CN211152526U - Anti-interference integrated radiating capacitor module - Google Patents

Abstract

The utility model discloses an anti-interference integrated heat dissipation capacitor module, which comprises a metal shell and an internal circuit board, wherein the bottom of the metal shell is sealed, the top of the metal shell is open, and the internal circuit board is arranged in the metal shell and is tightly attached to the bottom of the metal shell; at least one capacitor module is integrated on the internal circuit board, each capacitor module is a hot spot capacitor bank in an application circuit, a heat-conducting medium which is solid after being cooled is filled in the metal shell, and the internal circuit board is fixed at the bottom of the metal shell by the heat-conducting medium. The internal circuit board is etched with surface-mounted copper wire circuits corresponding to the capacitor modules one to one, each capacitor module is welded on the surface-mounted copper wire circuit corresponding to the capacitor module, and capacitor module pins corresponding to the capacitor modules are fixed on the internal circuit board. The metal shell is a copper shell or an aluminum shell with the bottom outer side smooth, the bottom outer side of the metal shell is directly contacted with the system shell, and the top of the metal shell is opened downwards so as to be directly contacted with the substrate through a heat conducting medium. The problem of low cost performance of the existing integral capacitor heat dissipation method is solved.

Description

Anti-interference integrated radiating capacitor module

Technical Field

The utility model belongs to the technical field of energy system's components and parts integrate, a anti-interference integrated form heat dissipation electric capacity module is related to.

Background

Capacitors are one of the basic components of electronic engineering. Plays a significant role in alternating current, direct current, low frequency, high frequency and other systems. Nowadays, the types of capacitors in the market are mainly classified into a surface mount type and a direct-insert through-hole type according to the installation mode.

In a common electronic product, capacitors are directly soldered on a circuit board. However, in high voltage and high current power systems such as power supplies, electrical power or radio frequency systems, a low saturation temperature is critical during operation. Whether alternating current or direct current, the current reaches a certain threshold value limit to cause the rapid heat accumulation of standard components and circuit boards, the temperature often exceeds 100 ℃, and the rise of the heat often causes irreparable results such as component explosion, circuit scorching and the like without good heat dissipation measures. And almost all applications in the market today have a tendency to be miniaturized. Power supply systems such as general dc power supplies and adapters, inverters and amplifier modules for wireless power transmission, or voltage regulators for chargers, etc. tend to be miniaturized. In applications with equivalent wattage, miniaturization of circuit boards has reached a technical bottleneck in heat dissipation, especially for high power devices. Although general cooling schemes such as increasing the thickness of the copper sheet, using special high thermal conductivity substrate materials, etc. have some effect, the overall cost is very high. Moreover, the capacitor heating hot spot in the active system is often only one corner or a few small areas of the whole circuit board, so that the integral scheme change is large and small in size, and medicine cannot be taken according to the symptoms, so that the cost performance is not high.

Disclosure of Invention

An object of the embodiment of the utility model is to provide an anti-interference integrated form heat dissipation electric capacity module to solve the problem that current integral electric capacity heat dissipation method price/performance ratio is low, and there is the circuit board at electric capacity focus such as electrical power generating system and receive the heat dissipation restriction and be difficult to the problem of miniaturization.

The embodiment of the utility model adopts the technical proposal that the anti-interference integrated heat dissipation capacitor module comprises a metal shell and an internal circuit board, wherein the metal shell is a metal shell with a sealed bottom and an open top, and the internal circuit board is arranged in the metal shell and is tightly attached to the bottom of the metal shell; at least one capacitor module is integrated on the internal circuit board, each capacitor module is a hot spot capacitor bank in an application circuit, heat-conducting media which are solid after being cooled are filled in the metal shell and the internal circuit board, and the internal circuit board is fixed at the bottom of the metal shell by the heat-conducting media.

Furthermore, the internal circuit board is etched with surface-mounted copper wire circuits corresponding to the capacitor modules one to one, and each capacitor module is welded on the surface-mounted copper wire circuit corresponding to the capacitor module.

Furthermore, the internal circuit board is fixed with capacitor module pins corresponding to each capacitor module, and the capacitor module pins are electrically connected with the corresponding capacitor modules.

Furthermore, the pins of the capacitor module are welded on the internal circuit board, and the pins of the capacitor module are electrically connected with the corresponding capacitor module through a patch copper wire circuit;

the side wall of the opening of the metal shell is provided with pin limiting grooves which correspond to the pin positions of the capacitor module one by one, the depth of each pin limiting groove is consistent with the thickness of the pin of the capacitor module, the width of each pin limiting groove is consistent with the width of the pin of the capacitor module, and the pins of the capacitor module extend to the outside of the metal shell through the pin limiting grooves.

Furthermore, the metal shell is a copper shell or an aluminum shell with smooth bottom outer side, and the bottom outer side of the metal shell is directly contacted with the system shell; the top of the metal shell is provided with a downward opening and is in direct contact with the substrate through a heat-conducting medium;

the heat-conducting medium is heat-conducting paste with heat conductivity and insulativity;

the system shell is a radiator or an application system shell of the anti-interference integrated radiating capacitor module.

Furthermore, be equipped with at least one location arch on the lateral wall of inside circuit board, be equipped with vertical constant head tank on metal casing's the inside wall, constant head tank and the protruding one-to-one of location, the location arch can be followed the constant head tank and reciprocated and drive inside circuit board up-and-down motion in metal casing.

Further, the metal shell is a metal shell with a heat dissipation function and/or an electromagnetic shielding function, or a composite metal shell formed by compounding metal with the heat dissipation function and metal with the electromagnetic shielding function.

Further, the metal shell of the metal shell with the heat dissipation function and/or the electromagnetic shielding function is a copper shell, an aluminum shell, an iron shell or a ferrite shell;

the composite metal shell is formed by arranging an iron shell on an aluminum shell.

The embodiment of the utility model has the beneficial effects that, the anti-interference integrated form electric capacity module that provides can not be restricted to certain specific application circuit, has certain universal usability. Because of the integrated form, a metal shell can contain a plurality of capacitor modules, the number of pins of the capacitor modules can be increased, and the integration level is high. Can be integrated as the module with current application circuit's electric capacity hotspot, through the metal covering at top and inside heat-conducting medium, upwards respectively with the shell is derived to heat energy downwards rapidly, simple process, with low costs, and the radiating efficiency is high, can reach the cooling degree more than 30%, has effectively solved the problem that current integral electric capacity radiating method price/performance ratio is low. Meanwhile, the capacitor module is small in size and convenient to use, the size of the metal shell can be set according to the requirement of the internal circuit board of the system, the capacitor module with the temperature raised at the middle end of the circuit is integrated in the metal shell, the heat dissipation effect is enhanced through the heat conducting paste, the size of the internal circuit board of the system is not required to be increased for heat dissipation, the problem that the internal circuit board is limited to be miniaturized due to heat dissipation is effectively solved, the generation and application of the capacitor module are beneficial to the miniaturization of the internal circuit board of a power supply system, and the problem that the internal circuit board with a capacitor hotspot in the existing power supply system is limited by heat dissipation and is difficult.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is an appearance schematic diagram of an anti-interference integrated heat dissipation capacitor module according to an embodiment of the present invention.

Fig. 2 is a schematic structural view of an anti-interference integrated heat dissipation capacitor module according to an embodiment of the present invention.

Fig. 3 is a schematic diagram of the heat dissipation of the anti-interference integrated heat dissipation capacitor module according to the embodiment of the present invention.

In the figure, 1, a metal shell, 2, an internal circuit board, 3, a capacitor module pin, 4, a capacitor module, 5, a heat-conducting medium, 6, a pin limiting groove, 7, a substrate, 8, a system shell, 9, a positioning bulge and 10, a positioning groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Based on the background art, the utility model discloses a local or the independent heat dissipation of components and parts hierarchy is optimized and is seem to be especially important, nevertheless will guarantee in the effective heat dissipation the surplus, also can not produce too big influence to whole system's design and budget.

The embodiment of the utility model provides an anti-interference integrated form heat dissipation capacitor module, its structure is as shown in fig. 1~3, including metal casing 1 and internal circuit board 2, metal casing 1 is the metal casing that the bottom is sealed, the top is open, and internal circuit board 2 is arranged in metal casing 1 and is hugged closely in its bottom, and internal circuit board 2's shape is the same with 1 inner chamber shapes of metal casing to guarantee that it can hug closely in metal casing 1. As shown in fig. 2, at least one capacitor module 4 is integrated on the internal circuit board 2, the internal circuit board 2 is etched with patch copper wire circuits corresponding to the capacitor modules 4 one to one, and each capacitor module 4 is welded at a corresponding position of the corresponding patch copper wire circuit.

Each capacitor module 4 on the internal circuit board 2 is a hot-spot capacitor bank (a heat-generating capacitor bank) in an application circuit thereof, and is generally a capacitor bank with a high temperature rise when the application circuits such as an ac circuit or a power supply system work, and such capacitor banks that can form high-temperature hot spots in the circuit are generally a filter capacitor, a matching capacitor of a radio frequency circuit, a resonant capacitor of a converter, and the like.

The internal circuit board 2 is provided with capacitor module pins 3 corresponding to each capacitor module 4, the side wall of the opening of the metal shell 1 is provided with pin limiting grooves 6 corresponding to the capacitor module pins 3 one by one, and the capacitor module pins 3 on the internal circuit board 2 extend from the inside of the metal shell 1 to the outside of the metal shell through the pin limiting grooves 6 so as to be connected with an external power supply and further serve as media for the power supply to enter and leave the anti-interference integrated heat dissipation capacitor module. The capacitor module pin 3 of the embodiment of the utility model is made of copper or tinned copper, the quantity of which is determined according to the requirement of the application system, capacitive modules such as rf matching circuits and hot spots of filters typically require 3 pins for input, output and ground, the capacitor module of the hot spot of the power circuit generally only needs 2 pins, the number of the capacitor module pins 3 on the internal circuit board 2 corresponds to the number of the capacitor modules 4 integrated thereon and the number of the pins of the capacitor modules 4, such as one capacitor module with only hot spots of the rf matching circuit or filter integrated on the internal circuit board 2, the number of the pins 3 of the capacitor module is 3, and if the internal circuit board 2 is integrated with not only one capacitor module of the hot spot of the filter but also one capacitor module of the hot spot of the power circuit, the number of the pins 3 of the capacitor module is 5. Integrated electric capacity module 4 is more, and electric capacity module pin 3 is corresponding increase also, consequently the utility model discloses anti-interference integrated form heat dissipation electric capacity module also is applicable to other circuit systems that need more pins.

In metal casing 1, the packing has heat-conducting medium 5 on the internal circuit board 2, and the solid is behind the 5 normal atmospheric temperature cooling of heat-conducting medium, can be fixed in metal casing 1 bottom with internal circuit board 2, makes internal circuit board 2 and 1 bottom direct contact of metal casing to lead out the heat that the electric capacity component on the internal circuit board 2 produced, the utility model discloses the preferred heat conductivity of heat-conducting medium 5 and the heat conduction cream that insulating nature is good, the melting point of heat conduction cream is far greater than the biggest intensification temperature of hot electric capacity in the circuit for the heat conduction cream can keep solid-state after the cooling all the time.

The metal case 1 may be round, square or any other shape according to the internal capacitance module, but its external surface must be smooth, as shown in fig. 3, the anti-interference integrated heat dissipation capacitance module directly contacts the substrate 7 through the heat conducting medium 5, and directly contacts the system case 8 through the external side of the bottom of the metal case 1, so as to improve the heat conducting performance to the utmost, and the heat energy is respectively conducted from the working module to the system case 8 upwards and downwards quickly, thereby being diffused to the outside. The metal shell 1 is a metal shell with a heat dissipation function and/or an electromagnetic shielding function, such as a copper shell and an aluminum shell, which have good heat dissipation performance, and the copper-aluminum metal has diamagnetism, and will form a shielding wall for the internal capacitor module 4, so that the internal and external electromagnetic fields do not interfere with each other. Such as an iron shell or a ferrite shell with good electromagnetic shielding performance, for example, a composite metal shell with both the heat dissipation function and the electromagnetic shielding function formed by arranging the iron shell on an aluminum shell.

Be equipped with at least one location arch 9 on the lateral wall of inside circuit board 2, be equipped with vertical constant head tank 10 on metal casing 1's the inside wall, constant head tank 10 equals with the protruding 9 quantity in location, and both one-to-one matches, and location arch 9 can follow constant head tank 10 and reciprocate and drive inside circuit board 2 up-and-down motion in metal casing 1, be convenient for installation and dismantlement. When the internal circuit board 2 is installed, the positioning protrusions 9 move from top to bottom along the positioning grooves 10 corresponding to the positioning protrusions, the internal circuit board 2 is placed at the bottom of the metal shell 1, the problem of inclination of the internal circuit board 2 in the installation and fixation process is effectively solved, and the internal circuit board 2 can be effectively positioned.

