CN212542413U - High-integration-level power module for vehicle - Google Patents

Abstract

The utility model discloses an automobile-used level power module of high integration, including the heating panel, the positive swing joint of heating panel has insulating substrate, insulating substrate's front is provided with metal oxide semiconductor field effect transistor, bonded resistance, signal terminal, thermistor, the range upon range of female terminal of arranging of electric capacity and power terminal, the top and the equal fixedly connected with fixed plate in bottom of insulating substrate both sides, the fixed plate passes through screw and heating panel swing joint, the equal fixedly connected with spring in four corners at the heating panel back, the rear end fixedly connected with bottom plate of spring. The utility model provides a current automobile-used level power module of high integrated level's radiating effect poor, the long-time operation of module produces the heat, can not in time dispel the heat and cool down, reduces life, and the in-process that the vehicle removed simultaneously can jolt, because the fluctuation by a wide margin of inertial power module, the problem of the easy damage of long-time power module.

Description

High-integration-level power module for vehicle

Technical Field

The utility model relates to a power module technical field specifically is a vehicle-grade power module of high integration.

Background

The insulated gate bipolar transistor module is more and more widely applied in the fields of frequency converters, inverter welding machines, induction heating, rail transit, wind energy, solar power generation, new energy automobiles and the like, particularly to a power module, the high integration of the rate module is used for meeting the lightweight requirement of the whole automobile, so the structure and the circuit reliability of the power module and the integration level are higher, but the existing high-integration automobile-grade power module has poor heat dissipation effect, the module generates heat when running for a long time, the heat dissipation and the cooling cannot be carried out in time, the service life is shortened, meanwhile, the automobile can bump in the moving process, and the power module is easy to damage for a long time due to the large amplitude fluctuation of the inertia power module.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a vehicle grade power module of high integration degree possesses the radiating effect good and cushion absorbing advantage, and it is poor to have solved the radiating effect of current vehicle grade power module of high integration degree, and the long-time operation of module produces the heat, can not in time dispel the heat and cool down, reduces life, and the in-process that the vehicle removed simultaneously can jolt, because the undulation by a wide margin of inertial power module, the problem of the easy damage of long-time power module.

In order to achieve the above object, the utility model provides a following technical scheme: a high-integration automotive-grade power module comprises a heat dissipation plate, wherein an insulating substrate is movably connected to the front face of the heat dissipation plate, a metal oxide semiconductor field effect transistor, a bonding resistor, a signal terminal, a thermistor, a capacitor lamination bus bar terminal and a power terminal are arranged on the front face of the insulating substrate, fixing plates are fixedly connected to the top and the bottom of two sides of the insulating substrate and movably connected with the heat dissipation plate through screws, springs are fixedly connected to four corners of the back face of the heat dissipation plate, a bottom plate is fixedly connected to the rear ends of the springs, round holes are formed in two sides of the front face of the bottom plate, a heat dissipation fan is fixedly connected to an inner cavity of each round hole through a support, bolts penetrate through four corners of the front face of the heat dissipation plate, and the rear ends of the bolts sequentially penetrate through the heat dissipation, the utility model discloses a bolt, including bolt rear end, water-cooling channel, bottom plate, mounting hole, the back fixedly connected with radiating fin of heating panel, the surface thread cover of bolt rear end is equipped with the nut, the water-cooling channel has been seted up to the inside of heating panel, the both sides of heating panel bottom all run through and are provided with the connecting pipe, the top of connecting pipe runs through to the inner chamber of water-cooling channel, the top and the equal fixedly connected with L template in bottom of bottom plate both sides, the.

Preferably, the metal oxide semiconductor field effect transistor, the bonding resistor and the thermistor are fixedly connected with a conducting layer of the insulating substrate through welding respectively, the capacitor laminated busbar terminal and the power terminal are connected with the conducting layer of the insulating substrate through ultrasonic welding, and the metal oxide semiconductor field effect transistor and the bonding resistor, the metal oxide semiconductor field effect transistor and the bonding resistor are connected with the conducting layer of the insulating substrate, and the signal terminal is connected with the conducting layer of the insulating substrate through a wire.

Preferably, a gasket is arranged between the nut and the bottom plate, and the rear end of the bolt penetrates through the back face of the gasket.

Preferably, the four corners of the front surfaces of the heat dissipation plate and the bottom plate are provided with through holes matched with bolts, and the diameters of the bolts are smaller than those of the through holes.

Preferably, the heat dissipation plate is made of aluminum alloy, and the outer surface of the heat dissipation plate is electroplated with tin.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a heating panel, insulating substrate, metal oxide semiconductor field effect transistor, bonded resistance, signal terminal, thermistor, the range upon range of female terminal of arranging of electric capacity, power terminal, the fixed plate, a spring, the bottom plate, the round hole, radiator fan, the bolt, the nut, the water-cooling passageway, the connecting pipe, the L template, mounting hole and radiating fin cooperate, possess the radiating effect good and the shock attenuation of buffering advantage, it is poor to have solved current automobile-used level power module's of high integrated level radiating effect, the long-time operation of module produces the heat, can not in time dispel the heat the cooling, and the service life is reduced, the in-process that the vehicle removed can jolt simultaneously, because the fluctuation by a wide margin of inertial power module, the problem of the.

2. The utility model discloses a setting welds the electric capacity terminal on insulating substrate and insulating substrate installs on the heating panel, reduces stray inductance between electric capacity and the module and improves its integrated level and effectively dispels the heat to the module, through setting up the gasket, area of contact between increase nut and the bottom plate, through setting up the through-hole, the bolt of being convenient for passes the heating panel and the bottom plate is connected with the nut, is the aluminum alloy material through setting up the heating panel, and the heat conduction is effectual to be convenient for dispel the heat.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a partial schematic view of the present invention from the bottom;

fig. 3 is a front cross-sectional view of the heat dissipating plate of the present invention.

In the figure: the structure comprises a heat dissipation plate 1, an insulating substrate 2, a metal oxide semiconductor field effect transistor 3, a bonding resistor 4, a signal terminal 5, a thermistor 6, a capacitor lamination busbar terminal 7, a power terminal 8, a fixing plate 9, a spring 10, a bottom plate 11, a circular hole 12, a heat dissipation fan 13, a bolt 14, a nut 15, a water cooling channel 16, a connecting pipe 17, a plate 18L, a mounting hole 19 and a heat dissipation fin 20.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a highly integrated automotive grade power module includes a heat sink 1, an insulating substrate 2 is movably connected to the front of the heat sink 1, a mosfet 3, a bonding resistor 4, a signal terminal 5, a thermistor 6, a capacitor stack busbar terminal 7 and a power terminal 8 are disposed on the front of the insulating substrate 2, fixing plates 9 are fixedly connected to the top and the bottom of the two sides of the insulating substrate 2, the fixing plates 9 are movably connected to the heat sink 1 by screws, springs 10 are fixedly connected to four corners of the back of the heat sink 1, a bottom plate 11 is fixedly connected to the rear ends of the springs 10, round holes 12 are disposed on the two sides of the front of the bottom plate 11, a heat dissipation fan 13 is fixedly connected to the inner cavity of the round holes 12 by a bracket, bolts 14 are disposed at four corners of the front of the heat sink 1, and the rear ends, The inner cavity of the spring 10 and the bottom plate 11 extend to the back of the bottom plate 11, a nut 15 is sleeved on the surface of the rear end of the bolt 14 in a threaded manner, a water cooling channel 16 is formed in the heat dissipation plate 1, connecting pipes 17 are arranged on two sides of the bottom of the heat dissipation plate 1 in a penetrating manner, the top of each connecting pipe 17 penetrates into the inner cavity of the water cooling channel 16, L-shaped plates 18 are fixedly connected to the top and the bottom of two sides of the bottom plate 11, mounting holes 19 are formed in the front of the L-shaped plates 18, heat dissipation fins 20 are fixedly connected to the back of the heat dissipation plate 1, the metal oxide semiconductor field effect transistors 3, the bonding resistors 4 and the thermistors 6 are fixedly connected with a conductive layer of the insulating substrate 2 in a welding manner, the capacitor laminated busbar terminal 7 and the power terminal 8 are connected with the conductive layer of the insulating substrate 2 in an ultrasonic welding manner, and the, The signal terminals 5 are connected with the conductive layer of the insulating substrate 2 through wires, the capacitor terminals are welded on the insulating substrate 2 and the insulating substrate 2 is arranged on the heat dissipation plate 1, stray inductance between the capacitors and the modules is reduced, the integration level is improved, and the modules are effectively dissipated, a gasket is arranged between the nut 15 and the bottom plate 11, the rear end of the bolt 14 penetrates through the back surface of the gasket, the contact area between the nut 15 and the bottom plate 11 is increased by arranging the gasket, through holes matched with the bolt 14 are formed in four corners of the front surfaces of the heat dissipation plate 1 and the bottom plate 11, the diameter of the bolt 14 is smaller than that of each through hole, the bolt 14 conveniently penetrates through the heat dissipation plate 1 and the bottom plate 11 to be connected with the nut 15 through arranging the through holes, the heat dissipation plate 1 is made of aluminum alloy, the outer surface of the heat dissipation plate 1 is electroplated with tin, the heat, the automobile-used high-integration-level power module has the advantages of good heat dissipation effect and buffering and shock absorption, and solves the problems that an existing automobile-used high-integration-level power module is poor in heat dissipation effect, the module generates heat during long-time operation, heat cannot be dissipated and cooled in time, the service life is shortened, meanwhile, the automobile can greatly bump in the moving process, and the power module is easy to damage for a long time due to the fact that an inertial power module fluctuates.

During the use, with connecting pipe 17 through the external water cooling plant of hose, the power module produces the heat when moving, transmit the heat to heating panel 1 through insulating substrate 2, heating panel 1 is on heat transmission fin 20, radiator fan 13's operation is dispelled the heat to fin 20 and heating panel 1, through water cooling plant's operation, circulate the coolant liquid and dispel the heat to heating panel 1 through water-cooling channel 16, thereby carry out high-efficient heat dissipation to the power module, the radiating effect is good, protect the power module, the in-process that the vehicle removed can jolt simultaneously, because the big undulation of inertia power module, the power module drives the vibrations of heating panel 1, the vibrations of spring 10 are driven to the vibrations of heating panel 1, the vibrations of spring 10 are to the heating panel 1, thereby carry out shock attenuation protection to the power module.

All kinds of parts used in the application document are standard parts and can be purchased from the market, the specific connection mode of all parts adopts conventional means such as mature bolts, rivets, welding and the like in the prior art, the conventional models in the prior art are adopted for machinery, parts and electrical equipment, the conventional connection mode in the prior art is adopted for circuit connection, and detailed description is not given here.

In summary, the following steps: the high-integration automotive power module solves the problems that an existing high-integration automotive power module is poor in heat dissipation effect, cannot dissipate heat and cool timely and is short in service life, meanwhile, the automobile can bump in the moving process, and the power module is prone to being damaged for a long time due to large amplitude fluctuation of an inertia power module.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. A vehicle grade power module of high integration degree, includes heating panel (1), its characterized in that: the front face of the heat dissipation plate (1) is movably connected with an insulating substrate (2), the front face of the insulating substrate (2) is provided with a metal oxide semiconductor field effect transistor (3), a bonding resistor (4), a signal terminal (5), a thermistor (6), a capacitor laminated busbar terminal (7) and a power terminal (8), the tops and the bottoms of the two sides of the insulating substrate (2) are fixedly connected with fixing plates (9), the fixing plates (9) are movably connected with the heat dissipation plate (1) through screws, the four corners of the back face of the heat dissipation plate (1) are fixedly connected with springs (10), the rear end of each spring (10) is fixedly connected with a bottom plate (11), the two front sides of the bottom plate (11) are respectively provided with a round hole (12), the inner cavity of each round hole (12) is fixedly connected with a heat dissipation fan (13) through a support, and the four front corners of the, the rear end of bolt (14) runs through the inner chamber and the bottom plate (11) of heating panel (1), spring (10) in proper order and extends to the back of bottom plate (11), the surface thread cover of bolt (14) rear end is equipped with nut (15), water-cooling passageway (16) have been seted up to the inside of heating panel (1), the both sides of heating panel (1) bottom all run through and are provided with connecting pipe (17), the inner chamber to water-cooling passageway (16) is run through at the top of connecting pipe (17), the top and the equal fixedly connected with L template (18) in bottom of bottom plate (11) both sides, mounting hole (19) have been seted up in the front of L template (18), the back fixedly connected with radiating fin (20) of heating panel (1).

2. The highly integrated vehicular grade power module of claim 1, wherein: the metal oxide semiconductor field effect transistor (3), the bonding resistor (4) and the thermistor (6) are fixedly connected with a conducting layer of the insulating substrate (2) through welding respectively, the capacitor laminated busbar terminal (7) and the power terminal (8) are connected with the conducting layer of the insulating substrate (2) through ultrasonic welding, and the metal oxide semiconductor field effect transistor (3) is connected with the bonding resistor (4), the metal oxide semiconductor field effect transistor (3), the bonding resistor (4) and the conducting layer of the insulating substrate (2) are connected with each other through wires, and the signal terminal (5) is connected with the conducting layer of the insulating substrate (2) through wires.

3. The highly integrated vehicular grade power module of claim 1, wherein: a gasket is arranged between the nut (15) and the bottom plate (11), and the rear end of the bolt (14) penetrates through the back face of the gasket.

4. The highly integrated vehicular grade power module of claim 1, wherein: the four corners of the front surfaces of the heat dissipation plate (1) and the bottom plate (11) are provided with through holes matched with the bolts (14), and the diameters of the bolts (14) are smaller than those of the through holes.

5. The highly integrated vehicular grade power module of claim 1, wherein: the heat dissipation plate (1) is made of aluminum alloy, and tin is electroplated on the outer surface of the heat dissipation plate (1).

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