CN217428005U

CN217428005U - Inverter and electric vehicle

Info

Publication number: CN217428005U
Application number: CN202221146700.8U
Authority: CN
Inventors: 邢欢; 康恩溥
Original assignee: Robert Bosch GmbH
Current assignee: Robert Bosch GmbH
Priority date: 2022-05-13
Filing date: 2022-05-13
Publication date: 2022-09-13
Anticipated expiration: 2032-05-13

Abstract

The utility model relates to an inverter and electric vehicle. The inverter includes: a housing; a printed circuit board mounted within the housing; a heat dissipation plate mounted in the case and located below the printed circuit board; and an electronic device fixed at an upper surface of the heat dissipation plate and electrically connected to the printed circuit board; the entire surface of the upper surface of the heat dissipation plate is formed with a graphene coating.

Description

Inverter and electric vehicle

Technical Field

The utility model belongs to the automobile parts field particularly, relates to an inverter to and dispose the electric vehicle of this inverter.

Background

The inverter has a main function of converting direct current of a battery into alternating current, and is widely used in the fields of fuel cell systems, vehicles, mobile devices, and the like. In general, the inverter generally includes a case (not shown), a printed circuit board 10 accommodated in the case, a heat dissipation plate 20, an electronic device 30, and various connectors. As shown in fig. 1, the electronic device 30 includes a capacitor 31, a filter 32, a chip 33, and the like, which are connected to each other by a bus bar. In the case of a large current, high voltage, in order to prevent damage to the electronic device or the printed circuit board due to voltage breakdown, the chip 33 is generally encapsulated by a resin, thereby forming a high energy density power module 34 for a large current. The power module 34, the capacitor 31, the filter 32, and the like are mounted to the heat sink 20 to assist heat dissipation. However, such an inverter has disadvantages or problems of uneven heat dissipation, unsatisfactory cooling effect, low reliability, and the like.

Therefore, there is a need for further improvements in the structure or design of existing inverters to at least reduce, or even eliminate, the above-mentioned deficiencies in the prior art.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve or alleviate the technical problem who provides above to a certain extent.

According to the utility model discloses, provide an inverter, it includes:

a housing;

a printed circuit board mounted within the housing;

a heat dissipation plate installed in the case and located below the printed circuit board; and

an electronic device fixed at an upper surface of the heat dissipation plate and electrically connected to the printed circuit board;

the entire surface of the upper surface of the heat dissipation plate is formed with a graphene coating.

Alternatively, in the inverter as described above, the graphene coating layer is formed on the entire surface of the upper surface of the heat dissipation plate by means of physical vapor deposition.

Alternatively, in the inverter as described above, the graphene coating layer is formed on the entire surface of the upper surface of the heat dissipation plate by means of electrostatic spraying.

Alternatively, in the inverter as described above, the electronic device is fixed at the upper surface of the heat dissipation plate by means of bonding.

Optionally, in the inverter as described above, the electronic device is at least one of a capacitor, a filter, and a power module.

Optionally, in the inverter as described above, the graphene coating layer is subjected to a baking treatment.

Optionally, in the inverter as described above, the power module includes:

an insulating substrate including a first surface and a second surface facing away from each other, the first surface abutting against an upper surface of the heat dissipation plate;

a chip disposed on a second surface of the insulating substrate; and

and the packaging adhesive completely covers the chip, completely covers or partially covers the second surface of the insulating substrate, and does not cover the first surface of the insulating substrate.

Optionally, in the inverter as described above, a lower surface of the heat dissipation plate is provided with a plurality of heat dissipation fins, and the heat dissipation plate is integrally molded.

Alternatively, in the inverter as described above, the heat dissipation plate is made of aluminum or copper.

Furthermore, according to the present invention, there is also provided an electric vehicle equipped with the inverter as described above, the electric vehicle being a pure electric vehicle or a hybrid vehicle.

Drawings

The disclosure of the present invention will become more readily understood with reference to the accompanying drawings. As is readily understood by those skilled in the art: these drawings are for illustrative purposes only and are not intended to constitute a limitation on the scope of the present invention. Moreover, in the drawings, like numerals are used to indicate like parts, and in which:

fig. 1 is a schematic view schematically showing the construction of a printed circuit board, an electronic device and a heat radiating plate of a related art inverter; and

fig. 2 exemplarily shows a schematic structural view of a printed circuit board, an electronic device, and a heat dissipation plate of the inverter according to the present disclosure.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below. First, it should be noted that the terms of orientation such as up, down, left, right, front, rear, inner, outer, top, bottom, etc., mentioned or possibly mentioned in the present specification are defined with respect to the configurations shown in the respective drawings, and they are relative concepts, and thus may be changed accordingly depending on the position and the use state thereof. Therefore, these and other directional terms should not be construed as limiting terms.

Fig. 2 shows a schematic block diagram of an inverter according to the present disclosure. As is clear from fig. 2, the inverter includes: a case (not shown), a printed circuit board 100, a heat dissipation plate 200, an electronic device 300, and the like. The printed circuit board 100 is mounted in the housing and is provided with control circuitry (not shown) for signal processing and command transmission. The heat dissipation plate 200 is installed in the housing and located below the printed circuit board 100, wherein the heat dissipation plate 200 has an upper surface 210 and a lower surface 220, the upper surface 210 is close to the printed circuit board 100, and the lower surface 220 is far from the printed circuit board 100. The electronic device 300 may be fixed at the upper surface 210 of the heat dissipation plate 200, for example, by means of bonding, and electrically connected to the control circuit of the printed circuit board 100. The entire surface of the upper surface 210 of the heat dissipation plate 200 is formed with a graphene coating layer 230. As known to those skilled in the art, graphene is in the regular sp ² Two-dimensional crystalline allotropes of carbon packed in a bonded hexagonal pattern, which have extremely high thermal conductivity and uniformity of thermal conductivity. The graphene coating may be described herein as a single atomic thick layer of graphite. It should be noted that the graphene coating 230 can rapidly absorb heat emitted from the electronic device 300 and timely transfer the heat to the heat dissipation plate 200 by using high thermal conductivity thereof. In addition, the graphene coating 230 may uniformly dissipate heat of the local hot spot to the entire surface of the upper surface 210 of the heat dissipation plate 200, so that the uniformity of heat dissipation is greatly improved, thereby preventingThe phenomenon of uneven heat dissipation caused by overhigh temperature of local hot spots is avoided.

In combination with other alternative embodiments of the above embodiments, the graphene coating 230 may be formed on the entire surface of the upper surface 210 of the heat dissipation plate 200 by physical vapor deposition. Alternatively, the graphene coating layer 230 may be formed on the entire surface of the upper surface 210 of the heat dissipation plate 200 by electrostatic spraying. Further, the graphene coating can be subjected to high-temperature baking treatment after electrostatic spraying, so that the quality of the graphene coating is more reliable.

These electronic devices 300 may include capacitors 310, filters 320, and power modules 330, etc., depending on the particular application of the printed circuit board. For example, the power module 330 includes: an insulating substrate 331, a chip 332, and a packaging adhesive 333. The insulating substrate 331 includes a first surface and a second surface facing away from each other, the first surface is abutted to the upper surface 210 of the heat dissipation plate 200 and is fixed at the upper surface 210 of the heat dissipation plate 200 by, for example, a thermally conductive adhesive, and the chip 332 is disposed on the second surface of the insulating substrate 331. In order to protect the chip from the external complex environment, the encapsulation adhesive 333 completely covers the chip 332 and completely covers or partially covers the second surface of the insulating substrate 331, and the encapsulation adhesive 333 does not cover the first surface of the insulating substrate 331.

It can be understood that the utility model discloses an inverter adopts common water-cooling design: the lower surface 220 of the heat dissipation plate 200 is provided with a water channel for passing cooling water, and the cooling water takes away heat when flowing through the lower surface 220 of the heat dissipation plate 200, so as to achieve the purpose of cooling. In order to enhance the area of heat exchange, the lower surface 220 of the heat dissipation plate 200 is provided with a plurality of heat dissipation fins (not shown), thereby further enhancing the heat dissipation effect. The heat dissipation plate 200 may be designed to be integrally formed for the purpose of manufacturing convenience. Alternatively, the heat dissipation plate 200 may be made of a metal material with good heat conductivity, such as aluminum or copper.

The utility model also provides an electric vehicle. The electric vehicle is equipped with the inverter described above. The electric vehicle is a pure electric vehicle or a hybrid vehicle.

To sum up, the utility model discloses a heating panel among the dc-to-ac converter adopts the graphite alkene coating, can conduct away the heat that comes from electron device rapidly and evenly, can play the effect of samming when avoiding local focus, improves the radiating efficiency by a wide margin under the condition that does not occupy space to this normal operating of guaranteeing the dc-to-ac converter. It is therefore highly recommended to apply such an inverter to an electric vehicle.

The inverter and the electric vehicle equipped with the inverter of the present invention have been described in detail with reference to the embodiments, and these examples are provided only for the purpose of illustrating the principles and embodiments of the present invention, and not for the purpose of limiting the present invention, and those skilled in the art can make various modifications and improvements without departing from the spirit and scope of the present invention. Accordingly, all equivalent embodiments are intended to fall within the scope of the present invention and are defined by the various claims of the present invention.

Claims

1. An inverter, comprising:

a housing;

a printed circuit board (100) mounted within the housing;

a heat dissipation plate (200) mounted within the housing and located below the printed circuit board (100); and

an electronic device (300) fixed at an upper surface (210) of the heat dissipation plate (200) and electrically connected to the printed circuit board (100);

it is characterized in that the preparation method is characterized in that,

a graphene coating layer (230) is formed on the entire surface of the upper surface (210) of the heat dissipation plate (200).

2. The inverter according to claim 1, wherein the graphene coating layer (230) is formed on the entire surface of the upper surface (210) of the heat dissipation plate (200) by means of physical vapor deposition.

3. The inverter according to claim 1, wherein the graphene coating layer (230) is formed on the entire surface of the upper surface (210) of the heat dissipation plate (200) by means of electrostatic spraying.

4. An inverter according to any one of claims 1-3, characterized in that the electronic device (300) is fixed at the upper surface (210) of the heat distribution plate (200) by means of gluing.

5. The inverter according to any of claims 1-3, wherein the electronic device (300) is at least one of a capacitor (310), a filter (320), and a power module (330).

6. The inverter of claim 3, wherein the graphene coating (230) is subjected to a baking treatment.

7. The inverter of claim 5, wherein the power module (330) comprises:

an insulating substrate (331) including a first surface and a second surface facing away from each other, the first surface abutting against an upper surface (210) of the heat dissipation plate (200);

a chip (332) disposed on a second surface of the insulating substrate (331); and

and the packaging adhesive (333) completely covers the chip (332), completely covers or partially covers the second surface of the insulating substrate (331), and does not cover the first surface of the insulating substrate (331).

8. An inverter according to any one of claims 1 to 3, characterized in that the lower surface (220) of the heat sink (200) is provided with a number of heat sink fins and the heat sink (200) is integrally formed.

9. Inverter according to any of claims 1-3, characterized in that the heat sink (200) is made of aluminum or copper.

10. An electric vehicle, characterized in that the electric vehicle is equipped with an inverter according to any one of claims 1-9, the electric vehicle being a pure electric vehicle or a hybrid vehicle.