CN214481576U - Ceramic packaging structure of integral type anaerobic copper base - Google Patents
Ceramic packaging structure of integral type anaerobic copper base Download PDFInfo
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- CN214481576U CN214481576U CN202120784523.5U CN202120784523U CN214481576U CN 214481576 U CN214481576 U CN 214481576U CN 202120784523 U CN202120784523 U CN 202120784523U CN 214481576 U CN214481576 U CN 214481576U
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- Prior art keywords
- ceramic
- shell
- ring
- composite lead
- copper base
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- 239000000919 ceramic Substances 0.000 title claims abstract description 96
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 27
- 239000010949 copper Substances 0.000 title claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 239000012212 insulator Substances 0.000 claims abstract description 28
- 230000007704 transition Effects 0.000 claims abstract description 25
- 238000005245 sintering Methods 0.000 claims abstract description 6
- 239000002131 composite material Substances 0.000 claims description 37
- 238000003466 welding Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000013307 optical fiber Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 abstract description 12
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 12
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 238000013461 design Methods 0.000 abstract description 4
- 230000001568 sexual effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000005219 brazing Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
The utility model discloses a ceramic package structure of integral type anaerobic copper base, the countersunk head shoulder hole has been seted up to the one end symmetry of tube Z casing, the ceramic ring is cylinder cavity structural design and matches with the countersunk head shoulder hole, the ceramic ring is worn to locate by compound lead wire, compound lead wire is established to one side and the cover that the ceramic ring was located to the transition ring, one side of transition ring and with compound lead wire contact department and ceramic ring all be equipped with the AgCu solder with the contact department of countersunk head shoulder hole, be used for sintering into the solder joint and be used for ceramic insulator pin subassembly to braze joint on tube Z casing, compound lead wire's one end extends to in the tube Z casing, be used for being connected with the chip in the tube Z casing. The utility model discloses make the cracked risk of ceramic insulator pin subassembly can not take place in the packaging structure use, guaranteed ceramic insulator pin subassembly's gas tightness requirement, adopt AgCu to braze and make packaging structure's reliability and gas tightness obtain satisfying, the sexual valence relative altitude has improved market competition.
Description
Technical Field
The utility model belongs to the technical field of ceramic insulator, especially, relate to a ceramic package structure of integral type anaerobic copper base.
Background
With the rapid development of the emerging fields of big data, cloud computing, internet +, intelligent manufacturing, smart cities and the like, the rapid growth of the markets of consumer electronic terminals, 5G networks, 100G OTN upgrading, electric automobiles, industrial control and the like is promoted, the prospects of electronic ceramic packaging products such as consumer electronic products, optical communication devices, power electronic power devices, power lasers and the like matched with the electronic ceramic packaging products are continuously good, with the wide application of power electronic devices, heat dissipation is the problem which needs to be solved firstly, the packaging shell serving as the electronic device needs to have excellent heat conduction performance, pure copper is undoubtedly the best choice in terms of heat conduction performance, but the average linear expansion coefficient of the pure copper is larger and is about 18x 10-6/DEG C, while the average linear expansion coefficient of the ceramic is smaller and is about 4x10-6/° C, and the difference between the two average linear expansion coefficients is larger, the direct welding causes that the welding air tightness and the welding strength can not meet the use requirements, which is also a main factor that always restricts the pure copper as the metal packaging material.
In the prior art, in order to utilize the excellent heat conductivity of pure copper, composite materials such as tungsten copper or molybdenum copper are generally adopted, the material can adjust the proportion of copper components according to requirements, different average linear expansion coefficients are obtained, the welding requirements of ceramics are met, the air tightness and the welding strength can meet the use requirements, but the processing technology of the material is complex, the manufacturing cost is high, particularly, tungsten and molybdenum which are precious metals are contained, the hardness and the density of the material are high, the use cost in the fields of machining and aerospace is high, therefore, how to design a ceramic packaging structure with low cost and sealing performance and reliability is needed to be solved urgently.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a ceramic package structure of integral type anaerobic copper base to solve the problem mentioned in the above-mentioned background art.
