CN218104055U

CN218104055U - Power conversion device and household energy storage system comprising same

Info

Publication number: CN218104055U
Application number: CN202222481571.4U
Authority: CN
Inventors: 刘钢
Original assignee: Hangzhou Weisibo System Technology Co ltd
Current assignee: Hangzhou Weisibo System Technology Co ltd
Priority date: 2022-09-20
Filing date: 2022-09-20
Publication date: 2022-12-20
Anticipated expiration: 2032-09-20

Abstract

The utility model provides a power conversion device and include its family energy storage system relates to power supply unit, through pasting the great switching device of calorific capacity in the power conversion device on the polylith copper of the second side of DBC ceramic substrate, has reduced the thermal contact resistance of switching device and DBC ceramic substrate greatly; the first side of the DBC ceramic substrate is integrally coated with copper, and the first side coated with copper is attached to the radiator, so that the heat of the switch device is transferred to the radiator through the DBC ceramic substrate and the copper on the DBC ceramic substrate, the thermal resistance from the switch device to the radiator is greatly reduced, the junction temperature of the switch device is greatly reduced, and the operation reliability of the power conversion device is improved; the first side of the DBC ceramic substrate is integrally coated with copper, so that the DBC ceramic substrate can be effectively prevented from being cracked, and the reliability is improved; in addition, the pin of the switch device is bent, so that the PCB, the switch device module and the radiator are arranged approximately in parallel, the size of the power conversion device is greatly reduced, and the power density of the power conversion device is improved.

Description

Power conversion device and household energy storage system comprising same

Technical Field

The utility model relates to a power supply unit, especially power conversion device reach including its family with energy storage system.

Background

Due to the influences of factors such as geopolitical situation, energy price soaring of petroleum, natural gas and the like, the energy cost and the electricity price in overseas, particularly in Europe greatly rise, the demand of a household energy storage system is increased explosively, and annual acceleration of the household energy storage market in 4-5 years in the future is expected to exceed 100%. At present, europe is the first market of energy storage for the global users, wherein Germany is the largest market of energy storage for the global users, and the electricity price of the German residents reaches more than 40 ohm/kWh in this year, which is three times higher than that of the German residents in the early 2021 year. Italy, polish, uk, czech, and other countries are also growing faster.

Furthermore, india, egypt, etc. are growing into emerging markets with ever-increasing demand. The east wu securities indicate that the global energy storage installation is expected to reach 148GW/369GWh by 2025, with the home energy storage installation 50GW/122gwh, CAGR 126%/130% by 2021-2025, and energy storage/home energy storage batteries will reach shipment 529/196GWh by 2025. Household energy storage has become the industry with the fastest global demand.

The power of the household energy storage system is larger, more than 5kW, and the heat generation is more serious. Since some scenes are co-located applications, noise is very sensitive to the user and it is desirable to keep it within 25 dB. In addition, the user also puts forward the requirement of IP67 on high protection level, so that the fault shutdown caused by foreign matters such as mosquitoes can be effectively prevented. The technical premise of the ultra-silent and high-protection level is natural cooling. However, the existing products are all air-cooled, and the reason for this is that the heat dissipation of these converters is relatively backward, most of the heat will be dissipated into the chassis, and thus a fan with high power has to be used for heat dissipation.

SUMMERY OF THE UTILITY MODEL

The present application provides a power conversion device, including: a heat sink; the heat dissipation module comprises a plurality of switch device modules, a heat dissipation module and a heat dissipation module, wherein each switch device module comprises a DBC (dielectric-bonded ceramic) substrate and a plurality of switch devices with bent pins, the first side of the DBC substrate is integrally plated with copper, the second side opposite to the first side is plated with a plurality of pieces of copper, the plurality of pieces of copper on the second side of the DBC substrate are respectively provided with a switch device with bent pins, the pins of the switch devices extend out in the direction far away from the DBC substrate, and the first sides of the DBC ceramic substrates of the switch device modules are fixed on a heat dissipation device; and pins of the switch device are inserted into the connecting holes of the PCB.

Further, the heat sink is a heat sink.

Furthermore, the metal layer side of the main body part of the switch device is fixedly connected with the copper on the second side of the DBC ceramic substrate in a one-to-one correspondence mode.

Further, the first side of the DBC ceramic substrate of the switching device module is attached to the heat sink by a thermally conductive silicone grease.

Further, the first side of the DBC ceramic substrate of the switching device module is soldered directly to the heat sink.

Further, the pin-bent switching device includes a pin and a body portion, wherein the pin of the switching device is at an angle to the body portion.

Furthermore, the PCB is arranged in parallel with the switch device module and the radiator.

The application provides a household energy storage system, which comprises the power conversion device.

Drawings

Fig. 1 is a side view of a power conversion device according to an embodiment of the present application.

Fig. 2 is a schematic diagram of a switching device with bent pins according to an embodiment of the present application.

Fig. 3 is a schematic view of a DBC ceramic substrate according to an embodiment of the present disclosure.

Fig. 4 is a schematic diagram of a switching device module according to an embodiment of the present application.

Fig. 5 is a schematic diagram illustrating a switching device module fixed to a heat sink according to an embodiment of the disclosure.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments, but not all embodiments, of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The present application provides a power conversion device, please refer to the side view of the power conversion device shown in fig. 1. A power conversion device includes:

a heat sink 400;

a plurality of switching device modules 300, each of which includes a DBC ceramic substrate 200 and a plurality of switching devices 100 with bent pins, wherein a first side 210 of the DBC ceramic substrate 200 is plated with copper entirely, a second side 220 opposite to the first side is plated with a plurality of pieces of copper (e.g., 221 to 22 n), the plurality of pieces of copper (e.g., 221 to 22 n) on the second side of the DBC ceramic substrate 200 are respectively provided with one switching device 100 with bent pins, and the pins 110 of the switching devices extend in a direction away from the DBC ceramic substrate 200, and the first sides 210 of the DBC ceramic substrates of the plurality of switching device modules 300 are fixed on a heat sink 400;

the PCB board 500, the pin 110 of the switching device is inserted into the connecting hole of the PCB.

As described above, the switching device with a large heat generation amount in the power conversion device is attached to the plurality of pieces of copper on the second side of the DBC ceramic substrate, so that the thermal contact resistance between the switching device and the DBC ceramic substrate is greatly reduced; the first side of the DBC ceramic substrate is integrally coated with copper, and the first side coated with copper is attached to the radiator, so that the heat of the switch device is transferred to the radiator through the DBC ceramic substrate and the copper on the DBC ceramic substrate, the thermal resistance from the switch device to the radiator is greatly reduced, the junction temperature of the switch device is greatly reduced, and the operation reliability of the power conversion device is improved; the first side of the DBC ceramic substrate is integrally coated with copper, so that the DBC ceramic substrate can be effectively prevented from being cracked, and the reliability is improved; in addition, the pin of the switch device is bent, so that the PCB, the switch device module and the radiator are arranged approximately in parallel, the size of the power conversion device is greatly reduced, and the power density of the power conversion device is improved.

Specifically, referring to fig. 2, which is a schematic diagram of a pin-bent switching device according to an embodiment of the present invention, a pin-bent switching device 100 includes a pin 110 and a main portion 120, where the pin 110 of the switching device forms an angle with the main portion 120, such as approximately 90 degrees.

Furthermore, as shown in fig. 1, the PCB 500 is disposed in parallel or approximately parallel with the switching device module 300 and the heat sink 400, so as to greatly reduce the size of the power conversion device and increase the power density thereof.

Specifically, referring to the schematic diagram of the DBC ceramic substrate shown in fig. 3, a first side 210 of the DBC ceramic substrate is plated with copper 211 entirely, referring to (a) in fig. 3, and a second side 220 opposite to the first side is plated with a plurality of pieces of copper (e.g., 221 to 22n, where n is a natural number greater than or equal to 2), referring to (b) in fig. 3.

Specifically, referring to the schematic diagram of the switching device module shown in fig. 4, the switching device module 300 includes a DBC ceramic substrate 200 and a plurality of switching devices 100 with bent pins, the switching devices 100 with bent pins are respectively disposed on a plurality of pieces of copper on the second side 220 of the DBC ceramic substrate 200, and the pins 110 of the switching devices extend away from the DBC ceramic substrate 200.

Specifically, referring to the schematic diagram of fig. 5 after the switching device module is fixed on the heat sink, the switching device module 300 is fixed on the heat sink 400, and the pins 110 of the switching device extend away from the heat sink 400. As shown in fig. 1, the pin 110 of the switching device is inserted into the connecting hole of the PCB, so that the switching device is electrically connected to other devices on the PCB board, thereby completing the power conversion function.

In one embodiment, the heat sink 400 is a heat sink. Of course, the heat sink 400 may be other solid heat dissipating devices.

In an embodiment, the metal layer side of the main body part 120 of the switching device is fixedly connected with the copper of the second side 220 of the DBC ceramic substrate 200 in a one-to-one correspondence manner, that is, one piece of copper is fixedly connected with the metal layer side of the main body part 120 of one switching device, so as to improve the heat dissipation effect on the switching device.

In one embodiment, the first side 210 of the DBC ceramic substrate 200 of the switching device module is bonded to the heat sink 400 through a thermal grease (not shown), which makes the process simple and the thermal conductivity good.

In one embodiment, the first side 210 of the DBC ceramic substrate 200 of the switching device module is directly soldered to the heat sink 400, such that the heat of the switching device is directly transferred to the heat sink 400 through the DBC ceramic substrate.

Experiments show that the total thermal resistance of the DBC ceramic substrate adopted by the application is 0.5, which is far less than the thermal resistance (about 2) of the traditional ceramic chip and silicone grease gluing process. Assuming that the heat generation amount of the power device is 20W, the temperatures caused by the two different heat dissipation technologies are 0.5 × 20=10 ℃ and 2 × 20=40 ℃, respectively, and the difference between the two temperatures is 30 ℃, so that the power conversion device formed by the power conversion device assembly method can realize natural cooling without other heat dissipation devices such as fans. If the service life of the power device is estimated according to the rule of thumb at 10 ℃, the thermal service life of the power device and the thermal service life of the power device are different by 8 times.

An embodiment of the present invention provides a household energy storage system, including the power conversion apparatus described above.

The advantages are the same as the power conversion device described above, and are not described herein again.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. A power conversion apparatus, comprising:

a heat sink;

the heat dissipation device comprises a plurality of switch device modules, a heat dissipation device and a heat dissipation device, wherein each switch device module comprises a DBC (dielectric-ceramic) ceramic substrate and a plurality of switch devices with bent pins, the first side of the DBC ceramic substrate is plated with copper integrally, the second side opposite to the first side is plated with a plurality of pieces of copper, the plurality of pieces of copper on the second side of the DBC ceramic substrate are respectively provided with a switch device with bent pins, the pins of the switch devices extend out in the direction far away from the DBC ceramic substrate, and the first sides of the DBC ceramic substrates of the switch device modules are fixed on a heat dissipation device;

and pins of the switch device are inserted into the connecting holes of the PCB.

2. The power conversion device of claim 1, wherein the heat sink is a heat sink.

3. The power conversion apparatus according to claim 1, wherein the metal layer side of the main body portion of the switching device is fixedly connected to the copper of the second side of the DBC ceramic substrate in a one-to-one correspondence.

4. The power conversion apparatus of claim 1, wherein the first side of the DBC ceramic substrate of the switching device module is bonded to the heat sink by a thermally conductive silicone grease.

5. The power conversion device of claim 1, wherein the first side of the DBC ceramic substrate of the switching device module is soldered directly to the heat sink.

6. The power conversion device of claim 1, wherein the pin-bent switching device comprises a pin and a body portion, wherein the pin of the switching device is at an angle to the body portion.

7. The power conversion device according to claim 1 or, wherein the PCB board is disposed in parallel with the switching device module and the heat sink.

8. A household energy storage system comprising the power conversion apparatus of claim 1.