CN220021573U - 传输线路以及电子设备 - Google Patents
传输线路以及电子设备 Download PDFInfo
- Publication number
- CN220021573U CN220021573U CN202190000891.4U CN202190000891U CN220021573U CN 220021573 U CN220021573 U CN 220021573U CN 202190000891 U CN202190000891 U CN 202190000891U CN 220021573 U CN220021573 U CN 220021573U
- Authority
- CN
- China
- Prior art keywords
- conductor layer
- transmission line
- ground conductor
- layer
- signal conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020198386 | 2020-11-30 | ||
| JP2020-198386 | 2020-11-30 | ||
| PCT/JP2021/042514 WO2022113889A1 (ja) | 2020-11-30 | 2021-11-19 | 伝送線路及び電子機器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220021573U true CN220021573U (zh) | 2023-11-14 |
Family
ID=81754578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202190000891.4U Active CN220021573U (zh) | 2020-11-30 | 2021-11-19 | 传输线路以及电子设备 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12438247B2 (https=) |
| JP (1) | JP7517469B2 (https=) |
| CN (1) | CN220021573U (https=) |
| WO (1) | WO2022113889A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119095259A (zh) * | 2024-11-07 | 2024-12-06 | 苏州东山精密制造股份有限公司 | 一种信号传输结构 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7644796B2 (ja) * | 2022-11-04 | 2025-03-12 | メクテック株式会社 | フレキシブルプリント配線板 |
| DE112024002130T5 (de) * | 2023-05-17 | 2026-04-23 | Murata Manufacturing Co., Ltd. | Mehrschichtsubstrat und elektronische vorrichtung |
| US20250247960A1 (en) * | 2024-01-30 | 2025-07-31 | Snap Inc. | Air gapped dynamic-flex circuits with stripline impedance controls |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62269401A (ja) * | 1986-05-16 | 1987-11-21 | Mitsubishi Electric Corp | サスペンデツド線路 |
| US6518844B1 (en) * | 2000-04-13 | 2003-02-11 | Raytheon Company | Suspended transmission line with embedded amplifier |
| JP4752796B2 (ja) | 2007-03-12 | 2011-08-17 | 日立電線株式会社 | フレキシブルプリント配線板 |
| KR100987191B1 (ko) * | 2008-04-18 | 2010-10-11 | (주)기가레인 | 신호전송라인 주위의 본딩 시트를 제거한 인쇄회로기판 |
| JP2010269401A (ja) | 2009-05-21 | 2010-12-02 | Sanno Tekko Kk | スリッター装置 |
| SG11201505616YA (en) * | 2013-01-18 | 2015-09-29 | Univ Yale | Superconducting device with at least one enclosure |
| CN208608339U (zh) * | 2016-01-27 | 2019-03-15 | 株式会社村田制作所 | 信号传输线路 |
| CN216905421U (zh) * | 2019-11-15 | 2022-07-05 | 株式会社村田制作所 | 传输线路以及电子设备 |
-
2021
- 2021-11-19 CN CN202190000891.4U patent/CN220021573U/zh active Active
- 2021-11-19 WO PCT/JP2021/042514 patent/WO2022113889A1/ja not_active Ceased
- 2021-11-19 JP JP2022565292A patent/JP7517469B2/ja active Active
-
2023
- 2023-05-15 US US18/197,273 patent/US12438247B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119095259A (zh) * | 2024-11-07 | 2024-12-06 | 苏州东山精密制造股份有限公司 | 一种信号传输结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| US12438247B2 (en) | 2025-10-07 |
| US20230282955A1 (en) | 2023-09-07 |
| WO2022113889A1 (ja) | 2022-06-02 |
| JPWO2022113889A1 (https=) | 2022-06-02 |
| JP7517469B2 (ja) | 2024-07-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |