CN219718595U - High-efficient radiating multilayer circuit board - Google Patents
High-efficient radiating multilayer circuit board Download PDFInfo
- Publication number
- CN219718595U CN219718595U CN202321189460.4U CN202321189460U CN219718595U CN 219718595 U CN219718595 U CN 219718595U CN 202321189460 U CN202321189460 U CN 202321189460U CN 219718595 U CN219718595 U CN 219718595U
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- dissipation
- layer
- waterproof layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 63
- 239000002184 metal Substances 0.000 claims abstract description 22
- 239000000428 dust Substances 0.000 claims description 17
- 238000010276 construction Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 7
- 230000005855 radiation Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 239000011120 plywood Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of circuit boards, and provides a high-efficiency heat-dissipation multi-layer circuit board which comprises a lower plate, an upper plate and a chip, wherein a main plate is arranged above the lower plate, the upper plate is arranged above the main plate, a waterproof structure is arranged on one side of the lower plate, a dustproof structure is arranged above the middle position of the upper plate, a heat-dissipation structure is arranged above the upper plate, the heat-dissipation structure comprises a metal heat-dissipation layer, a shell, a fan and a second heat-dissipation hole, the metal heat-dissipation layer is arranged above the upper plate, and one side of the metal heat-dissipation layer is connected with the shell. According to the utility model, the heat dissipation structure is arranged, so that the circuit board can be effectively prevented from being burnt out due to the fact that the circuit board generates heat in long-time use through the shell, the heat dissipation effect can be maximized under the effect of the metal heat dissipation layer in use, the circuit board is prevented from being shorted out due to high temperature, and the heat dissipation performance of the high-efficiency heat dissipation multi-layer circuit board in use is enhanced.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a high-efficiency heat dissipation multilayer circuit board.
Background
In daily production, a circuit board is used as a high-precision instrument, and a lot of heat is generated in the use process due to the defect of high density, if the heat is accumulated for a long time, the circuit board is easily damaged, so the circuit board is particularly a multi-layer circuit board with high-efficiency heat dissipation;
for this reason, the patent of publication number CN214381566U discloses a high-efficient radiating multilayer circuit board, including top plate, lower plywood, the top plate with be equipped with the heat conduction insulating layer between the lower plywood, the heat conduction insulating layer middle part is formed with the fretwork region, the top plate is equipped with first circuit layer, second circuit layer respectively at both ends about, first circuit layer with be connected with first metallized hole between the second circuit layer, first metallized hole is located fretwork region upside, be equipped with the bleeder vent on the lower plywood, the bleeder vent is located fretwork region downside, the lower plywood lower extreme is fixed with first fan, first fan is located the bleeder vent downside. The multilayer circuit board has the advantages of simple structure and high heat dissipation efficiency;
the circuit board has a relatively stable effect when in use, but still has some problems: because the heat dissipation base is poor, the heat accumulation and heating amount of the circuit board in the long-time process can easily cause the circuit board to burn out and short-circuit, so that the circuit board is extremely inconvenient to use.
Disclosure of Invention
First, the technical problem to be solved
The utility model aims to provide a high-efficiency heat-dissipation multi-layer circuit board, which is used for solving the defect of poor heat dissipation base of the traditional high-efficiency heat-dissipation multi-layer circuit board.
(II) summary of the utility model
In order to solve the technical problems, the utility model provides the following technical scheme: the high-efficiency heat dissipation multi-layer circuit board comprises a lower plate, an upper plate and a chip, wherein a main plate is arranged above the lower plate, an upper plate is arranged above the main plate, a waterproof structure is arranged on one side of the lower plate, a dustproof structure is arranged above the middle position of the upper plate, a heat dissipation structure is arranged above the upper plate, the heat dissipation structure comprises a metal heat dissipation layer, a shell, a fan and a second heat dissipation hole, the metal heat dissipation layer is arranged above the upper plate, one side of the metal heat dissipation layer is connected with the shell, the fan is arranged inside the shell, and the second heat dissipation hole is arranged below the fan;
a circuit element is arranged in the main board;
the bottom of the heat radiation structure is provided with a chip.
Preferably, the waterproof structure comprises a first waterproof layer, a second waterproof layer and a third waterproof layer, wherein the first waterproof layer is arranged at the bottom end of the lower plate, the second waterproof layer is arranged at one end, far away from the lower plate, of the first waterproof layer, and the third waterproof layers are arranged at two sides of the second waterproof layer.
Preferably, the first waterproof layer has a main view cross-sectional area equal to that of the second waterproof layer, and the third waterproof layer is in a concave structure design.
Preferably, the dustproof structure comprises a dustproof cover, a first radiating hole and a dustproof film, wherein the dustproof cover is arranged at the top end of the radiating structure, the first radiating hole is formed in the surface of the dustproof cover, and the dustproof film is arranged in the dustproof cover.
Preferably, the first heat dissipation holes are uniformly formed in the surface of the dust cover, and the front view cross-sectional area of the dust film is smaller than that of the dust cover.
Preferably, the surface of the metal heat dissipation layer is uniformly provided with heat dissipation holes, and the surface of the second heat dissipation hole is uniformly provided with heat dissipation holes.
Preferably, the fan is of a hollow structure design, and the main view cross-sectional area of the metal heat dissipation layer is larger than that of the second heat dissipation hole.
(III) beneficial effects
The high-efficiency heat dissipation multi-layer circuit board provided by the utility model has the advantages that:
through the waterproof structure, water possibly enters the circuit board due to misoperation in the use process to cause short circuit and burn out, and under the action of the first waterproof layer, the second waterproof layer and the third waterproof layer, the water can be thoroughly isolated outside the circuit board, so that the circuit board is prevented from burning out and short circuit due to water immersion, and the waterproof performance of the high-efficiency heat-dissipation multilayer circuit board in the use process is enhanced;
through being provided with dustproof construction, can lead to because dust accumulation leads to the circuit board short circuit because the incessant rotation of fan in long-term use, can effectually prevent under the effect of dustproof membrane that dust from piling up and leading to the circuit board short circuit, avoided the dust to pile up on the circuit board constantly to strengthened the dust proofness of this high-efficient radiating multilayer circuit board in the use;
through being provided with heat radiation structure, can prevent effectively through the shell that the circuit board from generating heat and leading to the circuit board short circuit to burn out in long-time use, can reach the biggest with the radiating effect through the effect of metal heat dissipation layer in the use, avoided the high temperature to lead to the short circuit of circuit board to strengthened the heat dispersion of this high-efficient radiating multilayer circuit board in the use.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a front view of the present utility model;
FIG. 2 is a schematic view of a front cross-sectional structure of the present utility model;
FIG. 3 is a schematic top view of the present utility model;
FIG. 4 is an enlarged schematic view of the structure of FIG. 2A according to the present utility model;
fig. 5 is a schematic three-dimensional structure of the dust-proof structure of the present utility model.
Reference numerals in the drawings illustrate: 1. a lower plate; 2. a main board; 3. an upper plate; 4. a waterproof structure; 401. a first waterproof layer; 402. a second waterproof layer; 403. a third waterproof layer; 5. a dust-proof structure; 501. a dust cover; 502. a first heat radiation hole; 503. a dust-proof film; 6. a heat dissipation structure; 601. a metal heat dissipation layer; 602. a housing; 603. a fan; 604. a second heat radiation hole; 7. a circuit element; 8. and a chip.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by one of ordinary skill in the art without inventive faculty, are intended to be within the scope of the present utility model, based on the embodiments of the present utility model.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Example 1
Referring to fig. 1-5, the high-efficiency heat dissipation multi-layer circuit board provided by the utility model comprises a lower board 1, an upper board 3 and a chip 8, wherein a main board 2 is arranged above the lower board 1, the upper board 3 is arranged above the main board 2, one side of the lower board 1 is provided with a waterproof structure 4, the waterproof structure 4 comprises a first waterproof layer 401, a second waterproof layer 402 and a third waterproof layer 403, the first waterproof layer 401 is arranged at the bottom end of the lower board 1, one end of the first waterproof layer 401 far away from the lower board 1 is provided with the second waterproof layer 402, both sides of the second waterproof layer 402 are provided with the third waterproof layer 403, the main view cross section area of the first waterproof layer 401 is equal to the main view cross section area of the second waterproof layer 402, and the third waterproof layer 403 is in a concave structure design.
In this embodiment, in the use process, water may enter to cause the circuit board to burn out due to an operation error, and under the action of the first waterproof layer 401, the second waterproof layer 402 and the third waterproof layer 403, water may be thoroughly isolated outside the circuit board, so that the circuit board is prevented from burning out and short-circuiting due to water immersion.
Example two
The embodiment further includes: the middle part position top of upper plate 3 is provided with dustproof construction 5, and dustproof construction 5 includes shield 501, first louvre 502 and dust membrane 503, and shield 501 sets up in the top of heat radiation structure 6, and the surface of shield 501 is provided with first louvre 502, and the inside of shield 501 is provided with dust membrane 503, and first louvre 502 evenly sets up in the surface of shield 501, and the main view cross-sectional area of dust membrane 503 is less than the main view cross-sectional area of shield 501.
In this embodiment, the fan 603 rotates continuously during long-term use, which may cause short circuit of the circuit board due to dust accumulation, and the dust accumulation can be effectively prevented from causing short circuit of the circuit board by the dustproof film 503, so that dust is prevented from accumulating continuously on the circuit board.
Example III
The embodiment further includes: the top of upper plate 3 is provided with heat radiation structure 6, heat radiation structure 6 includes metal heat dissipation layer 601, shell 602, fan 603 and second louvre 604, metal heat dissipation layer 601 sets up in the top of upper plate 3, one side of metal heat dissipation layer 601 is connected with shell 602, the inside of shell 602 is provided with fan 603, the below of fan 603 is provided with second louvre 604, the inside of mainboard 2 is provided with circuit element 7, the bottom of heat radiation structure 6 is provided with chip 8, the louvre has evenly been seted up on the surface of metal heat dissipation layer 601, the louvre has evenly been seted up on the surface of second louvre 604, fan 603 is hollow structural design, the main view cross-sectional area of metal heat dissipation layer 601 is greater than the main view cross-sectional area of second louvre 604.
In this embodiment, the shell 602 can effectively prevent the circuit board from being burned out due to heat generated during long-time use, and the heat dissipation effect can be maximized under the action of the metal heat dissipation layer 601 during use, so that the circuit board is prevented from being shorted out due to high temperature.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The apparatus embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present utility model without undue burden.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (7)
1. High-efficient radiating multilayer circuit board, including hypoplastron (1), upper plate (3) and chip (8), its characterized in that: the novel heat-dissipation structure is characterized in that a main board (2) is arranged above the lower board (1), an upper board (3) is arranged above the main board (2), a waterproof structure (4) is arranged on one side of the lower board (1), a dustproof structure (5) is arranged above the middle position of the upper board (3), a heat-dissipation structure (6) is arranged above the upper board (3), the heat-dissipation structure (6) comprises a metal heat-dissipation layer (601), a shell (602), a fan (603) and a second heat-dissipation hole (604), the metal heat-dissipation layer (601) is arranged above the upper board (3), one side of the metal heat-dissipation layer (601) is connected with the shell (602), a fan (603) is arranged inside the shell (602), and the second heat-dissipation hole (604) is arranged below the fan (603);
a circuit element (7) is arranged inside the main board (2);
the bottom of the heat dissipation structure (6) is provided with a chip (8).
2. The high-efficiency heat dissipating multilayer circuit board of claim 1, wherein: waterproof construction (4) are including first waterproof layer (401), second waterproof layer (402) and third waterproof layer (403), first waterproof layer (401) set up in the bottom of hypoplastron (1), the one end that hypoplastron (1) was kept away from to first waterproof layer (401) is provided with second waterproof layer (402), the both sides of second waterproof layer (402) are provided with third waterproof layer (403).
3. The high-efficiency heat dissipating multilayer circuit board of claim 2, wherein: the front view cross-sectional area of the first waterproof layer (401) is equal to the front view cross-sectional area of the second waterproof layer (402), and the third waterproof layer (403) is of a concave structure design.
4. The high-efficiency heat dissipating multilayer circuit board of claim 1, wherein: the dustproof structure (5) comprises a dustproof cover (501), a first radiating hole (502) and a dustproof film (503), wherein the dustproof cover (501) is arranged at the top end of the radiating structure (6), the first radiating hole (502) is formed in the surface of the dustproof cover (501), and the dustproof film (503) is arranged inside the dustproof cover (501).
5. The high-efficiency heat-dissipating multilayer circuit board of claim 4, wherein: the first heat dissipation holes (502) are uniformly formed in the surface of the dust cover (501), and the front view cross-sectional area of the dust film (503) is smaller than that of the dust cover (501).
6. The high-efficiency heat dissipating multilayer circuit board of claim 1, wherein: the surface of the metal heat dissipation layer (601) is uniformly provided with heat dissipation holes, and the surface of the second heat dissipation hole (604) is uniformly provided with heat dissipation holes.
7. The high-efficiency heat dissipating multilayer circuit board of claim 1, wherein: the fan (603) is of a hollow structure design, and the front view cross-sectional area of the metal heat dissipation layer (601) is larger than that of the second heat dissipation hole (604).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321189460.4U CN219718595U (en) | 2023-05-16 | 2023-05-16 | High-efficient radiating multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321189460.4U CN219718595U (en) | 2023-05-16 | 2023-05-16 | High-efficient radiating multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219718595U true CN219718595U (en) | 2023-09-19 |
Family
ID=87982948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321189460.4U Active CN219718595U (en) | 2023-05-16 | 2023-05-16 | High-efficient radiating multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219718595U (en) |
-
2023
- 2023-05-16 CN CN202321189460.4U patent/CN219718595U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN219718595U (en) | High-efficient radiating multilayer circuit board | |
| CN211152526U (en) | Anti-interference integrated radiating capacitor module | |
| CN108712846A (en) | The safe radiator structure of a kind of electronic equipment | |
| CN211352604U (en) | Heat dissipation optimization structure of circuit board | |
| CN209861447U (en) | Heat radiation structure of motor controller | |
| CN215991364U (en) | Composite structure of multiple circuit boards | |
| CN209787551U (en) | Novel house PCB board of half hole laminating | |
| CN201312472Y (en) | Flume-type water cooling structure for large-power induction cooker core and large-power power switch housing | |
| CN205793613U (en) | A kind of high-frequency resistance circuit board | |
| CN218104055U (en) | Power conversion device and household energy storage system comprising same | |
| CN220526754U (en) | Reflow-resistant chip capacitor | |
| CN220493211U (en) | HDI high density PCB board | |
| CN217470364U (en) | Circuit board with heat dissipation function | |
| CN212851169U (en) | High-efficient heat dissipation printed circuit board | |
| CN219893733U (en) | Portable box with radiating function and component overhang layout | |
| CN218851207U (en) | Heat dissipation circuit board | |
| CN218450686U (en) | Heat conduction type double-sided circuit board | |
| CN217336035U (en) | Ceramic-based PCB structure with embedded components | |
| CN213818360U (en) | High-efficient radiating bluetooth circuit board | |
| CN216752204U (en) | High-power quick radiating circuit board | |
| CN219068751U (en) | PCB circuit board with dampproofing waterproof function | |
| CN218277263U (en) | PCB heat dissipation device | |
| CN216820201U (en) | High-stability high-density interconnection lamination printed circuit board | |
| CN218483004U (en) | High-density thick-copper multilayer circuit board | |
| CN211297139U (en) | Heat dissipation type circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |