CN114289820A - Gold-tin brazing die and brazing method for photoelectric shell - Google Patents
Gold-tin brazing die and brazing method for photoelectric shell Download PDFInfo
- Publication number
- CN114289820A CN114289820A CN202111659827.XA CN202111659827A CN114289820A CN 114289820 A CN114289820 A CN 114289820A CN 202111659827 A CN202111659827 A CN 202111659827A CN 114289820 A CN114289820 A CN 114289820A
- Authority
- CN
- China
- Prior art keywords
- positioning
- chassis
- optical fiber
- fiber tube
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention provides a gold-tin brazing mold and a brazing method for a photoelectric shell, which belong to the technical field of semiconductor microelectronic device preparation. According to the gold-tin brazing mold and the brazing method for the photoelectric shell, the optical fiber tube is positioned through the three positioning surfaces, namely the periphery of the first boss, the periphery of the second boss and the side surface of the first positioning plate, so that the welding position of the optical fiber tube is more accurate, and the optical fiber tube is prevented from being deformed too much in the welding process. And the mounting position of the ceramic component in the mounting hole on the chassis is positioned through the chassis positioning surface on the positioning clamping plate, and then the ceramic component is positioned in the mounting hole in the axial direction through the positioning stop block, so that the mounting position of the ceramic component is more accurate.
Description
Technical Field
The invention belongs to the technical field of semiconductor microelectronic device preparation, and particularly relates to a gold-tin brazing mold and a brazing method for a photoelectric shell.
Background
Ceramic package enclosures are commonly used in high frequency, high transmission rate device packaging to provide electrical, thermal access, mechanical support, and hermetic environmental protection. When the ceramic package shell is assembled, a brazing mode is usually used to connect and fix the metal optical fiber tube and the ceramic component to the corresponding mounting positions of the metal chassis respectively. In the prior art, the outer size of the ceramic package shell is smaller. However, when the size of the package is large, particularly when the size exceeds 50mm x 50mm, the ceramic package is subjected to high-temperature soldering, so that the deformation of the ceramic package is large, the assembly size is difficult to ensure, and the subsequent installation and use of the ceramic package are seriously affected.
Disclosure of Invention
The invention aims to provide a gold-tin brazing mold and a brazing method for a photoelectric shell, and aims to solve the problem that the deformation of the conventional photoelectric shell after high-temperature brazing is difficult to guarantee in large size when the size is large.
In order to achieve the purpose, the invention adopts the technical scheme that: provides a gold-tin brazing mold of a photoelectric shell, which comprises an optical fiber tube brazing unit and a ceramic component brazing unit, the optical fiber tube brazing unit comprises a first positioning plate, a first boss, a second boss and a second positioning plate, wherein the first boss is arranged on the side surface of the first positioning plate, the periphery of the first boss is matched with the mounting groove, the second boss is arranged at the top of the first boss, the periphery of the second boss is matched with the inner wall of the optical fiber tube, the second positioning plate is used for being matched with the first positioning plate to clamp the optical fiber tube, the ceramic component brazing unit comprises two positioning clamping plates respectively arranged at two sides of the ceramic component and a positioning stop block used for positioning the mounting position of the ceramic component in the metal chassis, the positioning clamp plate is provided with a plurality of positioning holes for accommodating the ceramic component leads, and the periphery of the positioning clamp plate is also provided with a plurality of chassis positioning surfaces which are matched with the ceramic component mounting positions on the metal chassis.
In a possible implementation manner, an accommodating groove for accommodating the ceramic component and the positioning clamping plate is further formed in the top surface of the positioning stop block, the top surface of the positioning stop block abuts against the inner wall of the chassis, and a side wall positioning surface is further formed in the top surface of the positioning stop block.
In a possible implementation manner, the side surfaces of the positioning stop blocks are provided with abdicating notches for the side walls of the accommodating grooves on the positioning stop blocks to pass through.
In a possible implementation manner, the positioning hole penetrates through the positioning clamping plate, and the positioning hole comprises a first guiding section, a second guiding section arranged symmetrically to the first guiding section, and a connecting section arranged between the first guiding section and the second guiding section.
In a possible implementation manner, the first positioning plate and the first boss are of an integral structure, and the second boss and the first boss are of an integral structure.
The gold-tin brazing mold for the photoelectric shell provided by the invention has the beneficial effects that: compared with the prior art, when the optical fiber tube and the ceramic component are welded on the chassis, the optical fiber tube and the welding flux are firstly installed in the installation hole on the chassis, then the second boss is inserted into the optical fiber tube, the periphery of the first boss is kept to abut against the inner wall of the installation hole, the second positioning plate abuts against the end part of the optical fiber tube, and the first positioning plate and the second positioning plate are clamped through the clamp, so that the side surface of the first positioning plate abuts against the side wall of the chassis. In addition, when the ceramic component is welded, firstly, a lead on the ceramic component penetrates through a positioning hole in the positioning clamping plate to enable the positioning clamping plate to be abutted against and fixed on the side face of the ceramic component, then, solder is placed on the side face of the metal ring by crossing the positioning clamping plate, then, the ceramic component and the positioning clamping plate are integrally placed in the mounting groove position on the chassis, the chassis positioning face on the positioning clamping plate is abutted against the side wall of the mounting groove, and finally, the positioning stop block is placed at the end part of the ceramic component in the chassis to position the ceramic component. The circumference of the first boss, the circumference of the second boss and the three positioning surfaces on the side surface of the first positioning plate are used for positioning the optical fiber tube, so that the welding position of the optical fiber tube is more accurate, and the optical fiber tube is prevented from being deformed too much in the welding process. And the mounting position of the ceramic component in the mounting hole on the chassis is positioned through the chassis positioning surface on the positioning clamping plate, and then the ceramic component is axially positioned in the mounting hole through the positioning stop block, so that the mounting position of the ceramic component is more accurate, and meanwhile, the ceramic component can be effectively prevented from being deformed too much in the welding process.
In a first aspect, a further embodiment of the present invention provides a gold-tin soldering method for an optoelectronic package, where a gold-tin soldering mold for an optoelectronic package described in any one of the above is used in a soldering process, and the method includes the following steps:
fixing the chassis, and firmly fixing the metal chassis by using a tool or a clamp;
the optical fiber tube and the solder are installed, the solder is placed at the position, needing to be welded, on the chassis, the boss surface of the optical fiber tube is placed in the groove, needing to be welded, on the chassis, the optical fiber tube hole and the gold-tin solder hole are overlapped, the optical fiber tube is positioned by using an optical fiber tube brazing unit, and then the optical fiber tube is fixed by using a clamp;
placing the ceramic assembly and the solder, assembling the ceramic assembly, the solder and the ceramic assembly brazing unit, installing the ceramic assembly and the ceramic assembly brazing unit into the groove of the chassis, and fixing by using a clamp;
the ceramic assembly is welded with the optical fiber tube, the optical fiber tube is welded and fixed on the corresponding position of the chassis through the welding equipment matched with the welding flux, and meanwhile, the ceramic assembly is welded and fixed on the corresponding position of the chassis.
With reference to the first aspect, in a possible implementation manner, in the step of installing the optical fiber tube and the solder, the step of positioning the optical fiber tube by the optical fiber tube brazing unit includes the following steps:
the first positioning plate is installed, the second boss on the first positioning plate is inserted into the optical fiber tube, and the first boss is inserted into the groove on the side wall of the chassis until the side surface of the first positioning plate abuts against the side wall of the chassis;
and the second positioning plate is arranged, the second positioning plate is abutted against the other end part of the optical fiber tube, and the second positioning plate and the first positioning plate are mutually clamped and fixed at the two end parts of the optical fiber tube by using a tool or a clamp.
With reference to the first aspect, in one possible implementation manner, in the ceramic component and solder placing step, the positioning of the ceramic component by the ceramic component soldering unit includes the following steps:
installing the positioning clamping plates, namely enabling a lead on the ceramic component to penetrate through the positioning holes in the positioning clamping plates, enabling the side face of one of the positioning clamping plates to abut against the side face of the ceramic component with the metal ring, enabling the side face provided with the positioning clamping plate to face upwards, and then enabling the solder to cross the positioning clamping plates to be sleeved and placed on the plane of the metal ring;
the other positioning clamp plate is installed, and a lead on the other side of the ceramic component passes through a positioning hole in the other positioning clamp plate, so that the side face of the other positioning clamp plate is abutted against the other side of the ceramic component;
the ceramic component and the positioning clamping plates are installed, the assembled ceramic component and the two positioning clamping plates are installed on the chassis and are abutted against the installation position on the chassis through the chassis positioning surface on the positioning clamping plates;
the positioning stop block is installed, the positioning stop block is buckled at one end, located inside the chassis, of the ceramic assembly, the positioning clamping plate is abutted to the bottom of the accommodating groove, and meanwhile the top surface of the positioning stop block is abutted to the inner wall of the chassis.
With reference to the first aspect, in one possible implementation manner, in the step of mounting the ceramic component and the positioning clamp plate, the side of the ceramic component with the metal ring faces the chassis.
With reference to the first aspect, in one possible implementation manner, the solder is gold-tin solder, and the solder is in a ring shape adapted to the optical fiber tube or the ceramic component.
The gold-tin brazing method for the photoelectric shell has the beneficial effects that: compared with the prior art, the optical fiber tube is positioned by the circumference of the first boss, the circumference of the second boss and the three positioning surfaces on the side surface of the first positioning plate, so that the welding position of the optical fiber tube is more accurate, and the optical fiber tube is prevented from being deformed too much in the welding process. And the mounting position of the ceramic component in the mounting hole on the chassis is positioned through the chassis positioning surface on the positioning clamping plate, and then the ceramic component is positioned in the mounting hole in the axial direction through the positioning stop block, so that the ceramic component can be effectively prevented from being deformed too much in the welding process.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic view of the assembly of a base plate with fiber optic tubes and ceramic components used in the present invention;
FIG. 2 is a schematic structural diagram of a first positioning plate according to an embodiment of the present invention;
FIG. 3 is a side view of the first positioning plate shown in FIG. 2;
FIG. 4 is a schematic structural view of a second positioning plate according to an embodiment of the present invention;
FIG. 5 is a schematic structural view of a positioning clamp plate used in the embodiment of the present invention;
FIG. 6 is a cross-sectional structural view of the alignment cleat shown in FIG. 5;
fig. 7 is a schematic structural diagram of a positioning stopper used in the embodiment of the present invention.
In the figure: 1. a first positioning plate; 2. a first boss; 3. a second boss; 4. a second positioning plate; 5. positioning the clamping plate; 6. positioning holes; 7. a chassis positioning surface; 8. positioning a stop block; 9. an accommodating recess; 10. a sidewall positioning surface; 11. a chassis; 12. a ceramic component; 13. and a fiber tube.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to fig. 7, a gold-tin soldering mold and a soldering method for a photovoltaic housing according to the present invention will be described. The gold-tin brazing mold of the photoelectric shell comprises an optical fiber tube brazing unit and a ceramic component brazing unit, wherein the optical fiber tube brazing unit comprises a first positioning plate 1, a first boss 2 arranged on the side surface of the first positioning plate 1 and provided with a periphery matched with an installation groove, a second boss 3 arranged at the top of the first boss 2 and provided with a periphery matched with the inner wall of the optical fiber tube, and a second positioning plate 4 used for being matched with the first positioning plate 1 to clamp the optical fiber tube, wherein the ceramic component brazing unit comprises two positioning clamping plates 5 respectively arranged on two sides of the ceramic component and a positioning stop block 8 used for positioning the mounting position of the ceramic component in the metal chassis, a plurality of positioning holes 6 used for accommodating lead wires of the ceramic component are arranged on the positioning clamping plates 5, and a plurality of chassis positioning surfaces 7 matched with the mounting positions of the ceramic component on the metal chassis are also arranged on the periphery of the positioning clamping plates 5.
Compared with the prior art, the gold-tin brazing mold for the photoelectric shell, provided by the embodiment, has the advantages that when the optical fiber tube and the ceramic assembly are welded on the chassis, the optical fiber tube and the solder are firstly installed in the installation hole in the chassis, then the second boss 3 is inserted into the optical fiber tube and the periphery of the first boss 2 is kept to abut against the inner wall of the installation hole, the second positioning plate 4 abuts against the end part of the optical fiber tube, and the first positioning plate 1 and the second positioning plate 4 are clamped by the clamp to enable the side surface of the first positioning plate 1 to abut against the side wall of the chassis. In addition, when the ceramic component is welded, firstly, a lead on the ceramic component penetrates through a positioning hole 6 in the positioning clamping plate 5, the positioning clamping plate 5 is abutted to and fixed on the side face of the ceramic component, then, solder is placed on the side face of the metal ring by crossing the positioning clamping plate 5, then, the ceramic component and the positioning clamping plate 5 are integrally placed in the mounting groove position on the chassis, the chassis positioning face 7 on the positioning clamping plate 5 is abutted to the side wall of the mounting groove, and finally, the positioning stop block 8 is placed at the end part of the ceramic component in the chassis to position the ceramic component. The circumference of the first boss 2, the circumference of the second boss 3 and the three positioning surfaces on the side surface of the first positioning plate 1 are used for positioning the optical fiber tube, so that the welding position of the optical fiber tube is more accurate, and the optical fiber tube is prevented from being deformed too much in the welding process. And come to fix a position the mounted position of ceramic unit in the mounting hole on the chassis through chassis locating surface 7 on the locating splint 5, then fix a position ceramic unit in the axial of mounting hole in through location dog 8, can make ceramic unit's mounted position more accurate, can effectively prevent ceramic unit too big in welding process deformation simultaneously.
It should be noted that when the ceramic component is abutted against the positioning stop 8, the solder should be located on the ceramic component at a position between the metal ring and the side wall of the chassis. The position on first boss 2 is suit to the solder suit after the fiber tube is installed, also can fix the solder when fixing a position fiber tube and ceramic subassembly.
In some embodiments, the above-described feature positioning stop 8 may be configured as shown in FIG. 7. Referring to fig. 7, the top surface of the positioning block 8 is further provided with an accommodating groove 9 for accommodating the ceramic component and the positioning clamp plate 5, the top surface of the positioning block 8 abuts against the inner wall of the chassis, and the top surface of the positioning block 8 is further provided with a side wall positioning surface 10. Specifically, ceramic assembly and locating splint 5 stretch into and hold in the recess 9 and support and lean on the bottom that holds recess 9, and the top surface that holds recess 9 simultaneously supports and leans on the chassis inner wall, and the degree of depth through holding recess 9 comes to carry on spacingly to ceramic assembly along the axial position of mounting hole, makes ceramic assembly's mounted position more accurate.
As shown in fig. 5, on the basis of the positioning stop 8, the side surfaces of the positioning overtime work are provided with abdicating notches for the side walls of the accommodating grooves 9 on the positioning stop 8 to pass through. Specifically, the distance between two notch bottom surfaces of stepping down is less than the whole width of holding groove 9, and the setting of the notch of stepping down can make the 8 spiral-lock of location dog to ceramic package's tip more convenient, makes ceramic package location in the mounting hole axial more convenient.
In some embodiments, the above-described feature positioning stop 8 may take the configuration shown in FIG. 6. Referring to fig. 6, the positioning holes 6 are disposed through the positioning clamp plate 5, and each of the positioning holes 6 includes a first guide section, a second guide section symmetrically disposed with the first guide section, and a connection section disposed between the first guide section and the second guide section. Specifically, first direction section and second direction section are the toper, and the diameter of first direction section and second direction section all reduces from outside to inside gradually to first direction section and second direction are mutual symmetry setting. The first guide section and the second guide section adopt the structure, so that the lead on the ceramic component can be more conveniently inserted into the positioning hole 6
Preferably, the first positioning plate 1 and the first boss 2 are integrated, and the second boss 3 and the first boss 2 are also integrated. The relative position between the first boss 2 and the second boss 3 can be made more accurate.
In a first aspect, a further embodiment of the present invention provides a gold-tin soldering method for an optoelectronic package, where a gold-tin soldering mold for an optoelectronic package described in any one of the above is used in the soldering process, including the following steps:
fixing the chassis, and firmly fixing the metal chassis by using a tool or a clamp;
the optical fiber tube and the solder are installed, the solder is placed at the position, needing to be welded, on the chassis, the boss surface of the optical fiber tube is placed in the groove, needing to be welded, on the chassis, the optical fiber tube hole and the gold-tin solder hole are overlapped, the optical fiber tube is positioned by using an optical fiber tube brazing unit, and then the optical fiber tube is fixed by using a clamp;
placing the ceramic assembly and the solder, assembling the ceramic assembly, the solder and the ceramic assembly brazing unit, installing the ceramic assembly and the ceramic assembly brazing unit into the groove of the chassis, and fixing by using a clamp;
the ceramic assembly is welded with the optical fiber tube, the optical fiber tube is welded and fixed on the corresponding position of the chassis through the welding equipment matched with the welding flux, and meanwhile, the ceramic assembly is welded and fixed on the corresponding position of the chassis.
With reference to the first aspect, in one possible implementation manner, in the fiber tube and solder installing step, the positioning, by the fiber tube brazing unit, the fiber tube includes the following steps:
the first positioning plate 1 is installed, the second boss 3 on the first positioning plate 1 is inserted into the optical fiber tube, and the first boss 2 is inserted into the groove on the side wall of the chassis until the side surface of the first positioning plate 1 abuts against the side wall of the chassis;
the second positioning plate 4 is installed, the second positioning plate 4 is abutted against the other end part of the optical fiber tube, and the second positioning plate 4 and the first positioning plate 1 are clamped and fixed at the two end parts of the optical fiber tube by using a tool or a clamp.
With reference to the first aspect, in one possible implementation manner, in the ceramic component and solder placing step, the positioning of the ceramic component by the ceramic component soldering unit includes the following steps:
installing the positioning clamping plates 5, enabling a lead on the ceramic component to pass through the positioning holes 6 on the positioning clamping plates 5, enabling the side surface of one positioning clamping plate 5 to abut against the side surface of the ceramic component with the metal ring, enabling the side surface provided with the positioning clamping plate 5 to face upwards, and then enabling the solder to cross the positioning clamping plates 5 to be sleeved and placed on the plane of the metal ring;
the other positioning clamp plate 5 is installed, and a lead on the other side of the ceramic component passes through a positioning hole 6 on the other positioning clamp plate 5, so that the side surface of the other positioning clamp plate 5 is abutted against the other side of the ceramic component;
the ceramic component and the positioning splints 5 are installed, the assembled ceramic component and the two positioning splints 5 are installed on the chassis, and the ceramic component and the two positioning splints 5 are propped against the installation position on the chassis through the chassis positioning surface 7 on the positioning splints 5;
the positioning stop block 8 is installed, the positioning stop block 8 is buckled at one end of the ceramic component, which is positioned inside the chassis, so that the positioning clamping plate 5 is supported at the bottom of the accommodating groove 9, and the top surface of the positioning stop block 8 is supported at the inner wall of the chassis.
With reference to the first aspect, in a possible implementation manner, in the step of mounting the ceramic component with the positioning clamp 5, the side of the ceramic component with the metal ring faces the chassis. The solder may be compressed by the metal ring.
With reference to the first aspect, in one possible implementation manner, the solder is gold-tin solder, and the solder is in a ring shape adapted to the optical fiber tube or the ceramic component. The gold-tin solder can be soldered at a lower temperature, and the influence of high temperature on chassis deformation can be effectively reduced. The annular shape of the solder can facilitate the installation and fixation of the solder.
The gold-tin brazing method for the photoelectric shell has the beneficial effects that: compared with the prior art, the optical fiber tube is positioned by the circumference of the first boss 2, the circumference of the second boss 3 and the three positioning surfaces on the side surface of the first positioning plate 1, so that the welding position of the optical fiber tube is more accurate, and the optical fiber tube is prevented from being deformed too much in the welding process. And the mounting position of the ceramic component in the mounting hole on the chassis is positioned through the chassis positioning surface 7 on the positioning clamping plate 5, and then the ceramic component is axially positioned in the mounting hole through the positioning stop block 8, so that the ceramic component can be effectively prevented from being deformed too much in the welding process.
The large-size photoelectric shell has the characteristics of large deformation and large welding stress in the welding process due to large welding area, the welding strength is obviously influenced by the deformation stress, and the condition of welding failure caused by overlarge stress may exist. The welding deformation stress is influenced most obviously by temperature, and under the same welding area, the higher the welding temperature is, the longer the welding time is, the larger the product deformation degree is, and the larger the stress on the welding position is.
The gold-tin soldering method is used, Au80Sn20 eutectic solder is used, the melting point is only 280 ℃, the highest soldering temperature is about 350 ℃, a temperature curve is provided with a preheating zone and a heat preservation zone, the preheating zone has a certain buffer effect on the soldering deformation of a product, the soldering heat preservation time is only about 6min under the condition of the highest temperature of the heat preservation zone, compared with the melting point 780 ℃ of Ag72Cu28 eutectic solder commonly used for soldering of photoelectric shells in the industry, the soldering temperature is usually 800-900 ℃, the soldering time is more than 15min, the temperature of the gold-tin soldering method is obviously reduced, the soldering time is shortened, and the gold-tin soldering method has an important effect on improving the soldering deformation and the soldering stress.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A gold-tin brazing mold of a photoelectric shell is characterized by comprising an optical fiber tube brazing unit and a ceramic component brazing unit, the optical fiber tube brazing unit comprises a first positioning plate, a first boss, a second boss and a second positioning plate, wherein the first boss is arranged on the side surface of the first positioning plate, the periphery of the first boss is matched with the mounting groove, the second boss is arranged at the top of the first boss, the periphery of the second boss is matched with the inner wall of the optical fiber tube, the second positioning plate is used for being matched with the first positioning plate to clamp the optical fiber tube, the ceramic component brazing unit comprises two positioning clamping plates respectively arranged at two sides of the ceramic component and a positioning stop block used for positioning the mounting position of the ceramic component in the metal chassis, the positioning clamp plate is provided with a plurality of positioning holes for accommodating the ceramic component leads, and the periphery of the positioning clamp plate is also provided with a plurality of chassis positioning surfaces matched with the ceramic component mounting positions on the metal chassis.
2. The Au-Sn brazing mold for optoelectronic housing as claimed in claim 1, wherein the positioning block is further provided with a receiving groove on a top surface thereof for receiving the ceramic assembly and the positioning clamp plate, the top surface of the positioning block abuts against an inner wall of the chassis, and the top surface of the positioning block is further provided with a side wall positioning surface.
3. The Au-Sn brazing mold for optoelectronic package as set forth in claim 2, wherein the side surfaces of the positioning stoppers are provided with relief notches for the side walls of the accommodating grooves on the positioning stoppers to pass through.
4. The Au-Sn brazing mold for optoelectronic package as set forth in claim 3, wherein said positioning holes are provided through the positioning clamping plate, and each of said positioning holes comprises a first guide section, a second guide section symmetrically provided with respect to said first guide section, and a connecting section provided between the first guide section and the second guide section.
5. The optoelectronic package Au-Sn brazing mold as recited in claim 1, wherein the first positioning plate is integrally formed with the first boss, and the second boss is integrally formed with the first boss.
6. A gold-tin soldering method of a photovoltaic housing, wherein the gold-tin soldering mold of the photovoltaic housing as claimed in any one of claims 1 to 5 is used in the soldering process, and the method comprises the following steps:
fixing the chassis, and firmly fixing the metal chassis by using a tool or a clamp;
the optical fiber tube and the solder are installed, the solder is placed at the position, needing to be welded, on the chassis, the boss surface of the optical fiber tube is placed in the groove, needing to be welded, on the chassis, the optical fiber tube hole and the gold-tin solder hole are overlapped, the optical fiber tube is positioned by using an optical fiber tube brazing unit, and then the optical fiber tube is fixed by using a clamp;
placing the ceramic assembly and the solder, assembling the ceramic assembly, the solder and the ceramic assembly brazing unit, installing the ceramic assembly and the ceramic assembly brazing unit into the groove of the chassis, and fixing by using a clamp;
the ceramic assembly is welded with the optical fiber tube, the optical fiber tube is welded and fixed on the corresponding position of the chassis through the welding equipment matched with the welding flux, and meanwhile, the ceramic assembly is welded and fixed on the corresponding position of the chassis.
7. The method for gold-tin soldering of an optoelectronic package of claim 6, wherein in the step of mounting the optical fiber tube with solder, the step of positioning the optical fiber tube by the optical fiber tube soldering unit comprises the steps of:
the first positioning plate is installed, the second boss on the first positioning plate is inserted into the optical fiber tube, and the first boss is inserted into the groove on the side wall of the chassis until the side surface of the first positioning plate abuts against the side wall of the chassis;
and the second positioning plate is arranged, the second positioning plate is abutted against the other end part of the optical fiber tube, and the second positioning plate and the first positioning plate are mutually clamped and fixed at the two end parts of the optical fiber tube by using a tool or a clamp.
8. The method of gold-tin soldering of an optoelectronic package as recited in claim 6, wherein the ceramic package-to-solder placement step, the positioning of the ceramic package by the ceramic package soldering unit, comprises the steps of:
installing the positioning clamping plates, namely enabling a lead on the ceramic component to penetrate through the positioning holes in the positioning clamping plates, enabling the side face of one of the positioning clamping plates to abut against the side face of the ceramic component with the metal ring, enabling the side face provided with the positioning clamping plate to face upwards, and then enabling the solder to cross the positioning clamping plates to be sleeved and placed on the plane of the metal ring;
the other positioning clamp plate is installed, and a lead on the other side of the ceramic component passes through a positioning hole in the other positioning clamp plate, so that the side face of the other positioning clamp plate is abutted against the other side of the ceramic component;
the ceramic component and the positioning clamping plates are installed, the assembled ceramic component and the two positioning clamping plates are installed on the chassis and are abutted against the installation position on the chassis through the chassis positioning surface on the positioning clamping plates;
the positioning stop block is installed, the positioning stop block is buckled at one end, located inside the chassis, of the ceramic assembly, the positioning clamping plate is abutted to the bottom of the accommodating groove, and meanwhile the top surface of the positioning stop block is abutted to the inner wall of the chassis.
9. The method of au-sn soldering of a photovoltaic housing according to claim 8, wherein in the step of mounting the ceramic assembly to the jig plate, the side of the ceramic assembly having the metal ring faces the bottom plate.
10. The method of gold-tin soldering of a photovoltaic enclosure of any one of claims 6 to 9, wherein the solder is gold-tin solder in a ring shape fitting to the fiber tube or the ceramic package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111659827.XA CN114289820B (en) | 2021-12-30 | 2021-12-30 | Gold-tin brazing mold and brazing method for photoelectric shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111659827.XA CN114289820B (en) | 2021-12-30 | 2021-12-30 | Gold-tin brazing mold and brazing method for photoelectric shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114289820A true CN114289820A (en) | 2022-04-08 |
| CN114289820B CN114289820B (en) | 2023-08-18 |
Family
ID=80974357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111659827.XA Active CN114289820B (en) | 2021-12-30 | 2021-12-30 | Gold-tin brazing mold and brazing method for photoelectric shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114289820B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05335461A (en) * | 1992-05-29 | 1993-12-17 | Matsushita Electric Works Ltd | Soldering method for lead frame |
| JPH09167848A (en) * | 1995-12-14 | 1997-06-24 | Fujitsu Ltd | Optical semiconductor assembly |
| JP2004079965A (en) * | 2002-08-22 | 2004-03-11 | Sumitomo Electric Ind Ltd | Optical semiconductor module and its manufacturing method |
| JP2014227306A (en) * | 2013-05-20 | 2014-12-08 | 日鉄住金エレクトロデバイス株式会社 | Brazing tool for ceramic package |
| CN205129122U (en) * | 2015-11-24 | 2016-04-06 | 北京北广科技股份有限公司 | Pottery filtering board welding frock |
| CN205852125U (en) * | 2016-06-30 | 2017-01-04 | 西安赛尔电子材料科技有限公司 | A kind of laser instrument shell soldering mould |
| CN108422059A (en) * | 2018-03-02 | 2018-08-21 | 河北中瓷电子科技有限公司 | A kind of package casing soldering mold and method for welding |
| CN109128428A (en) * | 2018-10-13 | 2019-01-04 | 娄底市安地亚斯电子陶瓷有限公司 | A kind of welding fixture and ceramic relay fixed-position welding method of ceramics relay |
| CN212648721U (en) * | 2020-07-21 | 2021-03-02 | 深圳市宏钢机械设备有限公司 | 980nm laser ceramic packaging tube shell |
| CN113263241A (en) * | 2021-06-25 | 2021-08-17 | 福建火炬电子科技股份有限公司 | Production device and method of ceramic capacitor without encapsulated lead |
| CN214754652U (en) * | 2021-04-16 | 2021-11-16 | 深圳市宏钢机械设备有限公司 | 1X laser instrument encapsulation tube shell structure |
-
2021
- 2021-12-30 CN CN202111659827.XA patent/CN114289820B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05335461A (en) * | 1992-05-29 | 1993-12-17 | Matsushita Electric Works Ltd | Soldering method for lead frame |
| JPH09167848A (en) * | 1995-12-14 | 1997-06-24 | Fujitsu Ltd | Optical semiconductor assembly |
| JP2004079965A (en) * | 2002-08-22 | 2004-03-11 | Sumitomo Electric Ind Ltd | Optical semiconductor module and its manufacturing method |
| JP2014227306A (en) * | 2013-05-20 | 2014-12-08 | 日鉄住金エレクトロデバイス株式会社 | Brazing tool for ceramic package |
| CN205129122U (en) * | 2015-11-24 | 2016-04-06 | 北京北广科技股份有限公司 | Pottery filtering board welding frock |
| CN205852125U (en) * | 2016-06-30 | 2017-01-04 | 西安赛尔电子材料科技有限公司 | A kind of laser instrument shell soldering mould |
| CN108422059A (en) * | 2018-03-02 | 2018-08-21 | 河北中瓷电子科技有限公司 | A kind of package casing soldering mold and method for welding |
| CN109128428A (en) * | 2018-10-13 | 2019-01-04 | 娄底市安地亚斯电子陶瓷有限公司 | A kind of welding fixture and ceramic relay fixed-position welding method of ceramics relay |
| CN212648721U (en) * | 2020-07-21 | 2021-03-02 | 深圳市宏钢机械设备有限公司 | 980nm laser ceramic packaging tube shell |
| CN214754652U (en) * | 2021-04-16 | 2021-11-16 | 深圳市宏钢机械设备有限公司 | 1X laser instrument encapsulation tube shell structure |
| CN113263241A (en) * | 2021-06-25 | 2021-08-17 | 福建火炬电子科技股份有限公司 | Production device and method of ceramic capacitor without encapsulated lead |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114289820B (en) | 2023-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2962830B2 (en) | Optical module and manufacturing method thereof | |
| US6709169B2 (en) | Thermally and mechanically stable low-cost high thermal conductivity structure for single-mode fiber coupling to laser diode | |
| US4997243A (en) | Method of mounting a light emitting chip and an optical fiber on a photoelectric device | |
| US4883342A (en) | Method of assembling a light emitting device with an optical fiber | |
| EP0104882B1 (en) | Optical fibre coupling assemblies | |
| US5719979A (en) | Optical semiconductor module and method for manufacturing the same | |
| CN202886656U (en) | Optical fiber coupling structure capable of adotping movable optical fiber connector | |
| JPH02139506A (en) | Optical module | |
| CN109128428B (en) | Welding fixture of ceramic relay and ceramic relay positioning welding method | |
| US9297977B2 (en) | Lens optical component with lens housing supported by lens holder | |
| WO1989009421A1 (en) | Optical semiconductor device and production thereof | |
| US6087621A (en) | Method for laser hammering a multi-channel optoelectronic device module | |
| EP1239559A2 (en) | Semiconductor laser module and method for optically coupling laser light and optical fiber | |
| EP2860561B1 (en) | Light source device | |
| CN114289820A (en) | Gold-tin brazing die and brazing method for photoelectric shell | |
| CN108695622B (en) | Discrete device | |
| US6603093B2 (en) | Method for alignment of optical components using laser welding | |
| CN220492411U (en) | Fixing structure of laser tail fiber | |
| US7035521B2 (en) | Method and apparatus for the integration of a VCSEL flex with a parallel optical transceiver package | |
| EP1347323A1 (en) | Photonic package based on multi-functional lid | |
| JP3847178B2 (en) | Hermetic sealing structure of optical fiber and optical fiber array using the same | |
| JPH0894889A (en) | Semiconductor laser module | |
| CN114583545A (en) | Mechanism suitable for butterfly laser lead wire takes shape | |
| CN110687643A (en) | Metal packaging shell sealing structure and packaging method thereof | |
| CN117242658A (en) | Heat dissipation in a laser device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |