CN214754652U - 1X laser instrument encapsulation tube shell structure - Google Patents
1X laser instrument encapsulation tube shell structure Download PDFInfo
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- CN214754652U CN214754652U CN202120785815.0U CN202120785815U CN214754652U CN 214754652 U CN214754652 U CN 214754652U CN 202120785815 U CN202120785815 U CN 202120785815U CN 214754652 U CN214754652 U CN 214754652U
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- laser
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 18
- 239000012212 insulator Substances 0.000 claims abstract description 37
- 239000000835 fiber Substances 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 10
- 238000013461 design Methods 0.000 claims abstract description 9
- 230000002146 bilateral effect Effects 0.000 claims abstract description 6
- 230000007704 transition Effects 0.000 claims description 24
- 239000002131 composite material Substances 0.000 claims description 23
- 239000011521 glass Substances 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 238000005219 brazing Methods 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910000975 Carbon steel Inorganic materials 0.000 claims description 5
- 239000010962 carbon steel Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000013307 optical fiber Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract description 15
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- -1 specifically Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Semiconductor Lasers (AREA)
Abstract
The utility model belongs to the technical field of laser instrument encapsulation device, a 1X laser instrument encapsulation tube shell structure is disclosed, including laser casing, parallel seal welding apron and the insulator lead subassembly that is cuboid structural design, parallel seal welding apron weld in laser casing top, the shoulder hole has been seted up to the one end symmetry of laser casing, insulator lead subassembly is brazed and is encapsulated in the shoulder hole, the fiber tube hole that is used for leading to optic fibre is seted up to the other end of laser casing, an organic whole is connected with the step face that is used for chip subsides dress in the laser casing, the bilateral symmetry of laser casing extends has the ear of seting up the fixed orifices that is used for it to fix, wash or electroplate. The utility model relates to an ingenious, rational in infrastructure for laser instrument encapsulation tube structure possesses reliable operational environment, life and sealing performance.
Description
Technical Field
The utility model belongs to the technical field of laser instrument encapsulation device, especially, relate to a 1X laser instrument encapsulation tube shell structure.
Background
In the beginning of the 21 st century, optical fiber laser-loaded devices have attracted extensive attention in the industry and academia in China, and with the continuous development of the laser industry, low-power lasers cannot meet the use requirements of high-end industries. The demand of high-power lasers in industries such as industrial shipbuilding, aircraft and automobile manufacturing, 3D printing, aerospace and the like is increasing, and the high-power lasers gradually become a sharp tool in the laser industry. At present, developed countries take strict technical monopoly to China, independent research and development of high-power lasers is not slow enough, in the field of high-power lasers, due to the fact that the sealing performance of glass packaging can block alternation of optical devices inside a shell and external substances, external water vapor is prevented from entering the shell, the service life of components inside the shell is prolonged, in addition, the internal structure of the laser shell can be optimized, the use performance and the reliability of products are greatly improved, and therefore the packaging shell and the structure thereof have important significance in production and processing of lasers.
In the prior art, a package casing for a 1X laser is a high-power laser package casing, and has the characteristics of high heat dissipation, sealing performance, circuit transmission, corrosion resistance and the like, a glass insulator is directly used as an insulating material for packaging an oxygen-free copper casing and pins in a common scheme, but due to the difference of linear expansion coefficients of glass and the oxygen-free copper material, large internal stress is caused in a high-temperature sintering process, and the package casing is easy to have a glass crack phenomenon in a long-time used process, so that the air tightness is possibly deteriorated and the insulating performance is possibly reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a 1X laser instrument encapsulation tube shell structure to solve the problem mentioned in the above-mentioned background art.
For realizing the purpose of the above utility model, the technical scheme adopted is as follows:
the utility model provides a 1X laser instrument encapsulation tube shell structure, is including the laser instrument casing, parallel seal welding apron and the insulator lead wire subassembly that are cuboid structural design, parallel seal welding apron weld in laser instrument casing top, the shoulder hole has been seted up to the one end symmetry of laser instrument casing, the encapsulation of insulator lead wire subassembly brazing in the shoulder hole, the fiber tube hole that is used for leading to optic fibre is seted up to the other end of laser instrument casing, an organic whole is connected with the step face that is used for the chip to paste dress in the laser instrument casing, the bilateral symmetry of laser instrument casing extends has the ear of seting up the fixed orifices that is used for it to fix, wash or electroplate.
The utility model discloses further set up to: and a thread correction hole is formed at the other end of the laser shell and close to the optical fiber tube hole, and is used for ensuring the collimation of light through a collimator.
The utility model discloses further set up to: the laser shell is an integrated sealing shell and is made of an oxygen-free copper material, and nickel and gold are plated on the surface of the laser shell.
The utility model discloses further set up to: the insulator lead assembly comprises a glass insulator, a transition ring and a composite lead, wherein the glass insulator is in cylindrical cavity structural design and is sleeved on the composite lead, the transition ring is in cylindrical cavity structural design and is sleeved on the glass insulator, and the glass insulator is formed by integrally sintering the transition ring and the composite lead to form the insulator lead assembly.
The utility model discloses further set up to: the stepped hole comprises a lead hole, an assembly hole and a brazing hole which are sequentially and integrally connected, the transition ring is matched with the assembly hole, and the brazing hole and the transition environment-friendly holding gap are used for keeping the insulator lead assembly and the laser shell to be brazed and packaged through a soldering lug.
The utility model discloses further set up to: and one end of the composite lead extending into the laser shell is designed into a flat head and is used for gold wire bonding of the composite lead and electrical connection with a chip in the laser shell.
The utility model discloses further set up to: the width of one end of the composite lead wire in a flat head design is smaller than the diameter of the lead wire hole.
The utility model discloses further set up to: the composite lead is a 4J50 copper-clad lead with the diameter of 1.5 mm.
The utility model discloses further set up to: the transition ring is made of a cold-rolled carbon steel material, and is plated with a 3-5um nickel layer.
The utility model discloses further set up to: the top surface of the laser shell is flat and smooth, and the four side walls of the laser shell are thin walls with the thickness of 1.5mm and used for heat dissipation.
To sum up, compared with the prior art, the utility model discloses a 1X laser instrument encapsulation tube shell structure, parallel seal welding apron welds on laser casing top, the shoulder hole has been seted up to the one end symmetry of laser casing, insulator lead wire subassembly is brazed and is encapsulated in the shoulder hole, the fiber tube hole that is used for leading to optic fibre is offered to the other end of laser casing, an organic whole is connected with the step face that is used for the chip to paste dress in the laser casing, the bilateral symmetry extension of laser casing has the ear of seting up the fixed orifices that is used for it to fix, wash or electroplate. Through this setting promptly for laser instrument encapsulation tube shell structure possesses reliable operational environment, and life and sealing performance have improved price/performance ratio and market competition.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of a package structure of a 1X laser device provided in this embodiment;
fig. 2 is a schematic internal structural diagram of a package structure of a 1X laser according to this embodiment;
fig. 3 is a schematic cross-sectional structure diagram of a package structure of a 1X laser device provided in this embodiment;
fig. 4 is a schematic view of the overall structure of the insulator lead assembly according to the present embodiment.
Reference numerals: 1. a laser housing; 11. a fiber optic tube bore; 12. a step surface; 13. an ear; 14. a threaded alignment hole; 2. sealing and welding the cover plates in parallel; 3. an insulator lead assembly; 31. a glass insulator; 32. a transition ring; 33. compounding a lead; 4. a stepped hole; 41. a wire hole; 42. an assembly hole; 43. and (7) brazing the holes.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments, it is to be understood that the specific embodiments described herein are only used for explaining the present invention, and are not used for limiting the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the present invention described above can be combined with each other as long as they do not conflict with each other.
The utility model provides a 1X laser instrument encapsulation tube shell structure, as shown in fig. 1-4, including the laser casing 1 that is cuboid structural design, parallel seal welds apron 2 and insulator lead subassembly 3, parallel seal welds apron 2 and welds on laser casing 1 top, shoulder hole 4 has been seted up to the one end symmetry of laser casing 1, insulator lead subassembly 3 is brazed and is encapsulated in shoulder hole 4, the fiber tube hole 11 that is used for leading to optic fibre is seted up to the other end of laser casing 1, an organic whole is connected with step face 12 that is used for the chip subsides to paste in the laser casing 1, the bilateral symmetry of laser casing 1 extends has the ear 13 of seting up the fixed orifices that is used for it to fix, wash or electroplate.
In the specific implementation process, the top end surface of the laser shell 1 is flat and smooth, so that the parallel sealing welding of the cover plate 2 and the laser shell is convenient, and the sealing performance of the laser shell is kept.
Further, the other end of the laser housing 1 is close to the optical fiber tube hole 11, and a thread correction hole 14 is formed for ensuring collimation of light through a collimator, so that light beams in the sealed laser housing 1 can not be disturbed by outside air, and practicability is improved.
Wherein, laser instrument casing 1 formula seal housing as an organic whole to in practice thrift the processing cost, laser instrument casing 1 is made by good conductivity, good heat dissipation, the oxygen-free copper material of price/performance ratio height, with the improvement practicality, improve the price/performance ratio, and laser instrument casing 1 surface nickel plating gilding prevents the oxidation, prevents to rust and corrode, improves life.
It should be noted that the insulator lead assembly 3 includes a glass insulator 31, a transition ring 32 and a composite lead 33, the glass insulator 31 is designed to be a cylindrical cavity structure and is sleeved on the composite lead 33, the transition ring 32 is designed to be a cylindrical cavity structure and is sleeved on the glass insulator 31, and the glass insulator 31, the transition ring 32 and the composite lead 33 are integrally sintered to form the insulator lead assembly 3.
In the present embodiment, the stepped hole 4 includes a lead hole 41, a mounting hole 42 and a soldering hole 43 integrally connected in sequence, the transition ring 32 is matched with the mounting hole 42, and the soldering hole 43 is spaced from the transition ring 32 for holding the insulator lead assembly 3 in a soldered package with the laser housing 1 by a solder pad, which may be made of AgCu solder.
In the specific implementation process, one end of the composite lead 33 extending into the laser housing 1 is designed to be a flat head, and is used for gold wire bonding of the composite lead 33 and electrical connection with a chip in the laser housing 1.
Further, the width of the end of the composite lead 33 with the flat head design is smaller than the diameter of the lead hole 41, so that the composite lead 33 can be inserted conveniently.
The composite lead 33 is a 4J50 copper-clad lead with the diameter of 1.5mm, has good gold wire bonding welding quality, guarantees the reliability and stability of the device, and has the following characteristics: the chemical property is stable, and harmful intermetallic compounds are not generated in use; the low-resistance ohmic contact can be formed with the semiconductor material, and the bonding force with the semiconductor material is strong; the plasticity is good, and the bonding is easy to realize; the elasticity is small, and a certain geometric shape can be kept in the bonding process.
In the embodiment, the transition ring 32 is made of a cold-rolled carbon steel material, specifically, CRS carbon steel, which has a low cost and is used for low-cost compression sealing, the CRS carbon steel material has a thermal expansion coefficient similar to that of the laser housing 1, and as a transition material, thermal failure due to a difference in the expansion coefficient does not occur in the brazing sealing process, and due to high carbon content and poor corrosion resistance of the material, the transition ring 32 needs to be preplated with 3-5um chemical nickel treatment before sealing, that is, the transition ring 32 is plated with a 3-5um nickel layer.
Wherein, four lateral walls of the laser housing 1 are thin walls with the thickness of 1.5mm for heat dissipation.
In this embodiment, the glass insulator 31, the transition ring 32 and the composite lead 33 are integrally sintered by a compression glass sealing and sealing method, so that the cost is reduced, and the high-reliability brazing sealing insulator lead assembly 3 and the laser housing 1 are adopted, so that the market competitiveness is improved.
To sum up, the utility model discloses following beneficial effect has: the utility model discloses a 1X laser instrument encapsulation tube shell structure, parallel seal welding apron 2 welds in 1 top of laser casing, shoulder hole 4 has been seted up to laser casing 1's one end symmetry, the encapsulation of brazing of insulator lead wire subassembly 3 is in shoulder hole 4, the fiber tube hole 11 that is used for leading to optic fibre is offered to laser casing 1's the other end, an organic whole is connected with the step face 12 that is used for the chip to paste dress in laser casing 1, laser casing 1's bilateral symmetry extends has the ear 13 of seting up the fixed orifices that is used for it to fix, wash or electroplate. Through this setting promptly for laser instrument encapsulation tube shell structure possesses reliable operational environment, and life and sealing performance have improved price/performance ratio and market competition.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (10)
1. The utility model provides a 1X laser instrument encapsulation tube shell structure, is including the laser casing, parallel seal welding apron and the insulator lead wire subassembly that are cuboid structural design, its characterized in that: parallel seal weld apron weld in laser casing top, the shoulder hole has been seted up to the one end symmetry of laser casing, insulator lead wire subassembly encapsulation of brazing in the shoulder hole, the optical fiber tube hole that is used for leading to optic fibre is seted up to the other end of laser casing, an organic whole is connected with the step face that is used for chip subsides dress in the laser casing, the bilateral symmetry of laser casing extends has the ear of seting up the fixed orifices that is used for it to fix, wash or electroplate.
2. The package and package structure of claim 1, wherein a thread calibration hole is opened at the other end of the laser housing near the fiber tube hole for ensuring collimation of light by the collimator.
3. The package and package structure of claim 1, wherein the laser housing is a one-piece hermetic housing and made of an oxygen-free copper material, and the surface of the laser housing is plated with nickel and gold.
4. The structure of claim 1, wherein the insulator lead assembly comprises a glass insulator, a transition ring and a composite lead, the glass insulator is designed in a cylindrical cavity structure and is sleeved on the composite lead, the transition ring is designed in a cylindrical cavity structure and is sleeved on the glass insulator, and the glass insulator, the transition ring and the composite lead are integrally sintered to form the insulator lead assembly.
5. The package and package structure of claim 4, wherein the step hole comprises a lead hole, a mounting hole and a soldering hole integrally connected in sequence, the transition ring is matched with the mounting hole, and the soldering hole and the transition ring have a gap for holding the insulator lead assembly and the laser package by soldering through a soldering lug.
6. The package and package structure of claim 5, wherein the end of the composite lead extending into the laser housing is designed as a flat head for gold bonding and electrical connection of the composite lead to a chip in the laser housing.
7. The package and package structure of claim 6, wherein the width of the end of the composite lead with the flat head design is smaller than the diameter of the lead hole.
8. The package and package structure of claim 4, wherein the composite lead is a 1.5mm diameter 4J50 copper clad lead.
9. The package case structure of claim 4, wherein the transition ring is made of cold-rolled carbon steel material, and the transition ring is plated with a nickel layer of 3-5 um.
10. The package and package structure of claim 1, wherein the top surface of the laser housing is flat and smooth, and the four side walls of the laser housing are thin walls with a thickness of 1.5mm for heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120785815.0U CN214754652U (en) | 2021-04-16 | 2021-04-16 | 1X laser instrument encapsulation tube shell structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120785815.0U CN214754652U (en) | 2021-04-16 | 2021-04-16 | 1X laser instrument encapsulation tube shell structure |
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| CN214754652U true CN214754652U (en) | 2021-11-16 |
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| CN202120785815.0U Active CN214754652U (en) | 2021-04-16 | 2021-04-16 | 1X laser instrument encapsulation tube shell structure |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114156729A (en) * | 2021-11-24 | 2022-03-08 | 深圳市宏钢机械设备有限公司 | Packaging tube shell for high-power semiconductor laser and preparation process thereof |
| CN114204384A (en) * | 2021-12-01 | 2022-03-18 | 深圳市宏钢机械设备有限公司 | High-power laser shell packaging clamp and packaging process |
| CN114289820A (en) * | 2021-12-30 | 2022-04-08 | 河北中瓷电子科技股份有限公司 | Gold-tin brazing die and brazing method for photoelectric shell |
-
2021
- 2021-04-16 CN CN202120785815.0U patent/CN214754652U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114156729A (en) * | 2021-11-24 | 2022-03-08 | 深圳市宏钢机械设备有限公司 | Packaging tube shell for high-power semiconductor laser and preparation process thereof |
| CN114204384A (en) * | 2021-12-01 | 2022-03-18 | 深圳市宏钢机械设备有限公司 | High-power laser shell packaging clamp and packaging process |
| CN114204384B (en) * | 2021-12-01 | 2022-09-20 | 深圳市宏钢机械设备有限公司 | High-power laser shell packaging clamp and packaging process |
| CN114289820A (en) * | 2021-12-30 | 2022-04-08 | 河北中瓷电子科技股份有限公司 | Gold-tin brazing die and brazing method for photoelectric shell |
| CN114289820B (en) * | 2021-12-30 | 2023-08-18 | 河北中瓷电子科技股份有限公司 | Gold-tin brazing mold and brazing method for photoelectric shell |
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Address after: Room 101, Unit 1, Building C, No. 6 Juliu Road, Zhukeng Community, Longtian Street, Pingshan District, Shenzhen City, Guangdong Province, China Patentee after: Shenzhen Honggang Optoelectronic Packaging Technology Co.,Ltd. Address before: 518000 1-3 / F, C1 building, long industrial park, JuLongshan No.3 Road, big industrial zone, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HONGGANG MECHANISM & EQUIPMENT CO.,LTD. |
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