CN219740714U - Press-fit type circuit board structure - Google Patents
Press-fit type circuit board structure Download PDFInfo
- Publication number
- CN219740714U CN219740714U CN202320760460.9U CN202320760460U CN219740714U CN 219740714 U CN219740714 U CN 219740714U CN 202320760460 U CN202320760460 U CN 202320760460U CN 219740714 U CN219740714 U CN 219740714U
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- Prior art keywords
- conductor layer
- circuit board
- layer
- board structure
- insulating layer
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- 239000004020 conductor Substances 0.000 claims abstract description 105
- 239000002184 metal Substances 0.000 claims abstract description 18
- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 239000000741 silica gel Substances 0.000 claims description 17
- 229910002027 silica gel Inorganic materials 0.000 claims description 17
- 239000003292 glue Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 abstract 22
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000005452 bending Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a laminated circuit board structure which comprises a circuit board base layer, a first conductor layer, a second conductor layer, a third conductor layer and an insulating layer, wherein the first conductor layer is arranged above the circuit board base layer, the second conductor layer is arranged above the first conductor layer, the third conductor layer is arranged above the second conductor layer, the insulating layer is arranged above the third conductor layer, a pure adhesive layer is arranged among the circuit board base layer, the first conductor layer, the second conductor layer, the third conductor layer and the insulating layer, and metal connecting rods are arranged inside the first conductor layer, the second conductor layer and the third conductor layer in a penetrating manner. The utility model not only improves the connection compactness between the layers of the circuit board, is not easy to separate, but also improves the press-fit precision of the circuit board, improves the heat dissipation effect and prolongs the service life.
Description
Technical Field
The utility model relates to the technical field of flexible circuit boards, in particular to a press-fit circuit board structure.
Background
The flexible circuit board is also called a soft board, is a printed circuit made of flexible insulating base materials, provides excellent electrical performance, can meet the design requirements of smaller and higher-density installation, is also beneficial to reducing assembly procedures and enhancing reliability, is a unique solution for meeting the miniaturization and movement requirements of electronic products, can be freely bent, wound and folded, can bear millions of dynamic bending without damaging wires, can be randomly arranged according to the space layout requirements, and can be randomly moved and stretched in a three-dimensional space, thereby achieving the integration of component assembly and wire connection; the flexible circuit board can greatly reduce the volume and weight of the electronic product, and is suitable for the requirements of the electronic product on high density, miniaturization and high reliability. The existing multilayer circuit board production process realizes layer adding through a pressing mode, firstly, an inner layer plate is manufactured, and then structural layer adding is carried out layer by layer through pressing.
1. When the press-fit circuit board structure is pressed, the connection between the layers is not firm enough, and the separation condition is easy to occur, so that the normal use of the circuit board is affected, and the improvement is needed; 2. when the circuit board is pressed, all layers are easy to deviate, and all layers are not connected accurately enough, so that the precision of the circuit board is affected; 3. the circuit board has a general heat dissipation effect when in use, the temperature is easy to rise rapidly, and the service life of the circuit board can be influenced by the overhigh temperature.
Disclosure of Invention
The present utility model is directed to a press-fit circuit board structure, which solves the above-mentioned problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a pressfitting formula circuit board structure, includes circuit board basic unit, first conductor layer, second conductor layer, third conductor layer and insulating layer, first conductor layer sets up the top at circuit board basic unit, the second conductor layer sets up the top at first conductor layer, the third conductor layer sets up the top at second conductor layer, the insulating layer sets up the top at third conductor layer, all be provided with the pure glue film between circuit board basic unit, first conductor layer, second conductor layer, third conductor layer, the insulating layer, the upper surface of circuit board basic unit all is provided with equidistant first blind hole, the lower surface of insulating layer all is provided with equidistant second blind hole, first conductor layer, second conductor layer, third conductor layer's inside all wears to be equipped with the metal connecting rod, the bottom of metal connecting rod extends to the inside of first blind hole and with circuit board basic unit fixed connection, the top of metal connecting rod extends to the inside of second blind hole and with insulating layer fixed connection, the both sides of circuit board basic unit all are provided with the support.
Preferably, the lower surface of the circuit board base layer is adhered with heat conducting silica gel sheets, and the lower surfaces of the heat conducting silica gel sheets are fixed with equidistant radiating fins, so that the circuit board can be conveniently radiated.
Preferably, the corner positions of the upper surfaces of the circuit board base layer, the first conductor layer, the second conductor layer and the third conductor layer are provided with positioning grooves, so that the positioning protrusions are conveniently limited.
Preferably, the corner positions of the lower surfaces of the first conductor layer, the second conductor layer, the third conductor layer and the insulating layer are provided with positioning protrusions, the positioning protrusions are tightly clamped with the positioning grooves, the layers of the circuit board are prevented from being deviated, and the precision of the circuit board is improved.
Preferably, the top of support all is provided with the screw hole, just the inside threaded connection of screw hole has the bolt, is convenient for adjust the height of clamp plate.
Preferably, equidistant connecting pieces are fixed between the brackets below the heat-conducting silica gel piece, the connecting pieces are made of soft materials and can deform, and heat dissipation gaps are arranged between the connecting pieces, so that heat dissipation space is provided.
Preferably, the bottom of bolt rotates and installs the clamp plate, is convenient for apply down force for circuit board basic unit, through the mode of compressing tightly, has further promoted the compactness of connecting between each layer of circuit board, makes it difficult to separate.
Preferably, the bottom of the pressing plate is adhered with a rubber sheet, so that the friction force between the pressing plate and the circuit board base layer is increased, and the surface of the circuit board base layer can be prevented from being worn.
Compared with the prior art, the utility model has the beneficial effects that: the press-fit circuit board structure not only improves the connection compactness between the layers of the circuit board, is not easy to separate, does not deviate among the layers of the circuit board, improves the press-fit precision of the circuit board, improves the heat dissipation effect and prolongs the service life;
(1) The metal connecting rods, the first blind holes, the second blind holes, the support, the threaded holes, the bolts, the pressing plate and the rubber sheet are arranged, a plurality of groups of metal connecting rods penetrate through the first conductor layer, the second conductor layer and the third conductor layer, the top ends of the metal connecting rods are fixed in the second blind holes at the bottom ends of the insulating layers, the bottom ends of the metal connecting rods are fixed in the first blind holes at the top ends of the circuit board base layers, the metal connecting rods enable the connection between the layers of the circuit board structure to be tighter and firmer, the bolts are rotated in the threaded holes to rotate and move downwards, the bolts push the pressing plate to move downwards and apply downward pressure to the circuit board base layers, the rubber sheet is arranged to not only increase the friction force between the pressing plate and the circuit board base layers, but also prevent the surface of the circuit board base layers from being worn, and the connection compactness between the circuit board layers is further improved in a pressing mode, so that the circuit board base layers are not easy to separate;
(2) The positioning bulges and the positioning grooves are arranged at the corner positions of the upper surfaces of the base layer, the first conductor layer, the second conductor layer and the third conductor layer of the circuit board, and the positioning bulges are arranged at the corner positions of the lower surfaces of the first conductor layer, the second conductor layer, the third conductor layer and the insulating layer;
(3) Through being provided with heat conduction silica gel piece, fin, connection piece, heat dissipation clearance, owing to the lower surface of circuit board basic unit all glues and glues there is heat conduction silica gel piece, the inside heat of conduction circuit board of being convenient for, and the setting of heat conduction silica gel piece lower surface fin is convenient for derive heat, and simultaneously, the support bottom of heat conduction silica gel piece below is fixed with the connection piece, is equipped with the heat dissipation clearance between the connection piece, has formed radiating space, is convenient for follow the circulation of air with the heat dissipation, thereby improved the radiating effect of circuit board, prolonged life.
Drawings
FIG. 1 is a schematic elevational view of the present utility model;
FIG. 2 is a schematic view of a partial cross-sectional structure of the present utility model;
FIG. 3 is an enlarged schematic view of the structure of FIG. 1A according to the present utility model;
FIG. 4 is an enlarged schematic view of the structure of FIG. 2B according to the present utility model;
FIG. 5 is a schematic top view of a bracket according to the present utility model;
fig. 6 is a schematic view showing a bottom enlarged structure of the heat conductive silicone sheet of the present utility model.
In the figure: 1. a circuit board base layer; 2. a first conductor layer; 3. a second conductor layer; 4. a third conductor layer; 5. an insulating layer; 6. a pure glue layer; 7. a bracket; 8. a thermally conductive silicone sheet; 9. a heat sink; 10. a first blind hole; 11. a second blind hole; 12. a metal connecting rod; 13. a threaded hole; 14. a bolt; 15. a pressing plate; 16. a rubber sheet; 17. positioning the bulge; 18. a positioning groove; 19. a connecting sheet; 20. a heat dissipation gap.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present utility model are within the scope of protection of the present utility model.
Referring to fig. 1-6, an embodiment of the present utility model is provided: the utility model provides a pressfitting formula circuit board structure, including circuit board basic unit 1, first conductor layer 2, second conductor layer 3, third conductor layer 4 and insulating layer 5, first conductor layer 2 sets up in the top of circuit board basic unit 1, second conductor layer 3 sets up in the top of first conductor layer 2, third conductor layer 4 sets up in the top of second conductor layer 3, insulating layer 5 sets up in the top of third conductor layer 4, circuit board basic unit 1, first conductor layer 2, second conductor layer 3, third conductor layer 4, insulating layer 5 all are provided with pure glue film 6 between;
the upper surface of the circuit board base layer 1 is provided with equidistant first blind holes 10, the lower surface of the insulating layer 5 is provided with equidistant second blind holes 11, the interiors of the first conductor layer 2, the second conductor layer 3 and the third conductor layer 4 are respectively penetrated with a metal connecting rod 12, the bottom ends of the metal connecting rods 12 extend to the interiors of the first blind holes 10 and are fixedly connected with the circuit board base layer 1, the top ends of the metal connecting rods 12 extend to the interiors of the second blind holes 11 and are fixedly connected with the insulating layer 5, and the two sides of the circuit board base layer 1 are provided with brackets 7;
the lower surfaces of the circuit board base layers 1 are adhered with heat-conducting silica gel sheets 8, and the lower surfaces of the heat-conducting silica gel sheets 8 are fixed with equidistant radiating fins 9, so that the circuit board can be conveniently radiated;
positioning grooves 18 are formed in the corner positions of the upper surfaces of the circuit board base layer 1, the first conductor layer 2, the second conductor layer 3 and the third conductor layer 4, so that the positioning protrusions 17 can be conveniently limited;
the positioning protrusions 17 are arranged at the corner positions of the lower surfaces of the first conductor layer 2, the second conductor layer 3, the third conductor layer 4 and the insulating layer 5, the positioning protrusions 17 are tightly clamped with the positioning grooves 18, the layers of the circuit board are prevented from being deviated, and the precision of the circuit board is improved;
the top of the bracket 7 is provided with a threaded hole 13, and the inside of the threaded hole 13 is connected with a bolt 14 through threads, so that the height of the pressing plate 15 can be conveniently adjusted;
equidistant connecting pieces 19 are fixed between the brackets 7 below the heat-conducting silica gel sheets 8, and heat dissipation gaps 20 are arranged between the connecting pieces 19, so that a heat dissipation space is provided;
the bottom end of the bolt 14 is rotatably provided with a pressing plate 15, so that downward pressure is conveniently applied to the circuit board base layer 1, and the connection tightness between the layers of the circuit board is further improved in a pressing mode, so that the circuit board is not easy to separate;
the bottom end of the pressing plate 15 is adhered with a rubber sheet 16, which not only plays a role in increasing friction force between the pressing plate 15 and the circuit board base layer 1, but also can prevent the surface of the circuit board base layer 1 from wearing.
When the embodiment of the utility model is used, the following steps are adopted: firstly, the circuit board structure is formed by laminating and combining a circuit board base layer 1, a first conductor layer 2, a second conductor layer 3, a third conductor layer 4 and an insulating layer 5, wherein a pure glue layer 6 is arranged among the circuit board base layer 1, the first conductor layer 2, the second conductor layer 3, the third conductor layer 4 and the insulating layer 5, a plurality of groups of metal connecting rods 12 are penetrated among the first conductor layer 2, the second conductor layer 3 and the third conductor layer 4, the top ends of the metal connecting rods 12 are fixed in a second blind hole 11 at the bottom end of the insulating layer 5, the bottom ends of the metal connecting rods 12 are fixed in a first blind hole 10 at the top end of the circuit board base layer 1, the arrangement of the metal connecting rods 12 enables the connection among the layers of the circuit board structure to be more compact and firm, secondly, a rotary bolt 14 enables the circuit board to rotate in the threaded hole 13 and move downwards, the bolt 14 pushes a pressing plate 15 to move downwards and applies downward pressure to the circuit board base layer 1, the rubber sheet 16 not only plays a role in increasing friction force between the pressing plate 15 and the circuit board base layer 1, but also can prevent the surface of the circuit board base layer 1 from being worn, further improves connection tightness between layers of the circuit board in a pressing mode and is not easy to separate, wherein the bracket 7 and the pressing plate 15 only position the end part of the circuit board and cannot influence bending of the circuit board, then, as the corner positions of the upper surfaces of the circuit board base layer 1, the first conductor layer 2, the second conductor layer 3 and the third conductor layer 4 are all provided with positioning grooves 18, and the corner positions of the lower surfaces of the first conductor layer 2, the second conductor layer 3, the third conductor layer 4 and the insulating layer 5 are all provided with positioning protrusions 17, the positioning protrusions 17 are tightly clamped with the positioning grooves 18, and when in pressing, the positioning protrusions 17 between the layers of the circuit board are clamped into the corresponding positioning grooves 18, the circuit board laminating device has the advantages that the condition of deviation between layers of the circuit board is avoided, the laminating precision of the circuit board is improved, and the heat conducting silica gel sheet 8 is adhered to the lower surface of the circuit board base layer 1, so that the heat inside the circuit board is conducted conveniently, the heat radiating fin 9 on the lower surface of the heat conducting silica gel sheet 8 is convenient to conduct out the heat, the heat conducting silica gel sheet 8 and the heat radiating fin 9 can be bent along with the bending of the circuit board, meanwhile, the connecting sheet 19 is fixed at the bottom of the bracket 7 below the heat conducting silica gel sheet 8, the connecting sheet 19 is made of soft materials and can deform, the heat radiating gap 20 is formed between the connecting sheets 19, the heat radiating space is convenient to conduct out the heat along with air circulation, the heat radiating effect of the circuit board is improved, and the service life is prolonged.
Claims (8)
1. The utility model provides a pressfitting formula circuit board structure, its characterized in that includes circuit board basic unit (1), first conductor layer (2), second conductor layer (3), third conductor layer (4) and insulating layer (5), first conductor layer (2) set up in the top of circuit board basic unit (1), second conductor layer (3) set up in the top of first conductor layer (2), third conductor layer (4) set up in the top of second conductor layer (3), insulating layer (5) set up in the top of third conductor layer (4), all be provided with between circuit board basic unit (1), first conductor layer (2), second conductor layer (3), third conductor layer (4), insulating layer (5) pure glue film (6), the upper surface of circuit board basic unit (1) all is provided with equidistant first blind hole (10), the lower surface of insulating layer (5) all is provided with equidistant second blind hole (11), first conductor layer (2), second conductor layer (3), third conductor layer (4) and the inside connecting rod (12) of connecting wire (12) are all equipped with and extend to the inside basic unit (1) of connecting wire, the top end of the metal connecting rod (12) extends to the inside of the second blind hole (11) and is fixedly connected with the insulating layer (5), and brackets (7) are arranged on two sides of the circuit board base layer (1).
2. The laminated circuit board structure of claim 1, wherein: the lower surfaces of the circuit board base layers (1) are adhered with heat conduction silica gel sheets (8), and the lower surfaces of the heat conduction silica gel sheets (8) are fixed with equidistant radiating fins (9).
3. The laminated circuit board structure of claim 1, wherein: and positioning grooves (18) are formed in the corner positions of the upper surfaces of the circuit board base layer (1), the first conductor layer (2), the second conductor layer (3) and the third conductor layer (4).
4. A laminated circuit board structure according to claim 3, wherein: the positioning protrusions (17) are arranged at the corner positions of the lower surfaces of the first conductor layer (2), the second conductor layer (3), the third conductor layer (4) and the insulating layer (5), and the positioning protrusions (17) are tightly clamped with the positioning grooves (18).
5. The laminated circuit board structure of claim 1, wherein: screw holes (13) are formed in the tops of the brackets (7), and bolts (14) are connected to the inner threads of the screw holes (13).
6. A laminated circuit board structure according to claim 2, wherein: equidistant connecting pieces (19) are fixed between the brackets (7) below the heat conduction silica gel piece (8), and heat dissipation gaps (20) are arranged between the connecting pieces (19).
7. The laminated circuit board structure of claim 5, wherein: the bottom end of the bolt (14) is rotatably provided with a pressing plate (15).
8. The laminated circuit board structure of claim 7, wherein: the bottom end of the pressing plate (15) is stuck with a rubber sheet (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320760460.9U CN219740714U (en) | 2023-04-06 | 2023-04-06 | Press-fit type circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320760460.9U CN219740714U (en) | 2023-04-06 | 2023-04-06 | Press-fit type circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219740714U true CN219740714U (en) | 2023-09-22 |
Family
ID=88064543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320760460.9U Active CN219740714U (en) | 2023-04-06 | 2023-04-06 | Press-fit type circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219740714U (en) |
-
2023
- 2023-04-06 CN CN202320760460.9U patent/CN219740714U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |