CN110943048A - Compound silicon-aluminum alloy packaging shell - Google Patents
Compound silicon-aluminum alloy packaging shell Download PDFInfo
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- CN110943048A CN110943048A CN201911380806.7A CN201911380806A CN110943048A CN 110943048 A CN110943048 A CN 110943048A CN 201911380806 A CN201911380806 A CN 201911380806A CN 110943048 A CN110943048 A CN 110943048A
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- bottom plate
- shell
- alloy layer
- shell body
- aluminum alloy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention relates to a composite silicon-aluminum alloy packaging shell, which solves the problems of heavy quality, poor heat conduction efficiency and poor air tightness of the conventional metal shell. The packaging shell comprises a shell body, a radio frequency unit and a low frequency unit; the shell body is made of metal alloy, and the metal alloy comprises a first alloy layer, a second alloy layer and a third alloy layer which are sequentially overlapped and are made of different materials; the materials of the first alloy layer, the second alloy layer and the third alloy layer are respectively one of Al50Si75, Al50Si50 and Al50Si 25; the shell body comprises an annular side plate and a bottom plate; the radio frequency unit comprises a contact pin and a sleeve, the sleeve is arranged in a through hole of the bottom plate, low-temperature glass powder is sintered and filled in a gap between the sleeve and the bottom plate, the contact pin is arranged in the sleeve, and high-temperature glass powder is sintered and filled in the gap between the contact pin and the sleeve; the low-frequency unit comprises a socket, the socket is arranged in a through hole of the bottom plate, and low-temperature glass powder is filled in a gap between the socket and the bottom plate in a sintering mode.
Description
Technical Field
The invention relates to a packaging shell, in particular to a composite silicon-aluminum alloy packaging shell.
Background
With the development and demand of the electronic industry, the packaging shell is widely applied to the fields of aerospace, aviation, navigation, field operations, communication, weaponry and the like. The packaging shell is one of key components of an integrated circuit, and mainly plays roles of circuit support (a bearing circuit prevents the bearing circuit from being damaged mechanically and provides physical protection), electric signal transmission (leading-out wires on the shell realize the shell and are electrically connected with each other, and participate in the electric signal transmission of an internal circuit and a peripheral circuit), heat dissipation (heat generated by the circuit is transmitted to the outside and the heat loss of the circuit is avoided), shielding (an electromagnetic model can be isolated to a certain extent and electromagnetic interference is avoided), sealing (the internal circuit is isolated from the external environment through airtight packaging formed by the shell and a cover plate, and the circuit is protected from the influence of the external environment, particularly the corrosion of water and gas to the circuit) and chemical protection (the damage of salt mist, acid rain and the like to a shell substrate).
At present, products in the field of microelectronics are more and more widely used, the demand of corresponding shells is more and more increased, but the quality requirements for the shells are higher and higher, and the shells develop towards the direction of miniaturization, multifunction, stability, light weight, high performance, low cost and high air tightness, so that higher requirements are provided for the heat dissipation property and the sealing property of a packaging shell or an integrated module. In order to meet the requirements, higher requirements are provided for the material selection and processing of the metal shell material, high temperature resistance, weldability, sealing property, shielding property and the like.
The metal materials used by the existing shell are basically divided into kovar alloy (4J29 or 4J51 and the like) and aluminum materials and the like, and the defects of the shell are as follows: the material has heavy self-weight and poor heat conduction efficiency, and cannot be used for a complete machine system with the weight requirement; 2. aluminum material: when the aluminum material sintered part is used in a complete machine system with a gas sealing requirement, after the aluminum material sintered part is installed by laser welding, the gas sealing requirement cannot be ensured at the welding part, and the gas leakage condition exists.
Disclosure of Invention
The invention aims to solve the problems of heavy mass, poor heat conduction efficiency and poor air tightness of the conventional metal shell and provides a composite silicon-aluminum alloy packaging shell.
