CN114289820B - Gold-tin brazing mold and brazing method for photoelectric shell - Google Patents
Gold-tin brazing mold and brazing method for photoelectric shell Download PDFInfo
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- CN114289820B CN114289820B CN202111659827.XA CN202111659827A CN114289820B CN 114289820 B CN114289820 B CN 114289820B CN 202111659827 A CN202111659827 A CN 202111659827A CN 114289820 B CN114289820 B CN 114289820B
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Abstract
The invention provides a gold-tin brazing die and a brazing method of a photoelectric shell, which belong to the technical field of semiconductor microelectronic device preparation. According to the gold-tin brazing mold and the brazing method for the photoelectric shell, the optical fiber tube is positioned through the peripheral ring of the first boss, the peripheral ring of the second boss and the side surfaces of the first positioning plate, so that the welding position of the optical fiber tube is more accurate, and meanwhile, the optical fiber tube is prevented from being deformed excessively in the welding process. And the mounting position of the ceramic component in the mounting hole on the chassis is positioned through the chassis positioning surface on the positioning clamping plate, and then the ceramic component is positioned in the axial direction in the mounting hole through the positioning stop block, so that the mounting position of the ceramic component is more accurate.
Description
Technical Field
The invention belongs to the technical field of semiconductor microelectronic device preparation, and particularly relates to a gold-tin brazing die and a brazing method of a photoelectric shell.
Background
Ceramic package housings are commonly used in high frequency, high transmission rate device packages to provide electrical, thermal vias, mechanical support, and hermetic environmental protection. When the ceramic packaging shell is assembled, a brazing mode is generally needed to be used for realizing that the metal optical fiber tube and the ceramic component are respectively connected and fixed on the corresponding installation positions of the metal chassis. The external dimension of the common ceramic package shell is smaller in the prior art. However, when the size of the shell is large, particularly when the size exceeds 50mm, the deformation of the ceramic package shell is large and the assembly size is difficult to ensure after the ceramic package shell is subjected to high-temperature brazing, so that the subsequent installation and use of the ceramic package are seriously affected.
Disclosure of Invention
The invention aims to provide a gold-tin brazing die and a brazing method of a photoelectric shell, and aims to solve the problem that the deformation of the existing photoelectric shell after high-temperature brazing is large in size and difficult to guarantee.
In order to achieve the above purpose, the invention adopts the following technical scheme: the utility model provides a photoelectric housing's gold tin brazing mold, including optical fiber tube brazing unit and ceramic component brazing unit, optical fiber tube brazing unit includes first locating plate, sets up on the first locating plate side and the circumference is in with the first boss of the mutual adaptation of mounting groove, set up first boss top department and circumference and the second boss of optical fiber tube inner wall looks adaptation and be used for with first locating plate cooperation with the tight second locating plate of optical fiber tube clamp, ceramic component brazing unit includes two locating splint that set up respectively in ceramic component both sides and be used for the location ceramic component in the location dog of metal chassis mounted position, be provided with a plurality of locating holes that are used for holding ceramic component lead wire on the locating splint, still be provided with on the circumference a plurality of and the metal chassis ceramic component mounted position mutually support's chassis locating surface.
In one possible implementation manner, the top surface of the positioning stop block is further provided with an accommodating groove for accommodating the ceramic component and the positioning clamping plate, the top surface of the positioning stop block is abutted against the inner wall of the chassis, and two side walls of the accommodating groove form side wall positioning surfaces for limiting the positioning clamping plate.
In one possible implementation, the side surfaces of the positioning clamping plates are provided with yielding notches for the side wall positioning surfaces of the positioning stop blocks to pass through.
In one possible implementation manner, the positioning holes are formed through the positioning clamping plate, and each positioning hole comprises a first guiding section, a second guiding section symmetrically arranged with the first guiding section, and a connecting section arranged between the first guiding section and the second guiding section.
In one possible implementation manner, the first positioning plate and the first boss are integrally formed, and the second boss and the first boss are integrally formed.
The gold-tin brazing mold of the photoelectric shell has the beneficial effects that: compared with the prior art, when the optical fiber tube and the ceramic component are welded to the chassis, the optical fiber tube and the solder are firstly installed in the installation hole on the chassis, then the second boss is inserted into the optical fiber tube and keeps the circumference of the first boss to be abutted against the inner wall of the installation hole, the second locating plate is abutted against the end part of the optical fiber tube, and the first locating plate and the second locating plate are clamped through the clamp, so that the side face of the first locating plate is abutted against the side wall of the chassis. In addition, when the ceramic component is welded, firstly, a lead wire on the ceramic component passes through a positioning hole on a positioning clamping plate, so that the positioning clamping plate is abutted against and fixed on the side surface of the ceramic component, then, solder is placed on the side surface of a metal ring beyond the positioning clamping plate, then, the ceramic component and the positioning clamping plate are integrally placed at the position of a mounting groove on a chassis, the positioning surface of the chassis on the positioning clamping plate is abutted against the side wall of the mounting groove, and finally, a positioning stop block is placed at the end part of the ceramic component, which is positioned in the chassis, to position the ceramic component. The optical fiber tube is positioned through the peripheral ring of the first boss, the peripheral ring of the second boss and the three positioning surfaces of the side surface of the first positioning plate, so that the welding position of the optical fiber tube is more accurate, and meanwhile, the optical fiber tube is prevented from being deformed too much in the welding process. And the mounting position of the ceramic component in the mounting hole on the chassis is positioned through the chassis positioning surface on the positioning clamping plate, and then the ceramic component is positioned in the axial direction in the mounting hole through the positioning stop block, so that the mounting position of the ceramic component is more accurate, and meanwhile, the ceramic component is effectively prevented from being deformed too much in the welding process.
In a first aspect, the present invention further provides a method for soldering a tin solder of an optoelectronic housing, where the soldering process uses the tin solder mold of any one of the above optoelectronic housing, and the method includes the following steps:
the chassis is fixed, and a fixture or a clamp is used for fixing the metal chassis firmly;
the method comprises the steps of installing an optical fiber pipe and welding flux, placing the welding flux at a position on a chassis where the optical fiber pipe needs to be welded, placing a boss surface of the optical fiber pipe into a groove on the chassis where the optical fiber pipe needs to be welded, enabling an optical fiber pipe hole to coincide with a gold-tin welding flux hole, positioning the optical fiber pipe by using an optical fiber pipe brazing unit, and then fixing by using a clamp;
placing the ceramic component and the welding flux, assembling the ceramic component, the welding flux and the ceramic component brazing unit, mounting the ceramic component and the ceramic component brazing unit in a bottom disc groove, and fixing by using a clamp;
the ceramic component is welded with the optical fiber pipe, the optical fiber pipe is welded and fixed at the corresponding position on the chassis through welding equipment matched with solder, and meanwhile, the ceramic component is welded and fixed at the corresponding position on the chassis.
With reference to the first aspect, in one possible implementation manner, in the step of installing the optical fiber tube and the solder, the positioning the optical fiber tube by the optical fiber tube soldering unit includes the following steps:
the first positioning plate is installed, a second boss on the first positioning plate is inserted into the optical fiber tube, and the first boss is inserted into a groove on the side wall of the chassis until the side surface of the first positioning plate abuts against the side wall of the chassis;
the second locating plate is installed, the second locating plate is abutted against the other end portion of the optical fiber tube, and the second locating plate and the first locating plate are clamped and fixed to the two end portions of the optical fiber tube by means of a tool or a clamp.
With reference to the first aspect, in one possible implementation manner, in the step of placing the ceramic component with solder, the step of positioning the ceramic component by the ceramic component soldering unit includes the steps of:
the positioning clamping plates are arranged, the lead wires on the ceramic component pass through the positioning holes on the positioning clamping plates, the side surface of one positioning clamping plate is abutted against the side surface of one side of the ceramic component with the metal ring, the side surface provided with the positioning clamping plates faces upwards, and then the solder is sleeved on the plane of the metal ring beyond the positioning clamping plates;
the other locating clamping plate is arranged, and a lead wire on the other side of the ceramic component passes through a locating hole on the other locating clamping plate, so that the side surface of the other locating clamping plate is abutted against the other side of the ceramic component;
the ceramic component and the positioning clamping plates are installed, the assembled ceramic component and the two positioning clamping plates are installed on the chassis, and the ceramic component and the two positioning clamping plates are abutted against the installation position on the chassis through the chassis positioning surface on the positioning clamping plates;
the positioning stop block is installed, the positioning stop block is buckled at one end of the ceramic component, which is positioned in the chassis, so that the positioning clamping plate is abutted against the bottom of the accommodating groove, and the top surface of the positioning stop block is abutted against the inner wall of the chassis.
With reference to the first aspect, in a possible implementation manner, in the step of installing the ceramic component and the locating clamp plate, a side of the ceramic component with the metal ring faces the chassis.
With reference to the first aspect, in one possible implementation manner, the solder is gold-tin solder, and the solder is ring-shaped adapted to the fiber tube or the ceramic component.
The gold-tin brazing method of the photoelectric shell has the beneficial effects that: compared with the prior art, the optical fiber tube is positioned through the periphery of the first boss, the periphery of the second boss and the three positioning faces of the side face of the first positioning plate, so that the welding position of the optical fiber tube is more accurate, and meanwhile, the optical fiber tube is prevented from being deformed too much in the welding process. And the mounting position of the ceramic component in the mounting hole on the chassis is positioned through the chassis positioning surface on the positioning clamping plate, and then the ceramic component is positioned in the axial direction in the mounting hole through the positioning stop block, so that the ceramic component can be effectively prevented from being deformed too much in the welding process.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an assembly of a chassis and fiber optic tube and ceramic components employed in the present invention;
FIG. 2 is a schematic diagram of a first positioning plate according to an embodiment of the present invention;
FIG. 3 is a schematic side view of the first positioning plate shown in FIG. 2;
FIG. 4 is a schematic structural diagram of a second positioning plate according to an embodiment of the present invention;
FIG. 5 is a schematic view of a locating splint according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of the locating cleat shown in FIG. 5;
fig. 7 is a schematic structural diagram of a positioning block according to an embodiment of the present invention.
In the figure: 1. a first positioning plate; 2. a first boss; 3. a second boss; 4. a second positioning plate; 5. positioning clamping plates; 6. positioning holes; 7. a chassis locating surface; 8. positioning a stop block; 9. an accommodating groove; 10. a sidewall locating surface; 11. a chassis; 12. a ceramic component; 13. an optical fiber tube.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1 to 7, a description will now be given of a mold and a method for soldering a photovoltaic module according to the present invention. The utility model provides a photoelectric housing's metal tin brazing mold, including optical fiber tube brazing unit and ceramic component brazing unit, optical fiber tube brazing unit includes first locating plate 1, set up on first locating plate 1 side and the circumference with the first boss 2 of the mutual adaptation of mounting groove, set up in first boss 2 top department and circumference and optical fiber tube inner wall looks adaptation's second boss 3, and be used for with first locating plate 1 cooperation with the tight second locating plate 4 of optical fiber tube clamp, ceramic component brazing unit includes two locating splint 5 that set up respectively in ceramic component both sides, and be used for the location dog 8 of location ceramic component mounted position in the metal chassis, be provided with a plurality of locating holes 6 that are used for holding ceramic component lead wire on the locating splint 5, still be provided with a plurality of chassis locating surfaces 7 that mutually support with ceramic component mounted position on the metal chassis on the circumference of locating splint 5.
Compared with the prior art, when the optical fiber tube and the ceramic component are welded to the chassis, the optical fiber tube and the solder are firstly installed in the installation holes on the chassis, then the second boss 3 is inserted into the optical fiber tube and keeps the circumference of the first boss 2 to be abutted against the inner wall of the installation holes, the second positioning plate 4 is abutted against the end part of the optical fiber tube, and the first positioning plate 1 and the second positioning plate 4 are clamped by the clamp to enable the side face of the first positioning plate 1 to be abutted against the side wall of the chassis. In addition, when the ceramic component is welded, firstly, a lead wire on the ceramic component passes through a positioning hole 6 on a positioning clamping plate 5, so that the positioning clamping plate 5 is abutted against and fixed on the side surface of the ceramic component, then, solder is placed on the side surface of a metal ring beyond the positioning clamping plate 5, then, the ceramic component and the positioning clamping plate 5 are integrally placed at a mounting groove position on a chassis, a chassis positioning surface 7 on the positioning clamping plate 5 is abutted against the side wall of the mounting groove, and finally, a positioning stop block 8 is placed at the end part of the ceramic component, which is positioned in the chassis, to position the ceramic component. The optical fiber tube is positioned through the circumference of the first boss 2, the circumference of the second boss 3 and the three positioning faces of the side face of the first positioning plate 1, so that the welding position of the optical fiber tube is more accurate, and meanwhile, the optical fiber tube is prevented from being deformed too much in the welding process. And the mounting position of the ceramic component in the mounting hole on the chassis is positioned through the chassis positioning surface 7 on the positioning clamping plate 5, and then the ceramic component is positioned in the axial direction in the mounting hole through the positioning stop block 8, so that the mounting position of the ceramic component is more accurate, and meanwhile, the ceramic component is effectively prevented from being deformed too much in the welding process.
It should be noted that when the ceramic component is abutted against the positioning stopper 8, the solder should be located on the ceramic component between the metal ring and the side wall of the chassis. The solder is sleeved on the first boss 2 after the optical fiber tube is installed, and the solder can be fixed while the optical fiber tube and the ceramic component are positioned.
In some embodiments, the feature positioning block 8 may be configured as shown in fig. 7. Referring to fig. 7, the top surface of the positioning block 8 is further provided with a containing groove 9 for containing the ceramic component and the positioning clamping plate 5, the top surface of the positioning block 8 is abutted against the inner wall of the chassis, and two side walls of the containing groove 9 form a side wall positioning surface 10 for limiting the positioning clamping plate 5. Specifically, the ceramic component and the locating clamping plate 5 extend into the accommodating groove 9 and lean against the bottom of the accommodating groove 9, meanwhile, the top surface of the accommodating groove 9 is propped against the inner wall of the chassis, and the position of the ceramic component along the axial direction of the mounting hole is limited through the depth of the accommodating groove 9, so that the mounting position of the ceramic component is more accurate.
As shown in fig. 5, on the basis of the positioning block 8, the side surfaces of the positioning clamping plates 5 are provided with yielding notches for the side wall positioning surfaces 10 of the positioning block 8 to pass through. Specifically, the distance between two gap bottoms of stepping down is less than the whole width of holding recess 9, and the setting of the gap of stepping down can let the tip that location dog 8 was buckled to ceramic component more convenient, makes ceramic component at mounting hole axial orientation's location more convenient.
In some embodiments, the above-described feature positioning block 8 may take the configuration shown in fig. 6. Referring to fig. 6, the positioning holes 6 are provided through the positioning clamping plate 5, and the positioning holes 6 each include a first guide section, a second guide section provided symmetrically with the first guide section, and a connecting section provided between the first guide section and the second guide section. Specifically, the first guide section and the second guide section are both conical, the diameters of the first guide section and the second guide section are gradually reduced from outside to inside, and the first guide section and the second guide section are symmetrically arranged. The first guide section and the second guide section adopt the structure, so that the lead wire on the ceramic component is more convenient to be inserted into the positioning hole 6
Preferably, the first positioning plate 1 and the first boss 2 are integrally formed, and the second boss 3 and the first boss 2 are integrally formed. The relative position between the first boss 2 and the second boss 3 can be made more accurate.
In a first aspect, the present invention further provides a method for soldering a tin solder of an optoelectronic housing, in which any one of the above-mentioned tin solder dies of the optoelectronic housing is used in the soldering process, including the steps of:
the chassis is fixed, and a fixture or a clamp is used for fixing the metal chassis firmly;
the method comprises the steps of installing an optical fiber pipe and welding flux, placing the welding flux at a position on a chassis where the optical fiber pipe needs to be welded, placing a boss surface of the optical fiber pipe into a groove on the chassis where the optical fiber pipe needs to be welded, enabling an optical fiber pipe hole to coincide with a gold-tin welding flux hole, positioning the optical fiber pipe by using an optical fiber pipe brazing unit, and then fixing by using a clamp;
placing the ceramic component and the welding flux, assembling the ceramic component, the welding flux and the ceramic component brazing unit, mounting the ceramic component and the ceramic component brazing unit in a bottom disc groove, and fixing by using a clamp;
the ceramic component is welded with the optical fiber pipe, the optical fiber pipe is welded and fixed at the corresponding position on the chassis through welding equipment matched with solder, and meanwhile, the ceramic component is welded and fixed at the corresponding position on the chassis.
With reference to the first aspect, in one possible implementation manner, in the step of installing the optical fiber tube and the solder, the positioning the optical fiber tube by the optical fiber tube soldering unit includes the following steps:
the first positioning plate 1 is installed, the second boss 3 on the first positioning plate 1 is inserted into the optical fiber tube, and the first boss 2 is inserted into the groove on the side wall of the chassis until the side surface of the first positioning plate 1 abuts against the side wall of the chassis;
the second positioning plate 4 is installed, the second positioning plate 4 is abutted against the other end part of the optical fiber tube, and the second positioning plate 4 and the first positioning plate 1 are clamped and fixed at the two end parts of the optical fiber tube by using a tool or a clamp.
With reference to the first aspect, in one possible implementation manner, in the step of placing the ceramic component with solder, the step of positioning the ceramic component by the ceramic component soldering unit includes the steps of:
the positioning clamping plates 5 are installed, the lead wires on the ceramic component pass through the positioning holes 6 on the positioning clamping plates 5, the side surface of one positioning clamping plate 5 is abutted against the side surface of the ceramic component on the side with the metal ring, the side surface provided with the positioning clamping plates 5 faces upwards, and then the solder is sleeved on the plane of the metal ring beyond the positioning clamping plates 5;
the other locating clamping plate 5 is arranged, and a lead wire on the other side of the ceramic component passes through a locating hole 6 on the other locating clamping plate 5, so that the side surface of the other locating clamping plate 5 is abutted against the other side of the ceramic component;
the ceramic component and the positioning clamping plates 5 are installed, the assembled ceramic component and the two positioning clamping plates 5 are installed on the chassis, and the ceramic component and the two positioning clamping plates 5 are abutted against the installation position on the chassis through the chassis positioning surface 7 on the positioning clamping plates 5;
the positioning stop block 8 is installed, the positioning stop block 8 is buckled at one end of the ceramic component, which is positioned in the chassis, so that the positioning clamping plate 5 is abutted against the bottom of the accommodating groove 9, and meanwhile, the top surface of the positioning stop block 8 is abutted against the inner wall of the chassis.
With reference to the first aspect, in a possible implementation manner, in the step of mounting the ceramic component with the locating cleat 5, the side of the ceramic component with the metal ring faces the chassis. The solder may be compacted by a metal ring.
With reference to the first aspect, in one possible implementation, the solder is gold-tin solder, and the solder is ring-shaped to fit the fiber optic tube or the ceramic component. The gold-tin solder can be welded at a lower temperature, and the influence of high temperature on the deformation of the chassis can be effectively reduced. The solder ring shape can facilitate the installation and fixation of the solder.
The gold-tin brazing method of the photoelectric shell has the beneficial effects that: compared with the prior art, the optical fiber tube is positioned through the circumference of the first boss 2, the circumference of the second boss 3 and the three positioning faces of the side face of the first positioning plate 1, so that the welding position of the optical fiber tube is more accurate, and meanwhile, the optical fiber tube is prevented from being deformed too much in the welding process. And the mounting position of the ceramic component in the mounting hole on the chassis is positioned through the chassis positioning surface 7 on the positioning clamping plate 5, and then the ceramic component is positioned in the axial direction in the mounting hole through the positioning stop block 8, so that the ceramic component can be effectively prevented from being deformed too much in the welding process.
The welding of the large-size photoelectric shell has the characteristics of large deformation and large welding stress in the welding process due to large welding area, the welding strength is obviously influenced by the deformation stress, and the condition of welding failure caused by overlarge stress possibly exists. The welding deformation stress is most obviously affected by temperature, and under the same welding area, the higher the welding temperature is, the longer the welding time is, the greater the deformation degree of the product is, and the greater the stress on the welding position is.
According to the invention, a gold-tin brazing method is used, au80Sn20 eutectic solder is used, the melting point is only 280 ℃, the highest welding temperature is about 350 ℃, a preheating zone and a heat preservation zone are arranged in a temperature curve, the preheating zone has a certain buffer effect on welding deformation of products, the welding heat preservation time is only about 6 minutes under the highest temperature condition of the heat preservation zone, and compared with the melting point of Ag72Cu28 eutectic solder 780 ℃ commonly used in welding of photoelectric shells in industry, the welding temperature is generally 800-900 ℃, the welding time is more than 15 minutes, the temperature of the gold-tin brazing method is obviously reduced, the welding time is shortened, and the method has an important effect on improving the welding deformation and the welding stress.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (9)
1. The utility model provides a metal tin brazing mold of photoelectric shell, its characterized in that includes optical fiber tube brazing unit and ceramic component brazing unit, optical fiber tube brazing unit includes first locating plate, sets up on the first locating plate side and the week circle and the first boss of the mutual adaptation of mounting groove, set up the second boss of first boss top department and week circle and optical fiber tube inner wall looks adaptation and be used for with first locating plate cooperation with the tight second locating plate of optical fiber tube clamp, ceramic component brazing unit includes two locating splint that set up respectively in ceramic component both sides and be used for locating ceramic component in metal chassis mounted position's locating dog, be provided with a plurality of locating holes that are used for holding ceramic component lead wire on the locating splint on the week circle still be provided with a plurality of chassis locating surfaces that mutually support with the ceramic component mounted position on the metal chassis, still be provided with on the top surface of locating dog and be used for holding ceramic component and locating splint hold the recess, the top surface side wall that holds the recess forms the locating surface that is used for spacing splint.
2. The mold for soldering tin onto an optoelectronic package according to claim 1, wherein said positioning clamping plates are each provided with a relief notch on a side surface for passing said sidewall positioning surface of said positioning block.
3. The mold for soldering tin to an optoelectronic package of claim 2, wherein the locating holes are formed through the locating clip, the locating holes each including a first guide section, a second guide section disposed opposite the first guide section, and a connecting section disposed between the first guide section and the second guide section.
4. The mold for gold-tin brazing of an optoelectronic package according to claim 1, wherein the first positioning plate is integrally formed with the first boss and the second boss is integrally formed with the first boss.
5. A method of soldering an optoelectronic package with a tin solder using a tin solder mold for an optoelectronic package according to any one of claims 1 to 4, comprising the steps of:
the chassis is fixed, and a fixture or a clamp is used for fixing the metal chassis firmly;
the method comprises the steps of installing an optical fiber pipe and welding flux, placing the welding flux at a position on a chassis where the optical fiber pipe needs to be welded, placing a boss surface of the optical fiber pipe into a groove on the chassis where the optical fiber pipe needs to be welded, enabling an optical fiber pipe hole to coincide with a gold-tin welding flux hole, positioning the optical fiber pipe by using an optical fiber pipe brazing unit, and then fixing by using a clamp;
placing the ceramic component and the welding flux, assembling the ceramic component, the welding flux and the ceramic component brazing unit, mounting the ceramic component and the ceramic component brazing unit in a bottom disc groove, and fixing by using a clamp;
the ceramic component is welded with the optical fiber pipe, the optical fiber pipe is welded and fixed at the corresponding position on the chassis through welding equipment matched with solder, and meanwhile, the ceramic component is welded and fixed at the corresponding position on the chassis.
6. The method of brazing the optical fiber tube to the solder in the optical-electrical housing according to claim 5, wherein the positioning of the optical fiber tube by the optical fiber tube brazing unit comprises the steps of:
the first positioning plate is installed, a second boss on the first positioning plate is inserted into the optical fiber tube, and the first boss is inserted into a groove on the side wall of the chassis until the side surface of the first positioning plate abuts against the side wall of the chassis;
the second locating plate is installed, the second locating plate is abutted against the other end portion of the optical fiber tube, and the second locating plate and the first locating plate are clamped and fixed to the two end portions of the optical fiber tube by means of a tool or a clamp.
7. The method of gold-tin soldering of an optoelectronic package according to claim 5, wherein in the step of placing the ceramic package with solder, the positioning of the ceramic package by the ceramic package soldering unit comprises the steps of:
the positioning clamping plates are arranged, the lead wires on the ceramic component pass through the positioning holes on the positioning clamping plates, the side surface of one positioning clamping plate is abutted against the side surface of one side of the ceramic component with the metal ring, the side surface provided with the positioning clamping plates faces upwards, and then the solder is sleeved on the plane of the metal ring beyond the positioning clamping plates;
the other locating clamping plate is arranged, and a lead wire on the other side of the ceramic component passes through a locating hole on the other locating clamping plate, so that the side surface of the other locating clamping plate is abutted against the other side of the ceramic component;
the ceramic component and the positioning clamping plates are installed, the assembled ceramic component and the two positioning clamping plates are installed on the chassis, and the ceramic component and the two positioning clamping plates are abutted against the installation position on the chassis through the chassis positioning surface on the positioning clamping plates;
the positioning stop block is installed, the positioning stop block is buckled at one end of the ceramic component, which is positioned in the chassis, so that the positioning clamping plate is abutted against the bottom of the accommodating groove, and the top surface of the positioning stop block is abutted against the inner wall of the chassis.
8. The method of claim 7, wherein in the step of mounting the ceramic component to the locating clip, a side of the ceramic component having the metal ring faces the chassis.
9. A method of gold-tin soldering an optoelectronic package according to any one of claims 5 to 8 wherein the solder is gold-tin solder and the solder is annular in shape to fit into a fibre optic tube or ceramic component.
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| JPH05335461A (en) * | 1992-05-29 | 1993-12-17 | Matsushita Electric Works Ltd | Soldering method for lead frame |
| JPH09167848A (en) * | 1995-12-14 | 1997-06-24 | Fujitsu Ltd | Optical semiconductor assembly |
| JP2004079965A (en) * | 2002-08-22 | 2004-03-11 | Sumitomo Electric Ind Ltd | Optical semiconductor module and its manufacturing method |
| JP2014227306A (en) * | 2013-05-20 | 2014-12-08 | 日鉄住金エレクトロデバイス株式会社 | Brazing tool for ceramic package |
| CN205129122U (en) * | 2015-11-24 | 2016-04-06 | 北京北广科技股份有限公司 | Pottery filtering board welding frock |
| CN205852125U (en) * | 2016-06-30 | 2017-01-04 | 西安赛尔电子材料科技有限公司 | A kind of laser instrument shell soldering mould |
| CN108422059A (en) * | 2018-03-02 | 2018-08-21 | 河北中瓷电子科技有限公司 | A kind of package casing soldering mold and method for welding |
| CN109128428A (en) * | 2018-10-13 | 2019-01-04 | 娄底市安地亚斯电子陶瓷有限公司 | A kind of welding fixture and ceramic relay fixed-position welding method of ceramics relay |
| CN212648721U (en) * | 2020-07-21 | 2021-03-02 | 深圳市宏钢机械设备有限公司 | 980nm laser ceramic packaging tube shell |
| CN214754652U (en) * | 2021-04-16 | 2021-11-16 | 深圳市宏钢机械设备有限公司 | 1X laser instrument encapsulation tube shell structure |
| CN113263241A (en) * | 2021-06-25 | 2021-08-17 | 福建火炬电子科技股份有限公司 | Production device and method of ceramic capacitor without encapsulated lead |
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