CN219961214U - Electric control heat dissipation structure combined with semiconductor refrigerator - Google Patents
Electric control heat dissipation structure combined with semiconductor refrigerator Download PDFInfo
- Publication number
- CN219961214U CN219961214U CN202321148435.1U CN202321148435U CN219961214U CN 219961214 U CN219961214 U CN 219961214U CN 202321148435 U CN202321148435 U CN 202321148435U CN 219961214 U CN219961214 U CN 219961214U
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- China
- Prior art keywords
- semiconductor refrigerator
- aluminum substrate
- temperature
- mos tube
- heat dissipation
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Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 76
- 230000017525 heat dissipation Effects 0.000 title claims description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 60
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 230000000630 rising effect Effects 0.000 claims abstract description 4
- 238000001816 cooling Methods 0.000 claims 3
- 230000005856 abnormality Effects 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses an electric control radiating structure combined with a semiconductor refrigerator, which comprises a radiating bottom plate positioned at the bottom of an aluminum substrate and the semiconductor refrigerator positioned on the aluminum substrate and used for radiating heat generated by an MOS tube, wherein the cold surface of the semiconductor refrigerator is contacted with the aluminum substrate to enable the temperature of the aluminum substrate to be quickly reduced, so that the temperature rising speed of the MOS tube is controlled. The cold surface of the semiconductor refrigerator is tightly attached to the aluminum substrate around the MOS tube, so that the temperature of the aluminum substrate can be quickly reduced when the semiconductor refrigerator works, and the purpose of controlling the MOS temperature is achieved.
Description
Technical Field
The utility model relates to the technical field of motor controller heat dissipation, in particular to an electric control heat dissipation structure combined with a semiconductor refrigerator.
Background
The core unit motor controller (electric control) of the electric automobile is developed towards high frequency, high power, high integration level, miniaturization and the like, and electronic components related to the motor controller (wherein the MOS tube is a main heating device) inevitably generate larger energy loss in the working process, particularly in the climbing process of a vehicle, the MOS tube of the motor controller can generate a large amount of heat in a short time to lead the temperature of the electronic components to be rapidly increased due to the greatly increased power required by the vehicle, so that the risk of thermal failure of the components is increased, great challenges are brought to the reliability of products, the heat dissipation efficiency of the traditional aluminum heat dissipation base plate is low, the rapid conduction of the temperature heat of the electronic components cannot be rapidly reduced to the outside, and the heat dissipation effect is poor.
Therefore, it is a worth researching to provide an electronic control heat dissipation structure for a semiconductor refrigerator, which can rapidly reduce the temperature of an aluminum substrate when detecting the abnormality of the MOS temperature, thereby achieving the purpose of controlling the MOS temperature.
Disclosure of Invention
The utility model aims to provide an electric control radiating structure of a semiconductor refrigerator, which can quickly reduce the temperature of an aluminum substrate when the temperature abnormality of an MOS is detected, so as to achieve the purpose of controlling the temperature of the MOS.
The purpose of the utility model is realized in the following way:
the utility model provides an automatically controlled heat radiation structure that combines semiconductor refrigerator, includes the radiating bottom plate that is located aluminium base board bottom, is located the semiconductor refrigerator that the heat that the MOS pipe produced just is used for radiating on the aluminium base board, and the cold face of semiconductor refrigerator is contacted with aluminium base board so that the temperature of aluminium base board drops fast to control the speed that the MOS pipe temperature risees.
The semiconductor refrigerator is positioned above the aluminum substrate, and the cold face of the semiconductor refrigerator is in contact with the upper surface of the aluminum substrate.
The semiconductor refrigerator is located between the two MOS tubes.
And a radiator for radiating heat of the semiconductor refrigerator is arranged on the hot surface of the semiconductor refrigerator.
The semiconductor refrigerator is positioned below the aluminum substrate, and the cold face of the semiconductor refrigerator is in contact with the lower surface of the aluminum substrate.
And the radiating bottom plate is provided with a groove for placing the semiconductor refrigerator.
The beneficial effects of the utility model are as follows: when the temperature abnormality of the MOS tube is detected by hardware assistance, the semiconductor refrigerator is started to work rapidly. The cold surface of the semiconductor refrigerator is tightly attached to the aluminum substrate around the MOS tube, so that the temperature of the aluminum substrate can be quickly reduced when the semiconductor refrigerator works, and the purpose of controlling the MOS temperature is achieved.
Drawings
FIG. 1 is a schematic structural diagram of embodiment 1 of the present utility model;
fig. 2 is a schematic diagram of a structure of a semiconductor refrigerator and a radiator in embodiment 1 of the present utility model;
FIG. 3 is a schematic structural diagram of embodiment 2 of the present utility model;
in the figure: the heat dissipation base plate 1, the aluminum substrate 2, the electric control shell 3, the MOS tube 4, the semiconductor refrigerator 5, the radiator 6 and the groove 7.
Description of the embodiments
The utility model is further described below with reference to the drawings and examples.
Example 1
As shown in fig. 1 and fig. 2, an electric control heat dissipation structure combined with a semiconductor refrigerator comprises a heat dissipation bottom plate 1 positioned at the bottom of an aluminum substrate 2, and a semiconductor refrigerator 5 positioned on the aluminum substrate 2 and used for dissipating heat generated by a MOS tube 4, wherein the upper surface of the electric control shell 3 is fixedly connected with the upper surface of the residual heat dissipation bottom plate 1, the MOS tube 4, the aluminum substrate 2 and the semiconductor refrigerator 5 are positioned in the electric control shell 3, the MOS tube 4 is welded on the aluminum substrate 2, the aluminum substrate 2 is fixed on the aluminum heat dissipation bottom plate 1, the cold surface of the semiconductor refrigerator 5 is contacted with the aluminum substrate 2 so as to enable the temperature of the aluminum substrate 2 to be quickly reduced, thereby controlling the temperature rising speed of the MOS tube 4, and when the temperature abnormality of the MOS tube is detected through hardware assistance, the semiconductor refrigerator 5 is quickly started to work. The cold surface of the semiconductor refrigerator 5 is tightly attached to the aluminum substrate around the MOS tube 4, so that the temperature of the aluminum substrate can be quickly reduced when the semiconductor refrigerator 5 works, and the purpose of controlling the MOS temperature is achieved.
The semiconductor refrigerator 5 is positioned above the aluminum substrate 2, and the cold surface of the semiconductor refrigerator 5 is in contact with the upper surface of the aluminum substrate 2. The semiconductor refrigerator 5 is located between the two MOS tubes 4, every two MOS tubes 4 are divided into a group, and the position of the semiconductor refrigerator 5 is arranged on the aluminum substrate 2 in the middle of the group of 2 MOS tubes 4. The heat radiator 6 for dissipating the heat of the semiconductor refrigerator 5 is arranged on the hot surface of the semiconductor refrigerator 5, and the heat radiator 6 is used for absorbing the heat generated by the hot surface of the semiconductor refrigerator 5 in a short time and providing the heat dissipation speed of the hot surface of the semiconductor refrigerator 5.
When large current impact occurs in a short time of electric control, abnormal temperature rise can be caused, and at the moment, the semiconductor refrigerator 5 starts to work rapidly after detecting the abnormal temperature through hardware, and the cold surface of the semiconductor refrigerator 5 is tightly attached to the aluminum substrate 2, so that the temperature of the aluminum substrate 2 can be quickly reduced, and the temperature rise speed of the MOS tube 4 is controlled. The radiator on the hot surface of the semiconductor refrigerator 5 is used for absorbing heat generated by the hot surface of the semiconductor refrigerator 5 in a short time.
Example 2
As shown in fig. 3, an electric control heat dissipation structure combined with a semiconductor refrigerator comprises a heat dissipation bottom plate 1 positioned at the bottom of an aluminum substrate 2, and a semiconductor refrigerator 5 positioned on the aluminum substrate 2 and used for dissipating heat generated by a MOS tube 4, wherein the upper surface of the electric control shell 3 is fixedly connected with the upper surface of the residual heat dissipation bottom plate 1, the MOS tube 4, the aluminum substrate 2 and the semiconductor refrigerator 5 are all positioned in the electric control shell 3, the MOS tube 4 is welded on the aluminum substrate 2, the aluminum substrate 2 is fixed on the aluminum heat dissipation bottom plate 1, the cold surface of the semiconductor refrigerator 5 is contacted with the aluminum substrate 2 so as to enable the temperature of the aluminum substrate 2 to be quickly reduced, thereby controlling the temperature rising speed of the MOS tube 4, and when the temperature abnormality of the MOS tube is detected through hardware assistance, the semiconductor refrigerator 5 is quickly started to work. The cold surface of the semiconductor refrigerator 5 is tightly attached to the aluminum substrate around the MOS tube 4, so that the temperature of the aluminum substrate can be quickly reduced when the semiconductor refrigerator 5 works, and the purpose of controlling the MOS temperature is achieved.
The semiconductor refrigerator 5 is positioned below the aluminum substrate 2, and the cold surface of the semiconductor refrigerator 5 is in contact with the lower surface of the aluminum substrate 2. The heat dissipation base plate 1 is provided with a groove 7 for placing the semiconductor refrigerator 5.
When the temperature abnormality is caused by high-current impact in a short time in electric control, the semiconductor refrigerator 5 is started to work rapidly after the temperature abnormality is detected by hardware, and the heat of the aluminum substrate 2 can be quickly absorbed away to reduce the temperature of the aluminum substrate 2 as the cold surface of the semiconductor refrigerator 5 is tightly attached to the aluminum substrate 2, so that the purpose of controlling the temperature of the MOS tube 4 is achieved.
When the temperature abnormality of the MOS tube is detected by hardware assistance, the semiconductor refrigerator is started to work rapidly. The cold surface of the semiconductor refrigerator is tightly attached to the aluminum substrate around the MOS tube, so that the temperature of the aluminum substrate can be quickly reduced when the semiconductor refrigerator works, and the purpose of controlling the MOS temperature is achieved.
Claims (6)
1. An electrically controlled heat dissipation structure combined with a semiconductor refrigerator is characterized in that: the MOS tube cooling device comprises a cooling bottom plate positioned at the bottom of an aluminum substrate and a semiconductor refrigerator positioned on the aluminum substrate and used for cooling heat generated by the MOS tube, wherein a cold face of the semiconductor refrigerator is in contact with the aluminum substrate so as to enable the temperature of the aluminum substrate to be rapidly reduced, and therefore the temperature rising speed of the MOS tube is controlled.
2. The electrically controlled heat sink structure in combination with a semiconductor refrigerator as claimed in claim 1, wherein: the semiconductor refrigerator is positioned above the aluminum substrate, and the cold face of the semiconductor refrigerator is in contact with the upper surface of the aluminum substrate.
3. The electrically controlled heat sink structure in combination with a semiconductor refrigerator as claimed in claim 2, wherein: the semiconductor refrigerator is located between the two MOS tubes.
4. The electrically controlled heat sink structure in combination with a semiconductor refrigerator as claimed in claim 2, wherein: and a radiator for radiating heat of the semiconductor refrigerator is arranged on the hot surface of the semiconductor refrigerator.
5. The electrically controlled heat sink structure in combination with a semiconductor refrigerator as claimed in claim 1, wherein: the semiconductor refrigerator is positioned below the aluminum substrate, and the cold face of the semiconductor refrigerator is in contact with the lower surface of the aluminum substrate.
6. The electrically controlled heat sink structure in combination with a semiconductor refrigerator as claimed in claim 5, wherein: and the radiating bottom plate is provided with a groove for placing the semiconductor refrigerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321148435.1U CN219961214U (en) | 2023-05-14 | 2023-05-14 | Electric control heat dissipation structure combined with semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321148435.1U CN219961214U (en) | 2023-05-14 | 2023-05-14 | Electric control heat dissipation structure combined with semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219961214U true CN219961214U (en) | 2023-11-03 |
Family
ID=88538929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321148435.1U Active CN219961214U (en) | 2023-05-14 | 2023-05-14 | Electric control heat dissipation structure combined with semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219961214U (en) |
-
2023
- 2023-05-14 CN CN202321148435.1U patent/CN219961214U/en active Active
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