JP2007109734A - Optical module and substrate therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for optical module in which discontinuity of impedance is reduced and manufacturing yield is improved, and to provide an optical module. <P>SOLUTION: The optical module 11 is provided with metallic tubular bodies 23 which are lower than an auxiliary metal substrate 21, and are arranged adjacently to the side of the auxiliary metal substrate and has a coaxial structure; metal leads 24 which are disposed in center axes of the metal tubular bodies and project from the metal tubular bodies; and an end face light emission-type semiconductor laser 28 which is mounted on a circuit board loaded on the side of the auxiliary metal substrate. The optical module can be manufactured by a method which is the same as a conventional case. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical module substrate that can include an edge-emitting semiconductor laser and an optical module that includes an edge-emitting semiconductor laser.

  The transmission rate of the optical communication network is increasing from about 2.5 Gbps (Giga bit per second) to about 10 Gbps. Optical modules have become indispensable for high-speed transmission along with flat-emitting semiconductor lasers and edge-emitting semiconductor lasers.

A conventional optical module will be described with reference to FIG. 6 using the optical module 90 disclosed in Patent Document 1 as an example. FIG. 6 is an overall view of the optical module 90. The optical module 90
An optical semiconductor element 80, a connection wiring 81, a metal lead 82, a hole 83, a dielectric 84, and a metal substrate 85 are provided.

  The metal substrate 85 has a hole 83 having a diameter on one side smaller than the diameter on the other side. The dielectric 84 is filled on the side where the diameter of the hole 83 is large. The metal lead 82 penetrates the dielectric 84 and protrudes from one surface and the other surface of the metal substrate 85. The optical semiconductor element 80 is mounted on one surface of the metal substrate 85. The connection wiring 81 connects the optical semiconductor element 80 and the end face of the metal lead 82. The optical module 90 is hermetically sealed with a housing (not shown in FIG. 6) after being filled with an inert gas or in a vacuum state. The hole 83 has a coaxial structure by filling the dielectric 84 on the larger diameter side, and has a coaxial structure by filling an inert gas or the like as the dielectric on the smaller side.

  The impedances on the side having the larger diameter of the hole 83 and the side having the smaller diameter of the hole 83 are matched. Then, the optical module 90 can reduce the impedance discontinuity and shorten the connection wiring 81 that connects the optical semiconductor element 80 and the end face of the metal lead 82. Therefore, the optical module 90 can reduce impedance discontinuity from the other surface of the metal substrate 85 to the optical semiconductor element 80.

  With reference to FIGS. 7 and 8, another conventional optical module will be described using the optical module 91 disclosed in the cited document 2 as an example. FIG. 7 is an enlarged view of the optical module 91. FIG. 7 shows an optical semiconductor element 80, a metal lead 82, a metal substrate 85, a circuit substrate 86, a wiring pattern 87, and an insulating sealing body 88.

  FIG. 8 is a top view of the optical module 91. FIG. 8 shows an optical semiconductor element 80, a metal lead 82, a metal substrate 85, a circuit substrate 86, an insulating sealing body 88, and an auxiliary metal substrate 89.

  The auxiliary metal substrate 89 (not shown in FIG. 7) is formed on one surface of the metal substrate 85. The metal substrate 85 forms a hole (not shown in FIGS. 7 and 8). The insulating sealing body 88 fills the aforementioned hole. The metal lead 82 penetrates the insulating sealing body 88 and protrudes from one surface and the other surface of the metal substrate 85. The circuit board 86 having a certain thickness is inserted between the auxiliary metal board 89 and the metal lead 82. The circuit board 86 is brazed to the auxiliary metal substrate 89 on the opposite surface on which the optical semiconductor element 80 is mounted. The end of the metal lead 82 on the side close to the metal substrate 85 of the wiring pattern 87 and the side protruding from one surface of the metal substrate 85 is connected by a brazing material. The optical semiconductor element 80 is mounted on the side away from the metal substrate 85 of the wiring pattern 87 using solder or the like.

  The impedance of the transmission line formed by the wiring pattern 87 of the circuit board 86 is matched with the impedance of the hole of the metal substrate 85 having a coaxial structure by filling the insulating sealing body 88. Then, even if the optical module 91 includes an edge-emitting semiconductor laser as the optical semiconductor element 80, impedance discontinuity from the metal lead 82 protruding from the other surface of the metal substrate 85 to the optical semiconductor element 80 is reduced. be able to.

JP 2004-253419 A JP 2004-259971 A

  When the optical module 90 of FIG. 6 includes an edge-emitting semiconductor laser as the optical semiconductor element 80, there is a problem in that impedance discontinuity occurs.

In general, an edge-emitting semiconductor laser (not shown in FIG. 6) outputs signal light from the end face, and outputs monitor light for measuring the intensity of the output light from the end face opposite to the end face that outputs the signal light. To do.
In order to receive the monitor light of the edge-emitting semiconductor laser by the light receiving element, the edge-emitting semiconductor laser has a side surface of an auxiliary metal substrate (not shown in FIG. 6) having a certain height from the metal substrate 85. It is necessary to mount on. Then, the distance of the connection wiring 81 becomes long, and the optical semiconductor element 80 has a problem that impedance discontinuity occurs.

  The optical module 91 of FIG. 7 can reduce impedance discontinuity even if it includes an edge-emitting semiconductor laser. However, the optical module 91 has a problem of generating impedance discontinuity caused by member tolerance and mounting tolerance.

  In the mounting method described above, the thickness of the circuit board 86 and the gap between the auxiliary metal substrate 89 and the metal lead 82 are not uniform, and the optical module 91 may have a member tolerance and a mounting tolerance. Then, the optical module 91 has a problem of generating impedance discontinuity. Further, in order to adjust the distance between the auxiliary metal substrate 89 and the metal lead 82 to the thickness of the circuit board 86, it is necessary to increase the processing accuracy as compared with the conventional manufacturing method, and the optical module 91 has a problem that the manufacturing yield deteriorates. is there.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an optical module substrate and an optical module that reduce impedance discontinuity and increase the manufacturing yield.

  In order to achieve the above object, the first invention of the present application is a metal cylindrical body that is adjacent to the side surface of the auxiliary metal substrate, is lower than the auxiliary metal substrate, has a coaxial structure, and a central axis of the metal cylindrical body. An optical module substrate comprising a metal lead disposed and protruding from a metal cylindrical body.

  Specifically, the first invention of the present application includes a metal substrate, an auxiliary metal substrate that is disposed so as to protrude from one surface of the metal substrate, and has a flat side surface that is substantially perpendicular to the one surface, and the auxiliary metal substrate. A metal cylindrical body disposed adjacent to the side surface of the metal substrate, having a central axis substantially perpendicular to the one surface of the metal substrate and a height of one end surface lower than that of the auxiliary metal substrate, and the metal tube body A metal lead having one end protruding from the one end face of the metal cylindrical body and the other end protruding to the other face side of the metal substrate, the metal cylindrical body and the An optical module substrate comprising an insulating sealing body filled between metal leads.

  The optical module substrate has a coaxial structure in which the insulating sealing body is filled between the metal cylindrical body and the metal lead. In addition, since the metal cylindrical body is lower than the auxiliary metal substrate and one end of the metal lead protrudes from the one end surface of the metal cylindrical body, the optical module substrate is the auxiliary metal substrate. The side surface and the one end of the metal lead can be connected by a short wiring. Therefore, the substrate for an optical module can reduce impedance discontinuity generated in the metal cylindrical body and wiring. Furthermore, since the optical module substrate can be manufactured by the same method as the conventional one, the manufacturing yield can be increased. Therefore, it is possible to provide an optical module substrate that reduces impedance discontinuity and increases manufacturing yield.

  In order to achieve the above object, the second invention of the present application is a metal cylindrical body that is lower than the auxiliary metal substrate and is arranged adjacent to the side surface of the auxiliary metal substrate and has a coaxial structure, and a metal cylindrical body. An optical module including a metal lead disposed on a central axis and projecting from a metal cylindrical body, and an edge-emitting semiconductor laser mounted on a circuit board mounted on a side surface of an auxiliary metal substrate.

  Specifically, the second invention of the present application includes a metal substrate, an auxiliary metal substrate that protrudes from one surface of the metal substrate, and has a side surface substantially perpendicular to the one surface and the auxiliary metal substrate. A metal cylindrical body disposed adjacent to the side surface of the metal substrate, having a central axis substantially perpendicular to the one surface of the metal substrate and a height of one end surface lower than that of the auxiliary metal substrate, and the metal tube body A metal lead having one end protruding from the one end face of the metal cylindrical body and the other end protruding to the other face side of the metal substrate, the metal cylindrical body and the An insulating sealing body filled between metal leads, a circuit board mounted on the side surface of the auxiliary metal substrate and having a wiring pattern formed thereon, mounted on the circuit board, and a wiring electrode serving as the wiring pattern The formed edge-emitting semiconductor laser and the circuit board An optical module comprising a wiring conductor connecting the one end projecting from the metal tubular body of the metal lead and the wiring pattern, respectively.

  The optical module has a coaxial structure in which the insulating sealing body is filled between the metal cylindrical body and the metal lead. Further, since the metal cylindrical body is lower than the auxiliary metal substrate and the wiring pattern and the one end of the metal lead are connected by the wiring conductor, the optical module shortens the wiring conductor. be able to. Therefore, the optical module can reduce impedance discontinuity generated in the metal cylindrical body and the wiring conductor. Furthermore, since the optical module can be manufactured by a method similar to the conventional method, the manufacturing yield of the optical module can be increased. Therefore, it is possible to provide an optical module that can reduce impedance discontinuity and increase manufacturing yield.

  2nd invention of this application WHEREIN: It is preferable to further provide an electrical resistor in series in the middle of the said wiring pattern.

  The electrical resistor sets a resistance value so that the impedance of the transmission line matches the impedance of the terminal resistor formed by the edge-emitting semiconductor laser and the electrical resistor provided in the middle of the wiring pattern. can do. Then, the optical module can reduce electrical reflection due to the termination load, and can improve impedance matching. Therefore, an optical module that further reduces impedance discontinuity can be provided.

  In the second invention of the present application, the metal lead is preferably arranged so that a side surface in a major axis direction is in contact with an extension of a surface of the circuit board on which the wiring pattern is formed.

  The optical module can shorten the wiring conductor by arranging the metal leads so that the side surface in the long axis direction is in contact with the extension of the surface of the circuit board on which the wiring pattern is formed. Therefore, the optical module can reduce the impedance discontinuity generated in the wiring conductor. Therefore, an optical module that further reduces impedance discontinuity can be provided.

  The present invention can provide an optical module substrate and an optical module that reduce impedance discontinuity and increase manufacturing yield.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited to embodiment shown below.

(Embodiment 1)
The first embodiment of the present application includes a metal substrate, an auxiliary metal substrate that protrudes from one surface of the metal substrate, has a flat side surface that is substantially perpendicular to the one surface, and the side surface of the auxiliary metal substrate. A metal cylinder having a central axis substantially perpendicular to the one surface of the metal substrate and a height of one end surface lower than that of the auxiliary metal substrate, and a center of the metal tube A metal lead having one end projecting from the one end surface of the metal cylindrical body and the other end projecting to the other surface side of the metal substrate; the metal cylindrical body and the metal lead; And an insulating sealing body filled in between.

  An optical module substrate 10 according to the first embodiment will be described with reference to FIG. FIG. 1 is a perspective view of an optical module substrate 10. The optical module substrate 10 includes a metal substrate 20, an auxiliary metal substrate 21, a side surface 22, a metal cylindrical body 23, a metal lead 24, and an insulating sealing body 25.

  The production of the optical module substrate 10 will be described. The auxiliary metal substrate 21 is disposed so as to protrude from one surface of the metal substrate 20. The auxiliary metal substrate 21 has a flat side surface 22 that is substantially perpendicular to one surface of the metal substrate 20. The metal cylindrical body 23 is disposed adjacent to the side surface 22 of the auxiliary metal substrate 21. The central axis of the metal cylindrical body 23 is substantially perpendicular to one surface of the metal substrate 20. In addition, the height of one end face of the metal cylindrical body 23 is lower than that of the auxiliary metal substrate 21.

  For example, the metal substrate 20 is obtained by processing a cold rolled steel plate (SPC), a Kovar (iron-nickel-cobalt alloy) plate, a copper tungsten plate, or an iron-nickel alloy plate into a circular shape, a plate shape, or other shapes. Also good.

  The auxiliary metal substrate 21 may be integrally formed with the metal substrate 20. The auxiliary metal substrate 21 may be welded or bonded to the metal substrate 20 after the auxiliary metal substrate 21 is processed. For example, examples of the material of the auxiliary metal substrate 21 include SPC, Kovar, copper tungsten, and iron-nickel alloy. When the auxiliary metal substrate 21 is made of a metal having good thermal conductivity such as SPC, the optical module substrate 10 can efficiently dissipate the mounted edge-emitting semiconductor laser, and the laser output efficiency, oscillation wavelength, and element Lifespan can be improved.

  The metal cylindrical body 23 may be integrally formed with the metal substrate 20. Further, the metal cylindrical body 23 may be welded or bonded to the metal substrate 20 after the metal cylindrical body 23 is processed. For example, the metal cylinder 23 may be formed by processing SPC, Kovar, copper tungsten, or iron-nickel alloy into a cylinder, a square cylinder, or other shapes. If the edge-emitting semiconductor laser mounted on the optical module substrate 10 is used by differential driving, the number of the metal cylindrical bodies 23 may be two as shown in FIG. Further, if the edge-emitting semiconductor laser mounted on the optical module substrate 10 is used in a single drive, the number of the metal cylindrical bodies 23 may be one (not shown in FIG. 1). The number of the metal cylindrical bodies 23 is not limited to the above number.

  The metal lead 24 is disposed at the center of the metal cylindrical body 23. The metal lead 24 has one end of the metal lead 24 protruding from one end face of the metal cylindrical body 23, and the other end of the metal lead 24 protruding to the other face side of the metal substrate 20. For example, the metal lead 24 may be made by processing Kovar or an iron-nickel alloy into a cylindrical or prismatic shape. One end face of the metal lead 24 may be flat so as to be bonded (not shown in FIG. 1). The metal leads 24 may be arranged according to the number of the metal cylindrical bodies 23.

  The insulating sealing body 25 is filled between the metal cylindrical body 23 and the metal lead 24. For example, the insulating sealing body 25 may be borosilicate glass if the material of the metal cylindrical body 23 is Kovar or copper tungsten. The insulating sealing body 25 may be made of carbonate glass, lead glass, or phosphate glass.

  The point that the optical module substrate 10 reduces the impedance discontinuity and increases the manufacturing yield will be described. It has a coaxial structure in which an insulating sealing body 25 is filled between the metal cylindrical body 23 and the metal lead 24. In addition, since the metal cylindrical body 23 is lower than the auxiliary metal substrate 21 and one end of the metal lead 24 protrudes from one end surface of the metal cylindrical body 23, the optical module substrate 10 is formed of the auxiliary metal substrate 21. The side surface 22 and one end of the metal lead 24 can be connected with a short wiring. Accordingly, the optical module substrate 10 can reduce impedance discontinuity generated in the metal cylindrical body 23 and the wiring described above.

  Furthermore, since the optical module substrate 10 can be manufactured by a method similar to the conventional method, the manufacturing yield can be increased. Therefore, it is possible to provide an optical module substrate that reduces impedance discontinuity and increases manufacturing yield.

(Embodiment 2)
The second embodiment of the present application includes a metal substrate, an auxiliary metal substrate that protrudes from one surface of the metal substrate, has a flat side surface that is substantially perpendicular to the one surface, and the side surface of the auxiliary metal substrate. A metal cylinder having a central axis substantially perpendicular to the one surface of the metal substrate and a height of one end surface lower than that of the auxiliary metal substrate, and a center of the metal tube A metal lead having one end projecting from the one end surface of the metal cylindrical body and the other end projecting to the other surface side of the metal substrate; the metal cylindrical body and the metal lead; An insulating sealing body filled in between, a circuit board mounted on the side surface of the auxiliary metal substrate and having a wiring pattern formed thereon, mounted on the circuit board, and a wiring electrode formed in the wiring pattern An edge-emitting semiconductor laser and the circuit board; And one end protruding from the metal tubular body of the line pattern and the metal lead is an optical module comprising a wiring conductor, the connecting respectively.

  The optical module 11 according to the second embodiment will be described with reference to FIGS. FIG. 2 is a perspective view of the optical module 11. FIG. 3 is an enlarged view including the periphery of the circuit board 26 in FIG. The optical module 11 includes a metal substrate 20, an auxiliary metal substrate 21, a metal cylindrical body 23, a metal lead 24, an insulating sealing body 25, a circuit board 26, an edge-emitting semiconductor laser 28, an insulating substrate 30, and a monitor light receiving element 31. , A bonding wire 32, a metal conductor 34, and an insulator 35.

  3 shows an auxiliary metal substrate 21, a metal cylindrical body 23, a metal lead 24, an insulating sealing body 25, a circuit board 26, a wiring pattern 27, an edge emitting semiconductor laser 28, a wiring conductor 29, and a bonding wire 32. Has been.

  The optical module 11 can be manufactured by forming the edge emitting semiconductor laser 28 and the like on the optical module substrate 10 of FIG. Hereinafter, the manufacture of the optical module 11 will be described.

  The circuit board 26 is attached to the side surface 22 of the auxiliary metal substrate 21. The wiring pattern 27 is formed on the circuit board 26. For example, the material of the circuit board 26 can be aluminum nitride, aluminum oxide, or silicon nitride. If the material of the circuit board 26 is aluminum nitride, the edge-emitting semiconductor laser 28 radiates heat efficiently because of good thermal conductivity. The wiring pattern 27 may be nickel gold plating or copper plating.

  The edge-emitting semiconductor laser 28 is mounted on the circuit board 26. Further, the edge emitting semiconductor laser 28 forms a wiring electrode on the wiring pattern 27. For example, the edge emitting semiconductor laser 28 may be a Fabry-Perot semiconductor laser (FP-LD), a Bragg feedback semiconductor laser (DBR-LD), or a distributed feedback semiconductor laser (DFB-LD).

  The wiring conductor 29 connects the wiring pattern 27 of the circuit board 26 and one end protruding from the metal cylindrical body 23 of the metal lead 24. For example, the wiring conductor 29 may be connected by bonding. If the wiring conductor 29 is connected by wedge bonding, the wiring conductor 29 may be a ribbon wire. If the wiring conductor 29 is connected by ball bonding, the wiring conductor 29 may be a round wire.

  The edge emitting semiconductor laser 28 and the wiring pattern 27 of the circuit board 26 may be connected by a bonding wire 32. For example, the edge emitting semiconductor laser 28 and the wiring pattern 27 of the circuit board 26 may be connected by wedge bonding or ball bonding.

  The insulating substrate 30 may be mounted on one surface of the metal substrate 20 by performing metal plating on one surface. The monitor light receiving element 31 may be mounted at a position where the monitor light of the edge emitting semiconductor laser 28 of the insulating substrate 30 can be received. The monitor light receiving element 31 may include an electrode pad on the surface. The metal conductor 34 may be disposed so as to protrude from one surface of the metal substrate 20. The insulator 35 may be filled between the metal conductor 34 and the metal substrate 20 so that the metal conductor 34 and the metal substrate 20 do not contact each other. One metal conductor 34 and the electrode pad of the monitor light receiving element 31 may be connected by a bonding wire 32. Further, the other metal conductor 34 and one surface of the insulating substrate 30 may be connected by a bonding wire 32.

  A housing (not shown in FIGS. 2 and 3) may cover one surface of the metal substrate 20 and hermetically seal the optical module 11. The housing described above may include a transparent plate or a lens so that the signal light of the edge-emitting semiconductor laser 28 can be output to the outside. For example, the housing may be welded to the optical module 11 using a metal, plastic, or ceramic material. Further, the inside of the housing may be filled with nitrogen or other inert gas or be in a vacuum state.

  The point that the optical module 11 reduces the impedance discontinuity and increases the manufacturing yield will be described. The optical module 11 has the same coaxial structure as the optical module substrate 10 of FIG. Since the metal cylindrical body 23 is lower than the auxiliary metal substrate 21 and one end of the metal lead 24 protrudes from one end surface of the metal cylindrical body 23, the optical module 11 shortens the wiring conductor 29 and One end of the pattern 27 and the metal lead 24 can be connected. Therefore, the optical module 10 can reduce impedance discontinuity generated in the metal cylindrical body 23 and the wiring conductor 29. Furthermore, the optical module 11 can use a conventional manufacturing method. Therefore, it is possible to provide an optical module that can reduce impedance discontinuity and increase manufacturing yield.

  In 2nd Embodiment of this application, it is preferable to further provide an electrical resistor in series in the middle of the said wiring pattern.

  FIG. 4 is an enlarged view including the periphery of the circuit board 26 after the electrical resistor 33 is formed. 4, the auxiliary metal substrate 21, the metal cylindrical body 23, the metal lead 24, the insulating sealing body 25, the circuit board 26, the wiring pattern 27, the edge emitting semiconductor laser 28, the wiring conductor 29, the bonding wire 32, and the electric Resistor 33 is shown.

  The electrical resistor 33 may be formed in series in the middle of the wiring pattern 27. For example, tantalum nitride or tungsten may be formed on the wiring pattern as the electric resistor 33 by sputtering or vapor deposition, and the resistance value of the electric resistor 33 may be adjusted by laser trimming. As shown in FIG. 4, if the edge-emitting semiconductor laser 28 is differentially driven, the number of electrical resistors 33 may be two. If the edge-emitting semiconductor laser 28 is single-driven, the number of electrical resistors 33 may be one (not shown in FIG. 4).

  The impedance of the electrical resistor 33 is adjusted so that the impedance of the electrical resistor 33 and the combined impedance of the edge-emitting semiconductor laser 28 are substantially the same as the impedance of the metal cylindrical body 23 having a coaxial structure. Then, the optical module 11 can reduce electrical reflection due to the termination load and improve impedance matching. Therefore, an optical module that further reduces impedance discontinuity can be provided.

  In the second embodiment of the present application, it is preferable that the metal lead is disposed such that a side surface in a major axis direction is in contact with an extension of a surface of the circuit board on which the wiring pattern is formed.

  FIG. 5 is a top view of the auxiliary metal substrate 21 of the optical module 11. FIG. 5 illustrates the auxiliary metal substrate 21, the metal cylindrical body 23, the metal lead 24, the insulating sealing body 25, the wiring pattern 27, the edge emitting semiconductor laser 28, the wiring conductor 29, and the bonding wire 32. In FIG. 5, the extension of the surface on which the wiring pattern 27 is formed is indicated by a broken line.

  The metal lead 24 may be disposed such that the side surface in the major axis direction is in contact with the extension of the surface on which the wiring pattern 27 is formed. Then, since the wiring conductor 29 can be shortened, the optical module 11 can reduce the impedance discontinuity generated in the wiring conductor 29. Therefore, an optical module that reduces impedance discontinuity can be provided.

  The substrate for an optical module of the present invention can be used as a substrate for an edge-emitting semiconductor laser. The optical module of the present invention can be used as an optical module for transmission in optical communication.

It is a perspective view of the substrate for optical modules concerning one embodiment of the 1st invention of this application. It is a perspective view of the optical module which concerns on one Embodiment of this-application 2nd invention. FIG. 3 is an enlarged view including the periphery of the circuit board in FIG. 2. It is an enlarged view including the periphery of a circuit board after an electrical resistor is formed. FIG. 3 is a top view of an auxiliary metal substrate of the optical module in FIG. 2. It is a general view of the conventional optical module. It is an enlarged view of another conventional optical module. It is a top view of another conventional optical module.

Explanation of symbols

10 Optical Module Substrate 11, 90, 91 Optical Module 20, 85 Metal Substrate 21, 89 Auxiliary Metal Substrate 22 Side 23 Metal Cylindrical Body 26, 86 Circuit Substrate 24, 82 Metal Lead 27, 87 Wiring Pattern 25, 88 Insulation Sealing Stopping body 28 End-emitting semiconductor laser 29 Wiring conductor 30 Insulating substrate 31 Light-receiving element for monitoring 32 Bonding wire 33 Electric resistor 34 Metal conductor 35 Insulator 80 Optical semiconductor element 81 Connection wiring 83 Hole 84 Dielectric

Claims (4)

A metal substrate;
An auxiliary metal substrate disposed so as to protrude from one surface of the metal substrate and having a flat side surface substantially perpendicular to the one surface;
A metal cylindrical body disposed adjacent to the side surface of the auxiliary metal substrate, the central axis being substantially perpendicular to the one surface of the metal substrate, and the height of one end surface being lower than the auxiliary metal substrate;
A metal lead disposed at the center of the metal cylinder, one end protruding from the one end face of the metal cylinder, and the other end protruding to the other face side of the metal substrate;
An optical module substrate comprising: an insulating sealing body filled between the metal cylindrical body and the metal lead. A metal substrate;
An auxiliary metal substrate disposed so as to protrude from one surface of the metal substrate and having a flat side surface substantially perpendicular to the one surface;
A metal cylindrical body disposed adjacent to the side surface of the auxiliary metal substrate, the central axis being substantially perpendicular to the one surface of the metal substrate, and the height of one end surface being lower than the auxiliary metal substrate;
A metal lead disposed at the center of the metal cylinder, one end protruding from the one end face of the metal cylinder, and the other end protruding to the other face side of the metal substrate;
An insulating sealing body filled between the metal cylindrical body and the metal lead;
A circuit board mounted on the side surface of the auxiliary metal substrate and having a wiring pattern formed thereon;
An edge-emitting semiconductor laser mounted on the circuit board and having a wiring electrode formed on the wiring pattern;
An optical module comprising: a wiring conductor that connects the wiring pattern of the circuit board and one end of the metal lead protruding from the metal cylindrical body.   The optical module according to claim 2, further comprising an electric resistor in series in the middle of the wiring pattern. 4. The optical module according to claim 2, wherein the metal lead is disposed such that a side surface in a major axis direction is in contact with an extension of a surface of the circuit board on which the wiring pattern is formed. 5.

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