CN216217695U

CN216217695U - PCB structure of switching power supply module and switching power supply module

Info

Publication number: CN216217695U
Application number: CN202122299482.3U
Authority: CN
Inventors: 张汉顺; 林仲勇
Original assignee: Xiamen Hongfa Electroacoustic Co Ltd
Current assignee: Xiamen Hongfa Electroacoustic Co Ltd
Priority date: 2021-09-22
Filing date: 2021-09-22
Publication date: 2022-04-05
Anticipated expiration: 2031-09-22

Abstract

The utility model discloses a PCB structure of a switching power supply module and the switching power supply module, wherein the PCB structure comprises a PCB board, a plurality of power devices and at least one temperature sensitive device, wherein the power devices and the at least one temperature sensitive device are arranged on the PCB board; the power devices are located at a first position of the PCB, the at least one temperature sensitive device is located at a second position of the PCB, and the first position and the second position are distributed along the preset direction of the PCB. The power device and the temperature sensitive device are separately distributed on the PCB, so that the influence of heat generated by the power device on the temperature sensitive device can be reduced. In addition, the power devices are positioned at the same part of the PCB, so that the utility model can also carry out centralized treatment on the heat generated by the power devices so as to improve the heat dissipation effect.

Description

PCB structure of switching power supply module and switching power supply module

Technical Field

The utility model relates to the technical field of switching power supplies, in particular to a PCB structure of a switching power supply module and the switching power supply module.

Background

The PCB of the switching power supply module is generally provided with a plurality of power devices and temperature sensitive devices, wherein the power devices are heating devices and can generate a large amount of heat during working. The temperature sensitive device, such as an electrolytic capacitor, is greatly influenced by heat, and taking a better electrolytic capacitor as an example, the working temperature range is-40 ℃ to 105 ℃, the service life of the electrolytic capacitor is 10000 hours at 105 ℃, and the service life of the electrolytic capacitor is increased by 1 time when the working temperature is reduced by 10 ℃. When the heat generated by the power device is conducted to the electrolytic capacitor, the temperature of the electrolytic capacitor is likely to exceed 105 ℃ due to the temperature rise of the electrolytic capacitor in the charging and discharging processes, the service life of the electrolytic capacitor can be seriously influenced, and the service life of the whole switching power supply module is further influenced. At present, a power device and a temperature sensitive device on a PCB of a switching power supply module are not reasonably arranged, and the temperature sensitive device is easily affected adversely, so that the service life of a product is shortened.

SUMMERY OF THE UTILITY MODEL

The utility model provides a PCB structure of a switch power supply module and the switch power supply module aiming at the technical problems in the prior art.

The technical scheme adopted by the utility model for solving the technical problems is as follows: a PCB structure of a switch power supply module comprises a PCB, a plurality of power devices and at least one temperature sensitive device, wherein the power devices and the at least one temperature sensitive device are arranged on the PCB; the power devices are located at a first position of the PCB, the at least one temperature sensitive device is located at a second position of the PCB, and the first position and the second position are distributed along the preset direction of the PCB.

Further, the first portion and the second portion are distributed along a length direction, a width direction or a diagonal direction of the PCB.

Further, the power device is close to the edge of the PCB.

Furthermore, the power devices comprise power transformers, and the power transformers are located on the front side or the back side of the first portion of the PCB.

Furthermore, the power devices further comprise a patch power supply and a patch diode, and the patch power supply and the patch diode are respectively positioned on the front side or the back side of the first part of the PCB.

Further, the at least one temperature sensitive device comprises at least one electrolytic capacitor, and the electrolytic capacitor is positioned on the front surface or the back surface of the second part of the PCB.

Furthermore, the number of the electrolytic capacitors is at least two, and the distribution direction of the at least two electrolytic capacitors is perpendicular to the distribution direction of the first part and the second part.

Furthermore, a heat insulation sleeve is sleeved outside the electrolytic capacitor.

Furthermore, the PCB further comprises an annular inductor, and the annular inductor is arranged on the front surface or the back surface of the second part of the PCB.

Further, a rectifier filter circuit comprising at least one electrolytic capacitor, an EMC circuit comprising at least one electrolytic capacitor and a flyback PSR circuit comprising the power device are integrated on the PCB.

The utility model further provides a switching power supply module, which comprises a shell and a PCB structure of the switching power supply module, wherein the PCB structure is positioned in the shell and is sealed by the heat-conducting insulating glue filled in the shell.

Compared with the prior art, the utility model has the following beneficial effects:

1. the power devices and the temperature sensitive devices are separately distributed on the PCB, so that the influence of heat generated by the power devices on the temperature sensitive devices can be reduced. In addition, the power devices are positioned at the same part of the PCB, so that the utility model can also carry out centralized treatment on the heat generated by the power devices so as to improve the heat dissipation effect.

2. The power device is close to the edge of the PCB, so that heat generated by the power device during operation is easily led out, and the heat dissipation effect of the utility model is further improved.

3. The electrolytic capacitor is sleeved with the heat insulation sleeve, so that the influence of high temperature on the electrolytic capacitor can be further reduced.

The utility model is further explained in detail with the accompanying drawings and the embodiments; however, the PCB structure of the switching power supply module and the switching power supply module of the present invention are not limited to the embodiments.

Drawings

FIG. 1 is a schematic front view of a PCB structure of the present invention;

FIG. 2 is a schematic backside view of the PCB structure of the present invention;

fig. 3 is a schematic structural view (perspective) of a switching power supply module of the present invention;

the power transformer comprises a PCB (printed circuit board), 11, a first part, 12, a second part, 2, a power transformer, 3, an electrolytic capacitor, 4, an annular inductor, 5, a patch power supply, 6, a patch diode, 7, a shell, 8 and pins.

Detailed Description

Referring to fig. 1 and fig. 2, a PCB structure of a switching power supply module according to the present invention includes a PCB board 1, and a plurality of power devices and at least one temperature sensitive device disposed on the PCB board; the power devices are located at a first portion 11 of the PCB 1, the at least one temperature sensitive device is located at a second portion 12 of the PCB 1, and the first portion 11 and the second portion 12 are distributed along a predetermined direction of the PCB 1, and specifically, the first portion 11 and the second portion 12 are distributed along a length direction of the PCB 1, but not limited thereto, and in other embodiments, the first portion and the second portion are equally distributed along a width direction or a diagonal direction of the PCB.

In this embodiment, the power device is close to the edge of the PCB board 1. The power devices include a power transformer 2, and the power transformer 2 is located on the front side of the first portion 11 of the PCB board 1, but not limited thereto, and in other embodiments, the power transformer is located on the back side of the first portion of the PCB board. The power devices further include a patch power supply 5 and a patch diode 6, where the patch power supply 5 and the patch diode 6 are respectively located on the back side of the first portion 11 of the PCB 1, but not limited thereto, and in other embodiments, the patch power supply and the patch diode are respectively located on the front side of the first portion of the PCB.

In this embodiment, the at least one temperature sensitive device includes at least one electrolytic capacitor 3, and the electrolytic capacitor 3 is located on the front side or the back side of the second portion 12 of the PCB 1. The number of the electrolytic capacitors 3 is at least two, and the distribution direction of the at least two electrolytic capacitors 3 is perpendicular to the distribution direction of the first portion 11 and the second portion 12. Specifically, the number of the electrolytic capacitors 3 is two, and the two electrolytic capacitors 3 are distributed along the width direction of the PCB board 1. And a heat insulation sleeve is sleeved outside each electrolytic capacitor 3.

In this embodiment, the PCB structure of the present invention further includes a ring inductor 4, and the ring inductor 4 is disposed on the front surface of the second portion 12 of the PCB board 1, but is not limited thereto. A rectifier filter circuit comprising one of the two electrolytic capacitors, an EMC circuit comprising the other of the two electrolytic capacitors and a flyback PSR circuit comprising the power devices are integrated on the PCB 1.

According to the PCB structure of the switching power supply module, the power device and the temperature sensitive device (namely the electrolytic capacitor 3) are separately distributed on the PCB 1, so that the influence of heat generated by the power device on the temperature sensitive device (namely the electrolytic capacitor 3) can be reduced. In addition, the power devices are positioned at the same part of the PCB 1, so that the utility model can also perform centralized treatment on the heat generated by the power devices to improve the heat dissipation effect.

The switching power supply module is an AC-to-DC switching power supply module, and comprises a shell 7 and a PCB structure of the switching power supply module, wherein the PCB structure is positioned in the shell (as shown in figure 3, only a PCB 1 is shown in figure 3, components on the PCB 1 are not shown, the PCB 1 is electrically connected with a plurality of pins 8 which are partially positioned outside the shell 7, and the plurality of pins 8 comprise two input pins and two output pins) and are sealed by heat-conducting insulating glue filled in the shell 7. The filling of the heat-conducting insulating glue ensures the reliability of the installation of the PCB (printed circuit board) 1 and the heat dissipation of components, reduces the influence of high temperature on the electrolytic capacitor 3, increases the characteristics of insulativity, three-proofing and the like among the components, and improves the overall service life of the product.

The PCB structure of the switching power supply module and the switching power supply module are the same as or can be realized by adopting the prior art.

The above embodiments are only used to further illustrate the PCB structure of the switching power supply module and the switching power supply module of the present invention, but the present invention is not limited to the embodiments, and any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention fall within the scope of the technical solution of the present invention.

Claims

1. A PCB structure of a switch power supply module comprises a PCB, a plurality of power devices and at least one temperature sensitive device, wherein the power devices and the at least one temperature sensitive device are arranged on the PCB; the method is characterized in that: the power devices are located at a first position of the PCB, the at least one temperature sensitive device is located at a second position of the PCB, and the first position and the second position are distributed along the preset direction of the PCB.

2. The PCB structure of the switching power supply module according to claim 1, wherein: the first portion and the second portion are distributed along the length direction, the width direction or the diagonal direction of the PCB.

3. The PCB structure of the switching power supply module according to claim 1 or 2, wherein: the power device is close to the edge of the PCB.

4. The PCB structure of the switching power supply module according to claim 1, wherein: the power devices comprise power transformers, and the power transformers are positioned on the front side or the back side of the first part of the PCB; the power devices further comprise a patch power supply and a patch diode, and the patch power supply and the patch diode are respectively positioned on the front side or the back side of the first part of the PCB.

5. The PCB structure of the switching power supply module according to claim 1, wherein: the at least one temperature sensitive device comprises at least one electrolytic capacitor, and the electrolytic capacitor is positioned on the front surface or the back surface of the second part of the PCB.

6. The PCB structure of the switching power supply module according to claim 5, wherein: the number of the electrolytic capacitors is at least two, and the distribution direction of the at least two electrolytic capacitors is vertical to the distribution direction of the first part and the second part.

7. The PCB structure of the switching power supply module according to claim 5 or 6, wherein: and a heat insulation sleeve is sleeved outside the electrolytic capacitor.

8. The PCB structure of the switching power supply module according to claim 1, wherein: the PCB further comprises an annular inductor, and the annular inductor is arranged on the front side or the back side of the second part of the PCB.

9. The PCB structure of the switching power supply module according to claim 5 or 6, wherein: and a rectifier filter circuit comprising at least one electrolytic capacitor, an EMC circuit comprising at least one electrolytic capacitor and a flyback PSR circuit comprising the power device are integrated on the PCB.

10. A switching power supply module, includes the shell, its characterized in that: the PCB structure of the switching power supply module according to any one of claims 1 to 9, which is located in the housing and is sealed by a thermally conductive insulating paste filled in the housing.