The embodiment of the utility model provides an earlier the integration has electric capacity module 4's internal circuit board 2 to place in metal casing 1's tank bottoms, make internal circuit board 2 and metal casing 1 direct contact, ensure that both have the fastest heat conduction route, then in metal casing 1, pour into insulating heat-conducting medium 5 on the internal circuit board 2 again, let heat-conducting medium 5 fill all the other spaces in metal casing 1, avoid the existence of air in metal casing 1, heat-conducting medium 5 furthest has improved the integration has electric capacity module 4's internal circuit board 2, the contact surface between metal casing 1 and the base plate 7, can dispel the heat more effectively.

The heating of few circuits is comprehensive, most of circuits such as converters, transformers and the like are heated extremely and are all in the area where core conversion components and parts of the circuits are located, the heat dissipation is realized by increasing the size of an internal circuit board in the conventional general solution, the internal circuit board cannot be miniaturized by the mode, the capacitor module which is heated extremely in each circuit is integrated in a metal shell, the heat dissipation effect is enhanced by means such as heat conducting paste, the heat dissipation is realized without increasing the size of the internal circuit board of the system, and the problem that the internal circuit board is miniaturized due to heat dissipation limitation is effectively solved.

The embodiment of the utility model provides an integrated form heat dissipation capacitor module, the heat energy that produces when letting electric current pass through capacitor bank can lead it to the base plate 7 or the system's shell 8 that paste mutually fast through metal casing 1's top and bottom (like the shell of radiator or the system that uses this integrated form heat dissipation capacitor module etc.) to the consequence of general capacitor bank because of the unable normal work of heat-induced damage has been avoided. As the name suggests, integrated form heat dissipation electric capacity module is the electric capacity combination that can rapid heating up with the during operation forms electric capacity module 4 on a slice of internal circuit board 2, then put into heat conduction metal casing 1 with it, and pour into heat-conducting medium 5 and make electric capacity module 4 be fixed in metal casing 1 in, the process is simple and direct, has solved the overheated problem of common electric capacity in power, high frequency electric power system, and can reach the cooling degree more than 30%, but through experimental verification discover no matter what circuit's electric capacity module of integrated in the metal casing of the embodiment, with same size metal casing, the heat dissipation degree that is the cooling degree of circuit high temperature that electric capacity module corresponds in it is linear, makes the temperature of the hot spot in the circuit reduce 30% at least, is favorable to semiconductor system's stability. Because the metal shell 1 is made of copper-aluminum metal and belongs to diamagnetic metal, the capacitor module 4 in the metal shell has good shielding effect, and the service life and the efficiency of the whole system are prolonged.

The preparation method of the anti-interference integrated heat dissipation module specifically comprises the following steps:

step S1, determining the specification of the metal shell 1 to prepare the metal shell 1;

step S2, determining the specification of the internal circuit board 2 according to the specification of the metal shell 1, and etching a patch copper wire circuit which is used for integrating the capacitor module 4 and is connected with an external application system circuit on the internal circuit board 2;

step S3, welding the capacitor module 4 and the capacitor module pin 3 thereof on the patch copper circuit of the internal circuit board 2;

step S4, placing the internal circuit board 2 at the bottom of the metal shell 1 by using the positioning protrusions 9 and the positioning grooves 10, leading the pins 3 of the capacitor module out of the metal shell 1, and then pouring the molten heat-conducting medium 5 into the metal shell 1;

s5, after the heat-conducting medium 5 is solidified, fixing the internal circuit board 2, welding the top opening of the prepared anti-interference integrated radiating capacitor module on the external application system circuit board downwards, measuring the working temperature and the application system performance of the external application system circuit board, adjusting the specification of the metal shell 1 in a simulation mode, and circulating the steps S1-S5 until the working temperature of the external application system circuit board is the lowest and the system performance is the best.

Step S1 preliminarily determines the specification of the initial metal case 1 according to the power of the external application system circuit board and the accommodation space.

The physical parameters of the metal shell 1 can be determined by the wall thickness and the volume according to the heat conduction equation, because the size of the metal shell 1 can influence the specification of the circuit board of the external application system, the specification which can be contained by the circuit board of the external application system can be given first, and the physical parameters of the metal shell 1 can be further adjusted by simulation after the working temperature of the circuit board in the system is measured. The working effects of the same group of capacitor modules 4 and the metal shell 1 under different powers are different, and the size of the metal shell 1 under each power is obtained through simulation and actual measurement adjustment. The adjustment of the capacitor module 4 is to adjust the influence of the capacitance value on the whole circuit, such as efficiency, matching, power, temperature, etc. In high frequency high wattage applications on the market, capacitors are generally the work efficiency and frequency of the impact, so the overall performance of the external application system is referred to in the simulation of teaching capacitance values.

It is to be noted that, in the present invention, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

All the embodiments in the present specification are described in a related manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.

Claims (8)

1. The anti-interference integrated heat-dissipation capacitor module is characterized by comprising a metal shell (1) and an internal circuit board (2), wherein the metal shell (1) is a metal shell with a sealed bottom and an open top, and the internal circuit board (2) is arranged in the metal shell (1) and clings to the bottom of the metal shell; at least one capacitor module (4) is integrated on the internal circuit board (2), each capacitor module (4) is a hot spot capacitor bank in an application circuit, a heat-conducting medium (5) which is solid after being cooled is poured on the internal circuit board (2) in the metal shell (1), and the internal circuit board (2) is fixed at the bottom of the metal shell (1) by the heat-conducting medium (5).

2. The anti-jamming integrated heat dissipation capacitor module according to claim 1, wherein the internal circuit board (2) is etched with patch copper wire circuits corresponding to the capacitor modules (4) one to one, and each capacitor module (4) is soldered to the patch copper wire circuit corresponding thereto.

3. The antijam integrated heat dissipation capacitor module according to claim 1, wherein the inner circuit board (2) is fixed with capacitor module pins (3) corresponding to each capacitor module (4), and the capacitor module pins (3) are electrically connected with the corresponding capacitor modules (4).

4. The anti-jamming integrated heat dissipation capacitor module according to claim 3, wherein the capacitor module pins (3) are soldered on the internal circuit board (2), and the capacitor module pins (3) and the corresponding capacitor module (4) are electrically connected through a patch copper wire circuit;

the capacitor module is characterized in that pin limiting grooves (6) which correspond to the positions of the pins (3) of the capacitor module in a one-to-one mode are formed in the side wall of the opening of the metal shell (1), the depth of each pin limiting groove (6) is consistent with the thickness of each pin (3) of the capacitor module, the width of each pin limiting groove (6) is consistent with the width of each pin (3) of the capacitor module, and each pin (3) of the capacitor module extends to the outside of the metal shell (1) through the corresponding pin limiting groove (6).

5. The antijam integrated heat sink capacitor module as claimed in claim 1, wherein the metal housing (1) is a copper or aluminum case with smooth bottom and outer side, and the bottom outer side of the metal housing is in direct contact with the system housing (8); the top of the metal shell (1) is opened downwards and is in direct contact with the substrate (7) through the heat-conducting medium (5);

the heat-conducting medium (5) is heat-conducting paste with heat conductivity and insulativity;

the system shell (8) is a radiator or an application system shell of the anti-interference integrated radiating capacitor module.

6. The anti-interference integrated heat dissipation capacitor module according to claim 1, wherein at least one positioning protrusion (9) is disposed on a sidewall of the internal circuit board (2), a vertical positioning groove (10) is disposed on an inner sidewall of the metal housing (1), the positioning groove (10) and the positioning protrusion (9) are in one-to-one correspondence, and the positioning protrusion (9) can move up and down along the positioning groove (10) to drive the internal circuit board (2) to move up and down in the metal housing (1).

7. The anti-interference integrated heat dissipation capacitor module according to any one of claims 1 to 6, wherein the metal housing (1) is a metal shell having a heat dissipation function and/or an electromagnetic shielding function, or a composite metal shell formed by compositing a metal having a heat dissipation function and a metal having an electromagnetic shielding function.

8. The antijam integrated heat dissipating capacitor module according to claim 7, wherein the metal housing having the heat dissipating function and/or the electromagnetic shielding function is a copper, aluminum, iron or ferrite housing;

the composite metal shell is formed by arranging an iron shell on an aluminum shell.

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