CN209626639U - A kind of 800W laser list pumping source ceramic package shell - Google Patents
A kind of 800W laser list pumping source ceramic package shell Download PDFInfo
- Publication number
- CN209626639U CN209626639U CN201920723945.4U CN201920723945U CN209626639U CN 209626639 U CN209626639 U CN 209626639U CN 201920723945 U CN201920723945 U CN 201920723945U CN 209626639 U CN209626639 U CN 209626639U
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- CN
- China
- Prior art keywords
- mounting groove
- lead
- insulator
- pumping source
- ceramic package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 25
- 238000005086 pumping Methods 0.000 title claims abstract description 18
- 239000012212 insulator Substances 0.000 claims abstract description 41
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 29
- 230000007704 transition Effects 0.000 claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims 1
- 230000002411 adverse Effects 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000006263 metalation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Semiconductor Lasers (AREA)
Abstract
The utility model discloses a kind of 800W laser list pumping source ceramic package shells, including encapsulating housing, first mounting groove and the second mounting groove, the encapsulating housing lower end surface is fixedly installed with pedestal, the pedestal upper end is equipped with heat release hole, the base rear end wall and side wall have the first mounting groove and the second mounting groove, first mounting groove inner cavity is plugged with first lead, the first lead lateral wall is respectively equipped with the first insulator and the first gasket, the first insulator lateral wall is respectively equipped with First Transition ring and the first solder layer, second mounting groove inner cavity is plugged with the second lead, the second lead lateral wall is equipped with the second insulator and the second gasket, the 800W laser list pumping source can effectively improve the thermal diffusivity of sealed laser with ceramic package shell, air-tightness, stability and long service life, energy Adapt to the adverse circumstances that current laser uses.
Description
Technical field
The utility model relates to ceramic shell technical field, outside specially a kind of 800W laser list pumping source ceramic package
Shell.
Background technique
Previous popular laser sealing element, structure are mostly split type.Lead, gasket, ceramics are sintered respectively, in gum box
Injection glue connects ceramic electrode with stainless steel frame gluing, and lead and frame are not directly contacted with, and only by ceramic joining, protects
Demonstrate,prove the insulating properties of air locking；Pedestal select the preferable oxygen-free copper of thermal diffusivity, using weld tabs by pedestal together with frame welding；
Finally cover board and framework sealing-in are integrated using parallel sealing technique, meet leakproofness.Due to gluing poor reliability, it is easy old
Change and gas leakage, in addition split type structure is unstable, easily-deformable failure has been unable to meet in increasingly severe use environment
The requirement of laser, it is short-lived.For this purpose, it is proposed that a kind of 800W laser list pumping source ceramic package shell.
Utility model content
It is above-mentioned to solve the purpose of this utility model is to provide a kind of 800W laser list pumping source ceramic package shell
The problem of being proposed in background technique.
To achieve the above object, the utility model provides the following technical solutions: a kind of 800W laser list pumping source ceramics
Package casing, including encapsulating housing, the first mounting groove and the second mounting groove, the encapsulating housing lower end surface are fixedly installed with bottom
Seat, the pedestal upper end are equipped with heat release hole, and the base rear end wall and side wall have the first mounting groove and the second mounting groove,
First mounting groove inner cavity is plugged with first lead, and the first lead lateral wall is respectively equipped with the first insulator and the first pad
Piece, the first insulator lateral wall are respectively equipped with First Transition ring and the first solder layer, second mounting groove inner cavity grafting
There is the second lead, the second lead lateral wall is equipped with the second insulator and the second gasket, the second insulator lateral wall point
It She You not the second transition rings and the second solder layer.
Preferably, the pedestal upper surface is fixedly installed with cold water pipes.
Preferably, the first lead, the first insulator and the first gasket are integrated.
Preferably, second gasket, the second insulator and the second lead are integrated.
Preferably, first solder layer and First Transition ring lateral wall and the first mounting groove internal chamber wall are tangent.
Preferably, second mounting groove is one, and second lead is more.
Preferably, first mounting groove is two.
Compared with prior art, the utility model has the beneficial effects that outside the 800W laser list pumping source ceramic package
Shell has good heat dissipation, gas by being equipped with encapsulating housing, pedestal, heat release hole and the first installation slot structure, improved sealed laser
The advantages that close property is good, stability is high, the service life is long adapts to the adverse circumstances in current laser use.
Detailed description of the invention
Fig. 1 is the utility model section view；
Fig. 2 is the utility model pedestal partial sectional view；
Fig. 3 is the utility model pedestal partial sectional view.
In figure: 1 encapsulating housing, 2 pedestals, 3 heat release holes, 4 first mounting grooves, 41 first solder layers, 42 first insulators, 43
First gasket, 44 First Transition rings, 5 first leads, 6 second mounting grooves, 61 second gaskets, 62 second insulators, 63 second welderings
The bed of material, 64 second transition rings, 7 second leads.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of 800W laser list pumping source ceramic package
Shell, including encapsulating housing 1, the first mounting groove 4 and the second mounting groove 6, the encapsulating housing 1 are oxygen-free copper material, encapsulating shell
Body 1 is identical with the material of pedestal 2, is then installed by the former laser list pumping sources of 2 pairs of pedestal, encapsulating housing 1 and pedestal 2
Thermal conductivity is 391W/ (mK), has good heat dissipation performance and brazing property, heat dissipation and pricker convenient for high power package device
Sealing connects.
1 lower end surface of encapsulating housing is fixedly installed with pedestal 2, and the length of the pedestal 2 is 175mm, and width is
206mm.The length and width of pedestal is identical, whole height 15.5mm.2 upper surface of pedestal is fixedly installed with cold water pipe
Road.Cold water pipes are fixed on the upper surface of pedestal 2 by soldering, and cold water pipe is also made of oxygen-free copper, good heat dissipation effect.The bottom
2 upper ends of seat are equipped with heat release hole 3, and heat release hole 3 uniformly opens the surface in encapsulating housing 1 and the upper surface of pedestal 2.After the pedestal 2
End wall and side wall have the first mounting groove 4 and the second mounting groove 6, and first mounting groove 4 is that first lead can be inserted
5, the quantity of the first mounting groove 4 is two.The quantity of second mounting groove 6 is one, and the second mounting groove 6 can be inserted into more second and draw
Line 7,4 inner cavity of the first mounting groove are plugged with first lead 5.
Specific preparation process is as follows, uses oxygen-free copper that thermal conductivity is 391W/ (mK) as encapsulating housing and submount material,
Good heat dissipation performance and brazing property are made it have, convenient for the heat dissipation and soldering sealing-in of high power package device；First lead 5
It is first sintered in one with the first insulator 42 and the first gasket 43, then passes through the first solder layer with pedestal 2 and First Transition ring 44
41 soldering sealing-ins, the inside and outside connection for electric signal；Cavity is formed on pedestal 2, for chip installation and cover board encapsulation.It is described
First lead 5 is 4J50 copper-clad lead.The first lead 5, the first insulator 42 and the first gasket 43 are integrated.Described first
5 lateral wall of lead is respectively equipped with the first insulator 42 and the first gasket 43, and first insulator 42 is ceramic insulator, and first
Insulator 42 can increase the insulating properties of first lead 5, improve the leakproofness of encapsulation.First insulator 42 is through peroxidating, surface
Metallization forms nickel plating and seeps nickel, the available molybdenum manganese layer mutually infiltrated with AgCu28, by the first insulator 42, first lead
5 are sintered together with the first gasket 43, further according to metallization the first insulator 42 can with the characteristic of solder bonding metal, using soldering
Pedestal 2 and first lead 5, the first insulator 42 and the first gasket 43 are melted envelope and are integrated by mode, and pedestal is made to meet airtight, envelope
Connect the requirement of shape and seal size；First insulator, 42 lateral wall is respectively equipped with First Transition ring 44 and the first solder layer
41, the setting of First Transition ring 44 can guarantee ceramics in long-term use, not easily broken in heated stress, to ensure that
Good air-tightness.It is iron-nickel alloy 4J42 (4J42: in -60 DEG C~+600 DEG C temperature ranges that First Transition ring 44, which prepares material,
It is interior have and thermal expansion coefficient similar in ceramics), First Transition ring 44 use iron-nickel alloy 4J42 and the first insulator 42 for
It will not be deformed with sealing-in, be able to satisfy structural requirement.
First solder layer 41 and 44 lateral wall of First Transition ring and 4 internal chamber wall of the first mounting groove are tangent.Described second
6 inner cavity of mounting groove is plugged with the second lead 7, and second lead 7 is 4J50 copper-clad lead.Second lead, 7 lateral wall is set
There are the second insulator 62 and the second gasket 61, second insulator 62 is ceramic insulator, and the second insulator 62 can increase
The insulating properties of second lead 7, improves the leakproofness of encapsulation.Second insulator 62 forms nickel plating through peroxidating, surface metalation and seeps
Nickel, the available molybdenum manganese layer mutually infiltrated with AgCu28, the second insulator 62, the second lead 7, the second gasket 61 are sintered
Together, further according to the second insulator 62 of metallization can with the characteristic of solder bonding metal, using brazing mode, by pedestal 2 and
Two leads 7, the second insulator 62 and the second gasket 61 melt envelope and are integrated, and meet the requirement of airtight sealing-in shape and seal size.
Second gasket 61, the second insulator 62 and the second lead 7 are integrated.Second insulator, 62 lateral wall is respectively equipped with
Two transition rings 64 and the second solder layer 63.Second transition rings 64 are 4J42 transition rings, and increased second insulator 62 can guarantee
Second insulator 62 is in long-term use, not easily broken in heated stress, thus ensure that good air-tightness, the second transition
Ring 64 is also prepared using iron-nickel alloy, be can guarantee with the first insulator 42 to be that matched seal will not deform, is met structural requirement.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (7)
1. a kind of 800W laser list pumping source ceramic package shell, including encapsulating housing (1), the first mounting groove (4) and second
Mounting groove (6), it is characterised in that: encapsulating housing (1) lower end surface is fixedly installed with pedestal (2), and pedestal (2) upper end is set
Have heat release hole (3), pedestal (2) aft bulkhead and side wall have the first mounting groove (4) and the second mounting groove (6), described
First mounting groove (4) inner cavity is plugged with first lead (5), and first lead (5) lateral wall is respectively equipped with the first insulator
(42) and the first gasket (43), the first insulator (42) lateral wall are respectively equipped with First Transition ring (44) and the first solder layer
(41), the second mounting groove (6) inner cavity is plugged with the second lead (7), and the second lead (7) lateral wall is equipped with the second insulation
Sub (62) and the second gasket (61), the second insulator (62) lateral wall are respectively equipped with the second transition rings (64) and the second solder
Layer (63).
2. a kind of 800W laser list pumping source ceramic package shell according to claim 1, it is characterised in that: the bottom
Seat (2) upper surface is fixedly installed with cold water pipes.
3. a kind of 800W laser list pumping source ceramic package shell according to claim 1, it is characterised in that: described
One lead (5), the first insulator (42) and the first gasket (43) are integrated.
4. a kind of 800W laser list pumping source ceramic package shell according to claim 1, it is characterised in that: described
Two gaskets (61), the second insulator (62) and the second lead (7) are integrated.
5. a kind of 800W laser list pumping source ceramic package shell according to claim 1, it is characterised in that: described
One solder layer (41) and First Transition ring (44) lateral wall and the first mounting groove (4) internal chamber wall are tangent.
6. a kind of 800W laser list pumping source ceramic package shell according to claim 1-5, feature exist
In: second mounting groove (6) is one, and second lead (7) is more.
7. a kind of 800W laser list pumping source ceramic package shell according to claim 1-5, feature exist
In: first mounting groove (4) is two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920723945.4U CN209626639U (en) | 2019-05-20 | 2019-05-20 | A kind of 800W laser list pumping source ceramic package shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920723945.4U CN209626639U (en) | 2019-05-20 | 2019-05-20 | A kind of 800W laser list pumping source ceramic package shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209626639U true CN209626639U (en) | 2019-11-12 |
Family
ID=68443123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920723945.4U Active CN209626639U (en) | 2019-05-20 | 2019-05-20 | A kind of 800W laser list pumping source ceramic package shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209626639U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113660819A (en) * | 2021-07-23 | 2021-11-16 | 东莞市优琥电子科技有限公司 | Environment-friendly ceramic shell and adapter |
-
2019
- 2019-05-20 CN CN201920723945.4U patent/CN209626639U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113660819A (en) * | 2021-07-23 | 2021-11-16 | 东莞市优琥电子科技有限公司 | Environment-friendly ceramic shell and adapter |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 101, Unit 1, Building C, No. 6 Juliu Road, Zhukeng Community, Longtian Street, Pingshan District, Shenzhen City, Guangdong Province, China Patentee after: Shenzhen Honggang Optoelectronic Packaging Technology Co.,Ltd. Address before: 518000 1-3 / F, C1 building, long industrial park, JuLongshan No.3 Road, big industrial zone, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HONGGANG MECHANISM & EQUIPMENT CO.,LTD. |