver dendrite migration, so that the reliability is higher.
Description
Technical Field
The utility model relates to a solid-state microwave power tube technical field specifically is an airtight damp-proofing radio frequency power tube shell base structure of gold tin sealing cap.
Background
The bipolar radio frequency power tube is a microwave semiconductor discrete device manufactured based on semiconductor material silicon and VDMOS technology, and is widely applied to the fields of aviation, aerospace, radar, wireless communication, radio and television, geological exploration, nuclear energy detection, meteorological forecast and the like.
The patent "US 6,281,574 B1 High Power Microwave transducer Amplifier" discloses a High-Power Microwave Power tube, and the product structure disclosed in the document is a structure commonly adopted by bipolar radio frequency Power tubes for almost two thirty years.
The outline of the core cavity and the ceramic part of most products in the bipolar radio frequency power tube packaging shell are rectangular, the outline of the ceramic part of one type of shell is circular, and the matched ceramic cap with epoxy glue is also circular.
Representative products are: MRF426 and MRF171A radio frequency power tubes of Macom company, BLF246 radio frequency power tubes of Philips company and the like, and the corresponding packaging shells are respectively of a Case211-07 type and a SOT121 type.
Epoxy glue has limited its application under high temperature and high humidity conditions due to its water permeation and aging problems.
The Italian semiconductor discloses that two 50V radio frequency power tubes SD2931-12MR and SD4933MR50 solve the problem of silver dendrite migration under high temperature, high humidity and bias conditions by adopting a mode of filling gel in a cavity.
The patent '202110962092.1' discloses a bipolar radio frequency power tube shell base and a manufacturing method thereof, and the method adopts a transition ring and small-size carrier combined structure to replace a large-size double-sided metalized beryllium oxide carrier in a traditional base, so that on one hand, the risk of air tightness failure of a welding surface of a ceramic piece and a metal piece is reduced, on the other hand, the use amount of beryllium oxide materials is reduced, and even the beryllium oxide carriers are completely replaced, so that the product is more in line with the environmental protection requirement.
The patent '202110962092.1' solves the problem that the bipolar radio frequency power tube shell with the rectangular outer contour of ceramic is changed from glue sealing to full sealing.
For the outer contour of the ceramic part and the matched ceramic cap which are all round shells, the full sealing and the reliability need to be further optimized.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: to the technical problem, the utility model provides an airtight dampproofing radio frequency power tube housing base structure of gold tin sealing cap, this radio frequency power tube housing base can realize the reliable omniseal of circular outline ceramic member to and solve the lead wire fastness problem.
The technical scheme is as follows:
a gold-tin sealing cap airtight damp-proof radio frequency power tube shell base structure sequentially comprises a flange, a heat conducting fin, a transition ring, a carrier, a ceramic frame, a lead and a sealing ring from bottom to top, wherein the flange and the heat conducting fin are made of copper-based alloy or composite material with high heat conductivity and used for mechanical support and heat dissipation of a radio frequency power tube;
the transition ring is made of a metal material with a thermal expansion coefficient matched with the alumina ceramic, a cavity is formed in the middle of the transition ring, and the carrier is arranged in the cavity of the transition ring;
the outer contour of the ceramic frame is of a circular structure, the ceramic frame is a double-layer aluminum oxide ceramic frame based on a high-temperature co-fired multilayer ceramic process, metallization manufactured on the lower surface of the ceramic frame is used for welding a transition ring, metallization manufactured on the upper surface of the ceramic frame is used for welding a sealing ring, and an inner-buried-layer metallization pattern between the double layers of ceramic is a signal transmission line of a radio-frequency power tube.
Furthermore, a lead connecting cavity for welding a lead is arranged at a position, corresponding to the lead welding, of the upper surface, close to the outline edge, of the ceramic frame, and the outline edge of the lead connecting cavity is a straight edge.
Furthermore, the carrier is made of a ceramic material with metalized double surfaces, and the surface of the carrier is used for mounting a radio frequency power transistor chip.
Further, the lead is of a double-in and double-out structure.
Furthermore, the ceramic frame is provided with an inner cavity in a rectangular structure, and the sealing ring is in a rectangular structure matched with the inner cavity.
Further, the flange P1 and the heat conducting fin P2 are made of tungsten copper or Cu-MoCu-Cu.
Further, the material of the transition ring P3 is any one of iron-nickel alloy, iron-nickel-cobalt alloy or tungsten-copper alloy, and the thickness of the transition ring is 0.25mm to 1mm.
Further, the carrier material is beryllium oxide ceramic or aluminum nitride ceramic.
Further, the lead P6 and the sealing ring P7 are made of iron-nickel alloy or iron-nickel-cobalt alloy.
Furthermore, a circular boss is arranged in the middle of the flange and used for adjusting the height difference from the pins to the bottom surface of the shell, and the diameter of the circular boss is smaller than that of the heat conducting fins.
Has the beneficial effects that:
the utility model relates to an airtight dampproofing radio frequency power tube shell base structure of gold tin sealing cap compares current radio frequency power tube shell base structure and has following advantage:
first, the utility model discloses be circular shape radio frequency power tube shell product to current ceramic member outline, design out inner chamber structure and be the rectangle, the outline is circular shape shell base structure, can realize the compatibility and the normal position of target standard device mounting dimension and replace.
Second, the ceramic frame is the double-deck alumina ceramics frame based on high temperature burns multilayer ceramic technology altogether, and the metallization of ceramic frame lower surface preparation is used for welding the transition ring, and the metallization of ceramic frame upper surface preparation is used for welding the sealing ring and can avoids the mode of the intussuseption gel of prior art cavity to solve silver dendrite migration problem under humid tropical and bias voltage condition.
Thirdly, the inner cavity structure of the ceramic frame is rectangular and is matched with the conventional rectangular ceramic cap, so that the micro-assembly efficiency of the product can be improved.
The fourth, the utility model discloses the straight flange processing is carried out at the lead wire welding department to the pottery frame outline, can avoid the lead wire stress concentration under the condition of buckling, improves the lead wire fastness.
Drawings
FIG. 1 is a schematic view of the assembly of the structure of the base of the RF power tube housing with the gold-tin sealing cap;
FIG. 2 is an explosion view of the base structure of the RF power tube housing with gold-tin sealing cap according to the present invention;
FIG. 3 is a schematic view of the structure of the ceramic frame of the present invention;
wherein, P1 is a flange; p2 is a heat-conducting fin; p3 is a transition ring; p4 is a carrier; p5 is a ceramic frame; p6 is a lead; p7 is a sealing ring.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
Example 1
A gold-tin sealing cap airtight damp-proof radio frequency power tube shell base structure sequentially comprises a flange, a heat conducting fin, a transition ring, a carrier, a ceramic frame, a lead and a sealing ring from bottom to top, wherein the flange and the heat conducting fin are made of copper-based alloy or composite material with high heat conductivity and used for mechanical support and heat dissipation of a radio frequency power tube;
the transition ring is made of a metal material with a thermal expansion coefficient matched with the alumina ceramic, a cavity is formed in the middle of the transition ring, and the carrier is arranged in the cavity of the transition ring;
the outer contour of the ceramic frame is of a circular structure, the ceramic frame is a double-layer aluminum oxide ceramic frame based on a high-temperature co-fired multilayer ceramic process, metallization manufactured on the lower surface of the ceramic frame is used for welding a transition ring, metallization manufactured on the upper surface of the ceramic frame is used for welding a sealing ring, and an inner-buried-layer metallization pattern between double-layer ceramics is a signal transmission line of a radio-frequency power tube.
As a preferable mode of the embodiment 1, the lead has a double-in double-out structure.
As a preferable scheme of the technical solution of the embodiment 1, the ceramic frame has an inner cavity with a rectangular structure, and the sealing ring has a rectangular structure matched with the inner cavity.
As a preferable scheme of the embodiment 1, the flange P1 and the heat conducting sheet P2 are made of tungsten copper or Cu-MoCu-Cu.
As a preferable scheme of the technical scheme of the embodiment 1, the material of the transition ring P3 is any one of iron-nickel alloy, iron-nickel-cobalt alloy or tungsten-copper alloy, and the thickness of the transition ring is 0.25mm to 1mm.
As a preferable scheme of the technical scheme of the embodiment 1, the carrier material is beryllium oxide ceramic or aluminum nitride ceramic.
As a preferable mode of the embodiment 1, the lead P6 and the sealing ring P7 are made of an iron-nickel alloy or an iron-nickel-cobalt alloy.
As a preferable scheme of the technical solution of embodiment 1, the flange has a circular boss at a middle portion thereof, the circular boss is used for adjusting a height difference from the pin to the bottom surface of the housing, and a diameter of the circular boss is smaller than a diameter of the heat-conducting fin.
As a preferable scheme of the technical solution of embodiment 1, the carrier is a ceramic material with metalized double surfaces, and the surface is used for mounting a radio frequency power transistor chip.
Example 2
The difference between the embodiment 2 and the embodiment 1 is that a lead connecting cavity for welding a lead is arranged on the upper surface of the ceramic frame close to the outline edge, corresponding to the position of lead welding, and the outline edge of the lead connecting cavity is a straight edge. The outer contour of the ceramic frame is subjected to straight edge treatment at the lead welding position, so that stress concentration under the lead bending condition can be avoided, and the lead firmness is improved.
The utility model discloses the manufacturing method of the airtight dampproofing radio frequency power tube shell base of gold tin sealing cap, including following step:
step1, preparing a flange P1 and a heat conducting fin P2: the copper-tungsten alloy or Cu-based composite material Cu-MoCu-Cu with a sandwich structure is used as a raw material, the copper-tungsten alloy or Cu-based composite material Cu-MoCu-Cu is prepared by adopting a linear cutting and machining method, and the surface of the copper-tungsten alloy or Cu-based composite material Cu-MoCu-Cu is plated with nickel of 0.5-3 um for standby after being cleaned and annealed;
step2 preparation of transition Ring P3: the nickel-tungsten alloy is prepared by taking tungsten-copper alloy, iron-nickel alloy or iron-nickel-cobalt alloy as raw materials and adopting a linear cutting, machining or etching method, and the surface of the nickel-tungsten alloy is plated with nickel of 0.5-3 um after cleaning and annealing for later use
Step3 preparation of vector P4: purchasing a double-sided metalized beryllium oxide ceramic carrier or purchasing a double-sided metalized aluminum nitride ceramic carrier, wherein the double-sided metalized beryllium oxide ceramic and the double-sided metalized aluminum nitride ceramic are mature products in the market.
Step4, preparation of a ceramic frame P5: preparing a ceramic frame P5 by using aluminum oxide as a main raw material and tungsten as a main metallization material and adopting a co-fired multilayer ceramic (HTCC) process, and performing chemical nickel plating for later use;
step5, preparation of a lead P6: taking iron-nickel alloy as a raw material, preparing a lead P6 by adopting a mechanical stamping or chemical etching method, and cleaning and annealing for later use;
step6 preparation of the sealing ring P7: taking iron-nickel alloy as a raw material, preparing a sealing ring P7 by adopting a mechanical stamping or chemical etching method, and cleaning and annealing for later use;
step7, first Step of rack mounting and brazing: assembling the ceramic frame P5, the lead P6 and the sealing ring P7 together by using a graphite mould, and placing corresponding silver-copper solder at the interface position for connecting parts; putting the assembled graphite die into a high-temperature brazing furnace to be brazed into a whole to obtain a semi-finished lead frame product;
step8, second-Step rack mounting and brazing: assembling a flange P1, a heat conducting fin P2, a transition ring P3, a carrier P4 and a Step7 'semi-finished lead frame' together by using a graphite die, and placing corresponding silver-copper solders at the interface positions between adjacent parts; putting the assembled graphite mould into a high-temperature brazing furnace to be brazed into a whole to obtain a semi-finished product of the shell base;
step9, electroplating: plating a nickel layer and a gold layer on the metal surface by adopting a conventional tube shell electroplating method;
step10, annealing: and annealing the base of the shell electroplated in the previous step in a high-temperature diffusion furnace at 400-450 ℃ under the protection of nitrogen for 5-10 min to obtain the product.
The middle part of the flange P1 in the Step1 is provided with a boss, and the height of the boss is used for adjusting the height difference from the pins to the bottom surface of the shell. The diameter of the boss is smaller than that of the heat conducting fin P2; the thickness of the transition ring P3 in the Step2 is 0.25 mm-1.00 mm; the thickness of the lead P6 in the Step5 is 0.05 mm-0.25 mm; the thickness of the nickel layer in the Step9 is 1.3-11.4 μm, and the thickness of the gold layer is 1.3-5.7 μm.
In the raw ceramic processing stage in the preparation process of the Step5 ceramic frame, the corresponding lead welding position is welded by adopting ultraviolet laser or a mechanical method, and the edge of the circular arc-shaped outer contour is cut into a straight edge.
Obviously, according to the design idea of embodiment 1 and embodiment 2, by changing the geometric dimensions of the components to combine and match, further embodiments can be derived, and all should be within the protection scope claimed by the claims of the present invention.
Claims (10)
1. A gold-tin sealing cap airtight damp-proof radio frequency power tube shell base structure sequentially comprises a flange, a heat conducting fin, a transition ring, a carrier, a ceramic frame, a lead and a sealing ring from bottom to top, wherein the flange and the heat conducting fin are made of copper-based alloy or composite material with high heat conductivity and used for mechanical support and heat dissipation of a radio frequency power tube;
the transition ring is made of a metal material with a thermal expansion coefficient matched with the alumina ceramic, a cavity is formed in the middle of the transition ring, and the carrier is arranged in the cavity of the transition ring;
the method is characterized in that: the outer contour of the ceramic frame is of a circular structure, the ceramic frame is a double-layer aluminum oxide ceramic frame based on a high-temperature co-fired multilayer ceramic process, metallization manufactured on the lower surface of the ceramic frame is used for welding a transition ring, metallization manufactured on the upper surface of the ceramic frame is used for welding a sealing ring, and an inner-buried-layer metallization pattern between double-layer ceramics is a signal transmission line of a radio-frequency power tube.
2. The hermetic, moisture-proof RF power tube housing base structure of claim 1,
and a lead connecting cavity for welding a lead is arranged at the position, corresponding to the lead welding, of the upper surface, close to the outline edge, of the ceramic frame, and the outline edge of the lead connecting cavity is a straight edge.
3. The hermetic, moisture-proof RF power tube housing base structure of claim 1,
the carrier is a ceramic material with two metallized surfaces, and the surface of the carrier is used for mounting a radio frequency power transistor chip.
4. The base structure of the RF power tube housing with airtight and moisture-proof gold-tin sealing cap of claim 1,
the lead is of a double-in and double-out structure.
5. The hermetic moisture-proof radio frequency power tube housing base structure of claim 1, wherein: the ceramic frame is provided with an inner cavity in a rectangular structure, and the sealing ring is in a rectangular structure matched with the inner cavity.
6. The structure of claim 1, wherein the gold-tin sealing cap is configured to seal the rf power tube, and the structure further comprises: the flange P1 and the heat conducting fin P2 are made of tungsten copper or Cu-MoCu-Cu.
7. The structure of claim 1, wherein the gold-tin sealing cap is configured to cover the rf power tube, and the structure comprises: the transition ring P3 is made of any one of iron-nickel alloy, iron-nickel-cobalt alloy or tungsten-copper alloy, and the thickness of the transition ring is 0.25mm-1mm.
8. The structure of claim 1, wherein the gold-tin sealing cap is configured to seal the rf power tube, and the structure further comprises: the carrier material is beryllium oxide ceramic or aluminum nitride ceramic.
9. The structure of claim 1, wherein the gold-tin sealing cap is configured to seal the rf power tube, and the structure further comprises: the lead P6 and the sealing ring P7 are made of iron-nickel alloy or iron-nickel-cobalt alloy.
10. The structure of claim 1, wherein the gold-tin sealing cap is configured to cover the rf power tube, and the structure comprises: the middle part of the flange is provided with a circular boss, the circular boss is used for adjusting the height difference from the pins to the bottom surface of the shell, and the diameter of the circular boss is smaller than that of the heat conducting fins.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221550431.1U CN217822744U (en) | 2022-06-21 | 2022-06-21 | Airtight dampproofing radio frequency power tube shell base structure of gold tin sealing cap |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221550431.1U CN217822744U (en) | 2022-06-21 | 2022-06-21 | Airtight dampproofing radio frequency power tube shell base structure of gold tin sealing cap |
Publications (1)
Publication Number | Publication Date |
---|---|
CN217822744U true CN217822744U (en) | 2022-11-15 |
Family
ID=83993476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202221550431.1U Active CN217822744U (en) | 2022-06-21 | 2022-06-21 | Airtight dampproofing radio frequency power tube shell base structure of gold tin sealing cap |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN217822744U (en) |
-
2022
- 2022-06-21 CN CN202221550431.1U patent/CN217822744U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111599802B (en) | Ceramic package shell and package shell mounting structure | |
EP2927949B1 (en) | Container for housing an electronic component | |
CN111128925B (en) | Packaging structure and packaging method of digital circuit | |
CN112736058A (en) | Lead frame, power module adopting same and manufacturing method | |
CN112289753B (en) | Manufacturing method of wall dam ceramic substrate for ultraviolet LED packaging and product thereof | |
CN217822744U (en) | Airtight dampproofing radio frequency power tube shell base structure of gold tin sealing cap | |
CN113707634A (en) | Sheet type packaging shell | |
CN108172633B (en) | Packaging structure of semiconductor device | |
CN117457597A (en) | Ceramic packaging method and ceramic packaging structure for low-current surge suppressor | |
CN112635406A (en) | Radio frequency power tube shell base suitable for parallel sealing welding process and manufacturing method | |
CN209913232U (en) | Semiconductor laser pumping source packaging structure | |
CN115910954A (en) | Micro-channel radiator-based packaging structure of microwave power device and manufacturing method | |
CN113793840B (en) | Bipolar radio frequency power tube shell base and manufacturing method thereof | |
CN114156729A (en) | Packaging tube shell for high-power semiconductor laser and preparation process thereof | |
CN214672593U (en) | Lead frame and power module adopting same | |
CN212365947U (en) | Ceramic packaging structure for improving poor insulation | |
CN110783276B (en) | 0.4 mm-pitch main lead ceramic small-outline shell and power device | |
CN209913231U (en) | Heat sink-free laser pumping source packaging structure | |
CN113745168A (en) | Metal ceramic shell for TO-252 packaging and preparation method | |
EP1411602A1 (en) | Optical semiconductor module and method of producing the same | |
CN114488431A (en) | Miniaturized high-reliability external modulation light source packaging structure and packaging method | |
EP3041040B1 (en) | Element housing package and mounting structure provided with same | |
CN109936932B (en) | Ceramic, glass and metal ternary packaging tube shell and preparation method | |
KR20220101790A (en) | Wireless communication module and manufacturing method thereof | |
CN113594101A (en) | Metal packaging shell and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |