CN203071056U - Heat radiation mechanism for power module - Google Patents

Abstract

The utility model relates to a heat dissipation mechanism of a power module, which comprises a metal-ceramic substrate and a copper bottom plate. The cooling channels are connected. The utility model connects the pipe joints on the copper bottom plate with the external circulation pipeline, feeds the circulating cooling medium into the heat dissipation water channel, and dissipates the heat in the working of the power module through the copper bottom plate, and cancels the heat conduction silicone grease layer , which greatly reduces the thermal resistance of the power module, solves the problem of poor heat dissipation caused by poor contact between the copper base plate and the radiator, improves the service life and reliability of the power module, and has a compact and reasonable structure.

Description

Heat dissipation mechanism of the power module

technical field

The utility model relates to a heat dissipation mechanism of a power module, which belongs to the technical field of power modules.

Background technique

A semiconductor power module mainly includes a copper base plate, a cermet-clad substrate, a semiconductor chip, electrode terminals and a housing. Usually there are several power semiconductor chips in the power module, such as MOSFET or IGBT chips and diode chips are integrated and soldered or pasted on the metal layer of the metal ceramic substrate, and the electrode terminals are also welded on the metal layer of the metal ceramic substrate On and through the housing to connect with external devices to realize the input and output of the power module, and the metal-ceramic substrate is welded on the copper base plate. During the working process of the semiconductor power module, the heat generated by the semiconductor chip can be quickly absorbed through the copper base plate. Compared with the aluminum material, the copper base plate has a smaller specific heat and a slower heat escape speed, which cannot dissipate the heat in the module in time. Therefore, the bottom of the power module needs to be installed on the radiator for heat dissipation.

Power electronic devices need to work in a temperature cycle environment from -40°C to 125°C, so the heat of the current power module is dissipated by the copper base plate connected to it and the radiator fixed on the lower part of the copper base plate. This heat dissipation structure has the following problems: 1. Since the power module is installed on the heat sink, it is necessary to fill the gap between the copper base plate and the heat sink with thermal conductive silicone grease, which will increase the thermal resistance, especially the distance between the chip and the heat sink is relatively long. Far, thus reducing the cooling effect. Therefore, the heat-conducting silicone grease between the copper base plate and the heat sink has poor thermal conductivity, and the application process of the heat-conducting silicon grease has high requirements, which increases the production cost.

Contents of the invention

The purpose of the utility model is to provide a heat dissipation mechanism of a power module with a reasonable structure, which can improve the heat dissipation efficiency and the service life of the power module.

The technical solution of the utility model to achieve the above purpose is: a heat dissipation mechanism of a power module, including a metal-ceramic substrate and a copper bottom plate, characterized in that: the metal-ceramic substrate is welded on the copper bottom plate, and the copper bottom plate is equipped with The heat dissipation water channel, the pipe joint connected on the copper base plate communicates with the heat dissipation water channel.

The utility model has the following advantages after adopting the above-mentioned technical scheme:

1. The utility model is provided with a heat dissipation channel in the copper base plate to form a heat dissipation mechanism. Therefore, it can be connected with an external circulation pipeline through a pipe joint arranged on the copper base plate, and a circulating cooling medium can be introduced into the heat dissipation channel, and the power can be reduced. The heat in the working of the module is directly transferred to the copper base plate through the metal-ceramic substrate. The utility model uses the copper bottom plate directly as a heat sink, and the metal-ceramic substrate is welded on the copper bottom plate, cancels the heat-conducting silicone grease layer, greatly reduces the thermal resistance of the power module, and solves the problem of heat dissipation caused by poor contact between the copper bottom plate and the radiator The problem of low efficiency improves the service life and working reliability of the power module, and the structure is compact and reasonable.

2. The copper bottom plate of the utility model itself has a heat dissipation function, which can save the conventional radiator at the lower part, so that the power module can reduce the volume and weight of the whole machine, and meet the requirement that the whole machine must be compact and light in weight for the power module requirements, save the installation process.

Description of drawings

Embodiments of the present utility model are described in further detail below in conjunction with the accompanying drawings.

FIG. 1 is a structural schematic diagram of the heat dissipation mechanism of the present invention installed on a power module.

Fig. 2 is a structural schematic diagram of the heat dissipation mechanism of the present invention.

Fig. 3 is a schematic structural view of the copper base plate of the present invention.

Among them: 1—copper bottom plate, 11—radiation water channel, 2—shell, 3—pipe joint, 4—cermet-clad substrate, 5—semiconductor chip.

Detailed ways

As shown in Figures 1 to 3, the heat dissipation mechanism of the power module of the present invention includes a metal-ceramic substrate 4 and a copper base plate 1. The metal layer of the metal-ceramic substrate 4 is connected with a semiconductor chip 5 and electrode terminals and signal terminals. The terminals pass through the casing 2 and are arranged on the top of the casing 2, and are connected to the input and output of the current power module through the electrode terminals and external equipment, and the signal terminals are connected to the external control terminal to realize temperature signal and other control. As shown in Figures 2 and 3, the metal-clad ceramic substrate 4 of the present invention is welded on the copper base plate 1, and the copper base plate 1 is provided with a heat dissipation water channel 11, and the pipe joint 3 connected to the copper base plate 1 communicates with the heat dissipation water channel 11.

As shown in Figures 2 and 3, the heat dissipation water channels 11 in the copper base plate 1 of the present utility model are more than two independent, and the cooling medium is passed into the two heat dissipation channels 11 on the copper base plate 1 through the pipe joint 3 arranged on the copper base plate 1 . In the water channel 11, the cooling medium of the utility model can be passed into the heat dissipation water channel 11 from the pipe joint 3 on the same side, or the cooling medium can be passed into the heat dissipation water channel 11 from the pipe joints 3 at both ends, so that the cooling medium flows into the copper base plate 1 in a cross flow while cooling. The heat dissipation water channel 11 in the copper base plate 1 of the utility model is in the shape of a plurality of U-shaped snakes or discs connected end to end. The pipe joint 3 passes the external cooling medium into the heat dissipation water channel 11 to forcibly dissipate heat from the cermet-clad substrate 4 on the upper part of the copper base plate 1, thereby improving the service life and working reliability of the power module.

The thickness of the copper base plate 1 of the utility model is controlled at 5-25 mm, such as 8 mm, 10 mm, 15 mm, 18 mm or 20 mm, etc., the thickness can be set according to the size of the power module and the installation space, so that the copper base plate 1 meets the heat dissipation requirements.

As shown in Figures 1-3, the copper base plate 1 of the present invention is provided with threaded holes, and the pipe joint 3 is screwed and sealed on the copper base plate 1, which facilitates the processing of the heat dissipation water channel 11 in the copper base plate 1.

Claims (5)

1. A heat dissipation mechanism for a power module, comprising a cermet-clad substrate (4) and a copper base plate (1), characterized in that: the cermet-clad substrate (4) is welded on the copper base plate (1), and the copper base plate ( 1) A cooling channel (11) is provided inside, and the pipe joint (3) connected to the copper base plate (1) communicates with the cooling channel (11). 2. The heat dissipation mechanism of the basic power module according to claim 1, characterized in that: there are more than two independent heat dissipation channels (11) in the copper base plate (1). 3. The heat dissipation mechanism of the base power module according to claim 1, characterized in that: the heat dissipation water channel (11) on the copper base plate (1) is in the shape of a plurality of U-shaped serpentines or discs connected end to end. 4. The heat dissipation mechanism of the power module according to claim 1, characterized in that: the thickness of the copper base plate (1) is controlled at 5-25mm. 5 . The heat dissipation mechanism of the power module according to claim 1 , characterized in that: the copper base plate ( 1 ) is provided with threaded holes, and the pipe joint ( 3 ) is screwed and sealed on the copper base plate ( 1 ).

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