CN219627967U - Novel multiple composite circuit board - Google Patents
Novel multiple composite circuit board Download PDFInfo
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- CN219627967U CN219627967U CN202223428400.1U CN202223428400U CN219627967U CN 219627967 U CN219627967 U CN 219627967U CN 202223428400 U CN202223428400 U CN 202223428400U CN 219627967 U CN219627967 U CN 219627967U
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- circuit board
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- substrate layer
- composite circuit
- heat dissipation
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Abstract
The utility model relates to the technical field of composite circuit boards, in particular to a novel multiple composite circuit board which comprises a substrate layer, wherein the surface of the substrate layer is provided with an efficient heat dissipation mechanism, the efficient heat dissipation mechanism consists of a heat dissipation assembly and insulating heat conduction glue, a reinforcing mechanism is arranged above the substrate layer and consists of a reinforcing layer, a connecting part and a resin layer, and the corner positions at the bottom of the substrate layer are provided with protection mechanisms which consist of protection rings and buffer parts. The utility model not only ensures that the composite circuit board is not easy to be damaged by stress, thereby improving the strength of the composite circuit board when in use, ensuring that the composite circuit board is not easy to be damaged by impact, but also avoiding the circuit from being burnt by overheat of the substrate layer, and prolonging the service life of the composite circuit board.
Description
Technical Field
The utility model relates to the technical field of composite circuit boards, in particular to a novel multiple composite circuit board.
Background
The circuit board is one of important parts of the electronic industry, almost every electronic device, as small as an electronic watch, a calculator, as large as a computer, a communication electronic device and a military weapon system, and as long as electronic elements such as an integrated circuit are provided, the circuit board is used for electrically interconnecting the elements, and along with the continuous progress of society and the continuous development of technology, the requirement on the circuit board is increased, so that multiple composite circuit boards are generated.
The composite circuit board is generally weak in strength, is easily broken and damaged due to stress, and is easily broken due to stress when applied to certain electrical equipment which frequently moves or collides; the composite circuit board is generally arranged in the electronic product, and when the product is impacted by the outside, the circuit board in the product is easily damaged; after the circuit board works for a long time, the heating phenomenon can be avoided, and the common composite circuit board has poor heat dissipation effect, and heat is easy to accumulate, so that the service life of the composite circuit board is influenced.
Disclosure of Invention
The utility model aims to provide a novel multiple composite circuit board, which solves the problems that the composite circuit board provided in the prior art has low strength, is easy to damage due to impact and affects the service life when being used.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a novel multiple composite circuit board, includes the substrate layer, the surface on substrate layer is provided with high-efficient heat dissipation mechanism, and high-efficient heat dissipation mechanism comprises radiating component and insulating heat conduction glue, the top on substrate layer is provided with strengthening mechanism, and strengthening mechanism comprises enhancement layer, connecting portion and resin layer, the corner position department on substrate layer bottom all is provided with protection machanism, and protection machanism comprises guard ring and buffer portion.
Preferably, the inside of the heat dissipation assembly comprises a heat dissipation plate, a heat conduction plate and a clearance groove, the heat dissipation plate is embedded in the bottom of the substrate layer, the heat dissipation plate is made of aluminum, the clearance groove is formed in the surface of the heat dissipation plate, the heat conduction plate is fixed on the surface of the heat dissipation plate, the heat conduction plate is of a wave-shaped structure, and the surface of the substrate layer is covered with insulating heat conduction glue.
Preferably, the inside of connecting portion is provided with blind hole and copper plating layer, the resin layer is fixed on the surface of insulating heat conduction glue, and the surface adhesion of resin layer has the enhancement layer, and the enhancement layer is the panel that epoxy glass fiber formed.
Preferably, blind holes are formed in the surface of the reinforcing layer, one ends of the blind holes sequentially penetrate through the resin layer and the insulating heat-conducting glue, a copper plating layer is plated in the blind holes, and the copper plating layer is connected with the substrate layer.
Preferably, the inside of buffering portion is provided with fixed section of thick bamboo, mounting plate, buffer spring and buffer column, the corner position department of substrate layer bottom all is fixed with the buffer column, and the surface cover of buffer column is equipped with fixed section of thick bamboo to fixed section of thick bamboo and buffer column sliding fit each other.
Preferably, a buffer spring is fixed at the bottom of the buffer column, one end of the buffer spring is fixedly connected with the inner wall of the fixed cylinder, a mounting plate is fixed on the surface of the fixed cylinder, and the protective ring is fixed at the edge position of the surface of the reinforcing layer.
Compared with the prior art, the utility model has the beneficial effects that: the novel multiple composite circuit board not only ensures that the composite circuit board is not easily damaged by stress, thereby improving the strength of the composite circuit board when in use, ensuring that the composite circuit board is not easily damaged by impact, avoiding the circuit from being burnt by overheat of the substrate layer, and prolonging the service life of the composite circuit board;
1. by arranging the reinforcing mechanism, the reinforcing layer is a plate formed by epoxy glass fibers, so that the reinforcing mechanism has good mechanical strength and heat-resistant insulating performance, can play a role in supporting and reinforcing the substrate layer, and can increase the strength of the substrate layer under the action of the resin layer;
2. through being provided with protection machanism, install the composite circuit board in the inside of electronic product through the mounting sheet, if the electronic product carelessly receives the impact to influence the composite circuit board, can offset the partial impact that the composite circuit board received under the effect of guard ring, simultaneously, can cushion the composite circuit board under the effect of the inside buffer spring of fixed cylinder and unload the power, greatly reduced the impact force that the composite circuit board received, simultaneously, can lead the composite circuit board under the sliding fit of buffer post and fixed cylinder, realized the safeguard function of composite circuit board to make the composite circuit board be difficult for damaging because of the impact;
3. through being provided with high-efficient heat dissipation mechanism, can dispel the heat to the substrate layer under the effect of insulating heat conduction glue, simultaneously, because the heating panel is the aluminum product matter, easy heat dissipation, can in time go out the heat conduction that the substrate layer produced, simultaneously, can increase heat radiating area under the effect of clearance groove, make the radiating rate of composite circuit board accelerate, avoid the substrate layer overheated burning loss circuit that burns, because the coefficient of thermal expansion of heating panel and substrate layer is different, in order to adapt to the temperature variation needs, the heating panel transversely or vertically is equipped with more than one clearance groove, prevent that the internal stress between heating panel and the substrate layer from arousing the substrate layer warpage, the high-efficient heat dissipation function of composite circuit board has been realized, avoid the substrate layer overheated burning loss circuit that burns, thereby composite circuit board's life has been prolonged.
Drawings
FIG. 1 is a schematic view of a three-dimensional appearance structure of the present utility model;
FIG. 2 is a schematic top view of the present utility model;
FIG. 3 is an enlarged schematic view of the efficient heat dissipation mechanism of the present utility model;
fig. 4 is an enlarged schematic view of the protection mechanism of the present utility model.
In the figure: 1. a substrate layer; 2. an efficient heat dissipation mechanism; 201. a heat dissipation assembly; 2011. a heat dissipation plate; 2012. a heat conductive plate; 2013. a clearance groove; 202. insulating heat-conducting glue; 3. a reinforcing mechanism; 301. a reinforcing layer; 302. a connection part; 3021. a blind hole; 3022. copper plating; 303. a resin layer; 4. a protective mechanism; 401. a protective ring; 402. a buffer section; 4021. a fixed cylinder; 4022. a mounting piece; 4023. a buffer spring; 4024. and a buffer column.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments, and furthermore, the terms "first", "second", "third", "up, down, left, right", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Meanwhile, in the description of the present utility model, unless explicitly stated and defined otherwise, the terms "connected", "connected" and "connected" should be interpreted broadly, and for example, may be fixedly connected, detachably connected, or integrally connected; the mechanical connection and the electrical connection can be adopted; all other embodiments, which may be directly or indirectly through intermediaries, which may be obtained by a person of ordinary skill in the art without inventive effort based on the embodiments of the present utility model are within the scope of the present utility model.
The structure of the novel multiple composite circuit board provided by the utility model is shown in fig. 1 and 2, and comprises a substrate layer 1, wherein the surface of the substrate layer 1 is provided with a high-efficiency heat dissipation mechanism 2, the high-efficiency heat dissipation mechanism 2 consists of a heat dissipation component 201 and an insulating heat conduction adhesive 202, the inside of the heat dissipation component 201 comprises a heat dissipation plate 2011, a heat conduction plate 2012 and a clearance groove 2013, the bottom of the substrate layer 1 is embedded with the heat dissipation plate 2011, the heat dissipation plate 2011 is made of aluminum, the surface of the heat dissipation plate 2011 is provided with the clearance groove 2013, the surface of the heat dissipation plate 2011 is fixedly provided with a heat conduction plate 2012, the structure of the heat conduction plate 2012 is of a wave-shaped structure, and the surface of the substrate layer 1 is covered with the insulating heat conduction adhesive 202.
During the use, can dispel the heat to substrate layer 1 under the effect of insulating heat-conducting glue 202, simultaneously, because heating panel 2011 is the aluminium material, easily dispel the heat, can in time conduct away the heat that substrate layer 1 produced, simultaneously, can increase the radiating area under the effect of clearance groove 2013, make the radiating rate of composite wiring board accelerate, avoid substrate layer 1 overheated boiling hot burning out the line, because heating panel 2011 and substrate layer 1's coefficient of thermal expansion are different, in order to adapt to the temperature variation needs, heating panel 2011 transversely or vertically is equipped with more than one clearance groove 2013, prevent that the internal stress between heating panel 2011 and the substrate layer 1 from arousing substrate layer 1 warpage, in order to realize composite wiring board's high-efficient heat dissipation function.
Further, as shown in fig. 3, a reinforcing mechanism 3 is disposed above the substrate layer 1, and the reinforcing mechanism 3 is composed of a reinforcing layer 301, a connecting portion 302 and a resin layer 303, a blind hole 3021 and a copper plating layer 3022 are disposed inside the connecting portion 302, the resin layer 303 is fixed on the surface of the insulating heat-conducting glue 202, the reinforcing layer 301 is adhered to the surface of the resin layer 303, the reinforcing layer 301 is a plate formed by epoxy glass fibers, the surface of the reinforcing layer 301 is provided with blind holes 3021, one end of the blind holes 3021 sequentially penetrates through the resin layer 303 and the insulating heat-conducting glue 202, a copper plating layer 3022 is plated inside the blind holes 3021, and the copper plating layer 3022 is connected with the substrate layer 1.
When the composite circuit board is used, the reinforcing layer 301 is a plate formed by epoxy glass fibers, has good mechanical strength and heat-resistant insulating performance, can play a role in supporting and reinforcing the substrate layer 1, and can increase the strength of the substrate layer 1 under the action of the resin layer 303, meanwhile, the blind holes 3021 are pre-formed before the reinforcing layer 301 and the resin layer 303 are installed on the surface of the substrate layer 1, the blind holes 3021 are prevented from being blocked by broken residues during back opening, a copper plating layer 3022 can be formed by an electroless copper plating process after the reinforcing layer 301 and the resin layer 303 are fixed with the substrate layer 1, and the copper plating layer 3022 is connected with the substrate layer 1 into a whole, so that the reinforcing function of the composite circuit board is realized.
Further, as shown in fig. 4, the corner positions of the bottom of the substrate layer 1 are all provided with a protection mechanism 4, the protection mechanism 4 is composed of a protection ring 401 and a buffer part 402, a fixing barrel 4021, a mounting piece 4022, a buffer spring 4023 and a buffer column 4024 are arranged in the buffer part 402, the buffer column 4024 is fixed at the corner positions of the bottom of the substrate layer 1, the fixing barrel 4021 is sleeved on the surface of the buffer column 4024, the fixing barrel 4021 and the buffer column 4024 are in sliding fit with each other, the buffer spring 4023 is fixed at the bottom of the buffer column 4024, one end of the buffer spring 4023 is fixedly connected with the inner wall of the fixing barrel 4021, the mounting piece 4022 is fixed on the surface of the fixing barrel 4021, and the protection ring 401 is fixed at the edge position of the surface of the reinforcing layer 301.
During the use, install the inside at electronic product with compound circuit board through mounting piece 4022, if the electronic product carelessly receives the impact when influencing the compound circuit board, can offset the part impact that compound circuit board received under the effect of guard ring 401, simultaneously, can cushion under the effect of the inside buffer spring 4023 of fixed section of thick bamboo 4021 and unload the power to compound circuit board, greatly reduced the impact force that compound circuit board received, simultaneously, can lead to compound circuit board under the sliding fit of buffer post 4024 and fixed section of thick bamboo 4021 to realize the safeguard function of compound circuit board.
Working principle: when the composite circuit board is used, firstly, the reinforcing layer 301 is a plate formed by epoxy glass fibers, so that the composite circuit board has good mechanical strength and heat-resistant insulating property, the supporting and reinforcing effects on the substrate layer 1 can be achieved, the strength of the substrate layer 1 is increased under the effect of the resin layer 303, meanwhile, the blind holes 3021 are reserved before the reinforcing layer 301 and the resin layer 303 are arranged on the surface of the substrate layer 1, the blind holes 3021 are prevented from being blocked by broken residues during back hole opening, a copper plating layer 3022 can be formed through an electroless copper plating process after the reinforcing layer 301 and the resin layer 303 are fixed with the substrate layer 1, the copper plating layer 3022 and the substrate layer 1 are integrally connected, the reinforcing function of the composite circuit board is achieved, the composite circuit board is not easy to be damaged by stress, and the strength of the composite circuit board in use is improved.
At this time, the composite circuit board is installed in the electronic product through the installation piece 4022, if the electronic product is affected by the impact carelessly, the impact of the part received by the composite circuit board can be counteracted under the action of the protective ring 401, meanwhile, the impact force received by the composite circuit board can be greatly reduced under the action of the buffer spring 4023 in the fixed cylinder 4021, and meanwhile, the composite circuit board can be guided under the sliding fit of the buffer column 4024 and the fixed cylinder 4021, so that the protection function of the composite circuit board is realized, and the composite circuit board is not easy to damage due to the impact.
At this time, the heat dissipation can be performed on the substrate layer 1 under the effect of the insulating heat-conducting glue 202, meanwhile, because the heat dissipation plate 2011 is made of aluminum material, heat generated by the substrate layer 1 can be conducted out in time, meanwhile, the heat dissipation area can be increased under the effect of the clearance groove 2013, so that the heat dissipation speed of the composite circuit board is increased, the overheating of the substrate layer 1 is avoided, the burning loss line is avoided, and because the thermal expansion coefficients of the heat dissipation plate 2011 and the substrate layer 1 are different, in order to adapt to the temperature change requirement, the heat dissipation plate 2011 is transversely or longitudinally provided with more than one clearance groove 2013, the warping of the substrate layer 1 caused by the internal stress between the heat dissipation plate 2011 and the substrate layer 1 is prevented, so that the efficient heat dissipation function of the composite circuit board is realized, the overheating burning loss line of the substrate layer 1 is avoided, the service life of the composite circuit board is prolonged, and finally the use work of the composite circuit board is completed.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides a novel multiple composite circuit board, includes substrate layer (1), its characterized in that: the surface of substrate layer (1) is provided with high-efficient heat dissipation mechanism (2), and high-efficient heat dissipation mechanism (2) are by radiating component (201) and insulating heat conduction glue (202) are constituteed, the top of substrate layer (1) is provided with strengthening mechanism (3), and strengthening mechanism (3) are by strengthening layer (301), connecting portion (302) and resin layer (303) are constituteed, the corner position department of substrate layer (1) bottom all is provided with protection machanism (4), and protection machanism (4) are constituteed by guard ring (401) and buffer portion (402).
2. The novel multiple composite circuit board according to claim 1, wherein: the inside of radiating component (201) is including heating panel (2011), heat conduction board (2012) and clearance groove (2013), the bottom of substrate layer (1) is embedded has heating panel (2011), and the material of heating panel (2011) is aluminum product matter to clearance groove (2013) has all been seted up on the surface of heating panel (2011), the surface mounting of heating panel (2011) has heat conduction board (2012), and the structure of heat conduction board (2012) is wave-like structure, the surface covering of substrate layer (1) has insulating heat conduction glue (202).
3. The novel multiple composite circuit board according to claim 1, wherein: the inside of connecting portion (302) is provided with blind hole (3021) and copper plating (3022), resin layer (303) are fixed on the surface of insulating heat conduction glue (202), and the surface adhesion of resin layer (303) has enhancement layer (301), and enhancement layer (301) are the panel that epoxy glass fiber formed.
4. A novel multiple composite wiring board according to claim 3, wherein: blind holes (3021) are formed in the surface of the reinforcing layer (301), one end of each blind hole (3021) sequentially penetrates through the resin layer (303) and the insulating heat-conducting adhesive (202), a copper plating layer (3022) is plated in each blind hole (3021), and the copper plating layer (3022) is connected with the base material layer (1).
5. The novel multiple composite circuit board according to claim 1, wherein: the inside of buffering portion (402) is provided with fixed section of thick bamboo (4021), mounting plate (4022), buffer spring (4023) and buffer post (4024), the corner of substrate layer (1) bottom all is fixed with buffer post (4024), and the surface cover of buffer post (4024) is equipped with fixed section of thick bamboo (4021) to fixed section of thick bamboo (4021) and buffer post (4024) mutually sliding fit.
6. The novel multiple composite circuit board according to claim 5, wherein: the bottom of buffering post (4024) is fixed with buffer spring (4023), and the one end of buffer spring (4023) is fixed connection with the inner wall of fixed section of thick bamboo (4021), the surface mounting of fixed section of thick bamboo (4021) has mounting piece (4022), edge position department on enhancement layer (301) surface is fixed to guard ring (401).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223428400.1U CN219627967U (en) | 2022-12-21 | 2022-12-21 | Novel multiple composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223428400.1U CN219627967U (en) | 2022-12-21 | 2022-12-21 | Novel multiple composite circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219627967U true CN219627967U (en) | 2023-09-01 |
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ID=87796281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223428400.1U Active CN219627967U (en) | 2022-12-21 | 2022-12-21 | Novel multiple composite circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219627967U (en) |
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2022
- 2022-12-21 CN CN202223428400.1U patent/CN219627967U/en active Active
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