CN212648721U - 980nm laser ceramic packaging tube shell - Google Patents

980nm laser ceramic packaging tube shell Download PDF

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Publication number
CN212648721U
CN212648721U CN202021465559.9U CN202021465559U CN212648721U CN 212648721 U CN212648721 U CN 212648721U CN 202021465559 U CN202021465559 U CN 202021465559U CN 212648721 U CN212648721 U CN 212648721U
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frame body
ceramic
ceramic frame
laser
pins
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CN202021465559.9U
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Chinese (zh)
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王卷南
许乐
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Shenzhen Honggang Optoelectronic Packaging Technology Co.,Ltd.
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Shenzhen Honggang Mechanism & Equipment Co ltd
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Abstract

The utility model relates to a ceramic package technical field discloses a 980nm laser instrument ceramic package tube shell, include: the ceramic package comprises a ceramic frame body, wherein a sealing ring is arranged at one end of the ceramic frame body, a bottom plate is arranged at the bottom of the ceramic frame body, pins for signal transmission inside and outside a tube shell are arranged on the side wall of the ceramic frame body, a fiber outlet tube is arranged on the side wall of the ceramic frame body, and the ceramic frame body is respectively packaged with the sealing ring, the bottom plate, the pins and the fiber outlet tube by means of brazing and sintering. The ceramic frame body is respectively packaged with the sealing ring, the bottom plate, the pins and the fiber outlet pipe by brazing and sintering, so that the requirement on air tightness and reliability can be ensured, the high-efficiency heat dissipation performance of the laser in the use process is met, and the stability of the working temperature of the laser is ensured.

Description

980nm laser ceramic packaging tube shell
Technical Field
The utility model relates to a ceramic package technical field especially relates to a 980nm laser instrument ceramic package tube shell.
Background
With the rapid development of the emerging fields of big data, cloud computing, internet +, intelligent manufacturing, smart cities and the like, the rapid growth of the markets of consumer electronic terminals, 5G networks, 100G OTN upgrading, electric vehicles, industrial control and the like is promoted, and the prospects of electronic ceramic packaging products such as consumer electronic products, optical communication devices, power electronic power devices, power lasers and the like matched with the markets are continuously good.
The ceramic has the characteristics of high temperature resistance, corrosion resistance, high hardness, wear resistance and excellent insulating property, and based on the excellent characteristics, the ceramic packaging body has high reliability and good heat conduction property, and also has excellent electrical property, can realize multilayer wiring, and has the capability of integrally packaging complex devices. The ceramic package can meet the use requirements under the conditions of extremely severe environment, high reliability, high air tightness and the like, particularly in the fields of aviation, aerospace, large computers, national defense and the like, but because the ceramic is brittle and has poor processability, the development of the existing metal ceramic tube shell is still the weakest link, so that a ceramic package tube shell which can at least solve at least one problem to a certain extent needs to be designed.
Therefore, how to improve the air tightness of the ceramic package tube case becomes a technical problem to be solved urgently.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in how to improve the gas tightness of ceramic package tube shell.
Therefore, according to the first aspect, the embodiment of the utility model discloses a 980nm laser instrument ceramic package tube shell includes: the device comprises a ceramic frame body, wherein a sealing ring is arranged at one end of the ceramic frame body, a bottom plate is arranged at the bottom of the ceramic frame body, pins for signal transmission inside and outside a tube shell are arranged on the side wall of the ceramic frame body, a fiber outlet tube is arranged on the side wall of the ceramic frame body, and the ceramic frame body is respectively packaged with the sealing ring, the bottom plate, the pins and the fiber outlet tube by means of brazing and sintering.
Optionally, the number of the pins is set to 10, and the 10 pins are symmetrically arranged on two opposite sides of the ceramic frame.
Optionally, the bottom surface, the side surface and the end surface of the ceramic frame body are provided with tungsten paste metallization layers, and the surfaces of the tungsten paste metallization layers are plated with nickel.
Optionally, the bottom plate is provided with a round hole and a half-moon groove which are used for facilitating the fixation of the bottom plate.
Optionally, the bottom plate is made of W80Cu20 material.
Optionally, the fiber outlet tube, the sealing ring and the pins are all made of kovar alloy.
The utility model discloses following beneficial effect has: the ceramic frame body is respectively packaged with the sealing ring, the bottom plate, the pins and the fiber outlet pipe by brazing and sintering, so that the requirement on air tightness and reliability can be ensured, the high-efficiency heat dissipation performance of the laser in the use process is met, and the stability of the working temperature of the laser is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a 980nm laser ceramic package disclosed in this embodiment;
fig. 2 is a schematic diagram of a sintering process of a 980nm laser ceramic package disclosed in this embodiment.
Reference numerals: 1. a ceramic frame body; 2. a sealing ring; 3. a base plate; 31. a circular hole; 32. a half moon groove; 4. a pin; 5. fiber outlet pipes; 6. a metal cylindrical pressing block; 7. positioning a clamp; 8. and (5) a fiber outlet pipe clamp.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
The embodiment of the utility model discloses 980nm laser instrument ceramic package tube shell, as shown in figure 1, include: the optical fiber tube comprises a ceramic frame body 1, wherein a sealing ring 2 is arranged at one end of the ceramic frame body 1, a bottom plate 3 is arranged at the bottom of the ceramic frame body 1, pins 4 used for signal transmission inside and outside a tube shell are arranged on the side wall of the ceramic frame body 1, a fiber outlet tube 5 is arranged on the side wall of the ceramic frame body 1, and the ceramic frame body 1 is respectively packaged with the sealing ring 2, the bottom plate 3, the pins 4 and the fiber outlet tube 5 by brazing and sintering. In the specific implementation process, the ceramic frame body 1 is made of a multilayer wiring Al2O3 ceramic material, the ceramic internal structure of the ceramic frame body is provided with a circuit, the inner and outer side welding plates of the frame can be mutually conducted in a one-to-one mode, the transmission function of signals on the inner side and the outer side of the shell is realized, and the Ag72Cu28 brazing solder is adopted for brazing welding.
It should be noted that, the ceramic frame 1, the sealing ring 2, the bottom plate 3, the pins 4 and the fiber outlet tube 5 are respectively soldered, sintered and packaged, so that the requirement for air tightness and reliability can be ensured, the efficient heat dissipation performance of the laser in the use process can be met, and the stability of the working temperature of the laser can be ensured.
As shown in fig. 1, the number of the leads 4 is 10, and the 10 leads 4 are symmetrically disposed on opposite sides of the ceramic frame 1.
It should be noted that, the sealing ring 2 is to satisfy the parallel sealing and capping process of the tube shell, and 5 flat pins 4 on both sides satisfy the needs of signal transmission inside and outside the tube shell.
As shown in fig. 1, the bottom surface, the side surface and the end surface of the ceramic frame 1 are provided with tungsten paste metallization layers, and the surfaces of the tungsten paste metallization layers are plated with nickel. The surface of the plating layer is smooth and flat without defects, and the welding performance can be ensured.
As shown in fig. 1, the bottom plate 3 is provided with a circular hole 31 and a half-moon groove 32, both of which are used to facilitate the fixation of the bottom plate 3.
As shown in fig. 1, the base plate 3 is made of W80Cu20 material.
As shown in fig. 1, the fiber outlet tube 5, the sealing ring 2 and the pin 4 are made of kovar alloy. The fiber outlet pipe 5, the sealing ring 2 and the pins 4 are made of kovar alloy, have thermal expansion coefficients close to those of ceramics, and are welded with the ceramic frame body 1 through brazing, so that the requirement on air tightness and reliability can be ensured.
Fig. 2 is a schematic diagram of sintering process of a 980nm laser ceramic package disclosed in this embodiment, and as shown in fig. 2, a ceramic frame 1, a fiber outlet tube 5, a sealing ring 2, a bottom plate 3, and pins 4 are positioned by a special fixture, and are brazed at 782 ℃ in a special tunnel furnace with Ag72Cu28 solder placed therein. The metal cylindrical pressing block 6 is placed between the positioning clamp 7 and the fiber outlet pipe clamp 8, the fiber outlet pipe 5 is assembled in the circular hole 31 in the fiber outlet pipe clamp 8, the bottom of the metal cylindrical pressing block 66 is suspended, the inclined plane of the fiber outlet pipe clamp 8 is pressed through the cylindrical side surface, a leftward force and a downward force are formed, the fiber outlet pipe 5 is made to be tightly attached to the ceramic frame body 1 and the bottom plate 3, and the parallelism between the fiber outlet pipe 5 and the bottom plate 3 is less than 0.05mm after sintering is guaranteed.
The working principle is as follows: the ceramic frame body 1 is respectively soldered, sintered and packaged with the sealing ring 2, the bottom plate 3, the pins 4 and the fiber outlet pipe 5, so that the air tightness requirement and reliability can be ensured, the high-efficiency heat dissipation performance of the laser in the use process can be met, and the stability of the working temperature of the laser can be ensured. It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims (6)

1. A 980nm laser ceramic package capsule, comprising: ceramic frame body (1), the one end of ceramic frame body (1) is equipped with seals ring (2), the bottom of ceramic frame body (1) is equipped with bottom plate (3), the lateral wall of ceramic frame body (1) is equipped with pin (4) that are used for signal transmission inside and outside the tube, the lateral wall of ceramic frame body (1) is equipped with out fine pipe (5), ceramic frame body (1) respectively with seal ring (2) bottom plate (3) pin (4) and go out fine pipe (5) and adopt the sintering encapsulation of brazing.
2. The 980nm laser ceramic package case of claim 1, wherein the number of the pins (4) is 10, and the 10 pins (4) are symmetrically arranged on two opposite sides of the ceramic frame body (1).
3. The 980nm laser ceramic package case according to claim 1, wherein the bottom surface, the side surface and the end surface of the ceramic frame body (1) are provided with tungsten paste metallization layers, and the surface of the tungsten paste metallization layers is plated with nickel.
4. The 980nm laser ceramic package case of claim 1, wherein the base plate (3) is provided with a circular hole (31) and a half-moon groove (32) which are used for facilitating the fixing of the base plate (3).
5. The 980nm laser ceramic package of claim 1 or 4, wherein the base plate (3) is made of W80Cu20 material.
6. The 980nm laser ceramic package tube shell according to any of claims 1-4, wherein the fiber outlet tube (5), the sealing ring (2) and the pin (4) are made of kovar alloy.
CN202021465559.9U 2020-07-21 2020-07-21 980nm laser ceramic packaging tube shell Active CN212648721U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021465559.9U CN212648721U (en) 2020-07-21 2020-07-21 980nm laser ceramic packaging tube shell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021465559.9U CN212648721U (en) 2020-07-21 2020-07-21 980nm laser ceramic packaging tube shell

Publications (1)

Publication Number Publication Date
CN212648721U true CN212648721U (en) 2021-03-02

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114156729A (en) * 2021-11-24 2022-03-08 深圳市宏钢机械设备有限公司 Packaging tube shell for high-power semiconductor laser and preparation process thereof
CN114289820A (en) * 2021-12-30 2022-04-08 河北中瓷电子科技股份有限公司 Gold-tin brazing die and brazing method for photoelectric shell

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114156729A (en) * 2021-11-24 2022-03-08 深圳市宏钢机械设备有限公司 Packaging tube shell for high-power semiconductor laser and preparation process thereof
CN114289820A (en) * 2021-12-30 2022-04-08 河北中瓷电子科技股份有限公司 Gold-tin brazing die and brazing method for photoelectric shell
CN114289820B (en) * 2021-12-30 2023-08-18 河北中瓷电子科技股份有限公司 Gold-tin brazing mold and brazing method for photoelectric shell

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Address after: Room 101, Unit 1, Building C, No. 6 Juliu Road, Zhukeng Community, Longtian Street, Pingshan District, Shenzhen City, Guangdong Province, China

Patentee after: Shenzhen Honggang Optoelectronic Packaging Technology Co.,Ltd.

Address before: 518000 1-3 / F, C1 building, long industrial park, JuLongshan No.3 Road, big industrial zone, Longtian street, Pingshan District, Shenzhen City, Guangdong Province

Patentee before: SHENZHEN HONGGANG MECHANISM & EQUIPMENT CO.,LTD.

CP03 Change of name, title or address