CN219617363U

CN219617363U - Edge polishing device for wafer processing

Info

Publication number: CN219617363U
Application number: CN202320449758.8U
Authority: CN
Inventors: 孙效中
Original assignee: Changzhou Wantoon Semicondutor Co ltd
Current assignee: Changzhou Wantoon Semicondutor Co ltd
Priority date: 2023-03-10
Filing date: 2023-03-10
Publication date: 2023-09-01
Anticipated expiration: 2033-03-10

Abstract

The utility model belongs to the technical field of wafer processing, in particular to an edge polishing device for wafer processing. According to the utility model, the polishing assembly is arranged, the wafer is placed at the position corresponding to the central position on the tray, the rotating disc is rotated to drive the screw rod to rotate on the fixed plate, and the limiting plate at one end of the screw rod is pushed to move towards the direction of the wafer, so that four groups of polishing plates are attached to the outer wall of the wafer, and wafers with different diameters can be positioned and polished.

Description

Edge polishing device for wafer processing

Technical Field

The utility model relates to the technical field of wafer processing, in particular to an edge polishing device for wafer processing.

Background

Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer.

Before polishing the edge of a wafer, the wafer needs to be placed in a polishing device and fixed, and the polishing operation of the wafer is inconvenient because the wafer has different diameters and poor positioning effect and the polishing effect of the edge is affected.

Disclosure of Invention

The utility model aims at overcoming the defects of the prior art, and provides an edge polishing device for wafer processing, which is used for solving the problems.

The edge polishing device for wafer processing comprises a workbench, a hydraulic cylinder arranged on the workbench through a support frame and a polishing mechanism arranged on the workbench, wherein the polishing mechanism comprises a driving assembly and a polishing assembly, the driving assembly comprises a toothed ring, a ring barrel, a gear and a motor, the toothed ring is rotatably arranged on the workbench, the ring barrel is arranged on the toothed ring, and the gear is meshed with one side of the toothed ring and fixedly connected with the output end of the motor arranged in the workbench;

the polishing assembly comprises a rotating disc, a screw rod, a connecting plate, a fixing plate, a limiting plate and a polishing plate, wherein the four groups of connecting plates are arranged in four groups of opposite connecting plates and evenly encircle and penetrate through the annular cylinder, the fixing plate penetrates through the middle of the connecting plate, two ends of the fixing plate are fixed on the annular cylinder, the screw rod penetrates through the two ends of the connecting plate and the middle of the fixing plate, the screw rod is in threaded rotation connection with the fixing plate, the limiting plate is arranged at one end of the screw rod inside the annular cylinder, the polishing plate is detachably arranged on the limiting plate, and the rotating disc is arranged at the other end of the screw rod.

By adopting the technical scheme, wafers with different diameters are conveniently fixed.

Rectangular notch has been seted up at the connecting plate middle part, the fixed plate passes from this notch, and the thickness of fixed plate and the high looks adaptation of this notch, the connecting plate with be slip laminating connection between the fixed plate.

By adopting the technical scheme, the connecting plate can move at the annular cylinder.

The limiting plate and the polishing plate are in fan-shaped ring structure.

By adopting the technical scheme, the wafer is correspondingly attached to the wafer, and the wafer is fixed.

The inner side of the ring cylinder is positioned on the upper end face of the workbench, the tray is in a flat cylindrical structure, and the diameter of the tray is smaller than that of the ring cylinder.

By adopting the technical scheme, the wafer is supported.

And a pressing plate is arranged at the bottom end part of the hydraulic cylinder, and the center point of the pressing plate and the center point of the tray are positioned on the same vertical straight line.

By adopting the technical scheme, the upper end part of the wafer is positioned, and the movement of the wafer is limited when the wafer is polished.

The outer wall of the ring barrel is uniformly and circumferentially provided with a notch, the connecting plate is arranged at the notch, and the width of the connecting plate is matched with the width of the notch.

By adopting the technical scheme, the movement of the connecting plate is facilitated.

The edge polishing device for wafer processing has the beneficial effects that:

1. the driving assembly is arranged, so that the motor can be driven to drive the gear to drive the toothed ring to rotate, the toothed ring drives the ring barrel to synchronously rotate, the ring barrel drives the limiting plate to rotate, and the polishing assembly is utilized to polish the outer edge of the wafer;

2. through setting up the subassembly of polishing, place the wafer in the central point department that corresponds on the tray, rotate the rotation disk drive lead screw and rotate on the fixed plate to promote the limiting plate of a lead screw tip to the direction department motion of wafer, make four sets of polishing boards laminate in wafer outer wall department, can fix a position the wafer of different diameter sizes and polish.

Drawings

FIG. 1 is a schematic view of the overall structure of an edge polishing apparatus for wafer processing according to the present utility model;

FIG. 2 is a view showing the positions of a connecting plate and a fixing plate of an edge polishing device for wafer processing according to the present utility model;

fig. 3 is a schematic view of the ring cylinder and the toothed ring of the edge polishing device for wafer processing according to the present utility model.

In the figure: 1. a work table; 2. a support frame; 3. a hydraulic cylinder; 4. a pressing plate; 5. a toothed ring; 6. a ring barrel; 7. a gear; 8. a motor; 9. a tray; 10. a rotating disc; 11. a screw rod; 12. a connecting plate; 13. a fixing plate; 14. a limiting plate; 15. and (5) polishing the plate.

Detailed Description

The preferred embodiments of the present utility model will be described in detail below with reference to the attached drawings so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present utility model.

Referring to fig. 1-3, an edge polishing device for wafer processing comprises a workbench 1, a hydraulic cylinder 3 arranged on the workbench 1 through a support frame 2 and a polishing mechanism arranged on the workbench 1, wherein the polishing mechanism comprises a driving component and a polishing component, the driving component comprises a toothed ring 5, a ring cylinder 6, a gear 7 and a motor 8, the toothed ring 5 is rotatably arranged on the workbench 1, the ring cylinder 6 is arranged on the toothed ring 5, and the gear 7 is meshed with one side of the toothed ring 5 and fixedly connected with the output end of the motor 8 arranged inside the workbench 1;

the polishing assembly comprises a rotating disc 10, a screw rod 11, a connecting plate 12, a fixing plate 13, a limiting plate 14 and a polishing plate 15, wherein the four groups of connecting plates 12 are arranged in four groups relative to each other and evenly surround and penetrate through the annular cylinder 6, the fixing plate 13 penetrates through the middle of the connecting plate 12, two ends of the fixing plate 13 are fixed on the annular cylinder 6, the screw rod 11 penetrates through two ends of the connecting plate 12 and the middle of the fixing plate 13, the screw rod 11 is in threaded rotation connection with the fixing plate 13, the limiting plate 14 is arranged at one end of the screw rod 11 inside the annular cylinder 6, the polishing plate 15 is detachably arranged on the limiting plate 14, and the rotating disc 10 is arranged at the other end of the screw rod 11.

Placing a wafer at a position corresponding to the central position on the tray 9, then rotating the rotating disc 10 to drive the screw rod 11 to rotate on the fixed plate 13, and pushing the limiting plate 14 at one end part of the screw rod 11 to move towards the direction of the wafer, so that four groups of polishing plates 15 are attached to the outer wall of the wafer; and the diameter of the tray 9 is smaller than that of the ring cylinder 6, so that the wafer can be conveniently taken out after being processed.

Rectangular notch is offered at connecting plate 12 middle part, and fixed plate 13 passes in this notch, and the thickness of fixed plate 13 and the high looks adaptation of this notch, is the slip laminating connection between connecting plate 12 and the fixed plate 13.

The fixed plate 13 transversely penetrates through the connecting plate 12, two ends of the fixed plate are fixedly connected with the annular cylinder 6, and when the rotating disc 10 is rotated, the screw rod 11 is in threaded rotation connection with the fixed plate 13, so that the connecting plate 12 is driven to move, a bearing is arranged between the connecting plate 12 and the screw rod 11, and the screw rod 11 rotates on the connecting plate 12 through the bearing.

The limiting plate 14 and the polishing plate 15 are both in a fan-shaped ring structure.

The polishing plate 15 can be removed from the limiting plate 14, and a new polishing plate 15 is replaced, and when the polishing plate 15 is placed, only the upper end part of the limiting plate 14 is required to be inserted in a sliding manner.

The inner side of the ring cylinder 6 is positioned on the upper end surface of the workbench 1, the tray 9 is in a flat cylindrical structure, and the diameter of the tray 9 is smaller than that of the ring cylinder 6; the outer wall of the ring tube 6 evenly surrounds the notch, the connecting plate 12 is arranged at the notch, and the width of the connecting plate 12 is matched with the width of the notch. The driving motor 8 drives the gear 7 to rotate, the gear 7 drives the toothed ring 5 to rotate, the toothed ring 5 drives the annular cylinder 6 to synchronously rotate, and the annular cylinder 6 drives the limiting plate 14 to rotate, so that the outer edge of the wafer is polished.

The bottom end of the hydraulic cylinder 3 is provided with a pressing plate 4, and the center point of the pressing plate 4 and the center point of the tray 9 are on the same vertical straight line.

The hydraulic cylinder 3 is driven to push the pressing plate 4 to move downwards, so that the bottom end part of the pressing plate 4 is attached to the upper surface of the wafer, and pressure can be applied to the upper end surface of the wafer.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model.

Claims

1. The utility model provides an edge polishing device for wafer processing, includes workstation (1), installs pneumatic cylinder (3) on workstation (1) and installs the grinding machanism on workstation (1) through support frame (2), its characterized in that: the polishing mechanism comprises a driving assembly and a polishing assembly, the driving assembly comprises a toothed ring (5), a ring barrel (6), a gear (7) and a motor (8), the toothed ring (5) is rotatably installed on the workbench (1), the ring barrel (6) is installed on the toothed ring (5), and the gear (7) is meshed with one side of the toothed ring (5) and fixedly connected with the output end of the motor (8) installed inside the workbench (1);

the polishing assembly comprises a rotating disc (10), a screw rod (11), a connecting plate (12), a fixing plate (13), a limiting plate (14) and a polishing plate (15), wherein the connecting plate (12) is formed by uniformly penetrating four groups of opposite connecting plates (12) on the annular cylinder (6), the fixing plate (13) penetrates through the middle part of the connecting plate (12), two ends of the fixing plate are fixed on the annular cylinder (6), the screw rod (11) penetrates through two ends of the connecting plate (12) and the middle part of the fixing plate (13), the screw rod (11) is in threaded rotation connection with the fixing plate (13), the limiting plate (14) is installed at one end of the screw rod (11) inside the annular cylinder (6), the polishing plate (15) is detachably installed on the limiting plate (14), and the rotating disc (10) is installed at the other end of the screw rod (11).

2. The edge polishing apparatus for wafer processing according to claim 1, wherein: rectangular notch is offered at connecting plate (12) middle part, fixed plate (13) pass from this notch, and the thickness of fixed plate (13) and the high looks adaptation of this notch, connecting plate (12) with be slip laminating connection between fixed plate (13).

3. The edge polishing apparatus for wafer processing according to claim 2, wherein: the limiting plate (14) and the polishing plate (15) are of fan-shaped ring structures.

4. The edge polishing apparatus for wafer processing according to claim 3, wherein: the inner side of the ring cylinder (6) is positioned on the upper end face of the workbench (1), the tray (9) is arranged in a flat cylindrical structure, and the diameter of the tray (9) is smaller than that of the ring cylinder (6).

5. The edge polishing apparatus for wafer processing according to claim 4, wherein: the bottom end part of the hydraulic cylinder (3) is provided with a pressing plate (4), and the center point of the pressing plate (4) and the center point of the tray (9) are on the same vertical straight line.

6. The edge polishing apparatus for wafer processing according to claim 5, wherein: the outer wall of the ring barrel (6) is uniformly and circumferentially provided with a notch, the connecting plate (12) is arranged at the notch, and the width of the connecting plate (12) is matched with the width of the notch.