In order to realize the purpose, the technical scheme adopted by the invention is as follows:
a composite silicon-aluminum alloy packaging shell comprises a shell body, a plurality of radio frequency units and a plurality of low-frequency units; the shell body is made of metal alloy, and the metal alloy comprises a first alloy layer, a second alloy layer and a third alloy layer which are sequentially overlapped and are made of different materials; the materials of the first alloy layer, the second alloy layer and the third alloy layer are respectively one of Al50Si75, Al50Si50 and Al50Si 25; the shell body comprises an annular side plate and a bottom plate arranged at the bottom end of the annular side plate; the radio frequency unit is arranged on a bottom plate of the shell body and comprises a contact pin and a sleeve, the sleeve is arranged in a through hole of the bottom plate, low-temperature glass powder is sintered and filled in a gap between the sleeve and the bottom plate, the contact pin is arranged in the sleeve, and high-temperature glass powder is sintered and filled in a gap between the contact pin and the sleeve; the low-frequency unit is arranged on the bottom plate of the shell body and comprises a socket, the socket is arranged in a through hole of the bottom plate, and low-temperature glass powder is filled in a gap between the socket and the bottom plate in a sintering mode.
Further, the first alloy layer, the second alloy layer and the third alloy layer form a metal alloy through high-temperature pressing.
Further, the inner side surface of the annular side plate is subjected to electroplating treatment.
Furthermore, a plurality of supporting bosses are arranged on the bottom plate of the shell body and used for supporting and limiting the circuit board in the shell body.
Further, be provided with a plurality of mounting grooves on the bottom plate of casing body for it is spacing to install the circuit board in the casing body.
Further, the surfaces of the base plate and the support bosses are subjected to electroplating treatment.
Furthermore, a plurality of mounting bosses are arranged on the outer side of the annular side plate, and mounting holes are formed in the mounting bosses and used for being fixedly connected with the shell cover plate.
Furthermore, a plurality of mounting blind holes are formed in the bottom plate and used for fixing the circuit board in the shell body.
Furthermore, a plurality of mounting through holes are formed in the bottom plate and used for fixing the shell body on other devices.
Compared with the prior art, the invention has the following advantages:
1. the composite silicon-aluminum alloy packaging shell provided by the invention is made of metal alloy, the metal alloy is formed by pressing transition synthesis silicon-aluminum materials, the transition synthesis silicon-aluminum materials are silicon-aluminum with silicon contents of 25%, 50% and 75%, respectively, and the finally formed silicon-aluminum shell has the advantages of light weight, good heat conduction effect, easiness in processing, welding and the like.
2. The composite silicon-aluminum alloy packaging shell provided by the invention is made of a silicon-aluminum alloy material, the weight is reduced by 12% compared with a common sintered metal shell, and the composite silicon-aluminum alloy packaging shell has obvious advantages for use in projects with strict weight requirements.
3. The silicon-aluminum alloy material used by the composite silicon-aluminum alloy packaging shell provided by the invention has a thermal expansion coefficient which is more similar to that of silicon-boron glass, and the stability is higher.
4. The composite silicon-aluminum alloy packaging shell provided by the invention is used for hollowing the interior of the metal shell to form a carrier similar to a box shape, and the metal shell can be adjusted to correspond to the interior and the external dimensions according to the dimensions and the sizes of various device components to be packaged in the metal shell.
5. The shell body of the composite silicon-aluminum alloy packaging shell provided by the invention adopts a silicon-aluminum alloy materialThe shell body has the advantage of easy welding, when in packaging and welding (the metal shell is welded with the corresponding cover plate), the air tightness requirement is met on the premise of ensuring the reliability, and the integral leakage rate of the packaging module can reach less than or equal to 1.01 multiplied by 10 < -3 >/Pa.cm3Requirement of/s.
6. Under the same conditions and the same environment, the test performance index of the composite silicon-aluminum alloy packaging shell provided by the invention is greatly improved compared with that of a conventional sintered product, and the form of a reserved port can be adjusted according to actual use requirements.
Drawings
FIG. 1 is a cross-sectional view of a composite silicon aluminum alloy package housing of the present invention;
FIG. 2 is a top view of the composite silicon aluminum alloy package housing of the present invention;
FIG. 3 is a schematic distribution diagram of a metal alloy material of the composite silicon-aluminum alloy packaging shell according to the present invention;
FIG. 4 is a diagram of a RF unit of the composite Si-Al alloy package of the present invention;
fig. 5 is a structural diagram of a low-frequency unit of the composite silicon-aluminum alloy packaging shell.
Reference numerals: the novel low-temperature-resistant socket comprises a shell body 1, a radio frequency unit 2, a low-frequency unit 3, a first alloy layer 4, a second alloy layer 5, a third alloy layer 6, an annular side plate 11, a bottom plate 12, a supporting boss 13, a mounting groove 14, a mounting boss 15, a mounting blind hole 16, a mounting through hole 17, a pin 21, a sleeve 22, low-temperature glass powder 23, high-temperature glass powder 24 and a socket 31.
Detailed Description
The invention is described in detail below with reference to the figures and specific examples.
As shown in fig. 1 to 5, the composite silicon-aluminum alloy package housing provided by the invention comprises a housing body 1, a plurality of radio frequency units 2 and a plurality of low frequency units 3. As shown in fig. 3, the case body 1 is made of a metal alloy, and the metal alloy includes a first alloy layer 4, a second alloy layer 5, and a third alloy layer 6 which are sequentially stacked and have different materials; the materials of the first alloy layer 4, the second alloy layer 5 and the third alloy layer 6 are respectively one of Al50Si75, Al50Si50 and Al50Si25, and the first alloy layer 4, the second alloy layer 5 and the third alloy layer 6 are pressed at high temperature to form a metal alloy.
As shown in fig. 4 and 5, the housing body 1 includes an annular side plate 11 and a bottom plate 12 provided at a bottom end of the annular side plate 11; the radio frequency unit 2 is arranged on a bottom plate 12 of the shell body 1, the radio frequency unit 2 comprises a contact pin 21 and a sleeve 22, the sleeve 22 is arranged in a through hole of the bottom plate 12, a gap between the sleeve 22 and the bottom plate 12 is filled with low-temperature glass powder 23 in a sintering mode, the contact pin 21 is arranged in the sleeve 22, and a gap between the contact pin 21 and the sleeve 22 is filled with high-temperature glass powder 24 in a sintering mode; the low-frequency unit 3 is arranged on the bottom plate 12 of the shell body 1 and comprises a socket 31, the socket 31 is arranged and installed in a through hole of the bottom plate 12, and the low-temperature glass powder 23 filled in a gap between the socket 31 and the bottom plate 12 in a sintering mode.
The bottom plate 12 of the shell body 1 is provided with a plurality of supporting bosses 13 for supporting and limiting the circuit board of the shell body 1, and the bottom plate 12 of the shell body 1 is further provided with a plurality of mounting grooves 14 for mounting and limiting the circuit board of the shell body 1. The bottom plate 12 is provided with a blind mounting hole 16 for fixing the circuit board in the housing body 1, and the bottom plate 12 is provided with a through mounting hole 17 for fixing the housing body 1 in another device. The outer side of the annular side plate 11 is provided with a plurality of mounting bosses 15, and the mounting bosses 15 are provided with mounting holes for being fixedly connected with the shell cover plate.
The inner side surface of the annular side plate 11 is subjected to plating treatment, and simultaneously, the surfaces of the bottom plate 12 and the support bosses 13 are subjected to plating treatment. The plating layer requirement is as follows: al/ap. Ni (92) -P10 Ep. Au0.7 (partial plating), coating appearance requirements: the coating appearance is uniform, smooth and compact under the visual observation of a 20-time microscope, does not expose base metal or an intermediate coating, has no salt trace for cleaning, and has no harmful defects such as peeling, bubbles, pits, pinholes, burns and the like. No residue is left at the junction of the plating surface and the non-plating surface. The existence of the electroplating surface is equivalent to a carrier, so that the uniform grounding is provided for electronic components needing to be packaged during installation, and the surface after electroplating treatment can improve the welding reliability for the electronic components with welding installation requirements.
The plug pins 21 are the standard header size of the connector SMP, and form a standard SMP-J standard plug interface with corresponding openings of the shell body 1. The contact pin 21, the sleeve 22 and the high-temperature glass powder 24 are sintered into a whole at high temperature (SMP combined part for short), the SMP combined part has certain air tightness, and the leakage rate can reach less than or equal to 1.01 multiplied by 10 < -3 >/Pa.cm3The composite silicon-aluminum alloy packaging shell has the advantages that the requirement of/s is met, the glass medium is used as a support and is high-temperature resistant, compared with the conventional plastic medium, the glass medium can provide a material meeting higher use frequency and wider bandwidth, and the use frequency of the radio frequency part of the composite silicon-aluminum alloy packaging shell can reach 45GHz at most. And finally, sintering the SMP assembly and the shell body 1 into a whole through low-temperature glass powder 23 to achieve the functions of fixing and secondary sealing.
The socket 31 is a micro-rectangular electric connector J30JM1-ZK series standard socket, and forms a standard J30JM1-15ZKB and J30JM1-25ZKB mating interface with the corresponding opening of the housing body 1. The socket 31, the shell body 1 and the low-temperature glass powder 23 are integrated through high-temperature sintering, and the leakage rate can reach less than or equal to 1.01 multiplied by 10 < -3 >/Pa.cm3Requirement of/s.
The composite silicon-aluminum alloy packaging shell is made of metal alloy, the metal alloy is formed by pressing transition synthesis silicon-aluminum materials, the transition synthesis silicon-aluminum materials are silicon-aluminum with silicon contents of 25%, 50% and 75%, the finally formed silicon-aluminum shell has the advantages of light weight, good heat conduction effect, easiness in processing, easiness in welding and the like, and compared with a common sintered metal shell, the heat conduction effect of the silicon-aluminum alloy material (shell body 1) is obviously superior to that of the other shell. Meanwhile, the silicon-aluminum alloy material (the shell body 1) used by the packaging shell has the weight reduced by 12% compared with the common sintered metal shell, and has obvious advantages for the use in the project with strict weight requirement. The inner part of the metal shell is hollowed to form a carrier similar to a box shape, and the metal shell can be adjusted to correspond to the inner part and the external dimension according to the size and the size of various device parts required to be packaged in the metal shell.
The silicon-aluminum alloy material (metal shell) used for the composite silicon-aluminum alloy packaging shell provided by the invention has the advantage of easy welding, and when the packaging and welding are carried out (the metal shell and the corresponding cover plate are welded), on the premise of ensuring the reliability, the air tightness requirement is simultaneously met, and the integral leakage rate of the packaging module can reach the requirement of less than or equal to 1.01 multiplied by 10 < -3 >/Pa.cm 3/s.
The silicon-aluminum alloy material (metal shell) used by the composite silicon-aluminum alloy packaging shell provided by the invention has a thermal expansion coefficient which is more similar to that of silicon-boron glass, and the stability is higher. Under the same conditions and the same environment, the test performance indexes of the composite silicon-aluminum alloy packaging shell are greatly improved compared with those of a conventional sintered product, and the reserved port form can be adjusted according to actual use requirements (in the embodiment, two SMP-J types and one J30JM1-15ZKB interface and one J30JM1-25ZKB interface are adopted).
Claims (9)
1. A compound silicon-aluminum alloy packaging shell is characterized in that: the radio frequency unit comprises a shell body (1), a plurality of radio frequency units (2) and a plurality of low frequency units (3);
the shell body (1) is made of metal alloy, and the metal alloy comprises a first alloy layer (4), a second alloy layer (5) and a third alloy layer (6) which are sequentially overlapped and are made of different materials; the materials of the first alloy layer (4), the second alloy layer (5) and the third alloy layer (6) are respectively one of Al50Si75, Al50Si50 and Al50Si 25;
the shell body (1) comprises an annular side plate (11) and a bottom plate (12) arranged at the bottom end of the annular side plate (11);
the radio frequency unit (2) is arranged on a bottom plate (12) of the shell body (1) and comprises a contact pin (21) and a sleeve (22), the sleeve (22) is arranged in a through hole of the bottom plate (12), low-temperature glass powder (23) is filled in a gap between the sleeve (22) and the bottom plate (12) in a sintering mode, the contact pin (21) is arranged in the sleeve (22), and high-temperature glass powder (24) is filled in the gap between the contact pin (21) and the sleeve (22) in a sintering mode;
the low-frequency unit (3) is arranged on a bottom plate (12) of the shell body (1) and comprises a socket (31), the socket (31) is arranged in a through hole of the bottom plate (12), and low-temperature glass powder (23) is filled in a gap between the socket (31) and the bottom plate (12) in a sintering mode.
2. The composite silicon-aluminum alloy packaging shell of claim 1, characterized in that: the first alloy layer (4), the second alloy layer (5) and the third alloy layer (6) form a metal alloy through high-temperature pressing.
3. The composite silicon-aluminum alloy packaging shell of claim 2, characterized in that: and the inner side surface of the annular side plate (11) is subjected to electroplating treatment.
4. The composite silicon aluminum alloy package casing of claim 1, 2 or 3, wherein: the circuit board support is characterized in that a plurality of support bosses (13) are arranged on a bottom plate (12) of the shell body (1) and used for supporting and limiting the circuit board in the shell body (1).
5. The composite silicon-aluminum alloy packaging shell of claim 4, characterized in that: the circuit board mounting structure is characterized in that a plurality of mounting grooves (14) are formed in a bottom plate (12) of the shell body (1) and used for limiting the mounting of the circuit board in the shell body (1).
6. The composite silicon-aluminum alloy packaging shell of claim 5, characterized in that: and the surfaces of the bottom plate (12) and the supporting lug boss (13) are subjected to electroplating treatment.
7. The composite silicon-aluminum alloy packaging shell of claim 6, characterized in that: the outer side of the annular side plate (11) is provided with a plurality of mounting bosses (15), and mounting holes are formed in the mounting bosses (15) and are used for being fixedly connected with the shell cover plate.
8. The composite silicon-aluminum alloy packaging shell of claim 7, characterized in that: the bottom plate (12) is provided with a plurality of mounting blind holes (16) for fixing the circuit board in the shell body (1).
9. The composite silicon-aluminum alloy packaging shell of claim 8, characterized in that: the bottom plate (12) is provided with a plurality of mounting through holes (17) for fixing the shell body (1) on other devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911380806.7A CN110943048A (en) | 2019-12-27 | 2019-12-27 | Compound silicon-aluminum alloy packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911380806.7A CN110943048A (en) | 2019-12-27 | 2019-12-27 | Compound silicon-aluminum alloy packaging shell |
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| CN110943048A true CN110943048A (en) | 2020-03-31 |
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| CN201911380806.7A Pending CN110943048A (en) | 2019-12-27 | 2019-12-27 | Compound silicon-aluminum alloy packaging shell |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113381218A (en) * | 2021-05-17 | 2021-09-10 | 贵州航天电器股份有限公司 | Sealed electric connector with silicon-aluminum alloy shell and manufacturing method thereof |
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2019
- 2019-12-27 CN CN201911380806.7A patent/CN110943048A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113381218A (en) * | 2021-05-17 | 2021-09-10 | 贵州航天电器股份有限公司 | Sealed electric connector with silicon-aluminum alloy shell and manufacturing method thereof |
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