For realizing the purpose of the above utility model, the technical scheme adopted is as follows:
a ceramic packaging structure of an integrated oxygen-free copper base comprises a tube shell Z shell and a ceramic insulator pin component, wherein a countersunk stepped hole is symmetrically formed in one end of the tube shell Z shell, the ceramic insulator pin component is arranged in the countersunk stepped hole, the ceramic insulator pin component comprises a ceramic ring, a transition ring and a composite lead, the ceramic ring is designed in a cylindrical cavity structure and matched with the countersunk stepped hole, the composite lead penetrates through the ceramic ring, the transition ring is arranged on one side of the ceramic ring and sleeved with the composite lead, AgCu welding materials are arranged at one side of the transition ring, which is far away from the ceramic ring, at the contact part of the transition ring and the composite lead and at the contact part of the ceramic ring and the countersunk stepped hole, and are used for forming a welding spot in a sintering mode and for braze welding and sealing of the ceramic insulator pin component on the tube shell Z shell, one end of the composite lead extends into the shell Z of the tube shell and is used for being connected with a chip in the shell Z of the tube shell.
The utility model discloses further set up to: the shell Z of the pipe shell is an integrated sealing shell and is made of an oxygen-free copper material, and the surface of the shell Z of the pipe shell is plated with nickel and gold.
The utility model discloses further set up to: a step surface for chip mounting is integrally connected in the shell Z of the tube shell, and the height difference of the step surface is 0.42 mm.
The utility model discloses further set up to: the upper surface of the shell Z of the tube shell is provided with mounting grooves for mounting the upper cover plate and the lower cover plate and 4 threaded fixing holes for fixing, and the two sides of the shell Z of the tube shell are integrally connected with ear holes for fixing, cleaning or electroplating.
The utility model discloses further set up to: the other end of the shell Z shell is provided with a through hole for communicating the optical fiber, and two sides of the through hole are provided with threaded holes for fixing the optical fiber tube.
The utility model discloses further set up to: the composite lead is a 4J50 copper-clad lead with the diameter of 2.05mm, and one end of the composite lead is arranged in a flat head manner.
The utility model discloses further set up to: and one side of the ceramic ring, which deviates from one end of the transition ring and faces the composite lead, is provided with a chamfer which is convenient for the composite lead to penetrate through.
The utility model discloses further set up to: the ceramic ring, the transition ring and the composite lead are coaxially arranged.
To sum up, compared with the prior art, the utility model discloses a ceramic package structure of integral type anaerobic copper base, the ceramic ring is cylinder cavity structural design and matches with the countersunk head shoulder hole, the ceramic ring is worn to locate by compound lead wire, compound lead wire is established to one side and the cover that the ceramic ring was located to the transition ring, the transition ring deviates from one side of ceramic ring and all is equipped with the AgCu solder with compound lead wire contact department and ceramic ring and countersunk head shoulder hole's contact department, be used for sintering into the solder joint and be used for ceramic insulator pin subassembly to braze joint on tube Z casing, compound lead wire's one end extends to in the tube Z casing, be used for being connected with the chip in the tube Z casing. Through the arrangement, the tube shell Z shell fully utilizes the characteristics of high strength, high hardness, small linear expansion coefficient, wear resistance and good thermal shock resistance of the ceramic ring, the risk of breakage of the ceramic insulator pin assembly cannot occur in the using process, the air tightness requirement of the ceramic insulator pin assembly is ensured, the reliability and the air tightness of the packaging structure are met by AgCu brazing, the cost performance is high, and the market competitiveness is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram illustrating an overall structure of a ceramic package structure with an integrated oxygen-free copper base according to this embodiment;
fig. 2 is a schematic view of the overall structure of the ceramic insulator pin assembly provided in this embodiment;
fig. 3 is a schematic view illustrating an assembly of the ceramic insulator pin assembly and the countersunk stepped hole according to the present embodiment.
Reference numerals: 1. a shell Z; 11. countersunk stepped holes; 12. a step surface; 13. mounting grooves; 14. a threaded fixing hole; 15. an ear hole; 16. a through hole; 2. a ceramic insulator pin assembly; 3. a ceramic ring; 4. a transition ring; 5. compounding a lead; 6. AgCu solder.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments, it is to be understood that the specific embodiments described herein are only used for explaining the present invention, and are not used for limiting the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the present invention described above can be combined with each other as long as they do not conflict with each other.
A ceramic packaging structure of an integrated oxygen-free copper base is disclosed, as shown in figures 1-3, and comprises a tube shell Z shell 1 and a ceramic insulator pin component 2, wherein a countersunk stepped hole 11 is symmetrically formed at one end of the tube shell Z shell 1, the ceramic insulator pin component 2 is arranged in the countersunk stepped hole 11, the ceramic insulator pin component 2 comprises a ceramic ring 3, a transition ring 4 and a composite lead 5, the ceramic ring 3 is designed in a cylindrical cavity structure and is matched with the countersunk stepped hole 11, the composite lead 5 is penetrated through the ceramic ring 3, the transition ring 4 is arranged at one side of the ceramic ring 3 and is sleeved with the composite lead 5, AgCu welding fluxes 6 are arranged at one side of the transition ring 4, which is far away from the ceramic ring 3, and is in contact with the composite lead 5 and in contact with the countersunk stepped hole 11 of the ceramic ring 3, and are used for sintering to form a welding spot and for brazing the ceramic insulator pin component 2 on the tube shell Z shell 1, one end of the composite lead 5 extends into the case Z housing 1 for connection with a chip in the case Z housing 1.
In the concrete implementation process, the sealed casing of casing Z casing 1 formula as an organic whole to in practice thrift the processing cost, improve the price/performance ratio, casing Z casing 1 is made by good conductivity, good heat dissipation, the oxygen-free copper material that the price/performance ratio is high, with the improvement practicality, casing Z casing 1's surface nickel plating gilding, with preventing the oxidation, prevent the corrosion of rustting, improve life.
Further, a step surface 12 for chip mounting is integrally connected in the case Z housing 1, and the height difference of the step surface 12 is 0.42mm, so as to facilitate chip mounting.
Wherein, the upper surface of the shell Z of the tube shell 1 is provided with an installation groove 13 for installing the upper cover plate and the lower cover plate and 4 thread fixing holes 14 for fixing, and the two sides of the shell Z of the tube shell 1 are integrally connected with ear holes 15 for fixing, cleaning or electroplating.
It should be noted that the other end of the tube shell Z housing 1 is provided with a through hole 16 for communicating with the optical fiber, and both sides of the through hole 16 are provided with threaded holes (not shown) for fixing the optical fiber tube, so as to improve the practicability and ensure the transmission of signals.
In the specific implementation process, the composite lead 5 is a 4J50 copper-clad lead with the diameter of 2.05mm, one end of the composite lead 5 is arranged in a flat head mode, the composite lead 5 is used for gold wire bonding, the connection between a chip and the composite lead is guaranteed, circuit signals in the shell Z shell 1 of the tube shell are transmitted to the outside, the composite lead 5 is good in gold wire bonding welding quality, and the reliability and the stability of a device are guaranteed.
The composite lead 5 has the following characteristics: the chemical property is stable, and harmful intermetallic compounds are not generated in use; the low-resistance ohmic contact can be formed with the semiconductor material, and the bonding force with the semiconductor material is strong; the plasticity is good, and the bonding is easy to realize; the elasticity is small, and a certain geometric shape can be kept in the bonding process.
In this embodiment, one end of the ceramic ring 3 facing away from the transition ring 4 and facing the composite lead 5 is provided with a chamfer facilitating the composite lead 5 to be inserted.
Further, the ceramic ring 3, the transition ring 4 and the composite lead 5 are coaxially arranged.
It should be noted that the four sides of the shell Z housing 1 are designed to be 2.5-4.5mm thin walls for heat dissipation.
In the present embodiment, the ceramic ring 3 is made of ceramic with a size of 2.05 × 3.95 × 3mm, which has excellent electrical properties at high frequencies, low dielectric loss, high volume resistivity, high strength, high hardness, low linear expansion coefficient, and good wear and thermal shock resistance, so as to meet the requirements of the package structure on airtightness and reliability.
In the specific implementation process, the ceramic ring 3, the transition ring 4 and the composite lead 5 are sintered into a whole through the AgCu solder 6 to form the ceramic insulator pin component 2, so that the ceramic insulator pin component 2 and the shell Z shell 1 are conveniently soldered and sealed through the AgCu solder 6.
The ceramic ring 3, the transition ring 4 and the composite lead 5 are brazed at 780 ℃ through a special tunnel furnace to form the ceramic insulator pin assembly 2, and the shell Z shell 1 and the ceramic insulator pin assembly 2 are brazed and sealed at 780 ℃ through AgCu solder 6 in the tunnel furnace.
To sum up, the utility model discloses following beneficial effect has: the utility model discloses a ceramic package structure of integral type anaerobic copper base, ceramic ring 3 is cylinder cavity structural design and with 11 phase-matches of countersunk head shoulder hole, ceramic ring 3 is worn to locate by compound lead wire 5, transition ring 4 locates one side of ceramic ring 3 and overlaps and establishes compound lead wire 5, transition ring 4 deviates from one side of ceramic ring 3 and all is equipped with AgCu solder 6 with compound lead wire 5 contact department and ceramic ring 3 and countersunk head shoulder hole 11's contact department, be used for sintering into the solder joint and be used for ceramic insulator pin subassembly 2 to braze joint on shell Z casing 1, compound lead wire 5's one end extends to in the shell Z casing 1, be used for being connected with the chip in the shell Z casing 1. Through the arrangement, the tube shell Z shell fully utilizes the characteristics of high strength, high hardness, small linear expansion coefficient, wear resistance and good thermal shock resistance of the ceramic ring, the risk of breakage of the ceramic insulator pin assembly cannot occur in the using process, the air tightness requirement of the ceramic insulator pin assembly is ensured, the reliability and the air tightness of the packaging structure are met by AgCu brazing, the cost performance is high, and the market competitiveness is improved.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (8)
1. A ceramic packaging structure of an integrated oxygen-free copper base comprises a Z shell and a ceramic insulator pin component, and is characterized in that countersunk stepped holes are symmetrically formed in one end of the Z shell, the ceramic insulator pin component is arranged in the countersunk stepped holes and comprises a ceramic ring, a transition ring and a composite lead, the ceramic ring is designed in a cylindrical cavity structure and matched with the countersunk stepped holes, the composite lead penetrates through the ceramic ring, the transition ring is arranged on one side of the ceramic ring and sleeved with the composite lead, AgCu welding materials are arranged at one side of the transition ring, which is far away from the ceramic ring, in contact with the composite lead and in contact with the ceramic ring and the countersunk stepped holes, and are used for sintering to form a welding point and for braze welding and sealing the ceramic insulator pin component on the Z shell, one end of the composite lead extends into the shell Z of the tube shell and is used for being connected with a chip in the shell Z of the tube shell.
2. The ceramic package structure of an integrated oxygen-free copper base as claimed in claim 1, wherein the Z shell of the tube shell is an integrated sealed shell and made of oxygen-free copper material, and the surface of the Z shell of the tube shell is plated with nickel and gold.
3. The ceramic package structure of an integrated oxygen-free copper base as claimed in claim 1, wherein a step surface for chip mounting is integrally connected in the Z-shell of the package, and the height difference of the step surface is 0.42 mm.
4. The ceramic package structure of an integrated oxygen-free copper base as claimed in claim 1, wherein the upper surface of the Z shell of the cartridge is provided with mounting grooves for mounting the upper and lower cover plates and 4 screw fixing holes for fixing, and the two sides of the Z shell of the cartridge are integrally connected with ear holes for fixing, cleaning or electroplating.
5. The ceramic package structure of an integrated oxygen-free copper base as claimed in claim 1, wherein the other end of the Z-shell of the package has a through hole for communicating with an optical fiber, and both sides of the through hole have threaded holes for fixing an optical fiber tube.
6. The one-piece oxygen-free copper base ceramic package structure of claim 1, wherein the composite lead is a 2.05mm diameter 4J50 copper clad lead with one end of the composite lead being a flat head.
7. The ceramic package structure of an integrated oxygen-free copper base of claim 1, wherein one side of the ceramic ring facing away from the transition ring and facing the composite lead is provided with a chamfer facilitating the composite lead to be inserted.
8. The one-piece oxygen-free copper base ceramic package structure of claim 1, wherein the ceramic ring, the transition ring, and the composite lead are disposed coaxially.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120784523.5U CN214481576U (en) | 2021-04-16 | 2021-04-16 | Ceramic packaging structure of integral type anaerobic copper base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120784523.5U CN214481576U (en) | 2021-04-16 | 2021-04-16 | Ceramic packaging structure of integral type anaerobic copper base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214481576U true CN214481576U (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120784523.5U Active CN214481576U (en) | 2021-04-16 | 2021-04-16 | Ceramic packaging structure of integral type anaerobic copper base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214481576U (en) |
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2021
- 2021-04-16 CN CN202120784523.5U patent/CN214481576U/en active Active
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Address after: Room 101, Unit 1, Building C, No. 6 Juliu Road, Zhukeng Community, Longtian Street, Pingshan District, Shenzhen City, Guangdong Province, China Patentee after: Shenzhen Honggang Optoelectronic Packaging Technology Co.,Ltd. Address before: 518000 1-3 / F, C1 building, long industrial park, JuLongshan No.3 Road, big industrial zone, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HONGGANG MECHANISM & EQUIPMENT CO.,LTD. |