CN219780808U - Heat radiation structure suitable for double-sided heat radiation power module - Google Patents
Heat radiation structure suitable for double-sided heat radiation power module Download PDFInfo
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- CN219780808U CN219780808U CN202321148432.8U CN202321148432U CN219780808U CN 219780808 U CN219780808 U CN 219780808U CN 202321148432 U CN202321148432 U CN 202321148432U CN 219780808 U CN219780808 U CN 219780808U
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- power module
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- sided
- heat dissipation
- radiator
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- 230000005855 radiation Effects 0.000 title claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 claims abstract description 59
- 239000004065 semiconductor Substances 0.000 claims abstract description 41
- 230000009977 dual effect Effects 0.000 claims 3
- 238000001816 cooling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat radiation structure suitable for a double-sided heat radiation power module, which comprises a semiconductor refrigerator positioned above the double-sided heat radiation power module and a radiator positioned below the double-sided heat radiation power module, wherein the cold face of the semiconductor refrigerator is contacted with the upper surface of the double-sided heat radiation power module to radiate the double-sided heat radiation power module. When the temperature of the double-sided heat dissipation power module rises rapidly due to high current impact, the semiconductor refrigerator starts to work, and heat generated by the double-sided heat dissipation power module is absorbed through the semiconductor refrigerator so as to achieve the purpose of controlling the temperature of the double-sided heat dissipation power module.
Description
Technical Field
The utility model relates to the technical field of power module heat dissipation, in particular to a heat dissipation structure suitable for a double-sided heat dissipation power module.
Background
The core unit motor controller (electric control) of the electric automobile has been developed towards high frequency, high power, high integration level, miniaturization and the like, and unavoidable electronic components related to the motor controller are: one of the modules is a double-sided heat dissipation power module, such as a Hybird module, which is proposed by Yingfei, and is provided with two heat dissipation channels in a package, so that heat can be transferred to the upper and lower surfaces simultaneously. When an electric vehicle is in operation, the electrically controlled power module unit will generate a large amount of heat. The existing radiator generally adopts a water-cooling or air-cooling radiator, has poor radiating effect, ensures that the radiating speed of the double-sided radiating power module is low, influences the performance of the double-sided radiating power module,
therefore, the heat dissipation structure suitable for the double-sided heat dissipation power module, which can solve the heat dissipation problem of the power module and further ensure that the electric control can continuously and safely work, is a problem worthy of research.
Disclosure of Invention
The utility model aims to provide a heat dissipation structure which can solve the heat dissipation problem of a power module, thereby ensuring continuous safe and stable work of an electric control and is suitable for a double-sided heat dissipation power module.
The purpose of the utility model is realized in the following way:
the utility model provides a heat radiation structure suitable for double-sided heat dissipation power module, includes the semiconductor refrigerator that is located double-sided heat dissipation power module top, is located the radiator of double-sided heat dissipation power module below, and the cold junction of semiconductor refrigerator is in contact with double-sided heat dissipation power module's upper surface in order to dispel the heat to double-sided heat dissipation power module.
The hot-face radiator is arranged on the hot-face of the semiconductor refrigerator and transfers the hot-face heat of the semiconductor refrigerator to the external environment.
The hot-face radiator adopts an air-cooled radiator or a water-cooled radiator.
The radiator adopts an air-cooled radiator or a water-cooled radiator, when the double-sided radiating power module works normally, the radiator is always in a working state to transfer heat generated by the double-sided radiating power module to the external environment, and when the temperature of the double-sided radiating power module rises abnormally, the semiconductor refrigerator is opened and begins to work; and the heat of the double-sided heat dissipation power module is instantaneously transferred to the hot surface of the semiconductor refrigerator by utilizing the semiconductor refrigerator.
Has the positive beneficial effects that: the utility model is suitable for a power module with double-sided heat dissipation (such as a Hybrid module of Infrax), wherein one end of the double-sided heat dissipation power module is attached to a radiator for heat dissipation, and the other end is contacted with a cold surface of a semiconductor refrigerator. When the temperature of the double-sided heat dissipation power module rises rapidly due to high current impact, the semiconductor refrigerator starts to work, and heat generated by the double-sided heat dissipation power module is absorbed through the semiconductor refrigerator so as to achieve the purpose of controlling the temperature of the double-sided heat dissipation power module.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
in the figure: a double-sided heat dissipation power module 1, a semiconductor refrigerator 2, a hot-sided heat radiator 3 and a heat radiator 4.
Description of the embodiments
The utility model is further described below with reference to the drawings and examples.
Example 1
As shown in fig. 1, a heat dissipation structure suitable for a double-sided heat dissipation power module includes a semiconductor refrigerator 2 above the double-sided heat dissipation power module 1, and a heat radiator 4 below the double-sided heat dissipation power module 1, wherein a cold surface of the semiconductor refrigerator 2 contacts with an upper surface of the double-sided heat dissipation power module 1 to dissipate heat 3 of the double-sided heat dissipation power module.
The hot surface of the semiconductor refrigerator 2 is provided with a hot surface radiator 3, and the hot surface radiator 3 transfers the hot surface heat of the semiconductor refrigerator 2 to the external environment.
When the double-sided radiating power module 1 works normally, the radiator 4 is always in a working state to transfer heat generated by the double-sided radiating power module 1 to the external environment, and when the temperature of the double-sided radiating power module 1 rises abnormally, the semiconductor refrigerator 2 is opened and begins to work; the heat of the double-sided heat dissipation power module 1 is instantaneously transferred to the hot surface of the semiconductor refrigerator 1 by the semiconductor refrigerator 2, and the heat of the hot surface of the semiconductor refrigerator 2 is transferred to the external environment through the hot surface radiator 3; the temperature of the double-sided heat dissipation power module 1 is controlled in a lower range, so that the purpose of controlling the temperature of the double-sided heat dissipation power module 1 is achieved.
Example 2
As shown in fig. 1, a heat dissipation structure suitable for a double-sided heat dissipation power module includes a semiconductor refrigerator 2 above the double-sided heat dissipation power module 1, and a heat radiator 4 below the double-sided heat dissipation power module 1, wherein a cold surface of the semiconductor refrigerator 2 contacts with an upper surface of the double-sided heat dissipation power module 1 to dissipate heat 3 of the double-sided heat dissipation power module.
The hot surface of the semiconductor refrigerator 2 is provided with a hot surface radiator 3, and the hot surface radiator 3 transfers the hot surface heat of the semiconductor refrigerator 2 to the external environment.
The hot-face radiator 3 adopts an air-cooled radiator or a water-cooled radiator. The radiator 4 adopts an air-cooled radiator or a water-cooled radiator.
When the double-sided radiating power module 1 works normally, the radiator 4 is always in a working state to transfer heat generated by the double-sided radiating power module 1 to the external environment, and when the temperature of the double-sided radiating power module 1 rises abnormally, the semiconductor refrigerator 2 is opened and begins to work; the heat of the double-sided heat dissipation power module 1 is instantaneously transferred to the hot surface of the semiconductor refrigerator 1 by the semiconductor refrigerator 2, and the heat of the hot surface of the semiconductor refrigerator 2 is transferred to the external environment through the hot surface radiator 3; the temperature of the double-sided heat dissipation power module 1 is controlled in a lower range, so that the purpose of controlling the temperature of the double-sided heat dissipation power module 1 is achieved.
The utility model is suitable for a power module with double-sided heat dissipation (such as a Hybrid module of Infrax), wherein one end of the double-sided heat dissipation power module is attached to a radiator for heat dissipation, and the other end is contacted with a cold surface of a semiconductor refrigerator. When the temperature of the double-sided heat dissipation power module rises rapidly due to high current impact, the semiconductor refrigerator starts to work, and heat generated by the double-sided heat dissipation power module is absorbed through the semiconductor refrigerator so as to achieve the purpose of controlling the temperature of the double-sided heat dissipation power module.
Claims (4)
1. The utility model provides a heat radiation structure suitable for two-sided heat dissipation power module which characterized in that: the radiator comprises a semiconductor refrigerator positioned above the double-sided radiating power module and a radiator positioned below the double-sided radiating power module, wherein the cold face of the semiconductor refrigerator is contacted with the upper surface of the double-sided radiating power module to radiate heat of the double-sided radiating power module.
2. The heat dissipation structure adapted for a dual sided heat dissipation power module as recited in claim 1, wherein: the hot-face radiator is arranged on the hot-face of the semiconductor refrigerator and transfers the hot-face heat of the semiconductor refrigerator to the external environment.
3. The heat dissipation structure adapted for a dual sided heat dissipation power module as recited in claim 2, wherein: the hot-face radiator adopts an air-cooled radiator or a water-cooled radiator.
4. The heat dissipation structure adapted for a dual sided heat dissipation power module as recited in claim 1, wherein: the radiator adopts an air-cooled radiator or a water-cooled radiator, when the double-sided radiating power module works normally, the radiator is always in a working state to transfer heat generated by the double-sided radiating power module to the external environment, and when the temperature of the double-sided radiating power module rises abnormally, the semiconductor refrigerator is opened and begins to work; and the heat of the double-sided heat dissipation power module is instantaneously transferred to the hot surface of the semiconductor refrigerator by utilizing the semiconductor refrigerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321148432.8U CN219780808U (en) | 2023-05-14 | 2023-05-14 | Heat radiation structure suitable for double-sided heat radiation power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321148432.8U CN219780808U (en) | 2023-05-14 | 2023-05-14 | Heat radiation structure suitable for double-sided heat radiation power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219780808U true CN219780808U (en) | 2023-09-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321148432.8U Active CN219780808U (en) | 2023-05-14 | 2023-05-14 | Heat radiation structure suitable for double-sided heat radiation power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219780808U (en) |
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2023
- 2023-05-14 CN CN202321148432.8U patent/CN219780808U/en active Active
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